JPH06262383A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPH06262383A
JPH06262383A JP5081375A JP8137593A JPH06262383A JP H06262383 A JPH06262383 A JP H06262383A JP 5081375 A JP5081375 A JP 5081375A JP 8137593 A JP8137593 A JP 8137593A JP H06262383 A JPH06262383 A JP H06262383A
Authority
JP
Japan
Prior art keywords
laser beam
worked
laser
head
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP5081375A
Other languages
Japanese (ja)
Inventor
Tetsuo Kiyofuji
哲生 清藤
Kazumasa Ozeki
和正 大関
Yuji Saito
雄二 斉藤
Yukihisa Fukuda
幸久 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Nippon Steel Plant Designing Corp
Original Assignee
Nittetsu Plant Designing Corp
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nittetsu Plant Designing Corp, Nippon Steel Corp filed Critical Nittetsu Plant Designing Corp
Priority to JP5081375A priority Critical patent/JPH06262383A/en
Publication of JPH06262383A publication Critical patent/JPH06262383A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE:To keep an interval between a ftheta lens being continuously worked in a wide range and a surface to be worked constant by controlling the position of a laser beam machining head according to a detected result by a sensor so that a prescribed interval is kept between a laser beam machining head and an object to be worked, and performing a laser beam machining to a surface to be worked. CONSTITUTION:According to a laser beam machine, a laser beam machining is performed while always watching an interval between the ftheta lens 7 of a laser beam head 1 and a surface P to be worked by a distance sensor 13. So, even when there is a warp and an undulation on the object P to be worked, the intensity of a laser beam irradiating a surface to be worked, a spot diameter, etc., can be correctly controlled. Therefore, it has an large effect on heightening the working accuracy of a marking on a steel sheet P with a large surface area. Also, working accuracy can be further improved by correcting the shift of a mounting position between the sensor 13 and the laser beam head 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、鋼板等の表面に文字な
どを高速に刻印するためのレーザ加工装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for marking characters and the like on a surface of a steel plate or the like at high speed.

【0002】[0002]

【従来の技術】レーザ光束により、鋼板等の対象物の表
面に文字などの刻印を施す技術の一例として、レーザ光
源からのレーザ光を所望の方向にスキャニングするため
のガルバノスキャナとこのガルバノスキャナからのレー
ザ光を所定の同一平面上に集光させるfθレンズとを有
するレーザヘッドを刻印範囲で被加工面に沿って移動可
能とし、連続的に刻印を行うレーザ刻印装置が特開昭6
0−106686号公報に開示されている。
2. Description of the Related Art As an example of a technique for marking a surface of an object such as a steel plate with a laser beam, a galvano scanner for scanning a laser beam from a laser light source in a desired direction and the galvano scanner A laser marking device which makes it possible to move a laser head having an f.theta.
No. 0-106686.

【0003】この公報によれば、まず刻印開始位置にて
レーザヘッドを移動してその位置で固定し、ガルバノス
キャナにてスキャン可能な範囲の刻印を行い、次にレー
ザヘッドを所定の距離だけ移動してその位置で固定し、
再びガルバノスキャナにてスキャンしつつ刻印を行うよ
うにしており、レーザヘッド全体を刻印文字などに沿っ
て駆動しつつ刻印を行うX−Y駆動方式等に比較して高
速化されている。
According to this publication, first, a laser head is moved at a marking start position and fixed at that position, marking is performed within a scannable range by a galvano scanner, and then the laser head is moved by a predetermined distance. And fix it in that position,
Marking is performed while scanning again with the galvano scanner, which is faster than the XY driving method in which the marking is performed while driving the entire laser head along the marking characters.

