JPH06168899A - Heater unit for heating substrate - Google Patents

Abstract

PURPOSE:To provide a heater unit for heating substrate which realizes energy saving and shortening of processing time while enhancing quality and yield of substrate. CONSTITUTION:In a cylindrical heater unit 7 having ceiling in which a coiled heating element 10 is surrounded by a cylindrical vessel 9 having a vacuum thermal insulation layer 8 and mirror side face, the heating element 10 is fed with power from power supply sections 15, 15 to heat the interior of the heater unit. The cylindrical vessel 9 blocks conduction of heat to the outside by means of the vacuum thermal insulation layer 8 and the mirror face on the inside of the cylindrical vessel 9 reflects radiation of heat.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for manufacturing a semiconductor by heat-treating or film-forming a semiconductor substrate,
In particular, the present invention relates to a heater unit that performs heating during processing.

[0002]

2. Description of the Related Art First, a conventional heater unit shown in FIG. 2 will be described.

The heater unit 1 shown in FIG. 2 is a cylindrical heater unit that processes an object to be processed inside the heater unit 1. The heater unit 1 is a cylindrical body with a ceiling, and is composed of a metal outer wall 2, a heat insulating layer 3 and a heating element 4 from the outside, and the inside of the heating element 4 is hollow.

Explaining the structure of the heater unit 1 in detail, the heating element 4 has a coil shape, and the heater unit 1
Power is supplied via power supply units 5 and 5 provided outside the device.

The outer periphery of the heating element 4 excluding the lower surface is surrounded by a heat insulating material such as ceramics or heat insulating wool so as to have a required thickness.
The heat insulating layer 3 is used so as to maintain a predetermined heat insulating performance. Further, the heat insulating layer 3 is kept in shape by surrounding the outer periphery thereof with a metal outer wall 2 such as a metal plate.

Further, a cooling port 6 is vertically formed in the ceiling portion of the heater unit 1 from the outer metal outer wall 2 to the inner hollow portion so that the inside of the heater unit 1 can be forcibly cooled. ing.

When the heater unit 1 performs heat treatment or film formation on a semiconductor substrate, the heating element 4 is heated by supplying power from the power supply units 5 and 5 to heat the inside of the heater unit 1. . Also, after the substrate processing, the inside of the heating element 4 and the heater unit 1 is cooled, but gas is introduced from the cooling port 6 to shorten the cooling time at the time of cooling, and the inside of the heater unit 1 is forcedly cooled. Things are also commonly done.

[0008]

However, since the heater unit 1 is constructed as described above, the heat insulating layer 3 is thick and the heat capacity is large. Therefore, the heater unit 1
It takes a long time to raise and lower the temperature until the inside reaches a steady state.
The operating efficiency of the heater unit becomes low.

Further, when the gas is introduced from the cooling port 6 during cooling, particles are generated from the heat insulating wool used in the heat insulating layer 3, and the inside of the heater unit 1 is contaminated with the particles, so that a clean environment is obtained. It becomes an unsuitable environment for the processing of semiconductor substrates that prefer to.

Further, since the heat insulating property of the heat insulating layer 3 is not so excellent, it is unavoidable that heat escapes to the outside of the heater unit 1 and a heat insulating plate and a radiator have to be provided.

In view of such circumstances, the present invention is energy saving,
Aiming at shortening the processing time, improving heat insulation and thermal response,
Another object of the present invention is to provide a heater unit that can improve the quality and yield of semiconductor substrates.

[0012]

According to the present invention, in a cylindrical heater unit with a ceiling, a heating element is surrounded by a cylindrical container having a vacuum heat insulating layer, and the inner surface of the cylindrical container is a mirror surface.

[0013]

When the coil-shaped heating element is supplied with power from the power supply section, the heating element generates heat and heats the inside of the heater unit. Further, the cylindrical container blocks heat conduction to the outside by the vacuum heat insulating layer, and reflects the heat radiation to the outside by the mirror surface of the inner surface of the cylindrical container.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

The heater unit 7 shown in FIG. 1 is a cylindrical heater unit with a ceiling similar to the conventional heater unit 1 shown in FIG. 2, and the inside of the outer wall of the heater unit 7 is a vacuum heat insulating layer 8. The inside of the cylindrical container 9 is provided with a heat generating portion composed of a heat generating element 10, an electrical insulator 11, and a heat generating element supporter 12, which will be described later. Further, the inner surface of the cylindrical container 9 is mirror-finished by means such as plating.

The heat generating portion of the heater unit 7 will be described in detail.

The heating element supporter 12 is a cylinder made of a thin metal or the like, and a flange 13 is provided at the bottom thereof.

The heating element 10 is in the shape of a coil and is attached to the heating element supporter 12 via the electrical insulator 11 made of ceramics or the like.

To heat the heating element 10, power is supplied from power supply portions 15 and 15 provided in a port 14 formed so as to penetrate the heating element support 12 and the cylindrical container 9 in the horizontal direction. Done in. Further, if a port (not shown) is further provided and instruments such as a thermometer are provided at the port, the temperature inside the heater unit 7 can be easily measured.

Further, the ceiling portion of the heater unit 7 is provided with a cooling port 16 which vertically penetrates the cylindrical container 9 serving as an outer wall.

Next, heating and cooling in the heater unit 7 will be described.

When the cooling port 16 is closed and power is supplied to the heating element 10 by the power supply units 15 and 15,
The heating element 10 generates heat, and the temperature inside the heater unit 7 gradually rises. As described above, since the outer wall of the heater unit 7 is the cylindrical container 9 and the inside of the cylindrical container 9 is the vacuum heat insulating layer 8, heat conduction to the outside of the heater unit 7 is blocked, and the inner surface of the cylindrical container 9 is Since it is a mirror surface, the radiant heat emitted from the heating element 10 is reflected, and the radiant heat can be effectively used. Therefore, efficient heat insulation can be performed.

The heater unit 7 is also provided after the substrate processing is completed.
When the inside of the heater is cooled, the power supply from the power supply units 15 and 15 is stopped, and gas is introduced into the heater unit 7 through the cooling port so that the gas flows in the heater unit 7. Promote cooling.

[0024]

As described above, according to the present invention, the following excellent effects are exhibited.

Since the vacuum heat insulating layer is used for the heat insulating layer of the heater unit, high heat insulating performance can be realized, the heat capacity of the heater unit can be reduced, and energy can be saved.

Since the heater unit has good thermal responsiveness, substrate processing can be performed in many steady states and in multiple stages, and the temperature rise / fall time can be shortened, so that the substrate production amount can be increased.

Since the heat insulating layer is formed of a metal wall, there is no fear of dust generation when introducing gas during forced cooling, and high-quality substrate production can be expected.

Since the vacuum heat insulating layer has high heat insulating properties, protective equipment such as a heat insulating plate and a radiator is not required.

Since the vacuum heat insulating layer has high heat insulating properties, the thickness of the heat insulating layer can be reduced, the size can be reduced, and the space can be saved.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional example.

[Explanation of symbols]

 7 Heater Unit 8 Vacuum Insulation Layer 9 Cylindrical Container 10 Heating Element 15 Power Supply Section

Claims (2)

[Claims] 1. A ceiling-type cylindrical heater unit, comprising:
A heater unit for heating a substrate, characterized in that a heating element is surrounded by a cylindrical container having a vacuum heat insulating layer. 2. The heater unit for heating a substrate according to claim 1, wherein the inner surface of the cylindrical container has a mirror surface.