JPH06132180A - Check mark for detecting lamination deviation of lamination electronic parts and method for detecting lamination deviation of lamination electronic parts - Google Patents

Abstract

PURPOSE:To inspect the longitudinal direction and/or width direction simultaneously by the inspection of a lamination capacitor from one direction. CONSTITUTION:A pair of check marks consist of the opposing sides of the same length which are in parallel on a phantom line (1 or 4) to be cut for obtaining single-substance electronic parts and a side which is inclined to the side which is opposite to the opposing side. Lamination deviation is inspected by enlarging and expanding the group of a pair of check marks 13 appearing on the section of a lamination substrate and by detecting the deviation in width direction, that in length direction, or that in inclination direction of the above lamination substrate according to the length and position deviation of a pair of check marks 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component obtained by laminating substrates on which conductive members are laminated, for example, a check mark for detecting a lamination deviation of a capacitor, an inductor, a non-linear resistor, etc. The present invention relates to a stacking deviation inspection method for stacked electronic components.

[0002]

2. Description of the Related Art FIG. 6 is a view for explaining a ceramic element body of a conventional multilayer capacitor. In FIG. 6, electrode patterns 62, 64, 6 are provided on the ceramic body.
6, 68 are formed. Further, the odd-numbered ceramic element bodies and the even-numbered ceramic element bodies are laminated so that they can be connected to the external electrodes at the end portions of the electrode pattern. The ceramic bodies provided with such electrode patterns are stacked and thermocompression bonded. After that, the laminated ceramic body is cut along the virtual cutting lines 1 to 8 to be a chip, and the laminated capacitor body 6 is formed.
It becomes 1, 63, 65, 67. External capacitors are attached to the laminated capacitor element bodies 61, 63, 65, 67 and then fired to form a laminated capacitor.

In recent years, the size and capacity of multilayer capacitors have been remarkably increased. For this reason, the number of ceramic bodies having electrode patterns tends to increase more and more.
As the number of ceramic bodies increases, a problem arises in the stacking accuracy of these. Increasing the number of layers of the ceramic body and miniaturizing the ceramic body increases the probability of occurrence of stacking error, and increases the variation of capacitor characteristics and the occurrence of defects due to stacking error. The conventional method for detecting the stacking deviation of the ceramic body as described above is to print an electrode pattern on the ceramic body at the same time by printing a mark of an arbitrary shape to obtain an end face of a chip-type multilayer capacitor. And the above marks exposed on the side were inspected. As described above, in the chipped multilayer capacitor, the marks exposed on the end faces and the side faces are inspected for stacking deviation in the length direction and the width direction.

[0004]

However, in the above-described conventional method for inspecting the stacking error, in order to inspect the lengthwise direction and the widthwise direction of the stacking error, the displacement of the mark printed on the ceramic body is determined by the multilayer capacitor. Had to be inspected from two sides, the end face and the side face. Therefore, when the electrode pattern is printed, it is necessary to provide the inspection mark on the ceramic body in the length direction and the width direction. The inspection of the inspection mark is performed by recognizing an image of the magnified image with a microscope. But,
Inspecting the multilayer capacitor from two directions as described above has a problem that the image recognition process is complicated.

The present invention has been made to solve the above problems, and is capable of simultaneously inspecting stacking deviations in the length direction, the width direction, and the diagonal direction from only one direction of a multilayer capacitor, and stacking multilayer electronic components. An object of the present invention is to provide a check mark for detecting a deviation and a method for inspecting a lamination deviation of a laminated electronic component.

[0006]

(First Invention) In order to achieve the above object, a check mark for detecting a stacking error of a multilayer electronic component in the present invention is a conductive member (12 in FIG. 1).
The substrate (11 in FIG. 1) on which is formed is laminated, adhered, and then cut into a predetermined shape to obtain a single electronic component. On the virtual line to be cut (1 to 4 in FIG. 1) for obtaining a single electronic component, and at a right angle to the virtual line (1 to 4) to be cut, and parallel to each other. A pair of check marks each having an opposite side having the same length and an inclined side opposite to the opposite side (see FIG. 1).
13) and.

