WO2021029174A1 - Wire bonding device - Google Patents

Wire bonding device Download PDF

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Publication number
WO2021029174A1
WO2021029174A1 PCT/JP2020/027307 JP2020027307W WO2021029174A1 WO 2021029174 A1 WO2021029174 A1 WO 2021029174A1 JP 2020027307 W JP2020027307 W JP 2020027307W WO 2021029174 A1 WO2021029174 A1 WO 2021029174A1
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WIPO (PCT)
Prior art keywords
wire
bonding
clamp arm
actuator
voltage
Prior art date
Application number
PCT/JP2020/027307
Other languages
French (fr)
Japanese (ja)
Inventor
俊彦 富山
Original Assignee
株式会社新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to SG11202111630PA priority Critical patent/SG11202111630PA/en
Priority to KR1020217034714A priority patent/KR102556611B1/en
Priority to CN202080031826.8A priority patent/CN113767458A/en
Priority to JP2021539173A priority patent/JP7191421B2/en
Publication of WO2021029174A1 publication Critical patent/WO2021029174A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78353—Ultrasonic horns
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H01L2224/78631—Means for wire tension adjustments
    • H—ELECTRICITY
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    • H01L2224/789—Means for monitoring the connection process
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/789—Means for monitoring the connection process
    • H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the present invention relates to a configuration of a bonding device that bonds a wire to a bonding target.
  • wire bonding devices are used to connect the electrodes of the semiconductor die and the leads of the lead frame with wires.
  • the wire bonding device the wire is pressed onto the electrode by the capillary, the capillary is ultrasonically vibrated to join the wire and the electrode, the wire is hung to the lead, and the hung wire is pressed onto the lead. In this state, the capillary is ultrasonically connected to connect the wire and the lead (see, for example, Patent Document 1).
  • the direction of ultrasonic vibration of the capillary is the direction in which the ultrasonic horn extends (hereinafter referred to as the Y direction).
  • the shape of the joint portion between the wire and the electrode or the joint portion between the wire and the lead may be a shape extending in the Y direction, which is the direction of ultrasonic vibration of the capillary, which may lead to poor joining.
  • bonding is required to be performed in a very short time of about 10 msec. Therefore, it is required to vibrate the tip of the capillary at a high frequency in the X direction at the time of bonding.
  • the flexible connecting frame and the ultrasonic horn vibrate in the X direction as one unit, the mass vibrating in the X direction is large, and the ultrasonic horn is used at a high frequency. It was difficult to vibrate in the X direction. Therefore, when bonding in a short time, the number of vibrations of the tip of the capillary during bonding is reduced, and the bonding quality may be deteriorated.
  • an object of the present invention is to improve the bonding quality in the wire bonding apparatus.
  • the wire bonding apparatus of the present invention includes an ultrasonic horn to which a bonding tool through which the wire is inserted is attached to the tip, and a bonding arm to which the ultrasonic horn is attached, and the bonding tool is brought into contact with and separated from the bonding target to bond the wire.
  • the wire clamper includes a wire clamper and a control unit that adjusts the opening / closing operation of the actuator of the wire clamper. And.
  • the clamp arm can be vibrated at a high frequency by vibrating the lightweight clamp arm in the X direction, which is the opening direction. Then, the high frequency vibration generated by the clamp arm can be transmitted to the tip of the ultrasonic horn to vibrate the bonding tool at a high frequency in the X direction at the time of bonding.
  • the number of vibrations of the tip of the bonding tool in the X direction during bonding can be increased, and the bonding quality can be improved.
  • control unit may drive the clamp arm in the opening / closing direction at a frequency of 80% to 120% of the resonance frequency of the clamp arm by the actuator of the wire clamper at the time of bonding.
  • the clamp arm can be vibrated greatly with a small amount of input energy, and the bonding tool can be sufficiently vibrated in the X direction during bonding. Thereby, the bonding quality can be improved.
  • the length of the clamp arm of the wire clamper may be 80% to 120% of the length of the ultrasonic horn.
  • the resonance frequency in the X direction of the clamp arm and the resonance frequency in the X direction of the ultrasonic horn become substantially the same frequency, and the ultrasonic horn resonates in the X direction corresponding to the resonance in the X direction of the clamp arm. Therefore, the vibration due to the resonance of the clamp arm is smoothly transmitted to the ultrasonic horn, and the capillary attached to the tip of the ultrasonic horn can be sufficiently vibrated in the X direction. Thereby, the bonding quality can be improved.
  • the clamp arm in the wire clamper, the clamp arm is opened when a predetermined opening voltage is applied to the actuator, and the clamp arm is closed when no voltage is applied to the actuator. Even if the clamp arm is vibrated in the open / close direction in the open state by applying a fluctuating voltage that fluctuates in a predetermined voltage width around a base voltage that is the same as or slightly lower than the predetermined open circuit voltage to the actuator. Good.
  • the base voltage is a voltage of 80% to 100% of the predetermined open circuit voltage
  • the predetermined voltage width may be a voltage of 8% to 30% of the predetermined open circuit voltage.
  • the clamp arm can be vibrated while maintaining an open state in which the clamp arm does not come into contact with the wire. Therefore, the vibration frequency of the clamp arm can be set to the resonance frequency or a frequency in the vicinity of the resonance frequency.
  • the wire bonding apparatus of the present invention includes an ultrasonic vibrator that ultrasonically vibrates the ultrasonic horn in the longitudinal direction, and the control unit adjusts the drive of the ultrasonic vibrator and clamps it by the actuator of the wire clamper at the time of bonding.
  • the ultrasonic vibrator may be ultrasonically vibrated to ultrasonically vibrate the ultrasonic horn in the longitudinal direction.
  • the present invention can improve the bonding quality in the wire bonding apparatus.
  • FIG. 3 is a plan view showing the open dimension G of the tip of the clamp arm when the applied voltage V shown in FIG. 3 is the open circuit voltage V0, the applied voltage VB1, and the applied voltage VB2.
  • the direction from the bonding arm 20 to the ultrasonic horn 10 is the Y direction and the upward direction in the extending direction of the ultrasonic horn 10 and the bonding arm 20, or the longitudinal direction of the bonding arm 20 and the ultrasonic horn 10.
  • the Z direction, the Y direction, and the direction orthogonal to the Z direction will be described as the X direction.
  • the positive side in the Y direction will be described as the tip side, the negative side in the Y direction as the root side, the positive side in the Z direction as the upper side, the negative side in the Z direction as the lower side, the positive side in the X direction as the right side, and the negative side in the X direction as the left side.
  • the wire bonding apparatus 100 is a bonding stage that holds an ultrasonic horn 10, a bonding arm 20, a wire clamper 30, a control unit 60, and a substrate 52 or a semiconductor element 53 to be bonded. 51 and is included.
  • the ultrasonic horn 10 is formed in the horn main body 11, the base portion 12 formed on the negative side in the Y direction (hereinafter referred to as the root side) of the horn main body 11, and the base portion 12. It is provided with an opening 13 formed in the opening 13 and an ultrasonic vibrator 16 housed in the opening 13.
  • the base portion 12 includes a flange 14 projecting in the X direction.
  • the flange 14 on the root side is attached to the Y-direction plus side end 21 (hereinafter, referred to as the tip 21) of the bonding arm 20 by a bolt 15.
  • the length from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the positive end in the Y direction of the horn body 11 is the length Lh.
  • a capillary 41 which is a bonding tool, is attached to the Y-direction plus side end of the horn body 11 of the ultrasonic horn 10.
  • the capillary 41 is a cylindrical member having a through hole in the center and a sharp tip.
  • a wire 45 is inserted through the central hole of the capillary 41.
