JPH06120693A - Chip part mounter - Google Patents

Abstract

PURPOSE:To increase the speed of mounting by photographing the images of chip parts during the movement of a mounting head by installing a camera for recognizing the parts on the mounting head side while making operation possible for a prolonged term by automatically exchanging disk packs simultaneously. CONSTITUTION:A chip part mounter has a camera 15 for recognizing parts installed on the mounting head 10 side, an illuminating means lightening the rear of a chip part sucked by a suction nozzle 11 set up on the mounting head side, first and second plane mirrors 30, 31 for inputting the image of the chip part sucked by the suction nozzle 11 fitted on the mounting head side to the camera 15 for recognizing the parts and a feeder section 8 holding disk packs 7 in an exchangeable manner. A stocker section holding spare disk packs in the exchangeable manner and an exchanging means exchanging the disk packs between the feeder section and the stocker section are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component mounting machine using a disk pack in which chip components are accommodated in a storage path that continuously circulates, and more particularly to an image of a chip component adsorbed by a suction nozzle of a mounting head. The present invention relates to a chip component mounting machine having a function of capturing an image with a camera.

[0002]

2. Description of the Related Art In a conventional chip component mounting machine, a component recognition camera is fixed to the main body of the chip component mounting machine. Therefore, the mounting head moves to the component recognition camera position and is temporarily stopped. The chip component sucked by the suction nozzle of the mounting head (or passing through at a predetermined speed) can be imaged by the component recognition camera.

[0003]

By the way, when the mounting head stops (or passes at a predetermined speed) at the position of the component recognition camera for imaging the chip component, the mounting speed of the chip component on the printed circuit board decreases. There is a problem.

In view of the above points, the present invention provides a component recognition camera on the mounting head side so that a shadow image of a chip component can be picked up while the mounting head is moving so that the mounting speed can be increased, and at the same time, the disc can be discriminated. It is an object of the present invention to provide a chip component mounting machine that enables automatic replacement of packs and enables long-term operation.

[0005]

In order to achieve the above object, a chip component mounting machine according to the present invention is provided with a mounting head having a suction nozzle for suctioning a chip component, and a component recognition device mounted on the mounting head side. A camera, an illuminating device attached to the mounting head side to illuminate the back of the chip component sucked by the suction nozzle, and an image of the chip component attached to the mounting head side and sucked by the suction nozzle Means for inputting into the camera for recognizing components, a feeder section for holding a disc pack containing chip components in a continuously circulating storage path in a replaceable manner, and a spare disc pack for holding in a replaceable manner. It is configured to include a stocker unit and an exchange unit for exchanging the disc pack between the feeder unit and the stocker unit.

[0006]

In the chip component mounting machine of the present invention, the mounting head side is provided with the illumination means, the reflection means, and the component recognition camera, and the image of the chip component adsorbed by the suction nozzle of the mounting head is displayed on the mounting head. It can be captured by a part recognition camera while moving. Therefore, compared to the case where the component recognition camera is fixed to the main body of the chip component mounting machine (base or the like), the chip components can be mounted on the printed circuit board more efficiently. Further, by holding the disc pack in the feeder and automatically exchanging the disc pack by taking advantage of the exchangability of the disc pack, it is possible to eliminate the parts shortage and perform continuous operation for a long time. .

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip component mounting machine according to the present invention will be described below with reference to the drawings.

1 to 3 show the overall construction of an embodiment according to the present invention. In these drawings, reference numeral 1 denotes an X-direction guide rail, which is horizontally supported by a main body frame erected on a base 6.
On the other hand, an X-direction slider 2 which is slidable in the X-direction is attached. The X-direction slider 2 is driven in the X-direction by the X-direction driving means. The Y-direction guide shaft 3 is attached to the bracket 2A which is integrated with the X-direction slider 2.
Is fixed, and the Y-direction ball screw shaft 4 is rotatably supported. The Y-direction guide shaft 3 penetrates the Y-direction slide block 5 slidably, and the Y-direction ball screw shaft 4 is screwed to the Y-direction slide block 5. Then, the Y direction slide block 5 is driven in the Y direction by rotationally driving the Y direction ball screw shaft 4.

