JPH06105745B2 - Wafer transfer device - Google Patents
Wafer transfer deviceInfo
- Publication number
- JPH06105745B2 JPH06105745B2 JP6760485A JP6760485A JPH06105745B2 JP H06105745 B2 JPH06105745 B2 JP H06105745B2 JP 6760485 A JP6760485 A JP 6760485A JP 6760485 A JP6760485 A JP 6760485A JP H06105745 B2 JPH06105745 B2 JP H06105745B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- boat
- cassette
- wafer
- shaft member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は半導体装置の製造工程において、ウェーハを炉
内に移送させるため、ウェーハをカセットからボートに
移し替えるウェーハ移替装置に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a wafer transfer device for transferring a wafer from a cassette to a boat in order to transfer the wafer into a furnace in a semiconductor device manufacturing process.
半導体装置を製造する拡散工程においては、ウェーハを
石英等からなるボート上に載置した状態で炉内に移送し
ている。一方、この拡散工程の前工程を終了したウェー
ハはカセット内に収納された状態で送られてくる。この
ように送られてきたカセットからウェーハをボートに移
し替える必要があり、この移し替えを自動的に行なうた
め従来からウェーハ移替装置が使用されている。In a diffusion process for manufacturing a semiconductor device, a wafer is transferred into a furnace while being placed on a boat made of quartz or the like. On the other hand, the wafer which has completed the pre-process of this diffusion process is sent in a state of being housed in a cassette. It is necessary to transfer the wafer from the cassette thus sent to the boat, and a wafer transfer device has been conventionally used to automatically perform the transfer.
従来のウェーハ移替装置は、カセットが載置されるカセ
ット載置台にボートが載置されるボート載置台が隣りあ
うように設けられ、これらウェーハおよびボート載置台
間を移替手段が往復移動してボート又はカセットからウ
ェーハを取り出し、対応するカセット又はボートに移し
替えるようになっており、ひとつの炉に対してウェーハ
移替装置が１台配されている。従って、従来装置におい
ては、炉の数と同数の移替装置を配する必要があり、そ
のメインテナンスも煩雑であり、コスト高となってい
る。又、移替装置あるいはそのコントローラがクリーン
ルーム内のかなりのスペースを専有するため、移替装置
を設けて自動化したことによって得られるメリットが半
減してしまうという問題も生じている。A conventional wafer transfer device is provided so that a boat mounting table on which a boat is mounted is adjacent to a cassette mounting table on which a cassette is mounted, and a transfer means reciprocates between the wafer and the boat mounting table. The wafer is taken out from the boat or the cassette and transferred to the corresponding cassette or the boat, and one wafer transfer device is arranged for one furnace. Therefore, in the conventional device, it is necessary to arrange the same number of transfer devices as the number of furnaces, the maintenance is complicated, and the cost is high. In addition, since the transfer device or its controller occupies a considerable space in the clean room, the merit obtained by automating the transfer device is halved.
また、このようなウェーハ移替装置においては移し替え
のために用いられる移動機構が塵埃の発生源となるとい
う問題もある。Further, in such a wafer transfer apparatus, there is also a problem that the moving mechanism used for transfer serves as a dust generation source.