【0004】このようなガルバノスキャナ及びfθレン
ズを用いたレーザ加工装置では、fθレンズを固定した
まま所定の広さを有する被加工面に高速で加工できる反
面、レーザ光の焦点深度などの問題からレーザヘッド全
体を駆動しつつ刻印を行う装置などに比較してレーザヘ
ッドのfθレンズと被加工面との間隔、即ち焦点距離を
一層正確に所定の範囲内に保つ必要がある。
In such a laser processing apparatus using a galvano scanner and an fθ lens, a surface to be processed having a predetermined width can be processed at a high speed while the fθ lens is fixed, but there is a problem such as the depth of focus of laser light. It is necessary to more accurately maintain the distance between the fθ lens of the laser head and the surface to be processed, that is, the focal length within a predetermined range, as compared with an apparatus that performs marking while driving the entire laser head.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、例えば
鋼板などは反りなどにより必ずしも被加工面が平面とな
らず、刻印開始時に上記間隔が一定となるようにレーザ
ヘッドをセットしても加工中にこの間隔が変化し、刻印
文字の品質が劣化する虞があった。
However, for example, a steel plate or the like does not always have a flat surface to be machined due to warpage or the like, and even if the laser head is set so that the above-mentioned interval becomes constant at the start of marking, the laser head is not processed during machining. There is a risk that the spacing may change and the quality of the engraved characters may deteriorate.

【0006】本発明は、このような従来技術の不都合を
解消すべく案出されたものであり、その主な目的は、広
範囲に連続加工中のレーザヘッドのfθレンズと被加工
面との間隔を一定に保つことが可能なように改良された
レーザ加工装置を提供することにある。
The present invention has been devised in order to eliminate such inconveniences of the prior art, and its main purpose is to provide a gap between the fθ lens of the laser head and a surface to be processed during continuous wide area processing. It is an object of the present invention to provide an improved laser processing apparatus capable of keeping a constant value.

【0007】[0007]

【課題を解決するための手段】このような目的は、本発
明によれば、レーザ光源からのレーザ光を所望の方向に
スキャニングするためのガルバノスキャナ及び前記ガル
バノスキャナからのレーザ光を所定の同一平面上に集光
させるfθレンズを有するレーザヘッドと、前記レーザ
ヘッドを被加工物の被加工面に対して近接/離反可能
に、かつ前記被加工面に沿って移動可能に支持する手段
と、前記レーザヘッドと前記被加工面との間隔を検出す
るセンサとを有し、前記レーザ加工ヘッドと前記被加工
面とが所定の間隔となるように前記センサによる検出結
果を基に前記レーザ加工ヘッドの位置を制御しつつ前記
被加工面に対してレーザ加工を施す手段とを有すること
を特徴とするレーザ加工装置を提供することによって達
成される。
According to the present invention, a galvano scanner for scanning a laser beam from a laser light source in a desired direction and a laser beam from the galvano scanner have a predetermined same object. A laser head having an fθ lens for converging light on a flat surface, and means for supporting the laser head so that the laser head can be moved toward and away from a surface to be processed of a workpiece and movable along the surface to be processed. The laser processing head includes a sensor that detects a distance between the laser head and the surface to be processed, and the laser processing head based on a detection result of the sensor so that the laser processing head and the surface to be processed have a predetermined distance. And a means for performing laser processing on the surface to be processed while controlling the position of the laser processing apparatus.

【0008】[0008]

【作用】このような構成によれば、位置センサによりレ
ーザヘッドのfθレンズと被加工面との間隔を常に検出
し、被加工物に反りやうねりがあってもこの間隔が常に
一定となるように制御できる。
According to this structure, the distance between the fθ lens of the laser head and the surface to be processed is always detected by the position sensor, and the distance is always constant even if the workpiece is warped or undulated. Can be controlled.

【0009】[0009]

【実施例】以下に添付の図面に示された具体的な実施例
に基づいて本発明の構成を詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of the present invention will be described in detail below with reference to specific embodiments shown in the accompanying drawings.

【0010】図1は、本発明に基づき構成されたレーザ
加工装置の構成を示す部分断面側面図である。この装置
は被加工物としての鋼板Pの表面に文字などの刻印を施
すためのものである。
FIG. 1 is a partial sectional side view showing the configuration of a laser processing apparatus constructed according to the present invention. This device is for imprinting characters or the like on the surface of a steel plate P as a workpiece.