  • the horn body 11 When the ultrasonic vibrator 16 vibrates ultrasonically in the Y direction at a predetermined frequency, the horn body 11 resonates in the Y direction and vibrates vertically, and the capillary 41 attached to the tip side of the horn body 11 vibrates in the Y direction. Let me.
  • the bonding arm 20 is rotatably supported in the direction indicated by the arrow 90 by a rotation center 26 arranged at substantially the same height as the upper surface of the substrate 52 or the semiconductor element 53.
  • a Z-direction motor 27 that drives the capillary 41 connected to the tip of the ultrasonic horn 10 in the Z direction
  • an XY drive mechanism 29 that drives the base 28 on which the Z-direction motor 27 is mounted in the XY directions. And are attached.
  • a piezoelectric element 17 is attached to the upper surface of the bonding arm 20 on the tip end side by bolts 18. The piezoelectric element 17 detects a pressing force on the substrate 52 or the semiconductor element 53 of the capillary 41.
  • a wire clamper 30 is attached to the upper side of the bonding arm 20.
  • the wire clamper 30 includes a clamp arm 31 and a base portion 32.
  • the base portion 32 is fixed on the upper seat 24 of the bonding arm 20 with bolts 25.
  • the base portion 32 has a square opening 33 in the center, and the actuator 34 is housed in the opening 33.
  • the actuator 34 may be composed of, for example, a piezo element.
  • Left and right arm mounting portions 36 extending toward the tip side are provided on the positive side of the base portion 32 in the Y direction.
  • a clamp arm 31 is fixed to the arm mounting portion 36 with a bolt 35.
  • the tip of the clamp arm 31 projects from the tip 21 of the bonding arm 20 in the Y direction to grip the wire 45.
  • a recess 38 is provided between the left and right arm mounting portions 36.
  • An elastic hinge 37 that rotates around the Z direction axis is formed at the base of the arm mounting portion 36 by the recess 38.
  • the length from the elastic hinge 37 to the tip of the clamp arm 31 is the length Lc.
  • the length Lc is substantially the same as the length Lh from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the positive end in the Y direction of the horn body 11.
  • the clamp arm 31 rotates around the elastic hinge 37, and the tip of the clamp arm 31 opens and opens in the X direction, which is the opening / closing direction, as shown by a solid line in FIG.
  • the dimension G is the fully open dimension G0. Since the fully open dimension G0 is larger than the diameter d of the wire 45, the clamp arm 31 opens the wire 45.
  • the voltage V applied to the actuator 34 and the opening dimension G of the tip of the clamp arm 31 are in a substantially proportional relationship, and when the applied voltage V is increased, the tip of the clamp arm 31 is opened accordingly.
  • the dimension G also increases.
  • the applied voltage V is an applied voltage V1 slightly lower than the open circuit voltage V0
  • the open dimension G of the tip of the clamp arm 31 is a fully open dimension as shown by the broken line in FIG.
  • the large opening size G1 is slightly smaller than G0.
  • the opening dimension G of the tip of the clamp arm 31 is a small opening smaller than the large opening dimension G1 like the clamp arm 31 shown by the alternate long and short dash line in FIG.
  • the dimension is G2. Since the small opening dimension G2 is larger than the diameter d of the wire 45, the clamp arm 31 does not hit the wire 45 and the wire clamper 30 remains open even when the opening dimension G at the tip of the clamp arm 31 is the small opening dimension G2. ..
  • the open dimension G of the tip of the clamp arm 31 is set to the large open dimension G1 and the small open dimension G2 while maintaining the open state of the wire clamper 30. Can vary between.
  • the median value of the applied voltage VB1 and the applied voltage VB2 is set as the base voltage VB, and the voltage width ⁇ V centering on the base voltage VB.
  • the applied voltage V may be increased or decreased by the amount.
  • the base voltage VB and the voltage width ⁇ V can be freely selected.
  • the base voltage VB is 80% to 100% of the open circuit voltage V0
  • the voltage width ⁇ V is 8% to 30% of the open circuit voltage V0. It may be a voltage of%.
  • the control unit 60 includes a clamper control unit 61 and a bonding control unit 62.
  • the clamper control unit 61 adjusts the applied voltage V of the actuator 34 of the wire clamper 30 to open and close the clamp arm 31.
  • the bonding control unit 62 receives a signal from the piezoelectric element 17 and adjusts the Z-direction motor 27 to drive the tip of the capillary 41 in the contact / separation direction with respect to the substrate 52 or the semiconductor element 53.
  • the XY drive mechanism 29 is controlled to adjust the position of the capillary 41 in the XY direction.
  • the ultrasonic vibrator 16 of the ultrasonic horn 10 is driven to ultrasonically vibrate the horn body 11 in the Y direction.
  • the clamper control unit 61 sets the applied voltage V of the actuator 34 of the wire clamper 30 to zero, closes the wire clamper 30, and causes the wire clamper 30 to grip the wire 45.
  • the bonding control unit 62 generates a spark between the torch electrode (not shown) and the wire 45 extending from the tip of the capillary 41, and forms the lower end of the wire 45 into a free air ball 50.
  • the clamper control unit 61 vibrates the voltage V applied to the actuator 34 of the wire clamper 30 at a frequency f0 in the range of the voltage width ⁇ V centering on the base voltage VB shown in FIG.
  • the applied voltage V to the actuator 34 vibrates at a frequency f0 within the range of the applied voltage V1 and the applied voltage V2 shown in FIG. 3, and the open dimension G of the tip of the clamp arm 31 is a large open dimension as shown in FIG. It oscillates at a frequency f0 between G1 and the small opening dimension G2.
  • the clamper control unit 61 vibrates the clamp arm 31 at the frequency f0 while maintaining the open state of the wire clamper 30.
  • the frequency f0 is a frequency close to the resonance frequency f1 in which the clamp arm 31 vibrates in the X direction
  • the clamp arm 31 is resonated in the X direction around the elastic hinge 37 as shown by the arrow 96 in FIG. 6B.
  • the frequency f0 may be a frequency close to the resonance frequency f1 of the vibration of the clamp arm 31 in the X direction.
  • the resonance frequency of the clamp arm 31 is, for example, about 2 kHz, it may be a frequency close to 2 kHz, for example, a frequency of about 1.9 kHz to 2.0 kHz. Since the clamp arm 31 is lightweight, it can sufficiently vibrate in the X direction even at such a high frequency. As a result, the number of vibrations of the tip of the capillary 41 in the X direction during bonding can be increased even when bonding is performed in a short time.
  • the frequency f0 may be selected from a range such as f1 / ⁇ 2 ⁇ f0 ⁇ f1 ⁇ ⁇ 2 as long as the frequency f0 resonates in the X direction, or X of the clamp arm 31. It may be selected from frequencies in the range of 80% to 120% of the resonance frequency f1 in the direction.
  • the vibration of the clamp arm 31 in the X direction is transmitted from the bonding arm 20 to the ultrasonic horn 10.
  • the length Lc from the elastic hinge 37 of the wire clamper 30 to the tip of the clamp arm 31 is from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the Y-direction plus side end of the horn body 11.
  • the length is almost the same as Lh. Therefore, the resonance frequency f2 in the X direction of the ultrasonic horn 10 is a frequency close to the resonance frequency f1 in the X direction of the clamp arm 31.
  • the ultrasonic horn 10 resonates in the X direction as shown by the arrow 97 in FIG. 6A, and the tip of the horn body 11 resonates in the X direction. It vibrates laterally. As a result, the capillary 41 attached to the tip of the horn body 11 vibrates in the X direction.
  • the bonding control unit 62 applies a predetermined voltage to the ultrasonic vibrator 16 of the ultrasonic horn 10 to cause the ultrasonic vibrator 16 to vibrate ultrasonically.
