JPH06120640A - Production of flexible printed wiring board - Google Patents
Production of flexible printed wiring boardInfo
- Publication number
- JPH06120640A JPH06120640A JP26350992A JP26350992A JPH06120640A JP H06120640 A JPH06120640 A JP H06120640A JP 26350992 A JP26350992 A JP 26350992A JP 26350992 A JP26350992 A JP 26350992A JP H06120640 A JPH06120640 A JP H06120640A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resin
- hole
- wiring board
- printed wiring
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、高密度実装用フレキシ
ブルプリント配線板の製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a flexible printed wiring board for high density mounting.
【0002】[0002]
【従来の技術】フレキシブルプリント配線板は、一般に
次の様な方法で製造されている。すなわち、フレキシブ
ル基板に、パンチ又はドリルで穴あけしたのち、無電解
銅めっきや電解銅めっきでスルーホールを形成したの
ち、回路となる部分にエッチングレジストを形成し、塩
化銅/塩酸よりなるエッチング液で不要の銅を除去し、
次にエッチングレジストを除去して、フレキシブルプリ
ント配線板を製造している。2. Description of the Related Art Flexible printed wiring boards are generally manufactured by the following method. That is, after punching or drilling holes on a flexible substrate, through holes are formed by electroless copper plating or electrolytic copper plating, and then an etching resist is formed on a portion to be a circuit, and an etching solution containing copper chloride / hydrochloric acid is used. Remove unnecessary copper,
Next, the etching resist is removed to manufacture a flexible printed wiring board.
【0003】[0003]
【発明が解決しようとする課題】ところが、上記製造法
によって作製したフレキシブルプリント配線板の配線パ
ターンは図2に示したようになる。すなわち、A面にあ
る表面の実装型部品のはんだ付け用端子7から配線を裏
面(B面)に引き出す場合、図に示したように端子7か
らラインをスルーホール2を経由してB面ライン8と接
続する。このため、端子間にスルーホールを設ける部分
が必要で、端子間Loを挟め、高密度に部品を実装する
ことが困難であった。However, the wiring pattern of the flexible printed wiring board manufactured by the above manufacturing method is as shown in FIG. That is, when the wiring is pulled out from the soldering terminal 7 of the surface mount type component on the A side to the back side (B side), the line from the terminal 7 is passed through the through hole 2 and the B side line as shown in the figure. Connect with 8. Therefore, it is necessary to provide a portion where a through hole is provided between the terminals, and it is difficult to mount the parts at high density by sandwiching the Lo between the terminals.
【0004】本発明は、このような点に鑑みてなされた
もので、部品を高密度に実装できるフレキシブルプリン
ト配線板の製造法を提供するものである。The present invention has been made in view of the above circumstances, and provides a method for manufacturing a flexible printed wiring board in which components can be mounted at high density.
【0005】[0005]
【課題を解決するための手段】本発明は、両面に金属箔
を有するフレキシブル基板に穴あけした後、金属めっき
する工程、感光性樹脂フィルムをラミネートし、露光、
現象によりスルーホール内に感光性樹脂を充填する工
程、感光性樹脂表面を粗化し、金属めっきする工程、エ
ッチング用レジストパターンを形成した後、不要の金属
箔層をエッチング除去したのち、前記エッチング用レジ
ストを除去する工程よりなることを特徴とするフレキシ
ブルプリント配線板の製造法である。According to the present invention, a flexible substrate having metal foils on both sides thereof is perforated, and then metal plating is performed, a photosensitive resin film is laminated and exposed.
Due to the phenomenon, the step of filling the through hole with the photosensitive resin, the step of roughening the photosensitive resin surface and metal plating, forming the resist pattern for etching, and then removing the unnecessary metal foil layer by etching, A method of manufacturing a flexible printed wiring board, comprising a step of removing a resist.
【0006】詳細な説明を図1の工程別断面図を用いて
行う。図1(a)は両面に金属箔を有するフレキシブル
基板1である。この基板は、市販されているプリント配
線板用基板なら何れでも使用可能である。例えば、ポリ
イミドフィルムと銅箔を接着剤で一体化したフレキシブ
ル基板F−30VC2RC25C21(ニッカン工業株
式会社製、商品名)や接着剤のない、ポリイミド製フレ
キシブル基板MCF−5510I(日立化成工業株式会
社製、商品名)等があり、寸法変化率の小さいものが好
ましい。A detailed description will be given with reference to the sectional views for each step of FIG. FIG. 1A shows a flexible substrate 1 having metal foils on both sides. This substrate may be any commercially available printed wiring board substrate. For example, a polyimide film and a flexible substrate F-30VC a copper foil integrated with an adhesive 2 RC25C21 (Nikkan Kogyo Co., Ltd., trade name) and adhesive-free, polyimide flexible substrate MCF-5510I (Hitachi Chemical Co., Ltd. Manufactured, product name, etc., and those having a small dimensional change rate are preferable.