The mounting head 10 is fixed to the Y-direction slide block 5 and has a suction nozzle 11 at the bottom. The suction nozzle 11 can move in the Z direction (vertical direction) in conjunction with the vertical shaft 12 protruding above the mounting head 10. A component recognizing camera 15 and a board mark recognizing camera 16 are attached to the mounting head 10 via mounting brackets 13 and 14.

On the base 6, a feeder portion 8 for holding a disc pack 7 containing chip components in a replaceable manner in a continuously circulating storage path is provided, and as shown in FIG. A stocker section 9 for holding the spare disk pack 7 in a replaceable manner is arranged on the surface 6A which is lowered one step in a stepwise manner. The feeder unit 8 and the stocker unit 9 have guides and the like that support the disc packs 7 in a vertically standing state so that they can be freely taken in and out.

Reference numeral 17 in FIG. 2 denotes a printed circuit board on which chip components are to be mounted, and the printed circuit board 17 is positioned and supported at a fixed position by a board positioning mechanism 18.

As shown in FIG. 4, the suction nozzle 11 at the bottom of the mounting head 10 is composed of a nozzle body 20 made of metal or the like and a nozzle cap 21 which is replaceably fitted to the nozzle body 20. . The nozzle cap 21 is made of milky white (translucent) resin or the like, and has a function of partially transmitting light and irregular reflection.

The illuminating means is for irradiating the nozzle cap 21 with sideways light when the mounting head 10 is moving (that is, the suction nozzle 11 is in the raised position), and is made of aluminum or the like. It is composed of an annular illumination bracket 22 made of an opaque material and a plurality of light emitting diodes (LED) 23 fixed to the illumination bracket 22. A slit 24 is formed on the inner peripheral surface of the annular illumination bracket 22, and lateral light from the light emitting diode 23 is transmitted through the slit 24 to the nozzle cap 2
1 will be irradiated.

The reflecting means is arranged obliquely below the suction nozzle 11 and has a first plane mirror 30 which is tilted at an angle of approximately 45 degrees with respect to an extension line (that is, a vertical line) of the central axis of the suction nozzle 11. It is tilted at a lower position of the component recognition camera 15 and is tilted at about 45 degrees with respect to an extension line (that is, a vertical line) of the central axis of the component recognition camera 15 from the first plane mirror 30. The second which receives the reflected light of
And the plane mirror 31 of. A mounting plate 32 is fixed to the side surface of the mounting head 10, and a support arm 34 is mounted on the mounting plate 32 via a linear guide 33 in a direction perpendicular to the plane of FIG. . The first plane mirror 30 is fixed to the inclined tip surface of the support arm 34. The support arm 34 is driven in the Y direction by the air cylinder 35 mounted on the mounting plate 32. In this way, the support arm 34 and the first plane mirror 30 are made movable in the Y direction by shifting their positions from directly below the suction nozzle 11 to the side,
This is to prevent the suction nozzle 11 from sucking the chip component 40 from the feeder portion 8 and obstructing the mounting operation of the chip component 40 on the printed circuit board 17. Also,
The second plane mirror 31 is a support arm 3 fixed to the mounting bracket 13.
It is fixed to the inclined front end surface of 6.

As shown in FIGS. 3, 5 and 6, the replacement means for replacing the disk pack 7 between the feeder portion 8 and the stocker portion 9 is an X-direction guide rail 51 fixed to the side surface of the base. X-direction moving frame 52 slidably supported in the X-direction by means of a linear guide 53 fixed to the X-direction moving frame 52, and an inverted L-shape supported slidably in the Z-direction (vertical direction). The support frame 54, a Y-direction slider 56 slidably supported in the Y direction by a linear guide 55 fixed to the horizontal portion of the inverted L-shaped support frame 54, and fixedly integrated with the Y-direction slider 56. The hand unit 50 is assembled on the support plate 57. Two hand portions 50 are provided as shown in FIG. 5 (only one hand portion is shown in FIGS. 3 and 6, but an inverted L-shaped support frame 54 is provided.
There is also a linear guide, a Y-direction slider, and a support plate integral with this on the back side of, and another hand portion is provided. ).