  • Ultrasonic resonance in the Y direction occurs in the horn body 11, which causes the tip of the capillary 41 to vibrate in the Y direction, as shown by the arrow 92 in FIG. 5B.
  • the clamper control unit 61 vibrates the clamp arm 31 to vibrate the tips of the ultrasonic horn 10 and the capillary 41 in the X direction
  • the bonding control unit 62 drives the ultrasonic vibrator 16 to drive the capillary 41.
  • the tip is vibrated in the Y direction.
  • the bonding control unit 62 operates the Z-direction motor 27 and presses the capillary 41 against the electrodes of the semiconductor element 53 as shown by the arrow 91 in FIG. 5B.
  • the free air ball 50 is bonded to the electrode of the semiconductor element 53.
  • the bonding control unit 62 operates the Z-direction motor 27 to raise the capillary 41. Further, the clamper control unit 61 grips the wire 45 with the clamp arm 31 with the applied voltage V of the actuator 34 set to zero. Then, the bonding control unit 62 operates the Z-direction motor 27 and the XY drive mechanism 29 to loop the tip of the capillary 41 and guide it onto the electrodes of the substrate 52 as shown by the arrow 93 shown in FIG. 5C.
  • the clamper control unit 61 vibrates the applied voltage V of the actuator 34 of the wire clamper 30 at a frequency f0 close to the resonance frequency f1 of the vibration in the X direction of the clamp arm 31, as in the case of bonding the free air ball 50. ..
  • the clamp arm 31 laterally vibrates in the X direction around the elastic hinge 37 due to resonance.
  • the tip of the horn body 11 vibrates laterally in the X direction, and the tip of the capillary 41 vibrates in the X direction.
  • the bonding control unit 62 drives the ultrasonic vibrator 16 to vibrate the tip of the capillary 41 in the Y direction as shown by an arrow 95 in FIG. 5C. Then, with the tip of the capillary 41 vibrating in the XY direction, the bonding control unit 62 drives the Z-direction motor 27 and presses the tip of the capillary 41 against the electrode of the substrate 52 as shown by the arrow 94 in FIG. 5C to press the substrate 52. The wire 45 is bonded to the electrode of 52.
  • the length Lc from the elastic hinge 37 of the wire clamper 30 to the tip of the clamp arm 31 and the length from the flange 14 of the ultrasonic horn 10 to the positive end in the Y direction of the horn body 11 It has almost the same length as Lh. Therefore, the resonance frequency f1 in the X direction of the clamp arm 31 and the resonance frequency f2 in the X direction of the ultrasonic horn 10 have the same frequency. With this configuration, the ultrasonic horn 10 can be resonated and vibrated in the X direction by the resonance vibration of the clamp arm 31 in the X direction, and the tip of the capillary 41 can be vibrated in the X direction.
  • the ultrasonic vibrator 16 can resonate the horn body 11 of the ultrasonic horn 10 in the Y direction to vibrate the tip of the capillary 41 in the Y direction. Therefore, the wire 45 can be bonded to the electrode of the semiconductor element 53 or the electrode of the substrate 52 while the tip of the capillary 41 is vibrated in the XY direction. As a result, it is possible to prevent the joint portion of the wire 45 from becoming a deformed shape extending in the Y direction and causing poor joining, and it is possible to improve the bonding quality. Further, the bonding strength between the wire 45 and the electrode of the semiconductor element 53 or the electrode of the substrate 52 can be increased.
  • the length Lc and the length Lh are substantially the same length.
  • the length Lc may be in the range of 80% to 120% of the length Lh.
  • the resonance frequency f1 in the X direction of the clamp arm 31 and the resonance frequency f2 in the X direction of the ultrasonic horn 10 are high frequencies in the vicinity of 2 kHz, for example, the tip of the capillary 41 is vibrated in the X direction at a high frequency. It is possible to increase the number of vibrations of the tip of the capillary 41 in the X direction during bonding even when bonding is performed in a short time. Thereby, the quality of bonding can be improved.
  • the wire clamper 30 was reliably kept in the open state.
  • the clamp arm 31 can be vibrated in the X direction as it is. As a result, it is possible to prevent the clamp arm 31 from touching the wire 45 and disturb the vibration in the X direction during vibration, and it is possible to improve the bonding quality.
  • the bonding is performed by vibrating the tip of the capillary 41 in the XY direction, but the present invention is not limited to this, and the ultrasonic vibrator 16 is not driven and the clamp is used.
  • the tip of the capillary 41 may be vibrated only in the X direction for bonding.
  • the wire bonding apparatus 100 of the embodiment since the tip of the capillary 41 can be vibrated in the X direction at a high frequency, the number of vibrations of the capillary 41 should be increased even when bonding is performed in a short time. And the bonding quality can be maintained.
  • the ultrasonic vibrator 16 is driven without vibrating the clamp arm 31 in the X direction to carry the capillary.
  • the tip of 41 is ultrasonically vibrated in the Y direction and the wire 45 is bonded to the electrode of the substrate 52, only the clamp arm 31 is vibrated in the X direction without driving the ultrasonic vibrator 16 to cause the capillary 41.
  • the tip may be vibrated in the X direction.
  • the ultrasonic horn 10 has been described as having the flange 14 on the root side of the horn body 11 attached to the tip of the bonding arm 20, but the present invention is not limited to this.
  • a portion other than the root may be configured to be attached to the central portion of the bonding arm 20 or near the tip end.

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Abstract

This wire bonding device (100), which is provided with an ultrasonic horn (10) and a bonding arm (20), includes: a wire clamper (30) that has a clamp arm (31) that longitudinally protrudes from the tip of the bonding arm (20) and holds a wire (45), and a base body part (32) that is attached on the upper side of the bonding arm (20) and accommodates an actuator (34) for opening/closing the clamp arm (31); and a control unit (60) that adjusts the opening/closing operation of the actuator (34) of the wire clamper (30), wherein the control unit (60) vibrates the clamp arm (31), while being in an open state, in the opening/closing direction by means of the actuator (34) of the wire clamper (30) during bonding.

Description

ワイヤボンディング装置Wire bonding equipment
　本発明は、ワイヤをボンディング対象にボンディングするボンディング装置の構成に関する。 The present invention relates to a configuration of a bonding device that bonds a wire to a bonding target.
　半導体ダイの電極とリードフレームのリードとの間をワイヤで接続するワイヤボンディング装置が多く用いられている。ワイヤボンディング装置は、キャピラリによってワイヤを電極の上に押し付けた状態でキャピラリを超音波振動させてワイヤと電極とを接合した後、ワイヤをリードまで掛け渡し、掛け渡したワイヤをリードの上に押しつけた状態でキャピラリを超音波させてワイヤとリードとを接続するものである（例えば、特許文献１参照）。 Many wire bonding devices are used to connect the electrodes of the semiconductor die and the leads of the lead frame with wires. In the wire bonding device, the wire is pressed onto the electrode by the capillary, the capillary is ultrasonically vibrated to join the wire and the electrode, the wire is hung to the lead, and the hung wire is pressed onto the lead. In this state, the capillary is ultrasonically connected to connect the wire and the lead (see, for example, Patent Document 1).
　ワイヤボンディング装置では、キャピラリの超音波振動の方向は、超音波ホーンの伸びる方向（以下、Ｙ方向という）である。このため、ワイヤと電極との接合部分或いはワイヤとリードとの接合部分の形状がキャピラリの超音波振動の方向であるＹ方向に延びた形状となってしまい接合不良を招く場合があった。 In the wire bonding device, the direction of ultrasonic vibration of the capillary is the direction in which the ultrasonic horn extends (hereinafter referred to as the Y direction). For this reason, the shape of the joint portion between the wire and the electrode or the joint portion between the wire and the lead may be a shape extending in the Y direction, which is the direction of ultrasonic vibration of the capillary, which may lead to poor joining.
