JPH0617294Y2 - 半導体ウェハ用ピンセット - Google Patents
半導体ウェハ用ピンセットInfo
- Publication number
- JPH0617294Y2 JPH0617294Y2 JP1987140968U JP14096887U JPH0617294Y2 JP H0617294 Y2 JPH0617294 Y2 JP H0617294Y2 JP 1987140968 U JP1987140968 U JP 1987140968U JP 14096887 U JP14096887 U JP 14096887U JP H0617294 Y2 JPH0617294 Y2 JP H0617294Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- tweezers
- fork
- shaped
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 37
- 210000000078 claw Anatomy 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 2
- -1 ethylene-fluorofluoropropylene Chemical group 0.000 claims description 2
- 229920006026 co-polymeric resin Polymers 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 35
- 239000000463 material Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140968U JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987140968U JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6447044U JPS6447044U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-23 |
| JPH0617294Y2 true JPH0617294Y2 (ja) | 1994-05-02 |
Family
ID=31405614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987140968U Expired - Lifetime JPH0617294Y2 (ja) | 1987-09-17 | 1987-09-17 | 半導体ウェハ用ピンセット |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617294Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60142067U (ja) * | 1984-02-28 | 1985-09-20 | 松下電子工業株式会社 | ウエ−ハ保持具 |
-
1987
- 1987-09-17 JP JP1987140968U patent/JPH0617294Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6447044U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-23 |