JPH06140742A - Printed-circuit board and manufacture thereof - Google Patents

Abstract

PURPOSE:To obtain a printed circuit board whereon neither release nor cutting off of fine patter occurs by a method wherein a high conductive metal is buried in the trench parts formed on the substrate to form the fine patterns making the metal surface and the substrate surface almost flush with each other. CONSTITUTION:A ceramic or glass substrate 1 is irradiated with ultraviolet laser beams to form fine pattern trenches 6. Next, Au or Cu 2 as a high conductive metal is bonded onto the whole surface of the substrate 1 by evaporating or sputtering step, etc., and then the surface is polished to form fine patterns 5. At this time, the ceramic, glass etc. can be efficiently removed with high precision due to the short wavelength and high photon energy of the ultraviolet laser beams. Besides, neither thermal strain nor burring, etc., occurs during the removing step. Resultantly, neither release nor cutting off of patterns occurs on the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly to a printed circuit board and a printed circuit board in which the fine pattern is not cut off due to peeling of the fine pattern or contact with other parts. It relates to a manufacturing method.

[0002]

2. Description of the Related Art A conventional printed circuit board manufacturing process has the process shown in FIG. 3, in which a highly conductive metal 2 having high conductivity, such as Cu, is laminated or vapor-deposited on the substrate (see FIG. ), And apply the resist film 3 on the coating (b
Figure). The resist film 3 is exposed and developed to form a resist fine pattern 4 (Fig. C). Next, the metal film having high conductivity is etched (FIG. D), and finally the etching film is removed to form a fine pattern 5 (FIG. E).

[0003]

In recent years, due to the miniaturization of patterns, patterns on a substrate manufactured by a conventional method are liable to cause peeling of the fine patterns in a cleaning process, etc. Since the pattern portion is on the substrate, there is a drawback that it is easily cut due to contact with other components.

The present invention eliminates the above drawbacks and provides a highly reliable printed circuit board and its manufacturing method.

[0005]

DISCLOSURE OF THE INVENTION The present invention is to improve the above-mentioned drawbacks, and its gist is to embed a metal of good conductivity such as Au or Cu in a groove portion formed on a substrate such as ceramic or glass. A groove-like fine pattern is formed on a printed circuit board and a substrate such as ceramics or glass characterized in that the metal surface and the surface of the substrate are substantially flush with each other, and a conductive pattern is formed thereon. A method of manufacturing a printed circuit board is characterized in that a fine pattern is formed by coating a metal and removing the conductive metal film other than the groove.

The present invention will be described in more detail below with reference to the drawings.

FIG. 1 is an explanatory view showing a method of manufacturing a printed circuit board of the present invention in the order of steps, FIGS. 2 (a) and 2 (b) are cross-sectional views of the printed circuit board of the present invention, and FIG. FIG. 4 is an explanatory view showing the manufacturing method in order of steps, and FIG. 4 is a cross-sectional view of a conventional printed circuit board.

According to the present invention, a substrate such as a ceramic substrate or a glass substrate (FIG. 1 (a)) is irradiated with an ultraviolet laser to form fine pattern grooves (FIG. 1 (b)). Metal is attached by vapor deposition or sputtering (Fig. 1
(C)) After that, the surface is polished to form a fine pattern (FIG. 1 (d)).

According to the above method, since the wavelength of the ultraviolet laser beam is short and the photon energy is high, it is possible to remove ceramics, glass, etc. with high precision and efficiency,
In addition, thermal strain and burrs during removal do not occur.

The printed circuit board 1 obtained by the method of the present invention is substantially flush with the surface of the substrate 1 as shown in FIG. 2 (b), in which the metal 6 having good conductivity such as Au or Cu is embedded in the groove 6. The pattern 5 is formed so as to be a plane. FIG. 4 is a cross-sectional view of a pattern manufactured by the conventional method. In this case, the contact surface 7 with the outside is on the surface of the pattern 5, and is easily peeled or cut by cleaning or contact with other parts. On the other hand, FIGS. 2A and 2B are cross-sectional views of a pattern manufactured by the method according to the present invention. In the case of FIG.
The contact surface 7 with the outside is on the surface of the substrate 1, and external force due to cleaning, contact with other components, etc. is absorbed by the substrate surface, and the pattern 5
No peeling or cutting occurs. 2B shows the case where the pattern 5 and the surface of the substrate are coincident with each other, the external force evenly affects the pattern 5 and the surface of the substrate, and the peeling and cutting of the pattern are unlikely to occur as in the case of FIG. 2A.

[0011]

As described above, according to the present invention, it is possible to provide a highly reliable printed circuit board in which the pattern on the board is not peeled and the pattern is not cut.

[Brief description of drawings]

1A to 1D are explanatory views showing a method of manufacturing a printed circuit board of the present invention in the order of steps.

2A and 2B are cross-sectional views of the printed circuit board of the present invention.

3A to 3E are explanatory views showing a conventional method of manufacturing a printed circuit board in order of steps.

FIG. 4 is a cross-sectional view of a conventional printed circuit board.

[Explanation of symbols]

 1 Substrate 2 Good Conductive Metal 3 Resist Film 4 Resist Pattern 5 Pattern on Substrate 6 Groove

Claims (2)

[Claims] 1. A highly conductive metal such as Au or Cu is embedded in a groove portion formed on a substrate such as ceramic or glass so that the metal surface and the surface of the substrate are substantially flush with each other. A printed circuit board characterized by the above. 2. A groove-shaped fine pattern is formed on a substrate such as ceramic or glass, and a conductive metal is coated thereon.
A method of manufacturing a printed circuit board, wherein a fine pattern is formed by removing a conductive metal film other than a groove.