本発明は上記事情を考慮してなされたもので、メインテ
ナンスが簡単で、専有面積が少なく、低コストで、塵埃
による歩留まりや性能の劣化を招くことの少ないウェー
ハ移替装置を提供することを目的とする。The present invention has been made in consideration of the above circumstances, and an object thereof is to provide a wafer transfer device that is easy to maintain, has a small occupied area, is low in cost, and causes less yield and performance deterioration due to dust. And
上記目的を達成するために、本発明によるウェーハ移替
装置は複数のウェーハを把持する把持部と、この把持部
を回転させる回転テーブルと、この回転テーブルを支持
するとともに軸部材に沿って移動させる移動部とを備え
たウェーハ移替手段と、 処理装置に近接した前記軸部材の一方端位置でその両側
に設けられた、処理時にウェーハを保持するボートを載
置するボート載置台および前記軸部材の他方端位置でそ
の両側に設けられた、ウェーハを収納するカセットを載
置するカセット載置台と、 前記回転テーブルを前記把持部が前記ボート載置台ある
いはカセット載置台のいずれかと係合するように回転さ
せて前記ウェーハを把持し、前記ウェーハを把持した状
態で移動部を前記軸部材に沿って移動させ、前記ボート
載置台あるいはカセット載置台と同一側のカセット載置
台あるいはボート載置台に移し替えるときには回転を行
わず、反対側のカセット載置台あるいはボート載置台に
移し替えるときには前記把持部がそのカセット載置台あ
るいはボート載置台と係合するように回転させて、いず
れかの前記カセット載置台に載置されたカセットといず
れかの前記ボート載置台に載置されたボートとの間でウ
ェーハを移替える駆動手段とを備え、 前記軸部材、移動部および回転テーブルは前記ボート載
置台およびカセット載置台よりも下方に設けられている
ことを特徴とするものである。In order to achieve the above object, a wafer transfer apparatus according to the present invention has a gripping part for gripping a plurality of wafers, a rotary table for rotating the gripping part, and a rotary table supporting the rotary table and moving the rotary table along an axial member. A wafer transfer unit having a moving unit, a boat mounting table for mounting a boat holding a wafer during processing, and the shaft member, which are provided on both sides of the shaft member at one end position close to the processing apparatus. And a cassette mounting table provided on both sides thereof at the other end position thereof for mounting a cassette for storing wafers, and the rotary table so that the gripping portion engages with either the boat mounting table or the cassette mounting table. The wafer is rotated to grip the wafer, and the moving part is moved along the shaft member while gripping the wafer, and the boat mounting table or cassette is moved. When the cassette mounting table or the boat mounting table on the same side as the mounting table is not rotated, when the cassette mounting table or the boat mounting table on the opposite side is transferred, the gripping portion is not the cassette mounting table or the boat mounting table. Rotating so as to engage, comprising a driving means for transferring the wafer between the cassette mounted on any one of the cassette mounting tables and the boat mounted on any of the boat mounting tables, The shaft member, the moving unit and the turntable are provided below the boat mounting table and the cassette mounting table.
以下本発明を図示の一実施例により説明する。第１図に
本発明の一実施例によるウェーハ移替装置の全体斜視図
を、第２図にその移替機構の斜視図を示す、多数枚のウ
ェーハ１がカセット２内に収納されており、カセット２
はカセット載置台3a上に載置されている。このカセット
載置台3aの左側にはボート４が載置されるボート載置台
5aが長手方向に連設され、ボート載置台のさらに左側に
炉（図示せず）が位置している。そして、カセット載置
台3aの前方およびボート載置台5aの前方にはそれぞれ、
別のカセット載置台３およびボート載置台５が設けられ
ている。従って、本実施例ではカセット載置台およびボ
ート載置台が２列並列されている。ここで、カセット２
は側壁内にウェーハ１を収納するようになっており、一
方、ボート４は石英製の枠体からなり、枠体上にウェー
ハ１が載置されるようになっている。又、各載置台3a,3
bおよび5a,5bの天面部分には後述する移替機構10の取出
機構16が昇降可能なように開口６および７がそれぞれ形
成されている。さらに、２列の載置台間は載置台よりも
低くなった段部８となっており、この段部８に長手方向
のスライド孔９が開設され、移替機構10がスライド孔９
内を往復移動するようになっている。The present invention will be described below with reference to an embodiment shown in the drawings. FIG. 1 is an overall perspective view of a wafer transfer apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of the transfer mechanism. A large number of wafers 1 are stored in a cassette 2. Cassette 2
Is mounted on the cassette mounting table 3a. The boat mounting table on which the boat 4 is mounted on the left side of the cassette mounting table 3a
5a are connected in the longitudinal direction, and a furnace (not shown) is located on the further left side of the boat mounting table. Then, in front of the cassette mounting table 3a and in front of the boat mounting table 5a, respectively,
Another cassette mounting table 3 and a boat mounting table 5 are provided. Therefore, in this embodiment, two rows of the cassette mounting table and the boat mounting table are arranged in parallel. Where cassette 2
The wafer 1 is housed in the side wall, while the boat 4 is made of a quartz frame, and the wafer 1 is placed on the frame. Also, each mounting table 3a, 3
Openings 6 and 7 are formed in the top surface portions of b and 5a, 5b so that a take-out mechanism 16 of a transfer mechanism 10, which will be described later, can be moved up and down. Further, there is a stepped portion 8 between the two rows of the mounting table which is lower than the mounting table, and a slide hole 9 in the longitudinal direction is formed in this stepped portion 8, and the transfer mechanism 10 is provided with the slide hole 9
It is designed to reciprocate inside.