(Second Invention) A lamination deviation inspection method for a laminated electronic component according to the present invention comprises: when laminating a substrate (11) on which a pair of check marks (13) are formed together with a conductive member (12), The pair of check marks (13) appearing on the cross section of the laminated board are enlarged and inspected, and the width direction, the length direction of the laminated board, Alternatively, it is characterized by detecting a deviation in an oblique direction.

[0008]

[Operation] (First and second inventions)
A conductive member is formed, and on an imaginary line to be cut for obtaining a single electronic component, a parallel opposing side having the same length and an opposite side to the imaginary line to be cut are formed. A pair of check marks are formed with sides that are inclined to the sides. Therefore, the pair of check mark groups are exposed on the side surface of the laminated substrate. When there is no stacking error, the lengths of the pair of check marks are all the same, and the check marks are arranged at regular intervals. In case of stacking deviation in the width direction,
A long or short pair of check marks is detected. Further, in the case of stacking deviation in the length direction, a pair of check marks whose positions are displaced is detected.
Furthermore, in the case of stacking deviation in the diagonal direction, a pair of check marks having different lengths in the left-right direction or a pair of check marks having a misaligned position are detected. Further, in the case of stacking deviation in the oblique direction, the distance between the pair of check marks is detected wider than in the normal state. As described above, the lengthwise direction, the widthwise direction, and the oblique direction of the stacking displacement are detected by the inspection from one direction of the stacked substrate. In the present specification,
The shorter one of the electrode patterns shown in FIG. 1 is the width direction,
The longer side is referred to as the length direction. Similarly, the shorter electrode pattern is referred to as an end face and the longer electrode direction is referred to as a side face.

[0009]

EXAMPLE FIG. 1 is an example of the present invention and is a diagram for explaining a ceramic body of a multilayer capacitor. First, the dielectric ceramic powder is kneaded with an organic binder to form a slurry. The slurry forms the ceramic body 11 from a ceramic sheet having a thickness of, for example, 10 μm using a doctor blade or the like. On the ceramic body 11, an electrode pattern 12 to be an internal electrode is formed by screen printing, and at the same time, a check mark 13 for inspecting a stacking error is formed.

The position where the check mark 13 is printed is set so that the central portion of the check mark 13 comes on the virtual lines 1 to 4 for cutting. Further, the check mark 13 has a pair of shapes, and has opposing sides of the same length that are parallel to the planned cutting virtual lines 1 to 4 at a right angle, and sides that are inclined to the opposite side. For example,
The check marks 13 are formed on the cutting lines 1 to 4 with the vertical sides of the right triangles facing each other. The check mark 13 may be provided at one place, but as shown in FIG. 1, it is provided at two places on the side surface side of the ceramic body 11 and their directions are reversed.

The ceramic body 11 on which the electrode pattern 12 and the check mark 13 are formed as described above is punched into a certain shape and then stacked. After that, the ceramic body 11 having a fixed shape is bonded by, for example, thermocompression bonding to obtain a laminated body. This laminated body is cut along a virtual cutting line 1 to 4 by a rotary blade (not shown) to be divided into chips having a predetermined size. External electrodes (not shown) are connected to alternate electrode patterns 12 on the end faces of the laminated chips to form a laminated capacitor. On the other hand, two check marks 13 having different orientations appear on one side surface of the divided chip, and two check marks 13 having the same orientation and different orientations from the one side surface appear on the other side surface.

FIG. 2 is an enlarged view of a side surface of a multilayer capacitor having no stacking deviation, which is an embodiment of the present invention. Reference numeral 21 shown in FIG. 2 indicates a side surface of the ceramic body 11 in which 12 layers are stacked, and the check mark 13 appearing on the side surface 21 is inspected. Check mark 13
As described above, the central portion of the right-angled triangle is formed on the cut-off virtual lines 1 to 4. Therefore, when there is no stacking deviation in the ceramic body 11, as shown in FIG. 2, the central portion of the pair of right triangles has a cutting line (for example, 1).
Are cut at equal intervals by the same length. Therefore, as shown in FIG. 2, the check marks 13 having the same length are arranged at regular intervals. The check mark 13 is magnified by, for example, a microscope (not shown) and analyzed by the image recognition device, so that a deviation on the order of several μm can be detected.