A motor 62 is provided with an X-direction ball screw shaft 61 screwed into the ball screw nut 60 on the X-direction moving frame 52 side.
The X-direction moving frame 52 is driven in the X-direction by being rotationally driven by. A Z-direction ball screw shaft 63 is rotatably supported on the X-direction moving frame 52, and the Z-direction ball screw shaft 63 is screwed into a ball screw nut 64 on the side of the inverted L-shaped support frame 54. There is. Therefore, the Z-direction ball screw shaft 63
Is rotated by a motor 65, the inverted L-shaped support frame 54 is driven in the Z direction (vertical direction). Further, a Y-direction ball screw shaft 66 is rotatably supported on the inverted L-shaped support frame 54, and the Y-direction ball screw shaft 66 is screwed into a ball screw nut 67 on the Y-direction slider 56 side. .
Therefore, by rotating the Y direction ball screw shaft 66 by the motor 68, the Y direction slider 56 is driven in the Y direction (lateral direction). As a result, each hand unit 50 moves in the XY direction.
-Moveable in Z direction.

As shown in FIG. 6, each of the hand parts 50 is attached to the support plate 57 via a thrust bearing 80 so as to be slidable in the vertical direction, and slide rods 81A and 81B.
Parallel bars 70A and 70B that are fixed to the ends of the slide rods 81A and 81B and are movable in parallel, and engagement hooks 71A and 71B that are fixed to the tips of the parallel bars 70A and 70B so as to face each other, Parallel bars 70A, 70
The ball plungers 72 (parts in which the balls are urged in the protruding direction by springs) are attached to the front end surfaces of the Bs. U-shaped engaging members 82 are fixed to the middle portions of the slide rods 81A and 81B, respectively. A rotary actuator 83 is attached to the support plate 57, and a pin 85 that engages with the U-shaped engaging member 82 is fixed to a rotary plate 84 fixed to the rotary shaft of the rotary actuator 83.

The engaging hooks 71A and 71B have a shape capable of engaging with the replacement engaging portions 86 above and below the rear end of the disc pack 7, and the rotary plate 83 can be rotated clockwise by the rotary actuator 83. With both hooks 71A, 71
By narrowing the interval of B and reversing it, the interval between both hooks can be widened, and by combining the movement operation of the support plate 57 in the XYZ directions and the opening / closing operation of those hooks 71A and 71B, the disk The pack 7 can be held, transported or released.

As shown in FIG. 3, the inverted L-shaped support frame 54 has an upper side guide member 90 fixed to the upper side of the disc pack 7 held by each hand portion 50.

Next, the operation of the above embodiment will be described. A board mark for positioning (which has a fixed positional relationship with a component mounting position on the printed circuit board) on the printed circuit board 17 which is positioned and supported at a constant position by the circuit board positioning mechanism 18 of FIG. 2 is attached to the mounting head 10. Recognition camera 1
Image at 6. Since the positional relationship between the mounting head 10 and the board mark recognition camera 16 is known, the video signal of the board mark recognition camera 16 is processed from the image of the positioning board mark on the printed board by the board mark recognition camera 16. The image processing apparatus can accurately recognize the component mounting position on the printed circuit board.

