JP2003243856A - Electric appliance and camera - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To overcome the problem that, when connecting with each other a board and an electric element by lead wires, etc., disposal spaces of the lead wires, etc., must be secured. <P>SOLUTION: An electric appliance has a board 10 having a component mounting surface, a holding member 8 for holding the board on an end surface 8b present in its thickness direction, and an electric element 9 provided on the other end surface side relative to the end surface 8b of the holding member. In this electric appliance, a portion of the end surface 8b of the holding member is so formed oblique as to be extended to the direction of the electric element 9 being provided therein. Then, the board 10 is so provided along an inclined surface 8a of the holding member as to be connected electrically with the electric element 9 in the component mounting surface. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric device using a flexible board, and more particularly to a board arrangement structure capable of soldering with an electric part arranged at a position lower than a component mounting surface of the flexible board. Is.

[0002]

2. Description of the Related Art When soldering a flexible substrate and a terminal of an electric component, it is usual to solder the component mounting surface of the flexible substrate. Here, the structure described below is adopted for soldering with an electric component located at a position lower than the component mounting surface.

As one of the structures, as shown in FIGS. 2 and 4, a soldering land provided on the component mounting surface (one surface) of the flexible substrate 2 and the terminal portion 3 of the electric component are connected to the lead wire 5. There is a structure (first prior art) in which conduction is achieved by electrically connecting with each other. 2 and 4, the flexible substrate 2 is fixed to the base 1 on the surface opposite to the component mounting surface.

Further, as shown in FIG. 3, a double-sided flexible board 2 having copper foil patterns on both sides is used, and the surface of the printed board 2 on which the electric parts are arranged is soldered to the terminals 3 of the electric parts. There is an attached structure (second prior art). In FIG. 3, the flexible substrate 2 is fixed to the base 1 on the same surface as the component mounting surface.

[0005]

However, the above-mentioned structure of the prior art has the following drawbacks.

That is, in the first conventional technique, the flexible substrate 2 is connected to the terminal portion 3 of the electric component by using the lead wire 5.
If the distance between the component A and the flexible substrate 2 is shorter than the diameter of the lead wire 5 or the height of the soldering portion of the soldering land, the component A is placed near the lead wire. It is necessary to provide a space for accommodating the soldering part 5 and the soldering part.

Here, as shown in FIG. 2, when a molded component is used as the component A, the recess 6a must be formed by cutting the thickness of the molded component 6. Further, when the press part 7 is used for the part A as shown in FIG. 4, it is necessary to form the hole 7a in the press part 7.

On the other hand, when the component A is made of a material whose shape cannot be easily changed, such as glass, the lead wire is extended by increasing the distance between the component A and the flexible substrate. Space must be secured to accommodate the 5 and the soldered parts. This may increase the size of the electrical device that houses the flexible substrate.

Since the double-sided flexible substrate is used in the second conventional technique, even if the double-sided flexible substrate 2 is sandwiched between the base 1 and the component 4 as shown in FIG. 3, the above-described first conventional technique is used. There is no problem in
The cost is higher than that of a single-sided flexible board having a copper foil pattern formed on one side, and soldering is difficult because soldering is performed on the back side of the board. In addition, when the one-sided flexible substrate has to be used, naturally the two-sided flexible substrate cannot be used.

[0010]

According to the present invention, a board having a component mounting surface, a holding member for holding the board on one end face in the thickness direction, and a holding member arranged on the other end face side with respect to the one end face. In an electric device including an electric element, a part of one end surface of the holding member is formed to be inclined so as to extend in a direction in which the electric element is arranged, and the substrate is arranged along the inclined surface of the holding member. It is characterized in that it is arranged and is electrically connected to the electric element on the component mounting surface.

That is, a part of one end surface of the holding member is formed so as to be inclined so as to extend in the direction in which the electric element is arranged, and the substrate is arranged along this inclined surface. Even if the electric equipment parts are arranged in the vicinity of the board so as to sandwich the substrate, the electric continuity between the board and the electric element is ensured without providing the electric equipment parts with recesses or holes as in the first prior art. There is.

Here, it is not necessary to secure a space for arranging lead wires or the like between the electric device component and the substrate,
It is also possible to prevent an increase in the size of electric equipment. Further, by disposing the board along the inclined surface of the holding member, the board can be brought close to the electric element, so that it is necessary to use a board having copper foil patterns formed on both surfaces as in the second conventional technique. It is possible to prevent cost increase.

A camera is an example of the electric equipment of the present invention.

[0014]

FIG. 5 is a partial perspective view of an apparatus when the substrate arrangement structure according to the present invention is applied to a shutter apparatus. FIG. 6 is an external perspective view of a camera including the shutter device according to this embodiment.

In FIG. 6, 11 is a camera body,
A photographing lens barrel 12 capable of zooming is provided at the center of the front surface of the camera body 11. Further, a light emitting window member 16 constituting a strobe device is provided on the upper right side of the front surface of the camera body 11, and a finder window 15 and a photometric window 13 are provided in the vicinity thereof. Furthermore, on the upper surface of the camera body 11, the camera body 1
A shutter release button 14 for starting exposure (photographing) to an image pickup device such as a film or a CCD (not shown) in 1 is provided.