移替機構10は第２図に示すように、ガイドレール11に沿
って往復動を行う、例えば摺動体およびモータよりなる
往復動機構12と、この往復動機構12の上に取付けられて
回転を行う回転機構13と、この回転機構の回転軸をもな
すアーム14に取付けられたクランプ機構15を備えてい
る。回転機構13は、往復動機構12に取付けられたモータ
13aの回転軸をなすアーム14にターンテーブル13bが一体
的に取付けられた構造となっている。これらのガイドレ
ール11、往復動機構12、回転機構13は第２図に示すよう
に、ウェーハ移替装置内に形成された空間内に収納され
ており、アーム14のみがスライド孔から上方に延出する
ようになっている。As shown in FIG. 2, the transfer mechanism 10 reciprocates along a guide rail 11, for example, a reciprocating mechanism 12 including a sliding body and a motor, and is mounted on the reciprocating mechanism 12 to rotate. A rotating mechanism 13 for performing and a clamp mechanism 15 attached to an arm 14 which also serves as a rotating shaft of the rotating mechanism are provided. The rotating mechanism 13 is a motor attached to the reciprocating mechanism 12.
A turntable 13b is integrally attached to an arm 14 which forms a rotation axis of 13a. As shown in FIG. 2, the guide rail 11, the reciprocating mechanism 12, and the rotating mechanism 13 are housed in the space formed in the wafer transfer device, and only the arm 14 extends upward from the slide hole. It is supposed to be released.
アーム14は上方で水平方向に曲り、その先端部には取出
し機構16が設けられている。この取出し機構16に対応し
て、ターンテーブル13b上には取出し機構16が設けられ
ている。この取出し機構は昇降可能となっており、ター
ンテーブル13bが回転してクランプ機構がボート載置台3
aあるいはカセット載置台3bの直上にあるときには、上
昇して前述した載置台3a、3b、5a、5bに設けられた開口
部６、７から上方に進出し、カセット２あるいはボート
４中のウェーハ１を押上げ、あるいはクランプ機構15で
クランプされたウェーハ１を受けて下降し、ウェーハ１
をボート２あるいはカセット４に載置あるいは収納す
る。クランプ機構15は回転軸14の先端に矩形状に組み付
けられた状態で取り付けられた支持枠15aと、支持枠15a
内に対向して設けられた一対のクランプ板15bとからな
っている。そして、クランプ板15bの対向面にはウェー
ハをはさむための縦溝が複数本形成されて、ウェーハを
複数枚把持できるようになっている。The arm 14 is bent upward in the horizontal direction, and a take-out mechanism 16 is provided at the tip thereof. Corresponding to this take-out mechanism 16, a take-out mechanism 16 is provided on the turntable 13b. This take-out mechanism can be raised and lowered, and the turntable 13b rotates and the clamp mechanism moves to the boat mounting table 3
a or directly above the cassette mounting table 3b, it rises and advances upward through the openings 6 and 7 provided in the mounting tables 3a, 3b, 5a and 5b, and the wafer 1 in the cassette 2 or the boat 4 The wafer 1 clamped by the clamp mechanism 15 to lower the wafer 1.
Are placed on or housed in the boat 2 or the cassette 4. The clamp mechanism 15 includes a support frame 15a attached to the tip of the rotary shaft 14 in a rectangular shape and a support frame 15a.
It is composed of a pair of clamp plates 15b provided so as to face each other. Further, a plurality of vertical grooves for sandwiching the wafer are formed on the opposing surface of the clamp plate 15b so that a plurality of wafers can be held.
次に以上の実施例の動作を説明する。カセット載置台3a
上のカセット２からボート載置台5a上のボート４上にウ
ェーハを移し替える場合には、まず、往復動機構12によ
って移替機構10をカセット載置台3aまで移動させ、取出
機構16を上昇させて所望のカセット内からウェーハを取
り出し、クランプ板15bまで押上げる。クランプ板15bは
ウェーハを把持し、把持状態のまま、往復動機構12によ
って移替機構10をボート載置台5aに移動させ、位置出し
した後、取出機構16を再度、駆動させてクランプ板15b
からウェーハをボート４上に降す。Next, the operation of the above embodiment will be described. Cassette mounting table 3a
When the wafers are transferred from the upper cassette 2 to the boat 4 on the boat mounting table 5a, first, the reciprocating mechanism 12 moves the transfer mechanism 10 to the cassette mounting table 3a and raises the ejection mechanism 16. The wafer is taken out from the desired cassette and pushed up to the clamp plate 15b. The clamp plate 15b grips the wafer, and while the gripping state is maintained, the reciprocating mechanism 12 moves the transfer mechanism 10 to the boat mounting table 5a, and after positioning, the take-out mechanism 16 is driven again to clamp the clamp plate 15b.