【0007】図(b)に基板にスルーホール2を設けた
状態を示した。スルーホールの形成法は特に制限はな
く、ドリル穴あけ、バンチ穴あけ、レーザ穴あけ等何れ
の方法でも良い。FIG. 1B shows a state in which the through hole 2 is provided on the substrate. The method of forming the through hole is not particularly limited, and any method such as drilling, bunching, and laser drilling may be used.
【0008】次に図(c)に示した様に、めっき銅3を
基板表面とスルーホール内壁に形成する。このめっき銅
形成法も、特に制限するものではなく、市販の無電解銅
めっき液CUST201、CUST1000(日立化成
工業株式会社製、商品名)や電気銅めっきのピロリン酸
銅めっき浴や硫酸銅めっき浴等の単独、併用ができる。Next, as shown in FIG. 1C, plated copper 3 is formed on the surface of the substrate and the inner wall of the through hole. This plating copper forming method is also not particularly limited, and commercially available electroless copper plating solutions CUST201, CUST1000 (manufactured by Hitachi Chemical Co., Ltd., trade name) and electrolytic copper plating pyrophosphate copper plating baths and copper sulfate plating baths. Etc. can be used alone or in combination.
【0009】次に、図1(d)図に示した様に、基板の
片面から、感光性樹脂フィルム4をホットロールラシネ
タや真空方式ホットロールラミネータを用いて基板に貼
り付けると共にスルーホール内に充填したのち露光し、
さらに、トリクロルエタンやアルカリ性水溶液を用い
て、未露光部を除去する現象処理を行う。感光性樹脂フ
ィルム4としては、市販のフォテックスSR−300
0、フォテックスSR−2300(日立化成工業株式会
社製、商品名)が使用可能である。なお、感光性樹脂を
水溶液に完全に充填させるために、ロールラミネート条
件の適性化や必要に応じて基板をあらかじめ加熱しても
良い。また、硬化不十分の場合は、現像工程に加熱や再
露光を行っても良い。Next, as shown in FIG. 1 (d), the photosensitive resin film 4 is attached to the substrate from one surface of the substrate by using a hot roll laminator or a vacuum hot roll laminator and the inside of the through hole. And then exposed,
Further, using trichloroethane or an alkaline aqueous solution, a phenomenon process of removing the unexposed portion is performed. As the photosensitive resin film 4, commercially available Photex SR-300
0, Photex SR-2300 (manufactured by Hitachi Chemical Co., Ltd., trade name) can be used. In addition, in order to completely fill the aqueous solution with the photosensitive resin, the substrate may be preliminarily heated as appropriate by optimizing the roll laminating conditions. When the curing is insufficient, heating or re-exposure may be performed in the developing process.
【0010】次に、感光性樹脂表面を粗面化し、次工程
で形成するめっき銅との接着力を向上させる。この粗面
化方法としては、プラズマ処理や化学粗化が可能であ
る。化学粗化液としては、アルカリ性の過マンガン酸水
溶液、酸性のクロム酸水溶液等が使用可能である。ただ
し、ベルトサンダーやロールブラン等の機械的研磨は基
板を収縮や膨張を招くので好ましくない。Next, the surface of the photosensitive resin is roughened to improve the adhesive force with the plated copper formed in the next step. As this roughening method, plasma treatment or chemical roughening is possible. As the chemical roughening liquid, an alkaline aqueous solution of permanganate, an acidic aqueous solution of chromic acid, or the like can be used. However, mechanical polishing such as a belt sander or a roll blanc causes contraction and expansion of the substrate, which is not preferable.
【0011】次に、図1(e)で示した様に、前記と同
様の方法でめっき銅3’を基板表面に形成する。更に、
この表面にエッチング用レジストパターンを形成した
後、不要の金属銅をエッチング除去したのち、前記エッ
チング用レジストを除去することによって、図1(f)
に示したフレキシブルプリント配線板を製造することが
できる。エッチング用レジストととしては、市販品が使
用可能で、例えば、アルカリ性現像型のフォテック87
2(日立化成工業株式会社製、商品名)や溶剤現像型の
リストンT−1206(デュポン社製、商品名)等を用
いることができる。Next, as shown in FIG. 1E, plated copper 3'is formed on the surface of the substrate by the same method as described above. Furthermore,
After forming an etching resist pattern on this surface, the unnecessary metal copper is removed by etching, and then the etching resist is removed.
The flexible printed wiring board shown in can be manufactured. As the etching resist, a commercially available product can be used.
2 (manufactured by Hitachi Chemical Co., Ltd., trade name), solvent development type Liston T-1206 (manufactured by DuPont, trade name), and the like can be used.