FIG. 3 is an enlarged view of the side surface of the multilayer capacitor in the case where the stacking deviation in the width direction is detected in one embodiment of the present invention. If stacking error occurs in the width direction,
The center part of the right triangle which is the check mark 13 is not cut by the cutting line. For example, in FIG.
Is a check mark in a portion where there is no stacking deviation, and reference numerals 31 to 34 are check marks in a portion where stacking deviation has occurred. Check marks 32 and 33
Is longer than the length of the check mark 13 and is cut by a cutting line near the base of the right triangle. That is, check marks 32, 3 longer than usual
3 and check marks 31, 34 shorter than usual
It can be found in the third and tenth layer ceramic bodies shown in FIG. In this way, the different lengths of the pair of check marks 13 can identify the direction in which the ceramic body is displaced.

FIG. 4 is an enlarged view of the side surface of the multilayer capacitor in the case of detecting the stacking deviation in the length direction according to the embodiment of the present invention. As shown in FIG. 4, the lengths of the check marks 41 to 44 are the same as those of the check mark 13, but when the position is deviated from the check mark 13,
You can know the deviation in the length direction. FIG. 5 is an enlarged view of the side surface of the multilayer capacitor in the case where the stacking deviation in the oblique direction is detected in the embodiment of the present invention. As shown in FIG. 5, the left and right lengths are different, and the distance between the pair of check marks is wider than that of normal check marks.
1 through 54 include both offsets shown in FIGS. That is, when the check marks 51 to 54 as shown in FIG. 5 are found, it is known that the ceramic body is slanted. By providing a pair of check marks at least at one place on the virtual line for cutting as in the present embodiment, it is possible to find the stacking deviation in the width direction, the length direction, and the diagonal direction.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. And
Various design changes can be made without departing from the invention as set forth in the claims. For example, in the present embodiment, the check mark is made to appear on the side surface side of the ceramic body, but even if these are made to appear on the end surface side, the same action and effect are achieved. Also,
The shape of the pair of check marks is not limited to a triangle as long as it has a pair of parallel opposing sides and a side inclined on the side opposite to the opposing sides, and includes shapes other than those of this embodiment.

[0016]

According to the present invention, a check mark having a pair of parallel opposing sides and an edge inclined on the side opposite to the opposing sides is formed on the virtual cutting line of the substrate so that the substrates are laminated. If one side surface is inspected, it is possible to find the stacking deviation in the width direction, the length direction, and the oblique direction of the ceramic body. Therefore, the inspection work and the image recognition for inspecting the stacking error are simple and the inspection efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a ceramic body of a multilayer capacitor according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a side surface of a multilayer capacitor without a stacking error in one embodiment of the present invention.

FIG. 3 is an enlarged view of a side surface of the multilayer capacitor in the case where the stacking deviation in the width direction is detected in the embodiment of the present invention.

FIG. 4 is an enlarged view showing a side surface of the multilayer capacitor in the case where the stacking deviation in the length direction is detected in the embodiment of the present invention.

FIG. 5 is an enlarged view of a side surface of a multilayer capacitor in a case where a stacking deviation in an oblique direction is detected according to an embodiment of the present invention.

FIG. 6 is a diagram for explaining a ceramic body of a multilayer capacitor in a conventional example.

[Explanation of symbols]

11 ... Ceramic body 12 ... Electrode pattern 13 ... Check mark 21 ... Side surface of laminated ceramic body 31 to 34 ... Check mark when displaced in the width direction 41 to 44. ..Check marks when displaced in the longitudinal direction 51 to 54 ... Check marks when displaced in the diagonal direction

Claims (2)

[Claims] 1. A laminated electronic component in which a single electronic component is obtained by laminating and adhering substrates having conductive members formed thereon, and then cutting the substrates into a predetermined shape. An imaginary line to be cut for obtaining a part, and the imaginary line to be cut are arranged so as to be orthogonal to the imaginary line to be cut, and parallel opposite sides having the same length, and a side inclined to the opposite side of the opposite side, A check mark for detecting stacking deviation of a stacked electronic component, wherein a pair of check marks including the check mark are formed. 2. A pair of check marks formed on a cross section of the laminated substrate when a substrate on which the pair of check marks is formed is laminated together with a conductive member, and the inspection mark is enlarged and inspected. A method for inspecting stacking deviation of a laminated electronic component, which detects a deviation in a width direction, a length direction, or an oblique direction of the above-mentioned laminated substrate based on a deviation in length and position.