【0011】鋼板Pの幅方向(X方向)にガイド手段2
により移動可能に支持されたレーザヘッド1はモータ3
をもって駆動されるようになっている。また、レーザヘ
ッド1はベース1aと、鉛直方向、即ち鋼板Pに近接/
離反するZ方向にガイド手段4によりベース1aに移動
可能に支持されたZ方向可動部1bとから構成されてい
る。Z方向可動部1bはモータ5をもって駆動されるよ
うになっている。
Guide means 2 is provided in the width direction (X direction) of the steel plate P.
The laser head 1 movably supported by the motor 3
It is designed to be driven with. Further, the laser head 1 and the base 1a are in the vertical direction, that is, close to the steel plate P.
It comprises a Z-direction movable portion 1b movably supported by the base 1a by the guide means 4 in the separating Z-direction. The Z direction movable portion 1b is driven by a motor 5.

【0012】レーザヘッド1のZ方向可動部1bに於け
る鋼板Pと対向する位置にはfθレンズ7が設けられて
いる。このfθレンズ7にはガルバノミラー8a、8b
を有するガルバノスキャナ8、ミラー9〜12を介して
レーザ発振器6からレーザビームが供給されるようにな
っている。ここで、fθレンズ7は、入射角に応じて焦
点位置が光軸と直交する1平面上で移動するレンズであ
る。即ち、ガルバノスキャナ8による入射角の変化によ
りfθレンズ7から出射されるレーザの集光位置が鋼板
Pの表面上を所定の範囲で移動するようになっている。
An fθ lens 7 is provided at a position facing the steel plate P in the Z direction movable portion 1b of the laser head 1. The fθ lens 7 has galvanometer mirrors 8a and 8b.
A laser beam is supplied from the laser oscillator 6 via the galvano scanner 8 having the mirrors and the mirrors 9 to 12. Here, the fθ lens 7 is a lens whose focal position moves on one plane orthogonal to the optical axis depending on the incident angle. That is, the focus position of the laser emitted from the fθ lens 7 moves on the surface of the steel plate P within a predetermined range due to the change of the incident angle by the galvano scanner 8.

【0013】一方、レーザヘッド1に於けるfθレンズ
7の近傍に於けるレーザヘッド1の移動方向、即ちX方
向前または後ろの位置には、fθレンズ7と鋼板Pとの
間隔を検出するための距離センサ13が設けられてい
る。この距離センサ13は、モータ3、モータ5及びガ
ルバノスキャナ8を駆動制御するための制御ユニット1
4に接続されている。
On the other hand, in order to detect the distance between the fθ lens 7 and the steel plate P in the moving direction of the laser head 1 in the vicinity of the fθ lens 7 in the laser head 1, that is, in the position in front of or behind the X direction. The distance sensor 13 is provided. The distance sensor 13 is a control unit 1 for driving and controlling the motor 3, the motor 5, and the galvano scanner 8.
4 is connected.

【0014】以下に本実施例の作動要領について説明す
る。鋼板Pには刻印領域15が予め設定されており、例
えば20文字の文字をその刻印領域15にレーザ刻印す
るようになっている。ここで、刻印領域15はガルバノ
スキャナ8のスキャニング可能範囲(またはfθレンズ
7の大きさ)及び焦点保度と鋼板の反りまたはうねり量
の関係から定められる例えば4つの領域(A、B、C、
D)から構成されている。
The operating procedure of this embodiment will be described below. A marking area 15 is preset on the steel plate P, and for example, 20 characters are laser-marked on the marking area 15. Here, the engraved area 15 is, for example, four areas (A, B, C, and C) defined by the scanning range (or the size of the fθ lens 7) of the galvano scanner 8 and the relationship between the focus retention and the amount of warpage or waviness of the steel plate.
D).

【0015】まず、鋼板Pを搬送ロール16により搬送
して載置し、モータ3をもってレーザヘッド1の距離セ
ンサ13を刻印領域15の刻印開始位置(領域Aの中
心)に移動させる。そして、距離センサ13により領域
Aの中心に於けるfθレンズ7と鋼板Pとの間隔を検出
し、この検出結果に基づきZ方向可動部1bをモータ5
をもって駆動し、上記間隔とfθレンズ7の焦点距離と
を一致させる。その後、fθレンズ7の中心を領域Aの
中心に移動させ、実際にガルバノスキャナ8をスキャニ
ングさせて領域Aに刻印を行う。
First, the steel plate P is transported by the transport roll 16 and placed thereon, and the distance sensor 13 of the laser head 1 is moved by the motor 3 to the marking start position of the marking region 15 (center of the region A). Then, the distance sensor 13 detects the distance between the fθ lens 7 and the steel plate P at the center of the area A, and the Z-direction movable portion 1b is moved to the motor 5 based on the detection result.
The fθ lens 7 and the focal length of the fθ lens 7 are made to coincide with each other. Then, the center of the fθ lens 7 is moved to the center of the area A, and the galvano scanner 8 is actually scanned to mark the area A.