　そこで、超音波ホーンと超音波ホーンのアクチュエータとの間を弾性変形可能なフレキシブル連結フレームで構成し、キャピラリをアクチュエータの振動方向であるＹ方向とともにＹ方向に直交するＸ方向に振動させる構造が提案されている（例えば、特許文献２参照）。 Therefore, a structure is proposed in which the ultrasonic horn and the actuator of the ultrasonic horn are configured by an elastically deformable flexible connecting frame, and the capillary is vibrated in the X direction orthogonal to the Y direction as well as the Y direction which is the vibration direction of the actuator. (See, for example, Patent Document 2).
国際出願公開第２０１７／２１７３８５号International Application Publication No. 2017/217385 特許第６０７３９９１号公報Japanese Patent No. 6073991
　ところで、ボンディングは、１０ｍｓｅｃ程度の非常に短い時間で行うことが求められている。このため、ボンディングの際にキャピラリの先端を高い周波数でＸ方向に振動させることが求められる。この点に関し、引用文献２に記載された構成では、フレキシブル連結フレームと超音波ホーンとが一体となってＸ方向に振動するので、Ｘ方向に振動する質量が大きく、高い周波数で超音波ホーンをＸ方向に振動させることが難しかった。このため、短時間でボンディングする際には、ボンディング中のキャピラリの先端の振動回数が少なくなってしまい、ボンディング品質が低下する場合があった。 By the way, bonding is required to be performed in a very short time of about 10 msec. Therefore, it is required to vibrate the tip of the capillary at a high frequency in the X direction at the time of bonding. In this regard, in the configuration described in Reference 2, since the flexible connecting frame and the ultrasonic horn vibrate in the X direction as one unit, the mass vibrating in the X direction is large, and the ultrasonic horn is used at a high frequency. It was difficult to vibrate in the X direction. Therefore, when bonding in a short time, the number of vibrations of the tip of the capillary during bonding is reduced, and the bonding quality may be deteriorated.
　そこで、本発明は、ワイヤボンディング装置においてボンディング品質を向上させることを目的とする。 Therefore, an object of the present invention is to improve the bonding quality in the wire bonding apparatus.
　本発明のワイヤボンディング装置は、ワイヤが挿通するボンディングツールが先端に取付けられる超音波ホーンと、超音波ホーンが取付けられるボンディングアームと、を備え、ボンディングツールをボンディング対象に接離させてワイヤをボンディング対象にボンディングするワイヤボンディング装置であって、ボンディングアームから長手方向に突出してワイヤを把持するクランプアームと、ボンディングアームの上側に取付けられてクランプアームを開閉動作させるアクチュエータを収容する基体部と、を有するワイヤクランパと、ワイヤクランパのアクチュエータの開閉動作を調整する制御部と、を含み、制御部は、ボンディングの際にワイヤクランパのアクチュエータによってクランプアームを開放状態で開閉方向に振動させること、を特徴とする。 The wire bonding apparatus of the present invention includes an ultrasonic horn to which a bonding tool through which the wire is inserted is attached to the tip, and a bonding arm to which the ultrasonic horn is attached, and the bonding tool is brought into contact with and separated from the bonding target to bond the wire. A wire bonding device for bonding to an object, the clamp arm protruding from the bonding arm in the longitudinal direction to grip the wire, and a base portion for accommodating an actuator attached to the upper side of the bonding arm to open and close the clamp arm. The wire clamper includes a wire clamper and a control unit that adjusts the opening / closing operation of the actuator of the wire clamper. And.
　ボンディングの際に、軽量のクランプアームを開放方向であるＸ方向に振動させることにより、高い周波数でクランプアームを振動させることができる。そして、クランプアームで発生した高い周波数の振動を超音波ホーンの先端に伝達してボンディングの際にボンディングツールを高周波でＸ方向に振動させることができる。これにより、短時間でボンディングを行う場合でもボンディング中におけるボンディングツールの先端のＸ方向の振動回数を多くすることができ、ボンディング品質を向上させることができる。 At the time of bonding, the clamp arm can be vibrated at a high frequency by vibrating the lightweight clamp arm in the X direction, which is the opening direction. Then, the high frequency vibration generated by the clamp arm can be transmitted to the tip of the ultrasonic horn to vibrate the bonding tool at a high frequency in the X direction at the time of bonding. As a result, even when bonding is performed in a short time, the number of vibrations of the tip of the bonding tool in the X direction during bonding can be increased, and the bonding quality can be improved.
　本発明のワイヤボンディング装置において、制御部は、ボンディングの際にワイヤクランパのアクチュエータによってクランプアームをクランプアームの共振周波数の８０％～１２０％の周波数で開閉方向に駆動してもよい。 In the wire bonding apparatus of the present invention, the control unit may drive the clamp arm in the opening / closing direction at a frequency of 80% to 120% of the resonance frequency of the clamp arm by the actuator of the wire clamper at the time of bonding.
　これにより、少ない入力エネルギーでクランプアームを大きく振動させることができ、ボンディングの際にボンディングツールを十分にＸ方向に振動させることができる。これにより、ボンディング品質を向上させることができる。 As a result, the clamp arm can be vibrated greatly with a small amount of input energy, and the bonding tool can be sufficiently vibrated in the X direction during bonding. Thereby, the bonding quality can be improved.
　本発明のワイヤボンディング装置において、ワイヤクランパのクランプアームの長さは超音波ホーンの長さの８０％～１２０％の長さとしてもよい。 In the wire bonding apparatus of the present invention, the length of the clamp arm of the wire clamper may be 80% to 120% of the length of the ultrasonic horn.
　これにより、クランプアームのＸ方向の共振周波数と超音波ホーンのＸ方向の共振周波数とが略同一の周波数となり、クランプアームのＸ方向の共振に対応して超音波ホーンがＸ方向に共振する。このため、クランプアームの共振による振動がスムースに超音波ホーンに伝達され、超音波ホーンの先端に取付けられたキャピラリを十分にＸ方向に振動させることができる。これにより、ボンディング品質を向上させることができる。 As a result, the resonance frequency in the X direction of the clamp arm and the resonance frequency in the X direction of the ultrasonic horn become substantially the same frequency, and the ultrasonic horn resonates in the X direction corresponding to the resonance in the X direction of the clamp arm. Therefore, the vibration due to the resonance of the clamp arm is smoothly transmitted to the ultrasonic horn, and the capillary attached to the tip of the ultrasonic horn can be sufficiently vibrated in the X direction. Thereby, the bonding quality can be improved.
　本発明のワイヤボンディング装置において、ワイヤクランパは、アクチュエータに所定の開放電圧が印加されるとクランプアームが開放状態となり、アクチュエータに電圧が印加されない場合にはクランプアームが閉状態となり、制御部は、アクチュエータに所定の開放電圧と同一又は所定の開放電圧より僅かに低いベース電圧を中心として所定の電圧幅で変動する変動電圧を印加することにより、クランプアームを開放状態で開閉方向に振動させてもよい。この際、ベース電圧は、所定の開放電圧の８０％～１００％の電圧であり、所定の電圧幅は、所定の開放電圧の８％～３０％の電圧としてもよい。 In the wire bonding apparatus of the present invention, in the wire clamper, the clamp arm is opened when a predetermined opening voltage is applied to the actuator, and the clamp arm is closed when no voltage is applied to the actuator. Even if the clamp arm is vibrated in the open / close direction in the open state by applying a fluctuating voltage that fluctuates in a predetermined voltage width around a base voltage that is the same as or slightly lower than the predetermined open circuit voltage to the actuator. Good. At this time, the base voltage is a voltage of 80% to 100% of the predetermined open circuit voltage, and the predetermined voltage width may be a voltage of 8% to 30% of the predetermined open circuit voltage.
