JPH0617289Y2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JPH0617289Y2
JPH0617289Y2 JP7837488U JP7837488U JPH0617289Y2 JP H0617289 Y2 JPH0617289 Y2 JP H0617289Y2 JP 7837488 U JP7837488 U JP 7837488U JP 7837488 U JP7837488 U JP 7837488U JP H0617289 Y2 JPH0617289 Y2 JP H0617289Y2
Authority
JP
Japan
Prior art keywords
die island
heat block
die
island
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7837488U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02728U (US06272168-20010807-M00014.png
Inventor
富広 野田
政孝 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP7837488U priority Critical patent/JPH0617289Y2/ja
Publication of JPH02728U publication Critical patent/JPH02728U/ja
Application granted granted Critical
Publication of JPH0617289Y2 publication Critical patent/JPH0617289Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP7837488U 1988-06-15 1988-06-15 ワイヤボンディング装置 Expired - Lifetime JPH0617289Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7837488U JPH0617289Y2 (ja) 1988-06-15 1988-06-15 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7837488U JPH0617289Y2 (ja) 1988-06-15 1988-06-15 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH02728U JPH02728U (US06272168-20010807-M00014.png) 1990-01-05
JPH0617289Y2 true JPH0617289Y2 (ja) 1994-05-02

Family

ID=31303303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7837488U Expired - Lifetime JPH0617289Y2 (ja) 1988-06-15 1988-06-15 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JPH0617289Y2 (US06272168-20010807-M00014.png)

Also Published As

Publication number Publication date
JPH02728U (US06272168-20010807-M00014.png) 1990-01-05

Similar Documents

Publication Publication Date Title
JPH0617289Y2 (ja) ワイヤボンディング装置
JPH0345641U (US06272168-20010807-M00014.png)
JP2518247Y2 (ja) リードフレーム
JP3067560B2 (ja) 電子部品製造方法
JPS61182036U (US06272168-20010807-M00014.png)
JPH0442924Y2 (US06272168-20010807-M00014.png)
JPH0447880U (US06272168-20010807-M00014.png)
JPS62178532U (US06272168-20010807-M00014.png)
JPS5839046U (ja) 半導体パツケ−ジ
JPS6291443U (US06272168-20010807-M00014.png)
JPH01121929U (US06272168-20010807-M00014.png)
JPS63155642U (US06272168-20010807-M00014.png)
JPH0353853U (US06272168-20010807-M00014.png)
JPH022835U (US06272168-20010807-M00014.png)
JPS6242254U (US06272168-20010807-M00014.png)
JPS6122351U (ja) 樹脂封止形半導体装置
JPS62135960U (US06272168-20010807-M00014.png)
JPS6280342U (US06272168-20010807-M00014.png)
JPS59155749U (ja) 半導体装置
JPH03101524U (US06272168-20010807-M00014.png)
JPH0373444U (US06272168-20010807-M00014.png)
JPS63170946U (US06272168-20010807-M00014.png)
JPS6016553U (ja) 樹脂封止型半導体装置
JPH0392048U (US06272168-20010807-M00014.png)
JPS5983049U (ja) 微小半導体装置