【0016】次に、モータ3をもってレーザヘッド1の
距離センサ13を刻印領域15の領域Bの中心に移動さ
せ、距離センサ13により領域Bの中心に於けるfθレ
ンズ7と鋼板Pとの間隔を検出し、この検出結果に基づ
きZ方向可動部1bをモータ5をもって駆動した後、f
θレンズ7の中心を領域Bの中心に移動させ、実際にガ
ルバノスキャナ8をスキャニングさせて領域Bに刻印を
行う。
Next, the distance sensor 13 of the laser head 1 is moved to the center of the area B of the marking area 15 by the motor 3, and the distance sensor 13 sets the distance between the fθ lens 7 and the steel plate P at the center of the area B. After detecting and driving the Z-direction movable portion 1b with the motor 5 based on this detection result, f
The center of the θ lens 7 is moved to the center of the region B, the galvano scanner 8 is actually scanned, and the region B is marked.

【0017】上記同様に領域C、Dについても、距離セ
ンサ13により領域の中心に於けるfθレンズ7と鋼板
Pとの間隔を検出し、この間隔とfθレンズ7の焦点距
離とを一致させて刻印を行う。
Similarly for the areas C and D, the distance sensor 13 detects the distance between the fθ lens 7 and the steel plate P at the center of the area, and the distance and the focal length of the fθ lens 7 are matched. Make a stamp.

【0018】尚、距離センサ13により領域Aの中心に
於けるfθレンズ7と鋼板Pとの間隔を検出し、これを
fθレンズ7の焦点距離と一致させた後、モータ3によ
りセンサ位置を領域B〜Dに走査し、同様に計測した
後、この鋼板表面の変位(反りまたはうねり量)データ
に基づいて、連続的に領域A〜Dの刻印を行っても良い
ことは云うまでもない。
The distance sensor 13 detects the distance between the f.theta. Lens 7 and the steel plate P at the center of the area A, and after matching this with the focal length of the f.theta. It is needless to say that the regions A to D may be continuously marked based on the displacement (warpage or waviness amount) data of the steel sheet surface after scanning the regions B to D and performing the same measurement.

【0019】[0019]

【発明の効果】このように本発明のレーザ加工装置によ
れば、レーザヘッドと被加工面との間隔をセンサにより
常にウォッチングしながらレーザ加工を行うことで、被
加工物に反りやうねりがあっても、被加工面に照射され
るレーザの強度、スポット径等を正確に制御できること
から、大きな表面積を有する鋼板上の刻印加工精度を高
めるうえに大きな効果を奏することができる。また、セ
ンサと、レーザヘッドとの間の取付位置ずれを補正する
ことで加工精度を一層向上することができる。
As described above, according to the laser processing apparatus of the present invention, since the laser processing is performed while always monitoring the interval between the laser head and the surface to be processed by the sensor, the object to be processed is warped or undulated. However, since the intensity of the laser applied to the surface to be processed, the spot diameter, and the like can be accurately controlled, a great effect can be exerted in increasing the accuracy of the marking on a steel sheet having a large surface area. Further, by correcting the mounting position deviation between the sensor and the laser head, the processing accuracy can be further improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明が適用されたレーザ加工装置の模式的な
部分断面側面図である。
FIG. 1 is a schematic partial cross-sectional side view of a laser processing apparatus to which the present invention has been applied.

【図2】図1のII-II線について見た矢視図である。FIG. 2 is a view taken along the line II-II of FIG.

