JPH0611119U - Optical pickup device - Google Patents

Abstract

(57) [Abstract] [Purpose] To prevent the light receiving element from being displaced or displaced over time with respect to various substrates. [Structure] The light receiving section 1 includes a light receiving element 2 having a plurality of pins 2a and an insulating substrate 3 having holes 3a corresponding to the pins 2a.
And a flexible board 4 having a hole 4a corresponding to the pin 2a and having a wiring pattern,
The light receiving element 2 is formed by overlapping the pins 2a on the insulating substrate 3 and the flexible substrate 4 so that the pins 2a are inserted into the holes 3a and 4a, and soldering the pins 2a to the flexible substrate 4.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an optical pickup device, and more particularly to a mounting structure for a light receiving element that receives an optical signal and various substrates.

[0002]

[Prior art]

 Generally, the optical pickup device is composed of, for example, a semiconductor laser A, a collimator lens B, an objective lens C, a mirror D, a plano-concave lens E, and a light receiving section F as shown in FIG. Particularly, the light receiving portion F is configured as shown in FIGS. 4 and 5, for example. That is, the flexible substrate F2 is adhered to one surface of the light receiving element substrate F1 with a double-sided tape (double-sided adhesive) or the like, and the light receiving element F3 is fixed to a predetermined position of the flexible substrate F2 with an adhesive, and then the flexible substrate F2. The wiring pattern and the pin of the light receiving element F3 are soldered to each other.

[0003]

[Problems to be solved by the device]

 However, since the light receiving element substrate F1, the flexible substrate F2, and the light receiving element F3 are fixed by the adhesive agent in the light receiving section F, the adhesive agent changes due to the temperature change and the adhesive agent changes with time. There is a drawback that it becomes impossible to securely fix the light receiving element substrate F1 and the light receiving element F3, for example. Therefore, an object of the present invention is to provide an optical pickup device having a simple structure which does not cause displacement or displacement between the substrate and the light receiving element even when the temperature or time changes.

[0004]

[Means for Solving the Problems]

 Therefore, in order to achieve the above-mentioned object, the present invention includes a light receiving portion for receiving an optical signal, and the light receiving portion includes a light receiving element having a plurality of pins and an insulating substrate having holes corresponding to the pins of the light receiving element. It is composed of a flexible board.The light receiving element, the insulation board, and the flexible board are polymerized so that the pins are inserted into their respective holes, and the pins are soldered to the flexible board. The flexible substrate is temporarily fixed with an adhesive.

[0005]

[Action]

 According to this invention, the light receiving element, the insulating substrate, and the flexible substrate are integrally fixed by soldering the pins of the light receiving element to the flexible substrate.

[0006]

【Example】

 Next, an embodiment of the present invention will be described with reference to FIGS. In the figure, reference numeral 1 denotes a light receiving portion in an optical pickup device, which corresponds to a light receiving element 2 having a plurality of pins 2a, an insulating substrate 3 made of a ceramic plate having holes 3a corresponding to the pins 2a, and a pin 2a. And a flexible board 4 having a wiring pattern. The light receiving element 2 is preferably CCD, for example. The light receiving unit 1 is assembled, for example, as follows. First, a double-sided tape (with an adhesive) is attached to the wiring board 3. Then, the flexible substrate 4 is overlapped and adhered (temporarily fixed) to the insulating substrate 3 so that the holes 3a, 4a are aligned with each other. Next, the light receiving element 2 is superposed on the insulating substrate 3 so that the pins 2a are inserted into the holes 3a, 4a, and the pins 2a and the conductive lands of the wiring pattern on the flexible substrate 4 are soldered to complete the assembly. To do. In addition, at the time of this soldering, the solder flows into the holes 3a and 4a, so that the fixing is further strengthened.

[0007]

[Effect of device]

 As described above, according to the present invention, the light receiving element, the insulating substrate, and the flexible substrate are integrally fixed by soldering the pins to the flexible substrate. It is possible to eliminate any change in the degree of fixation to the substrate.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an assembled state of FIG.

FIG. 3 is a schematic configuration diagram of an optical pickup.

FIG. 4 is a perspective view showing a conventional light receiving section.

FIG. 5 is an exploded perspective view of FIG.

[Explanation of symbols]

 1 light receiving part 2 light receiving element 2a pin 3 insulating substrate 3a hole 4 flexible substrate 4a hole

Claims (2)

[Scope of utility model registration request] 1. A light receiving portion for receiving an optical signal, the light receiving portion comprising a light receiving element having a plurality of pins, and an insulating substrate and a flexible substrate having holes corresponding to the pins of the light receiving element. An optical pickup device characterized in that a light receiving element, an insulating substrate, and a flexible substrate are superposed so that the pins are inserted into the respective holes, and the pins are soldered to the flexible substrate. 2. The optical pickup device according to claim 1, wherein the insulating substrate and the flexible substrate are temporarily fixed with an adhesive.