【0012】[0012]
【作用】本発明によるフレキシブルプリント配線板で
は、図3に示した様に、部品端子部7にスルーホール2
を設け、裏面のライン8に接続できる。このような配線
パターンを形成しても端子7の表面には穴が無く平坦で
あるので、はんだ接続してもはんだが穴から流出するこ
とがなく、はんだ接続信頼を確保できる。また、端子間
隔は、従来のL0からL1に縮めることができるので、部
品を高密度に実装できる。In the flexible printed wiring board according to the present invention, as shown in FIG.
Can be connected to the line 8 on the back surface. Even if such a wiring pattern is formed, the surface of the terminal 7 has no holes and is flat, so that solder does not flow out from the holes even when solder connection is made, and solder connection reliability can be secured. Further, since the terminal interval can be reduced from the conventional L 0 to L 1 , components can be mounted at high density.
【0013】[0013]
【実施例】1)ポリイミド製無接着剤フレキシブル基板
MCF−5510I(日立化成工業製)にドリル穴あけ
(最小径φ0.2mm)したのち、無電解銅めっき用触
媒液HS−101B(日立化成工業株式会社製、商品
名)に浸漬、水洗後、無電解銅めっき液CUST−20
1(日立化成工業株式会社製、商品名)に室温で20分
間浸漬し、厚さ約0.3μmのめっき銅皮膜を形成す
る。更に、硫酸銅めっき液に浸漬し、電流密度3A/d
m2、めっき時間30分で厚さ15〜20μmのめっき
銅を形成した。 2)次に感光性樹脂フィルムフォテックSR−3000
(日立化成工業株式会社製、商品名)の厚さ70μmの
ものをB面に(端子を形成しない面)からホットロール
ラミネートした。この条件は、ロール温度130℃、圧
力40psi、送り速度0.3m/分である。 3)フォトマスクを重ね、130mJ/cm2の条件で
露光後、トリクロルエタン(18℃、スプレー圧力1.
6kg/cm2)で90秒間現像する。次に1.0J/
cm2で再度露光させたのち、150℃で40分間加熱
した。 4)次に、感光性樹脂表面を粗面化するために、アルカ
リ性過マンガン酸水溶液(NaOH26g/l、KMn
O460g/l、温度50℃)に15分間浸漬後、前記
1)と同様の方法でめっき銅を形成した。 5)次に、エッチング用レジストとしてフォテック87
2(厚さ25μm)をホットロールラミネータで両面に
形成した。この条件は、ロール温度110℃、圧力30
psi、送り速度1.1m/分である。 6)フォトマスクを重ね、65mJ/cm2の条件で露
光後、3%のNaOH水溶液(40℃)で60秒間現像
後、塩化銅系エッチング液で不要の銅を除去した。次
に、10%のNaOH水溶液(45℃)に90秒間浸漬
してエッチング用レジストを除去した。[Examples] 1) A polyimide adhesive-free flexible substrate MCF-5510I (manufactured by Hitachi Chemical Co., Ltd.) was drilled (minimum diameter φ0.2 mm), and then a catalyst solution HS-101B for electroless copper plating (Hitachi Chemical Co., Ltd.) Made in the company, product name), soaked in water, washed with water, electroless copper plating solution CUST-20
1 (manufactured by Hitachi Chemical Co., Ltd., trade name) is immersed at room temperature for 20 minutes to form a plated copper film having a thickness of about 0.3 μm. Furthermore, it is immersed in a copper sulfate plating solution to obtain a current density of 3 A / d.
m 2 and a plating time of 30 minutes formed plated copper having a thickness of 15 to 20 μm. 2) Next, photosensitive resin film, Fotec SR-3000
(Hitachi Chemical Co., Ltd., trade name) with a thickness of 70 μm was hot-roll laminated on the B side from the side on which the terminals were not formed. The conditions are a roll temperature of 130 ° C., a pressure of 40 psi, and a feed rate of 0.3 m / min. 3) Photomasks were overlaid, exposed under the condition of 130 mJ / cm 2 , and then trichloroethane (18 ° C., spray pressure 1.
Develop at 6 kg / cm 2 ) for 90 seconds. Next is 1.0 J /
After exposing again at cm 2, it was heated at 150 ° C. for 40 minutes. 4) Next, in order to roughen the surface of the photosensitive resin, an aqueous alkaline permanganate solution (NaOH 26 g / l, KMn) is used.
After dipping in O 4 60 g / l, temperature 50 ° C.) for 15 minutes, plated copper was formed by the same method as in 1) above. 5) Next, as an etching resist, Photec 87
2 (thickness 25 μm) was formed on both sides by a hot roll laminator. This condition is roll temperature 110 ℃, pressure 30
psi, feed rate 1.1 m / min. 6) A photomask was overlaid, exposed under conditions of 65 mJ / cm 2 , and developed for 60 seconds with a 3% NaOH aqueous solution (40 ° C.), and then unnecessary copper was removed with a copper chloride-based etching solution. Next, the etching resist was removed by immersing it in a 10% NaOH aqueous solution (45 ° C.) for 90 seconds.
