KR940003146Y1 - Semiconductor heating plate - Google Patents
Semiconductor heating plate Download PDFInfo
- Publication number
- KR940003146Y1 KR940003146Y1 KR92003120U KR920003120U KR940003146Y1 KR 940003146 Y1 KR940003146 Y1 KR 940003146Y1 KR 92003120 U KR92003120 U KR 92003120U KR 920003120 U KR920003120 U KR 920003120U KR 940003146 Y1 KR940003146 Y1 KR 940003146Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat dissipation
- dissipation fin
- fixing plate
- semiconductor device
- heat
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
내용 없음.No content.
Description
제1a도는 본 고안의 제1실시예를 도시한 방열판의 사시도.Figure 1a is a perspective view of a heat sink showing a first embodiment of the present invention.
제1b도는 제1실시예의 단면도.1B is a sectional view of the first embodiment.
제2a도는 본 고안의 제2실시예를 도시한 방열판의 사시도.Figure 2a is a perspective view of a heat sink showing a second embodiment of the present invention.
제2b도는 A-A 방향에서의 제2실시예의 단면도.2b is a cross-sectional view of the second embodiment in the A-A direction.
제3도는 종래 방열판의 분해사시도이다.3 is an exploded perspective view of a conventional heat sink.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 방열핀 2 : 절결부1: heat dissipation fin 2: cutout
3 : 돌조 4 : 고정판3: stone 4: fixed plate
5 : 확대부 6 : 고정판5 enlarged portion 6: fixed plate
7 : 지지판 8 : 스큐루7: support plate 8: skew
9 : 요철부 10 : 지지다리9: uneven portion 10: support leg
본 고안은 트랜지스터, IC등의 반도체장치에서 발생되는 열을 방열시키기 위한 반도체장치의 방열판에 관한 것이다.The present invention relates to a heat sink of a semiconductor device for dissipating heat generated in semiconductor devices such as transistors and ICs.
종래의 반도체 장치의 방열판은, 제1도에 도시된 바와같이, 복수의 절결부(2)가 형성된 방열핀(1)과 복수의 돌조(3)가 형성된 고정판(4)을 구비하고, 상기 방열핀(1)의 절결부(2)에 상기 고정판(4)의 돌조(3)을 압착, 절곡시켜서 고정함으로서 방열판의 고정판(4)과 방열핀(1)의 하단 평면부 사이에 틈새가 없게 되어 고정판 위에 부착된 반도체장치 등의 전자부품에서 발생되는 열을 방열핀(1)으로 효과적으로 전도시키도록 하고 있다.As shown in FIG. 1, a heat sink of a conventional semiconductor device includes a heat sink fin 1 having a plurality of cutouts 2 and a fixed plate 4 formed with a plurality of protrusions 3, and the heat sink fin ( By pressing and bending the protrusion 3 of the fixing plate 4 to the cutout part 2 of 1), there is no gap between the fixing plate 4 of the heat sink and the lower flat portion of the heat dissipation fin 1 so as to be attached to the fixing plate. The heat generated from the electronic components such as the semiconductor device is effectively conducted to the heat radiation fins 1.
그러나, 상기한 종래 기술에서는 방열핀(1)의 측면형상이 평면으로 되어 있어 방열효과를 높일 수 없다는 문제점이 있다.However, in the above-described prior art, there is a problem in that the side shape of the heat dissipation fin 1 is flat and the heat dissipation effect cannot be enhanced.
따라서, 본 고안은 이러한 점을 감안하여 고안한 것으로, 결합구조가 간단하면서도 방열효율이 높은 반도체 장치의 방열핀을 제공하기 위한 것이다.Accordingly, the present invention has been devised in view of the above, and is intended to provide a heat dissipation fin of a semiconductor device having a simple coupling structure and high heat dissipation efficiency.
이와같은 목적을 달성하기 위하여 본 고안은 복수개의 절결부가 저부에 형성된 방열핀과 이에 대응하는 복수개의 돌조가 형성된 고정판을 구비하고, 상기 방열핀의 절결부에 상기 고정판의 돌조를 압착절곡시켜서 고정한 방열판에 있어서, 상기 방열핀의 각 측면 일부를 외측으로 볼록하게 밀어내어 확대시킨 확대부를 복수개 형성함으로써 방열효율을 크게함을 특징으로 하고 있다.In order to achieve the above object, the present invention includes a heat dissipation fin having a plurality of cutouts formed at a bottom thereof, and a fixing plate having a plurality of protrusions corresponding thereto. The heat dissipation efficiency of the heat dissipation fin is increased by convexly pushing a portion of each side surface of the heat dissipation fin outwardly to enlarge the heat dissipation efficiency.
이하 본 고안의 바람직한 실시예를 첨부도면에 근거하여 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제1a 및 b도에 도시된 바와 같이, 방열핀(1)의 저면부에는 복수개의 절결부(2)가 형성되어 있으며, 상기 방열핀(1)의 측면에는 외측으로 밀어내어 측면의 일부를 확대시킨 복수개의 확대부(5)가 형성되어 있다.As shown in Figures 1a and b, a plurality of cutouts (2) are formed in the bottom portion of the heat dissipation fin (1), a plurality of the side of the heat dissipation fin (1) is pushed outward to enlarge a portion of the side Two enlarged portions 5 are formed.
