JPH06148026A - Method for detecting failure in laser marking - Google Patents

Method for detecting failure in laser marking

Info

Publication number
JPH06148026A
JPH06148026A JP4323785A JP32378592A JPH06148026A JP H06148026 A JPH06148026 A JP H06148026A JP 4323785 A JP4323785 A JP 4323785A JP 32378592 A JP32378592 A JP 32378592A JP H06148026 A JPH06148026 A JP H06148026A
Authority
JP
Japan
Prior art keywords
laser
marking
workpiece
intensity
laser marking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4323785A
Other languages
Japanese (ja)
Other versions
JP3262391B2 (en
Inventor
Kenji Ishikawa
健二 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Riken Corp
Original Assignee
Riken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken Corp filed Critical Riken Corp
Priority to JP32378592A priority Critical patent/JP3262391B2/en
Publication of JPH06148026A publication Critical patent/JPH06148026A/en
Application granted granted Critical
Publication of JP3262391B2 publication Critical patent/JP3262391B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

PURPOSE:To rationalize quality control and inspection processes by detecting a failure in laser marking at the same time as applying laser-marking to a product having a narrow curved rim such as a piston ring. CONSTITUTION:At the same time as marking by laser 6, luminous intensity at a marked portion of a product 1 is sensed by a photoelectric sensor 2, so that the sensed luminous intensity and a luminous time pattern are compared with preset intensity and time pattern according to processing conditions thereby determining whether the product is good or defective.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、レーザマーキングの異
常検出方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser marking abnormality detection method.

【0002】[0002]

【従来の技術】レーザによるマーキングは、近年、機械
式及び化学式マーキングに取って替る勢いで伸びてい
る。レーザマーキングは、図2に例示するように、レー
ザ発振器6より射出されるレーザ光線を、駆動ミラー
5、集光レンズ4を介してマークすべき加工物1上に集
光させ、マークの形状に応じて駆動ミラー5を駆動して
反射光の方向を偏向させることにより、加工物1の表面
に形成されるレーザスポットを移動させて、所要のマー
クを記録するものである。
2. Description of the Related Art Laser marking has recently gained momentum to replace mechanical and chemical marking. In laser marking, as illustrated in FIG. 2, a laser beam emitted from a laser oscillator 6 is focused on a workpiece 1 to be marked via a driving mirror 5 and a condenser lens 4 to form a mark shape. Accordingly, the driving mirror 5 is driven to deflect the direction of the reflected light, thereby moving the laser spot formed on the surface of the workpiece 1 to record a required mark.

【0003】しかし、この構成のレーザマーキング装置
では、レーザ発振器、ミラー駆動系の故障や、マーキン
グすべき加工物が例えばピストンリングのように加工物
自体の剛性が低く、かつ、加工物のマーキングされる部
分の幅が細く曲線で挟まれた部分にマーキングを行なう
場合の、加工物の加工位置への搬送のための搬送系の問
題も含め、レーザスポットが加工物の加工面から外れ、
マークの頭や上部が欠けたり、甚しい場合はマークなし
などの問題が発生する。
However, in the laser marking device having this structure, the laser oscillator and the mirror drive system have a failure, the workpiece to be marked has a low rigidity such as a piston ring, and the workpiece is marked. The laser spot deviates from the machined surface of the workpiece, including the problem of the transport system for transporting the workpiece to the processing position when marking the portion where the width of the workpiece is narrow and sandwiched by curves.
If the head or upper part of the mark is missing, or if it is severe, problems such as no mark occur.

【0004】レーザ発振の有無の確認については、例え
ば、図2に示す構成の市販されているレーザマーカ装置
には、レーザ発振器6にレーザ発振確認センサ7を付設
して、レーザ発振信号をフィードバックするなどの方式
によるセミクローズド制御により、レーザの発振の有無
確認が行なわれてはいるものの、ミラー駆動系の故障
や、加工物のマーキング状態を加工中に確認することが
できないため、加工後、人手による視認検査又はマーク
自動検査機による確認工程を別途必要とする問題があっ
た。
Regarding the confirmation of the presence or absence of laser oscillation, for example, in the commercially available laser marker device having the configuration shown in FIG. 2, a laser oscillation confirmation sensor 7 is attached to the laser oscillator 6 to feed back the laser oscillation signal. Although the presence or absence of laser oscillation is confirmed by the semi-closed control by the method of, the mirror drive system failure and the marking state of the workpiece cannot be confirmed during processing. There is a problem that a visual inspection or a confirmation process by an automatic mark inspection machine is separately required.

