JPH0611460Y2 - ピンセット形プローブ - Google Patents
ピンセット形プローブInfo
- Publication number
- JPH0611460Y2 JPH0611460Y2 JP16333288U JP16333288U JPH0611460Y2 JP H0611460 Y2 JPH0611460 Y2 JP H0611460Y2 JP 16333288 U JP16333288 U JP 16333288U JP 16333288 U JP16333288 U JP 16333288U JP H0611460 Y2 JPH0611460 Y2 JP H0611460Y2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- shield
- casing
- contact
- base end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 54
- 239000000463 material Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 6
- 239000011162 core material Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 11
- 238000005476 soldering Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 229910052755 nonmetal Inorganic materials 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16333288U JPH0611460Y2 (ja) | 1988-12-16 | 1988-12-16 | ピンセット形プローブ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16333288U JPH0611460Y2 (ja) | 1988-12-16 | 1988-12-16 | ピンセット形プローブ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0283468U JPH0283468U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-28 |
| JPH0611460Y2 true JPH0611460Y2 (ja) | 1994-03-23 |
Family
ID=31447963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16333288U Expired - Lifetime JPH0611460Y2 (ja) | 1988-12-16 | 1988-12-16 | ピンセット形プローブ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611460Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1988
- 1988-12-16 JP JP16333288U patent/JPH0611460Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0283468U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |