JPH0611394U - Mounting structure for heat-generating components on printed wiring boards - Google Patents
Mounting structure for heat-generating components on printed wiring boardsInfo
- Publication number
- JPH0611394U JPH0611394U JP4778592U JP4778592U JPH0611394U JP H0611394 U JPH0611394 U JP H0611394U JP 4778592 U JP4778592 U JP 4778592U JP 4778592 U JP4778592 U JP 4778592U JP H0611394 U JPH0611394 U JP H0611394U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- printed wiring
- wiring board
- generating component
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 放熱性を高める。
【構成】 発熱部品２を放熱板３上に固定し、放熱板３
の下面に突起５を形成する。突起５をプリント配線板１
上に当接させた状態で放熱板３とプリント配線板１をね
じ６によって固定する。発熱部品２とプリント配線板１
が非接触になり、放熱板３とプリント配線板１の間には
隙間ｄが出来る。
(57) [Summary] [Purpose] To improve heat dissipation. [Structure] The heat-generating component 2 is fixed on the heat sink 3,
A protrusion 5 is formed on the lower surface of the. Printed wiring board 1 with protrusions 5
The heat radiating plate 3 and the printed wiring board 1 are fixed with screws 6 in a state where they are in contact with each other. Heat-generating component 2 and printed wiring board 1
Are not in contact with each other, and a gap d is formed between the heat dissipation plate 3 and the printed wiring board 1.
Description
【０００１】[0001]
本考案は、トランジスタ等の発熱部品をプリント配線板に取り付ける発熱部品 取付構造に関する。 The present invention relates to a heat generating component mounting structure for mounting a heat generating component such as a transistor on a printed wiring board.
【０００２】[0002]
プリント配線板にトランジスタ等の発熱部品を実装する場合、発熱部品の昇温 によるその部品自体の性能低下や配線板上の他部品への熱の影響を回避するため に、熱伝導率の高い材質によって形成された放熱板を発熱部品と共にプリント配 線板に取り付けることがある。 When mounting a heat-generating component such as a transistor on the printed wiring board, a material with high thermal conductivity is used to avoid performance deterioration of the component itself due to temperature rise of the heat-generating component and heat influence on other components on the wiring board. The heat dissipation plate formed by is sometimes attached to the printed wiring board together with the heat generating component.
【０００３】 従来のこの種の発熱部品取付構造としては、例えば、実開昭６１−１４６９９ ３号公報に示されるようなものが知られている。As a conventional heat-generating component mounting structure of this type, for example, a structure shown in Japanese Utility Model Laid-Open No. 61-146993 is known.
【０００４】 この発熱部品取付構造は、発熱部品を直接プリント配線板に取り付ける一方で 、放熱板の一部を発熱部品の上面に密接させ、間に発熱部品を挟み込むようにし て放熱板をプリント配線板に取り付けている。そして、この取付構造を用いた場 合には、放熱板とプリント配線板の間に隙間が設けられることとなるため、放熱 板の放熱効率が良好になるうえに、放熱板の下方側スペースへの配線が可能にな ってプリント配線板を有効利用出来るようになる。In this heat generating component mounting structure, the heat generating component is directly attached to the printed wiring board, while a part of the heat radiating plate is brought into close contact with the upper surface of the heat generating component so that the heat generating component is sandwiched between the heat radiating plate and the printed wiring board. It is attached to the board. When this mounting structure is used, a gap is provided between the heat sink and the printed wiring board, so that the heat dissipation efficiency of the heat sink is good and the wiring to the space below the heat sink is improved. It becomes possible to use the printed wiring board effectively.
【０００５】[0005]
しかし、上述した従来の発熱部品取付構造の場合、発熱部品を直接プリント配 線板に密接させて取り付けるため、発熱部品の熱がプリント配線板側に伝達され 、そこに熱がこもり易いという不具合がある。 However, in the case of the conventional heat-generating component mounting structure described above, since the heat-generating component is mounted in close contact with the printed wiring board directly, the heat of the heat-generating component is transferred to the printed wiring board side, and there is the problem that heat easily accumulates there. is there.
【０００６】 そこで本考案はより放熱性に優れたプリント配線板の発熱部品取付構造を提供 しようとするものである。Therefore, the present invention is intended to provide a heat-generating component mounting structure for a printed wiring board, which is more excellent in heat dissipation.