【0005】[0005]

【発明が解決しようとする課題】本発明は、従来のレー
ザマーキング装置によるマーキング異常検出に関する上
記の問題点にかんがみ、例えばピストンリングのように
幅が狭く、かつ曲線状の縁を有する金属製加工物へのレ
ーザマーキングと同時にマーキングの異常を検出するこ
とができ、品質の管理と検査工程の合理化を図ることの
できるレーザマーキング異常検出方法を提供することを
課題とする。
SUMMARY OF THE INVENTION The present invention is conceived in view of the above-mentioned problems relating to marking abnormality detection by a conventional laser marking device, and for example, metal working having a narrow width and a curved edge such as a piston ring. An object of the present invention is to provide a laser marking abnormality detection method capable of detecting marking abnormalities at the same time as laser marking on an object and achieving quality control and rationalization of an inspection process.

【0006】[0006]

【課題を解決するための手段】上記の課題を解決するた
めの本発明の金属加工物に対するレーザマーキング異常
検出方法は、レーザによるマーキングと同時に、光電セ
ンサにより加工物のマーキング部位の発光強度を検知
し、検知された発光強度と時間的発光パターンとを、加
工物の材質、表面処理、表面状態、レーザ強度、加工マ
ークの形状等の加工条件に応じてあらかじめ設定し記憶
手段に記憶させた強度と時間的パターンと比較すること
により、その差異より異常を判定することを特徴とす
る。
A laser marking abnormality detection method for a metal work piece according to the present invention for solving the above-mentioned problems is to detect a light emission intensity of a marking part of a work piece by a photoelectric sensor at the same time as marking by a laser. Then, the detected emission intensity and temporal emission pattern are set in advance according to the processing conditions such as the material of the workpiece, the surface treatment, the surface condition, the laser intensity, and the shape of the processing mark, and the intensity is stored in the storage means. It is characterized in that the abnormality is judged from the difference by comparing with the temporal pattern.

【0007】[0007]

【作用】本発明のレーザマーキング異常検出方法は、レ
ーザを使用して金属の表面を照射してマーキングを行な
う時、加工物にレーザスポットが当ると、レーザによる
エネルギーによりその部分に発光現象が起ることを利用
したものである。この発光現象は、レーザの強度や加工
物の材質、表面状態によりほゞ一定の発光強度となるこ
とが知られている。
According to the laser marking abnormality detection method of the present invention, when a laser spot is struck on a workpiece when a metal surface is irradiated with the laser for marking, a light emission phenomenon occurs at that portion due to the energy of the laser. This is what is used. It is known that this light emission phenomenon has a substantially constant light emission intensity depending on the intensity of the laser, the material of the workpiece, and the surface condition.

【0008】したがって、レーザマーキングと同時にマ
ーキング部位の発光強度と時間的パターンを光電センサ
により電気量として検出し、レーザ強度や加工物の材
質、表面状態、マーキングすべきマークの形状等によ
り、あらかじめ設定し記憶された発光強度と時間的パタ
ーンと比較すれば、レーザ発振強度の異常とともに、マ
ーキングの加工物に対する位置ずれを検出することがで
きる。マーキングの加工物に対する位置ずれより、ミラ
ー駆動系の故障か加工物の搬送異常、異品種の混入が推
定されるので、これらの点を点検することにより、異常
に対する処置を遅延なく行なうことができる。
Therefore, at the same time as the laser marking, the light emission intensity and the temporal pattern of the marking portion are detected as a quantity of electricity by the photoelectric sensor, and are set in advance according to the laser intensity, the material of the workpiece, the surface condition, the shape of the mark to be marked, etc. Then, by comparing the stored emission intensity with the temporal pattern, it is possible to detect the positional deviation of the marking with respect to the workpiece as well as the abnormality of the laser oscillation intensity. From the misalignment of the marking with respect to the workpiece, it is estimated that the mirror drive system is faulty, the workpiece is abnormally conveyed, or different products are mixed. By checking these points, it is possible to take corrective action against the abnormality without delay. .

