JPH06103700B2 - Wire bonder wire clamp method - Google Patents
Wire bonder wire clamp methodInfo
- Publication number
- JPH06103700B2 JPH06103700B2 JP1237927A JP23792789A JPH06103700B2 JP H06103700 B2 JPH06103700 B2 JP H06103700B2 JP 1237927 A JP1237927 A JP 1237927A JP 23792789 A JP23792789 A JP 23792789A JP H06103700 B2 JPH06103700 B2 JP H06103700B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- clamp
- solenoid
- bonder
- force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置を製造するワイヤボンダに装備
され、ワイヤボンデイング工程中において、ワイヤを挟
付けたり、自由にしたりするワイヤボンダのワイヤクラ
ンプ装置（以下、クランプ装置と称する）のワイヤクラ
ンプ方法に関するものである。Description: TECHNICAL FIELD The present invention is equipped with a wire bonder for manufacturing a semiconductor device, and a wire clamp device for a wire bonder that clamps or frees a wire during a wire bonding process ( Hereinafter, it will be referred to as a clamp device).
第３図は例えば特開昭57−111039号公報に示された、従
来のクランプ装置の側面図で、同図（Ａ）はワイヤ
（９）を自由にした状態を、同図（Ｂ）はワイヤ（９）
を挟付けた状態を示す。FIG. 3 is a side view of a conventional clamp device disclosed in, for example, Japanese Patent Laid-Open No. 57-111039, FIG. 3A showing a state in which a wire 9 is free, and FIG. Wire (9)
It shows the state where is sandwiched.
図において、（１）はワイヤボンダのヘツド（図示せ
ず）に取付けられた固定部、（２）は固定部（１）に対
向して設けられた可動部、（３）は可動部（２）を回動
可能に固定部（１）に支持する支持ピンで、これら固定
部（１）、可動部（２）および支持ピン（３）でワイヤ
把持手段が構成されている。（４）はばね板（10）の先
端部（11）に可動側クランプ座（５）と対向して設けら
れた固定側クランプ座、（５）は固定側クランプ座
（４）と対向して可動部（２）に設けられた可動側クラ
ンプ座、（６）は固定側および可動側クランプ座
（４），（５）を互いに近づける向きの固定部（１）と
可動部（２）の間に力を加える第１の付勢部としてのば
ね、（７），（８）は上記とは逆に遠ざかる向きに力を
加える第２の付勢部を構成するソレノイドとプランジヤ
で、ソレノイド（７）は固定部（１）に、プランジヤ
（８）は可動部（２）に取付けられていて、ソレノイド
（７）に通電することによりプランジヤ（８）に吸引力
が働き、ばね（６）の力に打勝つて可動部（２）を矢印
Ｂの向きに回動させるようになつている。これら、ばね
（６）、ソレノイド（７）およびプランジャ（８）で付
勢手段が構成されている。（９）はワイヤボンデイング
のためのワイヤーであり、（10）は自由な状態では
「ヘ」の字形に曲つたばね板で、固定部（１）の、可動
部（２）に対向する側に設けられて、可動側クランプ座
（５）に対向する先端部（11）が固定部（１）と離隔す
るように固定部（１）に取りつけられている。In the figure, (1) is a fixed part attached to a head (not shown) of a wire bonder, (2) is a movable part provided facing the fixed part (1), and (3) is a movable part (2). A support pin that rotatably supports the fixed portion (1), and the fixed portion (1), the movable portion (2), and the support pin (3) constitute a wire gripping means. (4) is a fixed side clamp seat provided at the tip (11) of the spring plate (10) facing the movable side clamp seat (5), and (5) is facing the fixed side clamp seat (4). The movable side clamp seat provided in the movable part (2), (6) is between the fixed part (1) and the movable part (2) in a direction in which the fixed side and the movable side clamp seats (4), (5) are brought close to each other. The springs (7) and (8) serving as the first biasing portion that applies a force to the solenoid are a solenoid and a plunger that constitute a second biasing portion that applies a force in a direction away from the above. ) Is attached to the fixed part (1), and the plunger (8) is attached to the movable part (2). By energizing the solenoid (7), a suction force acts on the plunger (8), and the force of the spring (6) is applied. The movable part (2) is rotated in the direction of arrow B by overcoming. The spring (6), the solenoid (7) and the plunger (8) constitute a biasing means. (9) is a wire for wire bonding, and (10) is a spring plate bent in a "F" shape in a free state, on a side of the fixed part (1) facing the movable part (2). A tip portion (11) provided and facing the movable side clamp seat (5) is attached to the fixed portion (1) so as to be separated from the fixed portion (1).
（12）は、ソレノイド（７）に通電したり、通電を断つ
たりするためのコントローラである。Reference numeral (12) is a controller for energizing and de-energizing the solenoid (7).