　これにより、クランプアームがワイヤに接触しない開放状態を保ちながらクランプアームを振動させることができる。このため、クランプアームの振動周波数を共振周波数或いは共振周波数の近傍の周波数とすることができる。 As a result, the clamp arm can be vibrated while maintaining an open state in which the clamp arm does not come into contact with the wire. Therefore, the vibration frequency of the clamp arm can be set to the resonance frequency or a frequency in the vicinity of the resonance frequency.
　本発明のワイヤボンディング装置において、超音波ホーンを長手方向に超音波振動させる超音波振動子を含み、制御部は、超音波振動子の駆動を調整し、ボンディングの際にワイヤクランパのアクチュエータによってクランプアームを開放状態で開閉方向に振動させると同時に、超音波振動子を超音波振動させて超音波ホーンを長手方向に超音波振動させてもよい。 The wire bonding apparatus of the present invention includes an ultrasonic vibrator that ultrasonically vibrates the ultrasonic horn in the longitudinal direction, and the control unit adjusts the drive of the ultrasonic vibrator and clamps it by the actuator of the wire clamper at the time of bonding. At the same time that the arm is vibrated in the opening / closing direction in the open state, the ultrasonic vibrator may be ultrasonically vibrated to ultrasonically vibrate the ultrasonic horn in the longitudinal direction.
　この構成により、ボンディングツールの先端をＸＹ方向に振動させた状態でボンディングを行ことができる。これにより、ワイヤの接合部分に形状がＹ方向に延びた変形形状となって接合不良となることを抑制でき、ボンディング品質を向上させることができる。 With this configuration, bonding can be performed with the tip of the bonding tool vibrated in the XY direction. As a result, it is possible to suppress a deformed shape in which the shape extends in the Y direction at the joint portion of the wire and cause a joint failure, and it is possible to improve the bonding quality.
　本発明は、ワイヤボンディング装置においてボンディング品質を向上させることができる。 The present invention can improve the bonding quality in the wire bonding apparatus.
実施形態のワイヤボンディング装置の側面と制御系統を示す系統図である。It is a system diagram which shows the side surface of the wire bonding apparatus of embodiment and a control system. 図１に示すワイヤボンディング装置のボンディングアームと超音波ホーンとを示す底面図である。It is a bottom view which shows the bonding arm and the ultrasonic horn of the wire bonding apparatus shown in FIG. 図１に示すワイヤボンディング装置のボンディングアームとワイヤクランパとを示す平面図である。It is a top view which shows the bonding arm and the wire clamper of the wire bonding apparatus shown in FIG. ワイヤクランパへの印加電圧とクランプアーム先端の開寸法Ｇとの関係を示すグラフである。It is a graph which shows the relationship between the voltage applied to a wire clamper, and the open dimension G of the tip of a clamp arm. 図３に示す印加電圧Ｖが開放電圧Ｖ０、印加電圧ＶＢ１、印加電圧ＶＢ２の際のクランプアーム先端の開寸法Ｇを示す平面図である。FIG. 3 is a plan view showing the open dimension G of the tip of the clamp arm when the applied voltage V shown in FIG. 3 is the open circuit voltage V0, the applied voltage VB1, and the applied voltage VB2. ボンディング前にワイヤの下端をフリーエアボールに成形した際の超音波ホーンとワイヤクランパとの状態を示す立面図である。It is an elevation view which shows the state of an ultrasonic horn and a wire clamper when the lower end of a wire is formed into a free air ball before bonding. 半導体素子にワイヤをボンディングする際の超音波ホーンとワイヤクランパとの状態を示す立面図である。It is an elevation view which shows the state of an ultrasonic horn and a wire clamper at the time of bonding a wire to a semiconductor element. 基板にワイヤをボンディングする際の超音波ホーンとワイヤクランパとの状態を示す立面図である。It is an elevation view which shows the state of an ultrasonic horn and a wire clamper at the time of bonding a wire to a substrate. 図５Ｂ、図５Ｃに示す状態における超音波ホーンの振動を示す底面図である。It is a bottom view which shows the vibration of the ultrasonic horn in the state shown in FIGS. 5B and 5C. 図５Ｂ、図５Ｃに示す状態におけるクランプアームの振動を示す平面図である。5B is a plan view showing the vibration of the clamp arm in the state shown in FIGS. 5B and 5C.
　以下、図面を参照しながら、実施形態のワイヤボンディング装置１００について説明する。以下の説明では、超音波ホーン１０及びボンディングアーム２０の延びる方向、或いは、ボンディングアーム２０及び超音波ホーン１０の長手方向で、ボンディングアーム２０から超音波ホーン１０に向かう方向をＹ方向、上方向をＺ方向、Ｙ方向及びＺ方向と直交する方向をＸ方向として説明する。また、Ｙ方向プラス側を先端側、Ｙ方向マイナス側を根元側、Ｚ方向プラス側を上側、Ｚ方向マイナス側を下側、Ｘ方向プラス側を右側、Ｘ方向マイナス側を左側として説明する。 Hereinafter, the wire bonding apparatus 100 of the embodiment will be described with reference to the drawings. In the following description, the direction from the bonding arm 20 to the ultrasonic horn 10 is the Y direction and the upward direction in the extending direction of the ultrasonic horn 10 and the bonding arm 20, or the longitudinal direction of the bonding arm 20 and the ultrasonic horn 10. The Z direction, the Y direction, and the direction orthogonal to the Z direction will be described as the X direction. Further, the positive side in the Y direction will be described as the tip side, the negative side in the Y direction as the root side, the positive side in the Z direction as the upper side, the negative side in the Z direction as the lower side, the positive side in the X direction as the right side, and the negative side in the X direction as the left side.
　図１に示すように、ワイヤボンディング装置１００は、超音波ホーン１０と、ボンディングアーム２０と、ワイヤクランパ３０と、制御部６０と、ボンディング対象である基板５２或いは半導体素子５３とを保持するボンディングステージ５１とを含んでいる。 As shown in FIG. 1, the wire bonding apparatus 100 is a bonding stage that holds an ultrasonic horn 10, a bonding arm 20, a wire clamper 30, a control unit 60, and a substrate 52 or a semiconductor element 53 to be bonded. 51 and is included.
　図１、図２Ａに示すように、超音波ホーン１０は、ホーン本体１１と、ホーン本体１１のＹ方向マイナス側（以下、根元側という）に形成されたベース部１２と、ベース部１２の中に形成された開口１３と、開口１３の中に収容された超音波振動子１６とを備えている。ベース部１２は、Ｘ方向に張り出したフランジ１４を備えている。根元側のフランジ１４は、ボルト１５によってボンディングアーム２０のＹ方向プラス側端２１（以下、先端２１という）に取付けられている。ボンディングアーム２０の先端２１に固定される超音波ホーン１０のフランジ１４からホーン本体１１のＹ方向プラス側端までの長さは、長さＬｈとなっている。超音波ホーン１０のホーン本体１１のＹ方向プラス側端には、ボンディングツールであるキャピラリ４１が取付けられている。キャピラリ４１は、中心に貫通孔を有する先端が尖った円筒形部材である。キャピラリ４１の中心孔には、ワイヤ４５が挿通されている。 As shown in FIGS. 1 and 2A, the ultrasonic horn 10 is formed in the horn main body 11, the base portion 12 formed on the negative side in the Y direction (hereinafter referred to as the root side) of the horn main body 11, and the base portion 12. It is provided with an opening 13 formed in the opening 13 and an ultrasonic vibrator 16 housed in the opening 13. The base portion 12 includes a flange 14 projecting in the X direction. The flange 14 on the root side is attached to the Y-direction plus side end 21 (hereinafter, referred to as the tip 21) of the bonding arm 20 by a bolt 15. The length from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the positive end in the Y direction of the horn body 11 is the length Lh. A capillary 41, which is a bonding tool, is attached to the Y-direction plus side end of the horn body 11 of the ultrasonic horn 10. The capillary 41 is a cylindrical member having a through hole in the center and a sharp tip. A wire 45 is inserted through the central hole of the capillary 41.