【0009】[0009]

【実施例】以下に、本発明の実施例を、図面に基づいて
詳細に説明する。図1は、本発明のレーザマーキング異
常検出方法を実施するための装置が付設されたレーザマ
ーキング装置の一例を示す図である。この装置では、レ
ーザ発振器6より射出され、駆動ミラー5、集光レンズ
4を経て、加工物1の表面にレーザマーキングされる部
位の発光強度を検知することのできる位置に、光電セン
サ2が設けられている。光電センサ2で検知された発光
強度は電気信号に変換され、パターン認識装置3に入力
され、発光強度の時間的パターンがCRT等の画像表示
手段に表示される。画像表示手段には、レーザ発光強
度、加工物の材質、表面状態、マーキングすべきマーク
の形状等の加工条件に応じてあらかじめ設定し、メモリ
に記憶させたパターンも対比して表示される。この2つ
を比較することにより、マーキングが正常に行なわれて
いるか、異常であるかが判定され、パターンの形状が正
常で全体的に低レベルであればレーザ発振器の出力低下
と判断され、又、時間的発光パターンが記憶されたパタ
ーンと異る場合は、その異り方により上欠け、頭欠け等
の態様が判定される。又、従来の装置のレーザ発振確認
センサ7は不要となる。
Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a diagram showing an example of a laser marking apparatus provided with an apparatus for carrying out the laser marking abnormality detection method of the present invention. In this device, the photoelectric sensor 2 is provided at a position where the emission intensity of a portion emitted from the laser oscillator 6, passed through the driving mirror 5 and the condenser lens 4 and laser-marked on the surface of the workpiece 1 can be detected. Has been. The light emission intensity detected by the photoelectric sensor 2 is converted into an electric signal and input to the pattern recognition device 3, and the temporal pattern of the light emission intensity is displayed on an image display means such as a CRT. On the image display means, a pattern which is set in advance in accordance with processing conditions such as laser emission intensity, material of work, surface state, shape of mark to be marked, etc. and stored in the memory is also displayed for comparison. By comparing the two, it is determined whether the marking is performed normally or abnormally, and if the pattern shape is normal and the level is low overall, it is determined that the output of the laser oscillator is reduced, and If the temporal light emission pattern is different from the stored pattern, a mode such as top chipping or head chipping is determined depending on the difference. Further, the laser oscillation confirmation sensor 7 of the conventional device is unnecessary.

【0010】表1に、ピストンリングの合口部の端部に
メーカ名の略称をマークした例について、正常、上欠
け、頭欠けの場合のマーキング状態と時間的発光パター
ンを示す。
Table 1 shows a marking state and a temporal light emission pattern in the case of normal, top chipping, and head chipping in an example in which the abbreviation of the manufacturer name is marked on the end of the abutment part of the piston ring.

【0011】[0011]

【表1】 [Table 1]

【0012】正常時にはRIKの夫々の文字の幅に対応
した幅の3つのパターンが並んだ発光パターンが得られ
る。上欠けの場合は、RとKの文字の高さの中央で横に
結ぶ部分が欠けるため、夫々複数の小さい幅の部分が並
んだパターンになり、発光強度も低下する。頭欠けの場
合はRの文字の左の部分が欠けるため、幅が狭くなる。
したがって、発光パターンを見ることによって、マーキ
ング状態を判定することができる。その結果、レーザ発
振器の出力低下、駆動ミラーの故障、加工品の搬送不良
等の見当をつけることが出来、速やかに対策を講ずるこ
とができる。
In a normal state, a light emitting pattern in which three patterns having a width corresponding to the width of each character of RIK are arranged is obtained. In the case of the top chipping, the part that connects horizontally at the center of the heights of the letters R and K is chipped, resulting in a pattern in which a plurality of parts with small widths are lined up, and the light emission intensity also decreases. In the case of a head loss, the left part of the letter R is missing, so the width becomes narrower.
Therefore, the marking state can be determined by looking at the light emission pattern. As a result, the output of the laser oscillator can be reduced, the drive mirror can be broken, and the processed product can be conveyed poorly, so that countermeasures can be taken promptly.

【0013】[0013]

【発明の効果】以上の如く、本発明によれば、金属製加
工物にレーザマーキングを行うと同時に、レーザマーキ
ング異常を検出することができ、品質管理と検査工程の
合理化に顕著な効果を得ることができる。
As described above, according to the present invention, it is possible to carry out laser marking on a metal workpiece and at the same time detect an abnormality in laser marking, and obtain a remarkable effect in rationalizing quality control and inspection processes. be able to.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のレーザマーキング異常検出方法を実施
するための手段を付設したレーザマーキング装置の一例
を示す断面図である。
FIG. 1 is a cross-sectional view showing an example of a laser marking device provided with a means for carrying out a laser marking abnormality detection method of the present invention.