The wafer is dropped onto the boat 4.
次に、別のカセット載置台3bとボート載置台5bとの間で
ウェーハの移替を行なう場合には、回転機構13によって
移替手段10を180度回転させることでクランプ機構15の
向きを変え、前述の作動を同様に行なうことで行なうこ
とができる。従って、本実施例では炉２台に対して１台
のウェーハ移替装置を設けるだけでよい。Next, when performing wafer transfer between another cassette mounting table 3b and the boat mounting table 5b, the direction of the clamp mechanism 15 is changed by rotating the transfer means 10 by 180 degrees by the rotation mechanism 13. The above operation can be performed in the same manner. Therefore, in this embodiment, only one wafer transfer device needs to be provided for two furnaces.
第３図は本発明の別の実施例によるウェーハ移替装置の
平面図を示している。この実施例では２列に配された４
つのカセット載置台3c,3d,3e,3fに対して、各ボート載
置台5c,5d,5e,5fがそれぞれ外側に続けて設けらてお
り、各ボート載置台5c,5d,5e,5fの外方に４台の炉が夫
々、位置している。そして、移替機構10はこのように別
設された載置台列の間に往復移動および回転可能に設け
られている。このように本実施例においては、４台の炉
に対しひとつの移替手段10を設けるだけでよい。FIG. 3 is a plan view of a wafer transfer device according to another embodiment of the present invention. In this example, 4 arranged in two rows
For each of the three cassette placement tables 3c, 3d, 3e, 3f, each boat placement table 5c, 5d, 5e, 5f is continuously provided outside, and each boat placement table 5c, 5d, 5e, 5f Four furnaces are located in each direction. The transfer mechanism 10 is reciprocally movable and rotatable between the mounting table rows separately provided in this way. As described above, in this embodiment, it is sufficient to provide one transfer means 10 for four furnaces.
本発明は上記実施例に限らず、種々の変形が可能であ
る。例えばカセット載置台およびボート載置台を２列以
上設けてもよい。The present invention is not limited to the above embodiment, and various modifications can be made. For example, two or more rows of the cassette mounting table and the boat mounting table may be provided.
以上のとおり本発明によれば、カセット載置台とボート
載置台の列の間に移替手段を設けたから、複数の炉に対
するウェーハ移替処理がひとつのウェーハ移替装置によ
って行なうことができ、メインテナンス回数の低減およ
びコストの低減が図られると共にクリーンルーム内での
ウェーハ移替装置の専有面積を減少させることができ
る。As described above, according to the present invention, since the transfer means is provided between the row of the cassette mounting table and the row of the boat mounting table, the wafer transfer processing for a plurality of furnaces can be performed by one wafer transfer device, and the maintenance can be performed. The number of times and cost can be reduced, and the area occupied by the wafer transfer device in the clean room can be reduced.
また、本発明によれば、ウェーハ移替手段の両側に２列
に設けられいずれのカセット載置台とボート載置台の間
でウェーハを自由に移替えることができるというきわめ
て高い汎用性を有するものである。さらに、ウェーハ移
替えのための軸、往復動部、回転テーブルがいずれもボ
ート載置台やカセット載置台よりも低い位置にあるた
め、ウェーハに塵埃が付着する可能性が低く、歩留まり
や性能に対する悪影響を防止することができる。Further, according to the present invention, it has a very high versatility that the wafers can be freely transferred between any of the cassette mounting table and the boat mounting table, which are provided in two rows on both sides of the wafer transfer means. is there. Furthermore, since the axis for wafer transfer, the reciprocating part, and the rotary table are all located at a lower position than the boat mounting table or the cassette mounting table, the possibility of dust adhering to the wafer is low, which adversely affects yield and performance. Can be prevented.
第１図は本発明の一実施例によるウェーハ移替装置の斜
視図、第２図は同ウェーハ移替装置の移替機構の斜視
図、第３図は本発明の別の実施例によるウェーハ移替装
置の平面図である。 １…ウェーハ、２…カセット、3a,3b,3c,3d,3e,3f…カ
セット載置台、４…ボート、5a,5b,5c,5d,5e,5f…ボー
ト載置台、10…移替機構、12…往復動機構、13…回転機
構、15…クランプ機構、16…取出機構。1 is a perspective view of a wafer transfer apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a transfer mechanism of the wafer transfer apparatus, and FIG. 3 is a wafer transfer apparatus according to another embodiment of the present invention. It is a top view of a replacement device. 1 ... Wafer, 2 ... Cassette, 3a, 3b, 3c, 3d, 3e, 3f ... Cassette mount, 4 ... Boat, 5a, 5b, 5c, 5d, 5e, 5f ... Boat mount, 10 ... Transfer mechanism, 12 ... Reciprocating mechanism, 13 ... Rotating mechanism, 15 ... Clamping mechanism, 16 ... Extracting mechanism.