第４図は第３図に示すクランプ装置の動作図で、第４図
（Ａ）は第３図（Ａ）に、第４図（Ｃ）は第３図（Ｂ）
に対応するコントローラ（12）によりソレノイド（７）
に通電している時に第４図（Ａ）のようにワイヤ（９）
は自由になつている。コントローラ（12）によりソレノ
イド（７）の通電を断つとばね（６）により可動部
（２）は矢印Ａの向きに回動して第４図（Ｂ）の状態に
なる。この時、先ず、固定側クランプ座（４）と可動側
クランプ座（５）の先端部同士が当接してワイヤ（９）
には衝撃が加わらない。更に可動部（２）が矢印Ａの向
きに回動してばね板（10）がたわみ、第４図（Ｃ）のよ
うになつて固定側クランプ座（４）と可動側クランプ座
（５）でワイヤ（９）は挟付けるが、ばね板（10）によ
りワイヤ（９）への衝撃は緩和される。FIG. 4 is an operation diagram of the clamp device shown in FIG. 3. FIG. 4 (A) is shown in FIG. 3 (A), and FIG. 4 (C) is shown in FIG. 3 (B).
Solenoid (7) by controller (12) corresponding to
As shown in Fig. 4 (A), the wire (9)
Is free. When the solenoid (7) is de-energized by the controller (12), the movable part (2) is rotated in the direction of arrow A by the spring (6) to the state shown in FIG. 4 (B). At this time, first, the tip ends of the fixed side clamp seat (4) and the movable side clamp seat (5) are brought into contact with each other to make the wire (9).
Is not shocked. Further, the movable part (2) is rotated in the direction of arrow A to bend the spring plate (10), and as shown in FIG. 4 (C), the fixed side clamp seat (4) and the movable side clamp seat (5). Although the wire (9) is sandwiched by, the impact on the wire (9) is alleviated by the spring plate (10).
従来のワイヤボンダのワイヤクランプ装置は非常に柔軟
なばね板（10）に固定側クランプ座（４）を固定してい
るため、ワイヤ（９）を把持する際にばね板（10）によ
ってワイヤにかかる衝撃が緩和されるが固定側クランプ
座（４）と可動側クランプ座（５）との平行度を精度よ
く調整することが困難であり、この平行度が出てない
と、ワイヤ（９）が、クランプ時に異常変形してしまう
ことになる。又、近年生産能率の向上を目指し、ボンデ
イングスピードの高速化が図られ、クランプ装置が固定
されているボンデイングヘツドを高速に動作させること
が不可欠となつている。このため、ボンデイングヘツド
の振動がクランプ装置を伝わり、ばね板（10）を振動さ
せて、ワイヤ（９）を異常変形させているなどの問題が
あつた。またこの対策として単にばね板（10）を除去し
て剛性を高めるのみでは、ワイヤ（９）の把持に際し
て、その把持力によりワイヤ（９）が異常変形されると
いう問題を生じた。In the wire clamp device of the conventional wire bonder, since the fixed side clamp seat (4) is fixed to the spring plate (10) which is very flexible, the spring plate (10) catches the wire when gripping the wire (9). Although the shock is alleviated, it is difficult to accurately adjust the parallelism between the fixed side clamp seat (4) and the movable side clamp seat (5). If this parallelism does not appear, the wire (9) , It will be deformed abnormally when clamped. Further, in recent years, with the aim of improving the production efficiency, the bonding speed has been increased, and it is indispensable to operate the bonding head to which the clamp device is fixed at high speed. Therefore, there is a problem that vibration of the bonding head is transmitted through the clamp device to vibrate the spring plate (10) and abnormally deform the wire (9). Further, as a measure against this, merely removing the spring plate (10) to increase the rigidity causes a problem that when the wire (9) is gripped, the wire (9) is deformed abnormally by the gripping force.
この発明は、上記のような問題を解消するためになされ
たもので、固定側クランプ座（４）と可動側クランプ座
（５）との平行度出しが、容易で、ボンデイングヘツド
の振動などの外乱にも強いワイヤボンダのワイヤクラン
プ装置を用いつつ、ワイヤの異常変形を防止できるワイ
ヤクランプ方法を得ることを目的とする。The present invention has been made in order to solve the above problems, and it is easy to obtain parallelism between the fixed side clamp seat (4) and the movable side clamp seat (5) and to prevent vibration of the bonding head. An object of the present invention is to obtain a wire clamp method capable of preventing abnormal deformation of a wire while using a wire clamp device of a wire bonder that is strong against disturbance.