【０００７】[0007]
本考案は上述した課題を解決するための手段として、発熱部品を放熱板に固定 し、放熱板とプリント配線板とを、間にスペーサを介装して相互に連結するよう にした。 As a means for solving the above problems, the present invention fixes a heat-generating component to a heat radiating plate, and connects the heat radiating plate and the printed wiring board to each other with a spacer interposed therebetween.
【０００８】[0008]
発熱部品とプリント配線板が非接触になり、かつ、放熱板とプリント配線板の 間に隙間が出来る。 The heat generating component and the printed wiring board are not in contact, and there is a gap between the heat sink and the printed wiring board.
【０００９】[0009]
次に、本考案の一実施例を図１、図２に基づいて説明する。 Next, an embodiment of the present invention will be described with reference to FIGS.
【００１０】 図面において、１は、プリント配線板であり、２は、このプリント配線板１上 に実装されるトランジスタ等の発熱部品である。また、３は、発熱部品２の放熱 を促進するため放熱板であり、この放熱板３は熱伝導率の高い材質によって断面 略Ｌ字状に形成されていて、その一方の辺（以下、基部３ａと呼ぶ。）の上面に 発熱部品２がねじ４によって取り付けられている。放熱板３の基部３ａの下面側 にはスペーサとしての４つの突起５が一体に設けられており、放熱板３は、この 各突起５の先端をプリント配線板１の上面に当接させた状態でプリント配線板１ にねじ６によって固定されている。尚、図中７は、プリント配線板１上に印刷さ れた導体パターンであり、ｄは、放熱板３の基部３ａとプリント配線板１の間に 設けられた隙間である。In the drawings, 1 is a printed wiring board, and 2 is a heat generating component such as a transistor mounted on the printed wiring board 1. Reference numeral 3 denotes a heat radiating plate for promoting heat radiation of the heat generating component 2. The heat radiating plate 3 is formed of a material having a high thermal conductivity and has a substantially L-shaped cross section, and one side thereof (hereinafter referred to as a base). 3a) is attached to the upper surface of the heat generating component 2 with screws 4. Four projections 5 as spacers are integrally provided on the lower surface side of the base portion 3a of the heat dissipation plate 3, and the heat dissipation plate 3 is in a state where the tips of the projections 5 are brought into contact with the upper surface of the printed wiring board 1. It is fixed to the printed wiring board 1 with screws 6. In the figure, 7 is a conductor pattern printed on the printed wiring board 1, and d is a gap provided between the base 3a of the heat dissipation plate 3 and the printed wiring board 1.
【００１１】 この発熱部品取付構造の場合、放熱板３はプリント配線板１に対して４つの突 起５を介して接触し、発熱部品２は放熱板３の基部３ａの上面側に固定されてい るため、発熱部品２や放熱板３の熱はプリント配線板１側には伝達されずに、専 ら外気に放散される。このため、プリント配線板１に熱がこもるようなことはな い。また、この取付構造の場合、放熱板３とプリント配線板１の間に隙間ｄが形 成されるため、プリント配線板１上の放熱板３の下方位置に導体パターン７を印 刷したり、部品を配置したりすることが可能であり、そのため、プリント配線板 １上の限られたスペースを有効に利用することが出来る。In the case of this heat generating component mounting structure, the heat radiating plate 3 contacts the printed wiring board 1 through the four protrusions 5, and the heat generating component 2 is fixed to the upper surface side of the base portion 3 a of the heat radiating plate 3. Therefore, the heat of the heat generating component 2 and the heat radiating plate 3 is not transferred to the printed wiring board 1 side but is radiated exclusively to the outside air. For this reason, the printed wiring board 1 does not retain heat. Further, in the case of this mounting structure, since the gap d is formed between the heat dissipation plate 3 and the printed wiring board 1, the conductor pattern 7 may be printed on the printed wiring board 1 below the heat dissipation plate 3, It is possible to arrange components, and therefore, the limited space on the printed wiring board 1 can be effectively used.