In FIG. 5, reference numeral 8 denotes a shutter base plate which supports or fixes a shutter unit described later. 9
Is a coil unit for a stepping motor, and is one of the components that make up the stepping motor. The coil unit 9 is composed of three parts. Reference numeral 9a is a coil which is a component of the coil unit 9, and when energized, an electromagnetic effect is generated to drive the stepping motor. The coil 9a is wound around a bobbin (not shown) that is a component of the coil unit 9.

Reference numeral 9b denotes a terminal which constitutes the coil unit 9, and the coil 9a and a shutter flexible substrate 1 which will be described later.
This is a terminal for establishing continuity with 0. This terminal 9b is
Soldered to the shutter flexible substrate 10.
Reference numeral 10 denotes a shutter flexible substrate for signal transmission and motor driving, which is formed in a ring shape.

In this embodiment, the coil unit 9 is fixed to the shutter base plate 8, and the fixing portion 10a of the shutter flexible substrate 10 is the flat surface portion 8 of the shutter base plate 8.
It is attached to b. In this state, the shutter unit 4 is arranged above the shutter flexible substrate 10 in FIG. 5, as shown in FIG.

Next, the characteristic part of this embodiment will be described.

A part of the plane portion 8b of the shutter base plate 8 has an inclined surface 8a as shown in FIG. 1, and this inclined surface 8a faces in the direction in which the terminals 9b of the coil unit 9 are arranged. Has been formed. Then, the joint portion 10b of the shutter flexible substrate 10 is connected to the shutter base plate 8
Is formed so as to extend along the slope 8a.

The bent end of the shutter flexible substrate 10 has a semi-circular cutout, and the terminal 9 of the coil unit 9 is located at this cutout.
It is in contact with b. Then, the cutout portion and the terminal 9b
Are in contact with each other, they are soldered as shown in FIG.

Here, the inclination angle of the slope 8a of the shutter base plate 8 can be appropriately set according to the position of the shutter base plate 8 and the position of the terminals 9b of the coil unit 9.

In the present embodiment, the component mounting surface of the shutter flexible substrate and the terminal 9b of the coil unit 9 are directly connected by soldering, but the component mounting surface of the shutter flexible substrate 10 and the terminal 9b are connected by lead wires. You may make it connect. That is, by forming the slope 8a on the shutter base plate 8, as shown in FIG.
Since a space is generated between a and the shutter component 4, there is no problem even if the lead wire is arranged.

Further, in this embodiment, the slope 8a is formed in a flat shape, but the slope 8a may be formed in a step shape. Furthermore, although the present invention is applied to the shutter device (camera) in the present embodiment, the present invention can also be applied to other electric devices.

[0025]

According to the present invention, a part of one end surface of the holding member is formed to be inclined so as to extend in the direction in which the electric element is arranged, and the substrate is arranged along this inclined surface. , For example, even if an electric device component is arranged in the vicinity of the substrate so as to sandwich the substrate together with the holding member, electrical continuity between the substrate and the electric element can be achieved without providing a recess or a hole in the electric device component as in the first prior art. To ensure.

Since it is not necessary to secure a space for arranging lead wires or the like between the electric device component and the substrate,
It is also possible to prevent an increase in the size of electric equipment. Further, by disposing the board along the inclined surface of the holding member, the board can be brought close to the electric element, so that it is necessary to use a board having copper foil patterns formed on both surfaces as in the second conventional technique. It is possible to prevent cost increase.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part of the present embodiment.

FIG. 2 is a cross-sectional view of a main part in the first conventional technique.

FIG. 3 is a cross-sectional view of main parts in a second conventional technique.

FIG. 4 is a cross-sectional view of main parts in the first conventional technique.

FIG. 5 is a partial perspective view of the shutter device according to the present embodiment.

FIG. 6 is an external perspective view of a camera.

[Explanation of symbols]

1: Base 2: Flexible substrate 3: Terminal 4: Electrical parts 5: Lead wire 6: Molded parts 7: Pressed parts 8: Shutter base plate 9: Coil unit 10: Shutter flexible substrate

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 2H100 BB11                 5E336 AA04 AA16 BC21 BC37 CC31                       CC51 EE01 GG09 GG30                 5E338 AA05 AA12 BB51 EE22                 5E348 AA02 AA19 AA30 CC08 EE33                       EF04 EF12 FF10

Claims (4)

[Claims] 1. A substrate having a component mounting surface, a holding member for holding the substrate at one end face in the thickness direction, and an electric element arranged on the other end face side with respect to the one end face of the holding member. In the electric device, a part of one end surface of the holding member is formed to be inclined so as to extend in a direction in which the electric element is arranged, and the substrate is arranged along an inclined surface of the holding member. An electric device, which is electrically connected to the electric element on the component mounting surface. 2. The electric element has a terminal portion connected to a component mounting surface of the substrate, and the terminal portion and the component mounting surface of the substrate are soldered. The electric device described in. 3. The electric device according to claim 1, wherein a device component is arranged in the vicinity of the substrate so as to sandwich the substrate together with the holding member. 4. A substrate having a component mounting surface, a holding member for holding the substrate at one end face in the thickness direction, and an electric element arranged on the other end face side with respect to the one end face of the holding member. In the camera, a part of one end surface of the holding member is formed to be inclined so as to extend in a direction in which the electric element is arranged, the substrate is arranged along an inclined surface of the holding member, A camera which is electrically connected to the electric element on the component mounting surface.