この発明に係るワイヤボンダのワイヤクランプ方法は、
ワイヤ把持手段に配設された一対のクランプ座の開閉と
このクランプ座のワイヤ把持力とを制御可能とされた付
勢手段を備えたワイヤボンダでワイヤを把持する際に上
記ワイヤ把持力を小さい把持力から大きい把持力に多段
に変化させたものである。A wire clamp method for a wire bonder according to the present invention,
When gripping a wire with a wire bonder having an urging means capable of controlling the opening and closing of a pair of clamp seats arranged on the wire gripping means and the wire gripping force of the clamp seat, the gripping force is small. This is a multi-step change from a force to a large gripping force.
この発明におけるワイヤボンダのワイヤクランプ方法
は、ワイヤ把持手段に配設された一対のクランプ座の開
閉とこのクランプ座のワイヤ把持力とを制御可能とされ
た付勢手段を備えたワイヤボンダでワイヤを把持する際
にワイヤ把持力を小さい把持力から大きい把持力に多段
に変化させるようにしたので、ワイヤを異常変形させず
に挟付けたり、自由にしたりできる。A wire clamp method for a wire bonder according to the present invention grasps a wire with a wire bonder having an urging means capable of controlling opening and closing of a pair of clamp seats arranged in the wire gripping means and wire gripping force of the clamp seats. In doing so, since the wire gripping force is changed in multiple steps from a small gripping force to a large gripping force, the wire can be sandwiched or freely deformed without abnormal deformation.
第１図は、この発明の一実施例によるクランプ装置を示
す側面図であり、図において、（１）〜（３），
（５），（９）は第３図と同様であるので説明は省略す
る。（４）は固定部（１）の、可動部（２）と対向して
可動部（２）に設けられた可動側クランプ座、（６）は
固定側および可動側クランプ座（４），（５）を互いに
開放する向きに固定部（１）と可動部（２）の間に力を
加える第１の付勢部としてのばね、（７）（８）は、上
記とは逆に遠ざかる向きの力を加える第２の付勢部を構
成するソレノイドとプランジヤで、ソレノイド（７）は
固定部（１）に、プランジヤ（８）は可動部（２）に取
付けられていて、ソレノイド（７）に通電することによ
り、プランジヤ（８）に吸引力が働き、ばね（６）の力
に打勝つて可動部（２）を矢印Ｂの向きに回動させるよ
うになつている。（13）は、ソレノイド（７）の入力電
圧を２段階の電圧に変化する様に制御可能なコントロー
ラである。FIG. 1 is a side view showing a clamp device according to an embodiment of the present invention, in which (1) to (3),
Since (5) and (9) are the same as those in FIG. 3, description thereof will be omitted. (4) is a movable side clamp seat of the fixed part (1) facing the movable part (2) and provided on the movable part (2), and (6) is a fixed side and movable side clamp seats (4), ( A spring as a first urging portion that applies a force between the fixed portion (1) and the movable portion (2) in the direction in which 5) is opened to each other, and (7) and (8) are the opposite directions from the above. The solenoid (7) is attached to the fixed portion (1) and the plunger (8) is attached to the movable portion (2) by the solenoid and the plunger constituting the second biasing portion for applying the force of By energizing, the attraction force acts on the plunger (8) to overcome the force of the spring (6) and rotate the movable part (2) in the direction of arrow B. Reference numeral (13) is a controller that can control the input voltage of the solenoid (7) to be changed in two steps.
上記のクランプ装置において、第１図（Ａ）は、ワイヤ
（９）を解放している状態を示す図である。第１図では
コントローラ（13）によつてソレノイド（７）には通電
されてないため、ばね（６）の引張り力により、可動側
および固定側クランプ座（４），（５）が開き、ワイヤ
（９）を解放している。In the above clamp device, FIG. 1 (A) is a view showing a state in which the wire (9) is released. In FIG. 1, since the solenoid (7) is not energized by the controller (13), the movable side and fixed side clamp seats (4) and (5) are opened by the tensile force of the spring (6), (9) has been released.
第１図（Ｂ）は、ワイヤ（９）を挟付けた状態を示す図
である。FIG. 1 (B) is a view showing a state in which the wire (9) is clamped.
ワイヤ（９）を挟付ける時には、コントローラ（13）に
よつて、ソレノイド（７）に第２図に示す第１段の電圧
が印加される。第一段の電圧は、可動部（２）をＢ方向
に回動させるが、可動側及び固定側クランプ座（４），
（５）で、ワイヤ（９）を軽く挟付ける程度（ワイヤ径
φ25μｍで、約2g）であり、ワイヤ（９）に過大な衝撃
力を与えないようにしている。その後、ワイヤ（９）を
完全に挟付けるだけ（約50g）の第２段の電圧をソレノ
イド（７）に印加する。このように２段入力電圧をソレ
ノイド（７）に印加することによりワイヤ（９）をソフ
トに挟付けることができる。以上よりワイヤボンダ（図
示せず）の動作に応じて適宜ワイヤ（９）を挟付けた
り、自由にしたりする。When the wire (9) is clamped, the voltage of the first stage shown in FIG. 2 is applied to the solenoid (7) by the controller (13). The first stage voltage causes the movable part (2) to rotate in the B direction, but the movable side and fixed side clamp seats (4),
In (5), the wire (9) is lightly clamped (wire diameter φ25 μm, about 2 g) so as not to give an excessive impact force to the wire (9). Then, the second stage voltage is applied to the solenoid (7) so that the wire (9) is completely clamped (about 50 g). By thus applying the two-stage input voltage to the solenoid (7), the wire (9) can be softly clamped. From the above, the wire (9) is appropriately clamped or freed according to the operation of the wire bonder (not shown).