【００１２】 尚、この考案の実施例は図１、図２に示したものに限るものでなく、例えば、 図３、図４に示すもののように発熱部品２の上面と密接する補助放熱板８をさら に追加するようにしても良く、スペーサとしての突起５も別体のものを放熱板３ とプリント配線板１の間に介装するようにしても良い。また、上記実施例では発 熱部品２を一つずつねじ４によって放熱板３に固定するようにしていたが、図５ に示すように複数の部品支持部９ａを備えたばね部材９を介して複数個同時に放 熱板３に固定するようにしても良い。このばね部材９を用いた場合には左右のば ね弾性部９ｂ形状等を適宜変えることによって形状の異なる複数の部品を同時に 支持固定することが可能である。The embodiment of the present invention is not limited to the one shown in FIGS. 1 and 2, and for example, as shown in FIGS. 3 and 4, the auxiliary heat radiating plate 8 that is in close contact with the upper surface of the heat generating component 2 is used. May be further added, and the protrusions 5 as spacers may be separately provided between the heat sink 3 and the printed wiring board 1. Further, in the above embodiment, the heat-generating components 2 are fixed one by one to the radiator plate 3 by the screws 4, but as shown in FIG. 5, a plurality of component-supporting parts 9a are provided between the plurality of spring members 9. You may make it fix to the heat radiation plate 3 simultaneously at a time. When this spring member 9 is used, it is possible to simultaneously support and fix a plurality of parts having different shapes by appropriately changing the shape of the left and right elastic portions 9b.
【００１３】[0013]
以上のように本考案は、発熱部品を放熱板に固定し、放熱板とプリント配線板 とを、間にスペーサを介装して相互に連結することにより、発熱部品とプリント 配線板が非接触になり、かつ、放熱板とプリント配線板の間に隙間が出来るよう にしたため、放熱板や発熱部品の熱がプリント配線板に直接伝達されて熱がこも ることがなくなり、放熱性が良好になるという効果が得られる。また、放熱板ば かりでなく発熱部品も直接プリント基板上に接触しないため、放熱板の下方側の スペースをより有効に利用出来るという効果も得られる。 As described above, according to the present invention, the heat-generating component is fixed to the heat sink and the heat-radiating plate and the printed wiring board are connected to each other with a spacer interposed therebetween, so that the heat-generating component and the printed wiring board do not contact each other. In addition, since there is a gap between the heat sink and the printed wiring board, the heat of the heat sink and heat-generating components will not be directly transferred to the printed wiring board and the heat will not be trapped, resulting in better heat dissipation. The effect is obtained. Further, not only the heat sink but also the heat generating component does not directly contact the printed circuit board, so that the space below the heat sink can be more effectively used.
【図１】本考案の一実施例を示す側面図。FIG. 1 is a side view showing an embodiment of the present invention.
【図２】同実施例を示す斜視図。FIG. 2 is a perspective view showing the same embodiment.
【図３】本考案の他の実施例を示す斜視図。FIG. 3 is a perspective view showing another embodiment of the present invention.
【図４】同実施例を示す側面図。FIG. 4 is a side view showing the embodiment.
【図５】さらに別の実施例を示す側面図。FIG. 5 is a side view showing still another embodiment.
１…プリント配線板、 ２…発熱部品、 ３…放熱板、 ５…突起（スペーサ）、 ６…ねじ。 DESCRIPTION OF SYMBOLS 1 ... Printed wiring board, 2 ... Exothermic parts, 3 ... Heat sink, 5 ... Protrusion (spacer), 6 ... Screw.
Claims (1)
に取り付ける取付構造において、発熱部品を放熱板に固
定し、この放熱板とプリント配線板とを、間にスペーサ
を介装して相互に連結したことを特徴とするプリント配
線板の発熱部品取付構造。1. In a mounting structure for mounting a heat-generating component on a printed wiring board together with a heat-dissipating component, the heat-generating component is fixed to the heat-dissipating component, and the heat-dissipating component and the printed wiring component are connected to each other with a spacer interposed therebetween. A structure for mounting heat-generating components on a printed wiring board, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4778592U JPH0611394U (en) | 1992-07-09 | 1992-07-09 | Mounting structure for heat-generating components on printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4778592U JPH0611394U (en) | 1992-07-09 | 1992-07-09 | Mounting structure for heat-generating components on printed wiring boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0611394U true JPH0611394U (en) | 1994-02-10 |
Family
ID=12785035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4778592U Pending JPH0611394U (en) | 1992-07-09 | 1992-07-09 | Mounting structure for heat-generating components on printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611394U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52125915U (en) * | 1976-03-23 | 1977-09-24 |
-
1992
- 1992-07-09 JP JP4778592U patent/JPH0611394U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52125915U (en) * | 1976-03-23 | 1977-09-24 |
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