【符号の説明】[Explanation of symbols]

1 レーザヘッド 1a ベース 1b Z方向可動部 2 ガイド手段 3 モータ 4 ガイド手段 5 モータ 6 レーザ発振器 7 fθレンズ 8 ガルバノスキャナ 8a、8b ガルバノミラー 9〜12 ミラー 13 距離センサ 14 制御ユニット 15 刻印領域 16 搬送ロール P 鋼板 A、B、C、D 領域 1 laser head 1a base 1b Z direction movable part 2 guide means 3 motor 4 guide means 5 motor 6 laser oscillator 7 fθ lens 8 galvano scanner 8a, 8b galvano mirror 9-12 mirror 13 distance sensor 14 control unit 15 engraving area 16 carrier roll P Steel plate A, B, C, D area

───────────────────────────────────────────────────── フロントページの続き (72)発明者 斉藤 雄二 北九州市戸畑区大字中原46−59 新日本製 鐵株式会社機械・プラント事業部内 (72)発明者 福田 幸久 北九州市戸畑区大字中原46−59 日鐵プラ ント設計株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Saito 46-59 Nakahara, Tobata-ku, Kitakyushu City Nippon Steel Corporation Machinery & Plant Division (72) Inventor Yukihisa Fukuda 46-59 Nakahara, Tobata-ku, Kitakyushu City Nittetsu Plant Design Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 レーザ光源からのレーザ光を所望の方向
にスキャニングするためのガルバノスキャナ及び前記ガ
ルバノスキャナからのレーザ光を所定の同一平面上に集
光させるfθレンズを有するレーザヘッドと、 前記レーザヘッドを被加工物の被加工面に対して近接/
離反可能に、かつ前記被加工面に沿って移動可能に支持
する手段と、 前記レーザヘッドと前記被加工面との間隔を検出するセ
ンサとを有し、 前記レーザ加工ヘッドと前記被加工面とが所定の間隔と
なるように前記センサによる検出結果を基に前記レーザ
加工ヘッドの位置を制御しつつ前記被加工面に対してレ
ーザ加工を施す手段とを有することを特徴とするレーザ
加工装置。
1. A laser head having a galvano scanner for scanning a laser light from a laser light source in a desired direction, and a laser head having an fθ lens for condensing the laser light from the galvano scanner on a predetermined plane. The head is close to the work surface of the work piece /
And a sensor for detecting a distance between the laser head and the surface to be processed, the means for supporting the laser processing head and the surface to be processed. And a means for performing laser processing on the surface to be processed while controlling the position of the laser processing head on the basis of the detection result by the sensor so as to be at a predetermined interval.
JP5081375A 1993-03-15 1993-03-15 Laser beam machine Withdrawn JPH06262383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5081375A JPH06262383A (en) 1993-03-15 1993-03-15 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5081375A JPH06262383A (en) 1993-03-15 1993-03-15 Laser beam machine

Publications (1)

Publication Number Publication Date
JPH06262383A true JPH06262383A (en) 1994-09-20

Family

ID=13744566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5081375A Withdrawn JPH06262383A (en) 1993-03-15 1993-03-15 Laser beam machine

Country Status (1)

Country Link
JP (1) JPH06262383A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301374A (en) 1997-03-21 2000-10-31 Sumitomo Heavy Ind Ltd Laser beam machining device, and laser beam machining method
JP2006289419A (en) * 2005-04-08 2006-10-26 Mitsubishi Electric Corp Laser beam machining apparatus
JP2010075976A (en) * 2008-09-26 2010-04-08 Hitachi Via Mechanics Ltd Laser beam machine
JP2013226590A (en) * 2012-04-26 2013-11-07 Toshiba Corp Laser cutting apparatus and laser cutting method
WO2017094408A1 (en) * 2015-12-03 2017-06-08 村田機械株式会社 Laser processing machine, calculating device, and processing method for workpiece

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301374A (en) 1997-03-21 2000-10-31 Sumitomo Heavy Ind Ltd Laser beam machining device, and laser beam machining method
JP2006289419A (en) * 2005-04-08 2006-10-26 Mitsubishi Electric Corp Laser beam machining apparatus
JP2010075976A (en) * 2008-09-26 2010-04-08 Hitachi Via Mechanics Ltd Laser beam machine
JP2013226590A (en) * 2012-04-26 2013-11-07 Toshiba Corp Laser cutting apparatus and laser cutting method
WO2017094408A1 (en) * 2015-12-03 2017-06-08 村田機械株式会社 Laser processing machine, calculating device, and processing method for workpiece
JPWO2017094408A1 (en) * 2015-12-03 2018-09-13 村田機械株式会社 Laser processing machine, calculation device, and workpiece processing method

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