As shown in FIGS. 2 and 3, there is a suction stage ST at the right end of the upper side of the disc pack 7 for exposing chip components so that the suction head 11 can be designated by moving the mounting head 10 in the XY directions. Disc pack 7
To the position directly above the adsorption stage ST. At this time, the air cylinder 35 works to retract the first plane mirror 30 and the support arm 34 to a position where they do not interfere with the suction operation. After that, the suction nozzle 11 performs a descending operation to pick up a predetermined chip component by vacuum suction and return to the ascending position,
The movement to the component mounting position on the printed circuit board 17 is started.

After the suction nozzle 11 is returned to the raised position, the first flat mirror 30 and the support arm 34 are also in their original positions, that is, as shown in FIG. 7, the first flat mirror 30 is located directly below the suction nozzle 11. Return to become. Then, during the movement period of the mounting head 10 to the component mounting position, the light emitting diode 23 of the illuminating means is caused to emit light and the suction nozzle 1
1 The nozzle cap 21 forming the lower end portion is irradiated with light in the lateral direction. The nozzle cap 21 is made of milky white (semi-transparent) resin or the like and has a function of partially transmitting light and irregular reflection of light, so that the nozzle cap 2 as shown in FIG.
The back of the chip component 40 sucked and held at the lower end of 1 shines brightly. As a result, a shadow image (on the bottom surface of the chip component) in which the inside of the outline seen from the bottom surface side of the chip component 40 becomes a dark shadow and the background becomes bright is shown in FIG. It is reflected toward the plane mirror 31, and is further reflected toward the component recognition camera 15 facing downward by the second plane mirror 31. As a result, the component recognition camera 15 can capture the image of the outline of the bottom surface of the chip component 40. At the same time, the side image of the chip component 40 is directly reflected by the second plane mirror 31 and input to the component recognition camera 15, as can be seen from FIG. As a result, the image obtained by the component recognition camera 15 is as shown in FIG. 8, in which the image (a) is the bottom surface of the chip component and the image (b) is the side surface of the chip component. Then, the component recognition camera 15
With the image processing device for processing the video signal of (1), the suction posture of the chip component 40 can be recognized from the image (a), and the positional deviation of the chip component 40 with respect to the center position of the nozzle cap 21 can be detected (the component recognition camera 15 and The positional relationship with the center of the nozzle cap 21 can be known in advance). Further, the component height can be detected from the position of the straight line (c) of the image on the side of the chip component (b) which is in contact with the outline on the side opposite to the suction nozzle (since the height of the suction nozzle lower end face is known). . As a result, it becomes possible to detect the height of each chip component and control the suction nozzle descending amount at the time of mounting with high accuracy. This means that it is not necessary to separately provide a component height detection sensor or move the mounting head to the position of the height detection sensor, simplify the mechanism, and improve the efficiency of chip component mounting. Is effective for.

Image recognition of the chip component 40 is completed before the mounting head 10 reaches the component mounting position on the printed circuit board, and the mounting head 10 shifts the position of the chip component 40 with respect to the suction nozzle 11. The mounting on the printed circuit board 17 is performed in consideration. That is, the stop position of the mounting head 10 is determined so as to cancel the positional deviation of the chip component 40 so that the chip component 40 is accurately placed at the component mounting position. Even when the chip component is mounted, the air cylinder 35 works to retract the first plane mirror 30 and the support arm 34 to a position where they do not interfere with the mounting operation of the suction nozzle 11. After mounting the chip component 40 on the printed circuit board, the mounting head 10 uses the designated disk pack 7 to execute the mounting of the next chip component.
To the position directly above the adsorption stage ST.

Each disc pack 7 is provided in the feeder section 8.
A component sensor for detecting the remaining amount of chip components therein is provided, and when it is detected that there is no chip component in a specific disk pack 7, the exchanging means having the hand unit 50 starts operating based on the detection result. That is, the first hand unit 50 on the left side of FIG.
5 is chucked from the stocker unit 9 and moved to the feeder unit 8. The empty second disk pack of the feeder unit 8 is taken out by the second hand unit 50 on the right side of FIG. 5, and the X direction of the first and second hand units 50 is taken out. First hand unit 50 for the array pitch
Moves to insert a new disc pack into the feeder unit 8. At this time, the deviation between the required amount of insertion of the disc pack 7 into the feeder portion 8 and the movement amount of the hand portion 50 at the time of insertion is absorbed by the ball plunger 72 fixed to the tip surfaces of the parallel bars 70A and 70B. There is. That is, at the end of the inserting operation, the ball of the ball plunger 72 contacts the rear end surface of the disc pack 7 and pushes the disc pack 7 until it is positioned by the feeder portion 8.