또한, 고정판(4)의 일측면에는 역삼각형으로 절결된 돌조(3)가 상기 방열핀(1)의 절결부(2)에 대응하는 갯수만큼 병설되어 있으며, 상기 돌조(3)가 상기 방열핀(1)의 절결부(2)에 압착절곡되어 고정판(4)에 방열핀(1)이 틈새가 없도록 접촉되도록 방열판이 구성되어 있다.In addition, one side of the fixing plate 4 is provided with a protrusion 3 cut into an inverted triangle corresponding to the cutout portion 2 of the heat dissipation fin 1, and the protrusion 3 is the heat dissipation fin 1. The heat dissipation plate is configured to be crimped and bent at the cutout portion 2 of the c) so that the heat dissipation fin 1 is in contact with the fixing plate 4 so that there is no gap.
이와같은 구성핀 실시예에 의하면 고정판(4)에 방열핀(1)이 밀착되어 있으므로 고정판(4)의 타측면에 부착되어 있는 반도체장치에서 발생되는 열이 고정판(4)을 통하여 양호하게 방열핀(1)에 전도될 뿐만 아니라, 상기 방열핀(1)은 그의 측면이 확대부(5)가 복수개 형성되어 있으므로 방열핀의 측면적인 증대되어 방열효율을 높일 수 있게 된다.According to this configuration fin embodiment, since the heat radiation fins 1 are in close contact with the fixing plate 4, the heat generated by the semiconductor device attached to the other side of the fixing plate 4 is well transmitted through the fixing plate 4. In addition to being conductive to the heat dissipation fin 1, the side of the heat dissipation fin 1 can be increased by increasing the side of the heat dissipation fin because the plurality of enlarged portions 5 are formed.
제2a 및 b도는 본 고안의 다른 실시예를 나타낸 것으로, 제1a 및 b도의 실시예와 다른 점은, 방열핀(1)의 상측부에 반도체장치를 부착하기 위한 또 하나의 고정판(6)을 지지판(7)에 스크루(8)로 고정시킨 것이다. 그리고 상기 고정판(6)을 지지판(7)에 스크루(8)로 고정시킨 것이다. 그리고 상기 고정판(6)은 방열효과를 높이기 위하여 반도체장치가 부착되지 않는 부분에 요철부(9)를 형성함과 동시에 지지다리(10)를 형성하여 이 지지다리(10)와 방열핀(1)의 상측부가 접촉하도록 함으로써 상기 요철부(9)의 하측에 공간을 확보하여 공기가 유통되도록 구성한 것이다.2A and 2B show another embodiment of the present invention, which is different from the embodiment of FIGS. 1A and 1B, except that the fixing plate 6 for attaching the semiconductor device to the upper side of the heat dissipation fin 1 is supported. It fixed to (7) with the screw (8). The fixing plate 6 is fixed to the supporting plate 7 with a screw 8. In addition, the fixing plate 6 forms a support leg 10 and a support leg 10 at the portion where the semiconductor device is not attached to increase the heat dissipation effect, thereby forming the support leg 10 and the heat dissipation fin 1. By allowing the upper side to contact, the space is secured to the lower side of the uneven portion 9 so as to allow air to flow.
이와같이 구성된 또 하나의 실시예에 의하며, 하나의 방열핀(1)에 하측 고정판(4)과 상측 고정판(6)이 설치되어 있기 때문에, 반도체장치의 설치 면적이 증대되면서도 방열핀(1)의 측면을 외측으로 확대시킨 확대부가 설치되고, 상측 고정판(6)의 측면에 요철부(9)가 형성됨과 동시에 이 요철부(9)에 공기가 유통하게 지지다리(10)를 통하여 공간이 확보되었기 때문에 고정이 용이할 뿐만 아니라 방열효과가 증대되므로 적은 설치공간내에 여러가지의 많은 반도체장치를 부착하여 사용할 수 있으며, 부착구조도 지지판(7)과 고정판(6)을 하나의 스큐루(8)를 사용하여 고정시킬 수 있기 때문에 매우 간편하다.According to another embodiment configured as described above, since the lower fixing plate 4 and the upper fixing plate 6 are provided in one heat dissipation fin 1, the side surface of the heat dissipation fin 1 is increased while the installation area of the semiconductor device is increased. The enlarged part enlarged to the side is provided, and since the uneven part 9 is formed in the side of the upper fixing plate 6, and the space was secured through the support leg 10 so that air flows to this uneven part 9, Not only is it easy, but also the heat dissipation effect is increased, so that many semiconductor devices can be attached and used in a small installation space, and the attachment structure can also be fixed by using a single skew (8). It is very easy because it can.
이상과 같이 본 고안은 결합구조가 간편하면서도 방열효과가 증대될 뿐만 아니라 작은 설치공간내에 여러가지의 많은 반도체 장치를 부착하여 사용할 수 있는 등 뛰어난 효과가 있다.As described above, the present invention has an excellent effect such that the coupling structure is simple and the heat dissipation effect is not only increased, but also many semiconductor devices can be attached and used in a small installation space.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92003120U KR940003146Y1 (en) | 1992-02-28 | 1992-02-28 | Semiconductor heating plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92003120U KR940003146Y1 (en) | 1992-02-28 | 1992-02-28 | Semiconductor heating plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930020642U KR930020642U (en) | 1993-09-24 |
| KR940003146Y1 true KR940003146Y1 (en) | 1994-05-12 |
Family
ID=19329604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92003120U KR940003146Y1 (en) | 1992-02-28 | 1992-02-28 | Semiconductor heating plate |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940003146Y1 (en) |
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1992
- 1992-02-28 KR KR92003120U patent/KR940003146Y1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR930020642U (en) | 1993-09-24 |
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