【図2】従来のレーザマーキング装置の一例を示す断面
図である。
FIG. 2 is a sectional view showing an example of a conventional laser marking device.

【符号の説明】[Explanation of symbols]

1 金属製加工物 2 光電センサ 3 パターン認識装置 4 集光レンズ 5 駆動ミラー 6 レーザ発振器 1 Metal Workpiece 2 Photoelectric Sensor 3 Pattern Recognition Device 4 Condensing Lens 5 Drive Mirror 6 Laser Oscillator

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 金属製加工物にレーザによりマーキング
を行なう場合のマーキング異常検出方法において、レー
ザによるマーキングと同時に、光電センサにより加工物
のマーキング部位の発光強度を検知し、検知された発光
強度と時間的発光パターンとを、加工物の材質、表面処
理、表面状態、レーザ強度、加工マークの形状等の加工
条件に応じてあらかじめ設定し記憶手段に記憶させた強
度と時間的パターンと比較することにより、その差異よ
り異常を判定することを特徴とする異常検出方法。
1. In a marking abnormality detection method for marking a metal workpiece with a laser, at the same time as the laser marking, the photoelectric sensor detects the emission intensity of the marking portion of the workpiece, and the detected emission intensity is Comparing the temporal emission pattern with the temporal pattern preset and stored in the storage means according to the processing conditions such as the material of the workpiece, the surface treatment, the surface condition, the laser intensity, and the shape of the processing mark. An abnormality detection method characterized by determining an abnormality from the difference.
JP32378592A 1992-11-10 1992-11-10 Laser marking abnormality detection method Expired - Fee Related JP3262391B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32378592A JP3262391B2 (en) 1992-11-10 1992-11-10 Laser marking abnormality detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32378592A JP3262391B2 (en) 1992-11-10 1992-11-10 Laser marking abnormality detection method

Publications (2)

Publication Number Publication Date
JPH06148026A true JPH06148026A (en) 1994-05-27
JP3262391B2 JP3262391B2 (en) 2002-03-04

Family

ID=18158594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32378592A Expired - Fee Related JP3262391B2 (en) 1992-11-10 1992-11-10 Laser marking abnormality detection method

Country Status (1)

Country Link
JP (1) JP3262391B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009204396A (en) * 2008-02-27 2009-09-10 Toray Eng Co Ltd Evaluating method of marking
US7705268B2 (en) * 2004-11-11 2010-04-27 Gsi Group Corporation Method and system for laser soft marking
KR102107187B1 (en) * 2019-12-04 2020-05-06 대한이연주식회사 Manufacturing apparatus of piston rings for a vehicle and thereby piston rings
KR102107188B1 (en) * 2020-01-30 2020-05-06 대한이연주식회사 Manufacturing apparatus of piston rings for a vehicle and thereby piston rings
JP2020175425A (en) * 2019-04-19 2020-10-29 ファナック株式会社 Mechanical learning device for learning focus positional deviation of laser beam machine and mechanical learning method, and laser processing system for correcting focus positional deviation
CN114815741A (en) * 2022-06-27 2022-07-29 南通端高科技有限公司 Mode control system based on information acquisition

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7705268B2 (en) * 2004-11-11 2010-04-27 Gsi Group Corporation Method and system for laser soft marking
JP2009204396A (en) * 2008-02-27 2009-09-10 Toray Eng Co Ltd Evaluating method of marking
JP2020175425A (en) * 2019-04-19 2020-10-29 ファナック株式会社 Mechanical learning device for learning focus positional deviation of laser beam machine and mechanical learning method, and laser processing system for correcting focus positional deviation
US11565344B2 (en) 2019-04-19 2023-01-31 Fanuc Corporation Device and method for learning focal position offset of laser processing apparatus, and laser processing system correcting focal position offset
KR102107187B1 (en) * 2019-12-04 2020-05-06 대한이연주식회사 Manufacturing apparatus of piston rings for a vehicle and thereby piston rings
KR102107188B1 (en) * 2020-01-30 2020-05-06 대한이연주식회사 Manufacturing apparatus of piston rings for a vehicle and thereby piston rings
CN114815741A (en) * 2022-06-27 2022-07-29 南通端高科技有限公司 Mode control system based on information acquisition

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