なお上記実施例では、可動部（２）を動作させるために
ばね（６）とソレノイド（７）を設けたものを示した
が、リニアモータや、圧電素子を設けてもよい。Although the spring (6) and the solenoid (7) are provided in order to operate the movable portion (2) in the above embodiment, a linear motor or a piezoelectric element may be provided.
また、ソレノイド（７）への印加電圧を２段階になるよ
うにしたが、マイコン等により、多段階になるようにし
てもよい。Further, although the voltage applied to the solenoid (7) has two levels, it may have multiple levels by a microcomputer or the like.
以上のようにこの発明によれば、ワイヤ把持手段に配設
された一対のクランプ座の開閉とこのクランプ座のワイ
ヤ把持力とを制御可能とされた付勢手段を備えたワイヤ
ボンダでワイヤを把持する際にワイヤ把持力を小さい把
持力から大きい把持力に多段に変化させるようにしたの
で、ワイヤの異常変形を防止でき、信頼性の高い半導体
装置が得られる効果がある。As described above, according to the present invention, the wire is gripped by the wire bonder including the biasing means capable of controlling the opening / closing of the pair of clamp seats arranged in the wire gripping means and the wire gripping force of the clamp seats. In doing so, the wire gripping force is changed in multiple steps from a small gripping force to a large gripping force, so that there is an effect that abnormal deformation of the wire can be prevented and a highly reliable semiconductor device can be obtained.
第１図はこの発明の一実施例によるクランプ装置の側面
図、第２図は、ソレノイドへの二段階印加電圧指令を示
すグラフ、第３図（Ａ）及び第３図（Ｂ）は従来装置の
側面図、第４図（Ａ），第４図（Ｂ），第４図（Ｃ）は
その動作を示す側面図である。 図中、（１）は固定部、（２）は可動部、（４）は可動
側クランプ座、（５）は固定側クランプ座、（６）はば
ね、（７）はソレノイド、（13）はコントローラであ
る。 なお、各図同一符号は同一または相当部分を示す。FIG. 1 is a side view of a clamp device according to an embodiment of the present invention, FIG. 2 is a graph showing a two-stage applied voltage command to a solenoid, and FIGS. 3 (A) and 3 (B) are conventional devices. 4A, FIG. 4A, FIG. 4B, and FIG. 4C are side views showing the operation. In the figure, (1) is a fixed part, (2) is a movable part, (4) is a movable side clamp seat, (5) is a fixed side clamp seat, (6) is a spring, (7) is a solenoid, (13). Is the controller. The same reference numerals in each figure denote the same or corresponding parts.
Claims (1)
プ座の開閉と上記クランプ座のワイヤ把持力とを制御可
能とされた付勢手段を備えたワイヤボンダのワイヤクラ
ンプ方法において、ワイヤを把持する際に上記ワイヤ把
持力を小さい把持力から大きい把持力に多段に変化させ
ることを特徴とするワイヤボンダのワイヤクランプ方
法。1. A wire clamp method for a wire bonder, comprising a biasing means capable of controlling opening and closing of a pair of clamp seats arranged on the wire gripping means and wire gripping force of the clamp seat. A wire clamping method for a wire bonder, wherein the wire gripping force is changed in multiple steps from a small gripping force to a large gripping force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1237927A JPH06103700B2 (en) | 1989-09-13 | 1989-09-13 | Wire bonder wire clamp method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1237927A JPH06103700B2 (en) | 1989-09-13 | 1989-09-13 | Wire bonder wire clamp method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03101138A JPH03101138A (en) | 1991-04-25 |
| JPH06103700B2 true JPH06103700B2 (en) | 1994-12-14 |
Family
ID=17022522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1237927A Expired - Fee Related JPH06103700B2 (en) | 1989-09-13 | 1989-09-13 | Wire bonder wire clamp method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06103700B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286704A (en) * | 2005-03-31 | 2006-10-19 | Sharp Takaya Denshi Kogyo Kk | Apparatus for wire bonding and method of cutting wire therein |
-
1989
- 1989-09-13 JP JP1237927A patent/JPH06103700B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03101138A (en) | 1991-04-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
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| LAPS | Cancellation because of no payment of annual fees |