Claims (3)
把持部を回転させる回転テーブルと、この回転テーブル
を支持するとともに軸部材に沿って移動させる移動部と
を備えたウェーハ移替手段と、 処理装置に近接した前記軸部材の一方端位置でその両側
に設けられた、処理時にウェーハを保持するボートを載
置するボート載置台および前記軸部材の他方端位置でそ
の両側に設けられた、ウェーハを収納するカセットを載
置するカセット載置台と、 前記回転テーブルを前記把持部が前記ボート載置台ある
いはカセット載置台のいずれかと係合するように回転さ
せて前記ウェーハを把持し、前記ウェーハを把持した状
態で移動部を前記軸部材に沿って移動させ、前記ボート
載置台あるいはカセット載置台と同一側のカセット載置
台あるいはボート載置台に移し替えるときには回転を行
わず、反対側のカセット載置台あるいはボート載置台に
移し替えるときには前記把持部がそのカセット載置台あ
るいはボート載置台と係合するように回転させて、いず
れかの前記カセット載置台に載置されたカセットといず
れかの前記ボート載置台に載置されたボートとの間でウ
ェーハを移替える駆動手段とを備え、 前記軸部材、移動部および回転テーブルは前記ボート載
置台およびカセット載置台よりも下方に設けられている
ことを特徴とするウェーハ移替装置。1. Wafer transfer means comprising a gripping part for gripping a plurality of wafers, a rotary table for rotating the gripping part, and a moving part for supporting the rotary table and moving the rotary table along a shaft member. , A boat mounting table provided on both sides of the shaft member at one end position close to the processing apparatus, for mounting a boat holding a wafer during processing, and provided on both sides of the shaft member at the other end position. A cassette mounting table on which a cassette for storing wafers is mounted, and the rotary table is rotated so that the gripping portion engages with either the boat mounting table or the cassette mounting table to grip the wafer, and the wafer The moving part is moved along the shaft member while gripping the carriage, and the cassette mounting table or the button on the same side as the boat mounting table or the cassette mounting table is moved. When it is transferred to the cassette mounting table or the boat mounting table on the opposite side, the grip is rotated so as to engage with the cassette mounting table or the boat mounting table. Of a cassette mounted on the cassette mounting table and a driving means for transferring wafers between any of the boats mounted on the boat mounting table, wherein the shaft member, the moving unit and the rotary table are A wafer transfer device provided below the boat mounting table and the cassette mounting table.
前記ボート載置台間およびカセット載置台間に形成され
た開口部の下方に形成された空間内に設けられたことを
特徴とする特許請求の範囲第１項記載のウェーハ移替装
置。2. The shaft member, the moving portion, and the rotary table are provided in a space formed below an opening formed between the boat mounting tables and between the cassette mounting tables. The wafer transfer apparatus according to item 1 above.
た位置でウェーハを支持して上下動する取出機構を備え
たものであることを特徴とする特許請求の範囲第２項記
載のウェーハ移替装置。3. The wafer transfer according to claim 2, wherein the rotary table is provided with a take-out mechanism that supports the wafer at a position corresponding to the grip portion and moves up and down. Replacement device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6760485A JPH06105745B2 (en) | 1985-03-30 | 1985-03-30 | Wafer transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6760485A JPH06105745B2 (en) | 1985-03-30 | 1985-03-30 | Wafer transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61226939A JPS61226939A (en) | 1986-10-08 |
| JPH06105745B2 true JPH06105745B2 (en) | 1994-12-21 |
Family
ID=13349693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6760485A Expired - Lifetime JPH06105745B2 (en) | 1985-03-30 | 1985-03-30 | Wafer transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06105745B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5030057A (en) * | 1987-11-06 | 1991-07-09 | Tel Sagami Limited | Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer |
| JP2651858B2 (en) * | 1987-12-07 | 1997-09-10 | 東京エレクトロン株式会社 | Wafer transfer equipment |
-
1985
- 1985-03-30 JP JP6760485A patent/JPH06105745B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61226939A (en) | 1986-10-08 |
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