　超音波振動子１６が所定の周波数でＹ方向に超音波振動すると、ホーン本体１１はＹ方向に共振して縦振動し、ホーン本体１１の先端側に取付けられているキャピラリ４１をＹ方向に振動させる。 When the ultrasonic vibrator 16 vibrates ultrasonically in the Y direction at a predetermined frequency, the horn body 11 resonates in the Y direction and vibrates vertically, and the capillary 41 attached to the tip side of the horn body 11 vibrates in the Y direction. Let me.
　図１に示すように、ボンディングアーム２０は、基板５２或いは半導体素子５３の上面と略同一高さに配置された回転中心２６で矢印９０に示す方向に回転自在に支持されている。後端部には、超音波ホーン１０の先端に接続されたキャピラリ４１をＺ方向に駆動するＺ方向モータ２７と、Ｚ方向モータ２７が搭載されたベース２８をＸＹ方向に駆動するＸＹ駆動機構２９とが取付けられている。また、ボンディングアーム２０の先端側の上面には、圧電素子１７がボルト１８によって取付けられている。圧電素子１７は、キャピラリ４１の基板５２又は半導体素子５３への押圧力を検出する。 As shown in FIG. 1, the bonding arm 20 is rotatably supported in the direction indicated by the arrow 90 by a rotation center 26 arranged at substantially the same height as the upper surface of the substrate 52 or the semiconductor element 53. At the rear end, a Z-direction motor 27 that drives the capillary 41 connected to the tip of the ultrasonic horn 10 in the Z direction and an XY drive mechanism 29 that drives the base 28 on which the Z-direction motor 27 is mounted in the XY directions. And are attached. A piezoelectric element 17 is attached to the upper surface of the bonding arm 20 on the tip end side by bolts 18. The piezoelectric element 17 detects a pressing force on the substrate 52 or the semiconductor element 53 of the capillary 41.
　図１、図２Ｂに示すように、ボンディングアーム２０の上側には、ワイヤクランパ３０が取付けられている。ワイヤクランパ３０は、クランプアーム３１と、基体部３２とを含んでいる。基体部３２は、ボンディングアーム２０の上側の座２４の上にボルト２５で固定されている。基体部３２は中央に四角い開口３３を有し、開口３３の中にはアクチュエータ３４が収容されている。アクチュエータ３４は、例えば、ピエゾ素子で構成されてもよい。 As shown in FIGS. 1 and 2B, a wire clamper 30 is attached to the upper side of the bonding arm 20. The wire clamper 30 includes a clamp arm 31 and a base portion 32. The base portion 32 is fixed on the upper seat 24 of the bonding arm 20 with bolts 25. The base portion 32 has a square opening 33 in the center, and the actuator 34 is housed in the opening 33. The actuator 34 may be composed of, for example, a piezo element.
　基体部３２のＹ方向プラス側には先端側に向かって延びる左右のアーム取付け部３６が設けられている。アーム取付け部３６には、クランプアーム３１がボルト３５で固定されている。クランプアーム３１は先端がボンディングアーム２０の先端２１からＹ方向に突出してワイヤ４５を把持する。また、左右のアーム取付け部３６の間には、凹部３８が設けられている。凹部３８によりアーム取付け部３６の根元部には、Ｚ方向軸の周りに回転する弾性ヒンジ３７が形成される。弾性ヒンジ３７からクランプアーム３１の先端までの長さは、長さＬｃである。長さＬｃは、ボンディングアーム２０の先端２１に固定される超音波ホーン１０のフランジ１４からホーン本体１１のＹ方向プラス側端までの長さＬｈと略同様の長さとなっている。 Left and right arm mounting portions 36 extending toward the tip side are provided on the positive side of the base portion 32 in the Y direction. A clamp arm 31 is fixed to the arm mounting portion 36 with a bolt 35. The tip of the clamp arm 31 projects from the tip 21 of the bonding arm 20 in the Y direction to grip the wire 45. Further, a recess 38 is provided between the left and right arm mounting portions 36. An elastic hinge 37 that rotates around the Z direction axis is formed at the base of the arm mounting portion 36 by the recess 38. The length from the elastic hinge 37 to the tip of the clamp arm 31 is the length Lc. The length Lc is substantially the same as the length Lh from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the positive end in the Y direction of the horn body 11.
　次に、図３、図４を参照しながら、ワイヤクランパ３０のアクチュエータ３４への印加電圧Ｖとクランプアーム３１の開寸法Ｇの関係について説明する。図３に示すように、アクチュエータ３４に所定の電圧が印加されていない場合は、クランプアーム３１の開寸法Ｇはゼロとなり、ワイヤクランパ３０は閉状態となる。この際、左右のクランプアーム３１の間にワイヤ４５がある場合には、クランプアーム３１はワイヤ４５を把持する。 Next, the relationship between the voltage V applied to the actuator 34 of the wire clamper 30 and the open dimension G of the clamp arm 31 will be described with reference to FIGS. 3 and 4. As shown in FIG. 3, when a predetermined voltage is not applied to the actuator 34, the open dimension G of the clamp arm 31 becomes zero, and the wire clamper 30 is in the closed state. At this time, if there is a wire 45 between the left and right clamp arms 31, the clamp arm 31 grips the wire 45.
　アクチュエータ３４に所定の開放電圧Ｖ０が印加されるとクランプアーム３１は弾性ヒンジ３７の周りに回転し、図４に実線で示すようにクランプアーム３１の先端が開閉方向であるＸ方向に開き、開寸法Ｇは全開寸法Ｇ０となる。全開寸法Ｇ０は、ワイヤ４５の直径ｄよりも大きいので、クランプアーム３１はワイヤ４５を開放する。 When a predetermined open circuit voltage V0 is applied to the actuator 34, the clamp arm 31 rotates around the elastic hinge 37, and the tip of the clamp arm 31 opens and opens in the X direction, which is the opening / closing direction, as shown by a solid line in FIG. The dimension G is the fully open dimension G0. Since the fully open dimension G0 is larger than the diameter d of the wire 45, the clamp arm 31 opens the wire 45.