As described above, by providing the two hand parts 50, the replacement work time can be shortened (halved) as compared with the case where the number of the hand parts 50 is one.

[0026]

As described above, according to the chip component mounting machine of the present invention, by providing the component recognition camera on the mounting head side, it is possible to capture the image of the chip component adsorbed while the mounting head is moving. As a result, the mounting speed can be increased. In addition, since it has an automatic disc pack exchange function, it can be operated for a long time.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a chip component mounting machine according to the present invention.

FIG. 2 is a side sectional view of the same.

FIG. 3 is a side sectional view showing a disc pack exchanging means in the embodiment.

FIG. 4 is an enlarged front sectional view showing a mechanism portion for capturing a shadow image of a chip component sucked by a suction nozzle in the embodiment.

FIG. 5 is a perspective view for explaining a schematic configuration and operation of a disc pack exchange unit.

FIG. 6 is an enlarged side cross-sectional view showing a main part configuration of a disc pack exchange unit.

FIG. 7 is an explanatory diagram showing image capturing of a chip component.

FIG. 8 is an explanatory diagram showing an example of an image captured by a component recognition camera.

[Explanation of symbols]

 6 base 7 disk pack 8 feeder section 9 stocker section 10 mounting head 11 suction nozzle 15 component recognition camera 16 board mark recognition camera 17 printed board 18 board positioning mechanism 20 nozzle body 21 nozzle cap 23 light emitting diode 30, 31 plane mirror 35 Air cylinder 50 Hand part 54 Reverse L-shaped support frame 57 Support plate 70A, 70B Parallel bar 71A, 71B Engaging hook

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hitoshi Nakayama 1-13-1 Nihonbashi, Chuo-ku, Tokyo Tea Decay Co., Ltd. (72) Inventor Kazuya Abe 1-13-1 Nihonbashi, Chuo-ku, Tokyo DK Co., Ltd. (72) Inventor Masakazu Toki 1-13-1 Nihonbashi, Chuo-ku, Tokyo DT Decay Co., Ltd.

Claims (6)

[Claims] 1. A mounting head having a suction nozzle for sucking a chip component, a component recognition camera mounted on the mounting head side, and a chip component mounted on the mounting head side and sucked by the suction nozzle. Lighting means for illuminating the back of the device, reflecting means for inputting the image of the chip component, which is attached to the mounting head side and adsorbed by the adsorption nozzle, to the camera for recognizing the component, and a storage that continuously circulates. A feeder part that holds a disc pack containing chip parts in the path in a replaceable manner, a stocker part that holds a spare disc pack in a replaceable manner, and a disc pack exchange between the feeder part and the stocker part And a chip component mounting machine. 2. The chip component mounting machine according to claim 1, wherein a board mark recognition camera is mounted on the mounting head side. 3. The chip component mounting machine according to claim 1, wherein the exchanging means includes a plurality of hand portions capable of holding a disc pack. 4. The reflecting means includes a first plane mirror tilted below the suction nozzle and a second plane mirror tilted below the component recognition camera. Item 1. A chip component mounting machine according to item 1. 5. The chip component mounting machine according to claim 4, wherein the image of the lower surface of the chip component sucked by the suction nozzle is reflected by the first and second plane mirrors and input to the component recognition camera. 6. The chip component mounting machine according to claim 4, wherein the image of the side surface of the chip component sucked by the suction nozzle is reflected only by the second plane mirror and input to the camera for component recognition.