【0014】比較例 1)の実施例の工程のうち、2)、3)、4)の工程を
除いてフレキシブルプリント配線板を製造した。ただ
し、使用した穴あけデータ及びフォトマスクパターンは
実施例の場合と異なる。COMPARATIVE EXAMPLE A flexible printed wiring board was manufactured except for the steps 2), 3) and 4) in the steps of the example of Comparative Example 1). However, the drilling data and photomask pattern used are different from those in the example.
【0015】[0015]
【発明の効果】本発明によるフレキシブルプリント配線
板は、表実装型抵抗やコンデンサを高密度に実装できた
ため、比較例に比べて約20%基板サイズを小さくする
ことができた。また、感光性樹脂をスルーホール内に充
填する作業を基板に加えられる応力の小さいホットロー
ルラシネータを用いたため、寸法変化率は比較例とほぼ
同等であり、製造安定性に問題はなかった。In the flexible printed wiring board according to the present invention, the surface mounting resistors and capacitors can be mounted at a high density, so that the substrate size can be reduced by about 20% as compared with the comparative example. Further, since the hot roll lasing machine with a small stress applied to the substrate for filling the photosensitive resin into the through holes was used, the dimensional change rate was almost the same as that of the comparative example, and there was no problem in manufacturing stability.
【図1】本発明の一実施例を示す製造工程別の断面図で
ある。FIG. 1 is a cross-sectional view of each manufacturing process showing an embodiment of the present invention.
【図2】従来例の配線パターンを示す上面図である。FIG. 2 is a top view showing a wiring pattern of a conventional example.
【図3】本発明の一実施例の配線パターンを示す上面図
である。FIG. 3 is a top view showing a wiring pattern according to an embodiment of the present invention.
1.フレキシブル基板 2.スルーホール 3,3’.めっき銅 4.感光性樹脂 5.平坦端子 6.ライン 7.A面の端子 8.B面のライン 1. Flexible substrate 2. Through hole 3,3 '. Plated copper 4. Photosensitive resin 5. Flat terminal 6. Line 7. A side terminal 8. Line on side B
Claims (1)
キシブルプリント配線板の製造法。 (A)両面に金属箔を有するフレキシブル基板に、穴あ
けした後、金属めっきする工程。 (B)感光性樹脂フィルムをラミネートし、露光、現象
によりスルーホール内に感光性樹脂を充填する工程。 (C)感光性樹脂表面を粗化し、金属めっきする工程。 (D)エッチング要レジストパターンを形成した後、不
要の金属箔をエッチング除去したのち、前記エッチング
用レジストを除去する工程。1. A method for manufacturing a flexible printed wiring board, which comprises the following steps. (A) A step of metal-plating after perforating a flexible substrate having metal foils on both sides. (B) A step of laminating a photosensitive resin film, and filling the photosensitive resin in the through holes by exposure and a phenomenon. (C) A step of roughening the surface of the photosensitive resin and performing metal plating. (D) A step of removing an unnecessary metal foil by etching after forming a resist pattern for etching, and then removing the etching resist.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26350992A JPH06120640A (en) | 1992-10-01 | 1992-10-01 | Production of flexible printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26350992A JPH06120640A (en) | 1992-10-01 | 1992-10-01 | Production of flexible printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06120640A true JPH06120640A (en) | 1994-04-28 |
Family
ID=17390519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26350992A Pending JPH06120640A (en) | 1992-10-01 | 1992-10-01 | Production of flexible printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06120640A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
JP2010272837A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Electric Ind Ltd | Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board |
US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
US10076032B2 (en) | 2014-03-20 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
-
1992
- 1992-10-01 JP JP26350992A patent/JPH06120640A/en active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010122918A1 (en) * | 2009-04-24 | 2010-10-28 | 住友電気工業株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
JP2010272837A (en) * | 2009-04-24 | 2010-12-02 | Sumitomo Electric Ind Ltd | Substrate for printed wiring board, printed wiring board, and method for producing substrate for printed wiring board |
CN102415222A (en) * | 2009-04-24 | 2012-04-11 | 住友电气工业株式会社 | Substrate for printed wiring board, printed wiring board, and methods for producing same |
EP2475234A2 (en) | 2009-04-24 | 2012-07-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed wiring board, printed wiring board, and methods for producing same |
US10076032B2 (en) | 2014-03-20 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10237976B2 (en) | 2014-03-27 | 2019-03-19 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board |
US10076028B2 (en) | 2015-01-22 | 2018-09-11 | Sumitomo Electric Industries, Ltd. | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board |
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