　図３の実線ａに示すように、アクチュエータ３４への印加電圧Ｖとクランプアーム３１の先端の開寸法Ｇとは略比例関係にあり、印加電圧Ｖを大きくするとそれに従ってクランプアーム３１の先端の開寸法Ｇも大きくなっていく。図３に示すように、印加電圧Ｖを開放電圧Ｖ０よりも少し低い印加電圧Ｖ１とした場合、クランプアーム３１の先端の開寸法Ｇは、図４に破線で示すクランプアーム３１のように全開寸法Ｇ０よりもすこし小さい大開寸法Ｇ１となる。また、印加電圧Ｖを印加電圧ＶＢ１よりも低い印加電圧ＶＢ２とすると、クランプアーム３１の先端の開寸法Ｇは、図４に一点鎖線で示すクランプアーム３１のように大開寸法Ｇ１よりも小さい小開寸法Ｇ２となる。小開寸法Ｇ２はワイヤ４５の直径ｄよりも大きいので、クランプアーム３１の先端の開寸法Ｇが小開寸法Ｇ２の場合もクランプアーム３１はワイヤ４５に当たらず、ワイヤクランパ３０は開放状態を保つ。従って、印加電圧Ｖを印加電圧ＶＢ１とＶＢ２との間で変動させると、ワイヤクランパ３０の開放状態を保ったまま、クランプアーム３１の先端の開寸法Ｇを大開寸法Ｇ１と小開寸法Ｇ２との間で変動させることができる。ここで、印加電圧Ｖを印加電圧ＶＢ１と印加電圧ＶＢ２との間の変動電圧とするには、印加電圧ＶＢ１と印加電圧ＶＢ２の中央値をベース電圧ＶＢとし、ベース電圧ＶＢを中心に電圧幅ΔＶだけ印加電圧Ｖを増減させてもよい。ベース電圧ＶＢ、電圧幅ΔＶは自由に選択することができるが、例えば、ベース電圧ＶＢは、開放電圧Ｖ０の８０％～１００％の電圧とし、電圧幅ΔＶは、開放電圧Ｖ０の８％～３０％の電圧としてもよい。 As shown by the solid line a in FIG. 3, the voltage V applied to the actuator 34 and the opening dimension G of the tip of the clamp arm 31 are in a substantially proportional relationship, and when the applied voltage V is increased, the tip of the clamp arm 31 is opened accordingly. The dimension G also increases. As shown in FIG. 3, when the applied voltage V is an applied voltage V1 slightly lower than the open circuit voltage V0, the open dimension G of the tip of the clamp arm 31 is a fully open dimension as shown by the broken line in FIG. The large opening size G1 is slightly smaller than G0. Further, assuming that the applied voltage V is an applied voltage VB2 lower than the applied voltage VB1, the opening dimension G of the tip of the clamp arm 31 is a small opening smaller than the large opening dimension G1 like the clamp arm 31 shown by the alternate long and short dash line in FIG. The dimension is G2. Since the small opening dimension G2 is larger than the diameter d of the wire 45, the clamp arm 31 does not hit the wire 45 and the wire clamper 30 remains open even when the opening dimension G at the tip of the clamp arm 31 is the small opening dimension G2. .. Therefore, when the applied voltage V is varied between the applied voltages VB1 and VB2, the open dimension G of the tip of the clamp arm 31 is set to the large open dimension G1 and the small open dimension G2 while maintaining the open state of the wire clamper 30. Can vary between. Here, in order to make the applied voltage V a fluctuating voltage between the applied voltage VB1 and the applied voltage VB2, the median value of the applied voltage VB1 and the applied voltage VB2 is set as the base voltage VB, and the voltage width ΔV centering on the base voltage VB. The applied voltage V may be increased or decreased by the amount. The base voltage VB and the voltage width ΔV can be freely selected. For example, the base voltage VB is 80% to 100% of the open circuit voltage V0, and the voltage width ΔV is 8% to 30% of the open circuit voltage V0. It may be a voltage of%.
　制御部６０は、クランパ制御部６１と、ボンディング制御部６２とを含んでいる。クランパ制御部６１は、ワイヤクランパ３０のアクチュエータ３４の印加電圧Ｖを調整してクランプアーム３１を開閉動作させる。ボンディング制御部６２は、圧電素子１７からの信号が入力され、Ｚ方向モータ２７を調整してキャピラリ４１の先端を基板５２或いは半導体素子５３に対して接離方向に駆動する。また、ＸＹ駆動機構２９を制御してキャピラリ４１のＸＹ方向の位置を調整する。また、超音波ホーン１０の超音波振動子１６を駆動してホーン本体１１をＹ方向に超音波振動させる。 The control unit 60 includes a clamper control unit 61 and a bonding control unit 62. The clamper control unit 61 adjusts the applied voltage V of the actuator 34 of the wire clamper 30 to open and close the clamp arm 31. The bonding control unit 62 receives a signal from the piezoelectric element 17 and adjusts the Z-direction motor 27 to drive the tip of the capillary 41 in the contact / separation direction with respect to the substrate 52 or the semiconductor element 53. Further, the XY drive mechanism 29 is controlled to adjust the position of the capillary 41 in the XY direction. Further, the ultrasonic vibrator 16 of the ultrasonic horn 10 is driven to ultrasonically vibrate the horn body 11 in the Y direction.
　次に図５Ａ～図５Ｃ、図６Ｂ、図６Ｂを参照しながら、以上のように構成されたワイヤボンディング装置１００のボンディング動作について説明する。 Next, the bonding operation of the wire bonding apparatus 100 configured as described above will be described with reference to FIGS. 5A to 5C, 6B, and 6B.
　図５Ａに示すように、クランパ制御部６１は、ワイヤクランパ３０のアクチュエータ３４の印加電圧Ｖをゼロとしてワイヤクランパ３０を閉状態としワイヤクランパ３０にワイヤ４５を把持させる。ボンディング制御部６２は、図示しないトーチ電極とキャピラリ４１の先端から延出したワイヤ４５との間でスパークを発生させてワイヤ４５の下端をフリーエアボール５０に成形する。 As shown in FIG. 5A, the clamper control unit 61 sets the applied voltage V of the actuator 34 of the wire clamper 30 to zero, closes the wire clamper 30, and causes the wire clamper 30 to grip the wire 45. The bonding control unit 62 generates a spark between the torch electrode (not shown) and the wire 45 extending from the tip of the capillary 41, and forms the lower end of the wire 45 into a free air ball 50.
　図５Ｂに示すように、クランパ制御部６１は、ワイヤクランパ３０のアクチュエータ３４への印加電圧Ｖを図３に示すベース電圧ＶＢを中心に電圧幅ΔＶの範囲において周波数ｆ０で振動させる。 As shown in FIG. 5B, the clamper control unit 61 vibrates the voltage V applied to the actuator 34 of the wire clamper 30 at a frequency f0 in the range of the voltage width ΔV centering on the base voltage VB shown in FIG.
　これにより、アクチュエータ３４への印加電圧Ｖは、図３に示す印加電圧Ｖ１と印加電圧Ｖ２の範囲で周波数ｆ０で振動し、クランプアーム３１の先端の開寸法Ｇは図４に示すように大開寸法Ｇ１と小開寸法Ｇ２との間で周波数ｆ０で振動する。このように、クランパ制御部６１は、ワイヤクランパ３０の開放状態を保ったまま、クランプアーム３１を周波数ｆ０で振動させる。ここで、周波数ｆ０をクランプアーム３１がＸ方向に振動する共振周波数ｆ１に近い周波数とすると、図６Ｂに矢印９６で示すように、クランプアーム３１は、共振により弾性ヒンジ３７を中心にＸ方向に横振動する。周波数ｆ０は、クランプアーム３１のＸ方向の振動の共振周波数ｆ１に近い周波数であればよい。クランプアーム３１の共振周波数が、例えば、略２ｋＨｚの場合には２ｋＨｚの近傍周波数、例えば、１．９ｋＨｚ～２．０ｋＨｚ程度の周波数としてもよい。クランプアーム３１は軽量であることからこのような高周波でも十分にＸ方向に振動可能である。これにより、短時間でボンディングを行う場合でもボンディング中のキャピラリ４１の先端のＸ方向の振動回数を多くすることができる。なお、周波数ｆ０は、クランプアーム３１がＸ方向に共振する周波数であれば、例えば、ｆ１／√２＜ｆ０＜ｆ１×√２のような範囲から選択してもよいし、クランプアーム３１のＸ方向の共振周波数ｆ１の８０％～１２０％の範囲の周波数から選択するようにしてもよい。 As a result, the applied voltage V to the actuator 34 vibrates at a frequency f0 within the range of the applied voltage V1 and the applied voltage V2 shown in FIG. 3, and the open dimension G of the tip of the clamp arm 31 is a large open dimension as shown in FIG. It oscillates at a frequency f0 between G1 and the small opening dimension G2. In this way, the clamper control unit 61 vibrates the clamp arm 31 at the frequency f0 while maintaining the open state of the wire clamper 30. Here, assuming that the frequency f0 is a frequency close to the resonance frequency f1 in which the clamp arm 31 vibrates in the X direction, the clamp arm 31 is resonated in the X direction around the elastic hinge 37 as shown by the arrow 96 in FIG. 6B. It vibrates laterally. The frequency f0 may be a frequency close to the resonance frequency f1 of the vibration of the clamp arm 31 in the X direction. When the resonance frequency of the clamp arm 31 is, for example, about 2 kHz, it may be a frequency close to 2 kHz, for example, a frequency of about 1.9 kHz to 2.0 kHz. Since the clamp arm 31 is lightweight, it can sufficiently vibrate in the X direction even at such a high frequency. As a result, the number of vibrations of the tip of the capillary 41 in the X direction during bonding can be increased even when bonding is performed in a short time. The frequency f0 may be selected from a range such as f1 / √2 <f0 <f1 × √2 as long as the frequency f0 resonates in the X direction, or X of the clamp arm 31. It may be selected from frequencies in the range of 80% to 120% of the resonance frequency f1 in the direction.
　クランプアーム３１が共振するとクランプアーム３１のＸ方向の振動は、ボンディングアーム２０から超音波ホーン１０に伝達される。ここで、ワイヤクランパ３０の弾性ヒンジ３７からクランプアーム３１の先端までの長さＬｃは、ボンディングアーム２０の先端２１に固定される超音波ホーン１０のフランジ１４からホーン本体１１のＹ方向プラス側端までの長さＬｈと略同様の長さとなっている。このため、超音波ホーン１０のＸ方向の共振周波数ｆ２は、クランプアーム３１のＸ方向の共振周波数ｆ１に近い周波数となる。このため、ボンディングアーム２０から伝達されたクランプアーム３１のＸ方向の共振振動により、図６Ａに矢印９７で示すように超音波ホーン１０がＸ方向に共振し、ホーン本体１１の先端がＸ方向に横振動する。これにより、ホーン本体１１の先端に取付けられているキャピラリ４１がＸ方向に振動する。 When the clamp arm 31 resonates, the vibration of the clamp arm 31 in the X direction is transmitted from the bonding arm 20 to the ultrasonic horn 10. Here, the length Lc from the elastic hinge 37 of the wire clamper 30 to the tip of the clamp arm 31 is from the flange 14 of the ultrasonic horn 10 fixed to the tip 21 of the bonding arm 20 to the Y-direction plus side end of the horn body 11. The length is almost the same as Lh. Therefore, the resonance frequency f2 in the X direction of the ultrasonic horn 10 is a frequency close to the resonance frequency f1 in the X direction of the clamp arm 31. Therefore, due to the resonance vibration of the clamp arm 31 in the X direction transmitted from the bonding arm 20, the ultrasonic horn 10 resonates in the X direction as shown by the arrow 97 in FIG. 6A, and the tip of the horn body 11 resonates in the X direction. It vibrates laterally. As a result, the capillary 41 attached to the tip of the horn body 11 vibrates in the X direction.
　一方、ボンディング制御部６２は、超音波ホーン１０の超音波振動子１６に所定の電圧を印加して超音波振動子１６を超音波振動させる。ホーン本体１１にはＹ方向の超音波共振が発生し、これにより、図５Ｂの矢印９２に示すように、キャピラリ４１の先端がＹ方向に振動する。 On the other hand, the bonding control unit 62 applies a predetermined voltage to the ultrasonic vibrator 16 of the ultrasonic horn 10 to cause the ultrasonic vibrator 16 to vibrate ultrasonically. Ultrasonic resonance in the Y direction occurs in the horn body 11, which causes the tip of the capillary 41 to vibrate in the Y direction, as shown by the arrow 92 in FIG. 5B.
　このように、クランパ制御部６１はクランプアーム３１を振動させて、超音波ホーン１０及びキャピラリ４１の先端をＸ方向に振動させ、ボンディング制御部６２が超音波振動子１６を駆動してキャピラリ４１の先端をＹ方向に振動させる。このように、キャピラリ４１の先端がＸＹ方向に振動した状態で、ボンディング制御部６２はＺ方向モータ２７を動作させて、図５Ｂの矢印９１に示すようにキャピラリ４１を半導体素子５３の電極に押し付けてフリーエアボール５０を半導体素子５３の電極にボンディングする。 In this way, the clamper control unit 61 vibrates the clamp arm 31 to vibrate the tips of the ultrasonic horn 10 and the capillary 41 in the X direction, and the bonding control unit 62 drives the ultrasonic vibrator 16 to drive the capillary 41. The tip is vibrated in the Y direction. In this way, with the tip of the capillary 41 vibrating in the XY directions, the bonding control unit 62 operates the Z-direction motor 27 and presses the capillary 41 against the electrodes of the semiconductor element 53 as shown by the arrow 91 in FIG. 5B. The free air ball 50 is bonded to the electrode of the semiconductor element 53.
　半導体素子５３へのボンディングが終了したら、ボンディング制御部６２は、Ｚ方向モータ２７を動作させてキャピラリ４１を上昇させる。また、クランパ制御部６１はアクチュエータ３４の印加電圧Ｖをゼロとしてクランプアーム３１でワイヤ４５を把持する。そしてボンディング制御部６２は、Ｚ方向モータ２７とＸＹ駆動機構２９とを動作させて図５Ｃに示す矢印９３のようにキャピラリ４１の先端をルーピングさせて基板５２の電極の上に導く。 When the bonding to the semiconductor element 53 is completed, the bonding control unit 62 operates the Z-direction motor 27 to raise the capillary 41. Further, the clamper control unit 61 grips the wire 45 with the clamp arm 31 with the applied voltage V of the actuator 34 set to zero. Then, the bonding control unit 62 operates the Z-direction motor 27 and the XY drive mechanism 29 to loop the tip of the capillary 41 and guide it onto the electrodes of the substrate 52 as shown by the arrow 93 shown in FIG. 5C.
　ここで、クランパ制御部６１は、フリーエアボール５０のボンディングの際と同様、ワイヤクランパ３０のアクチュエータ３４の印加電圧Ｖをクランプアーム３１のＸ方向の振動の共振周波数ｆ１に近い周波数ｆ０で振動させる。これにより、クランプアーム３１は図６Ｂに矢印９６で示すように、共振により弾性ヒンジ３７を中心にＸ方向に横振動する。また、図６Ａに矢印９７で示すように、ホーン本体１１の先端がＸ方向に横振動してキャピラリ４１の先端がＸ方向に振動する。また、ボンディング制御部６２は、超音波振動子１６を駆動して図５Ｃの矢印９５に示すようにキャピラリ４１の先端をＹ方向に振動させる。そして、キャピラリ４１の先端がＸＹ方向に振動した状態で、ボンディング制御部６２はＺ方向モータ２７を駆動して図５Ｃの矢印９４に示すようにキャピラリ４１の先端を基板５２の電極に押し付けて基板５２の電極にワイヤ４５をボンディングする。 Here, the clamper control unit 61 vibrates the applied voltage V of the actuator 34 of the wire clamper 30 at a frequency f0 close to the resonance frequency f1 of the vibration in the X direction of the clamp arm 31, as in the case of bonding the free air ball 50. .. As a result, as shown by the arrow 96 in FIG. 6B, the clamp arm 31 laterally vibrates in the X direction around the elastic hinge 37 due to resonance. Further, as shown by an arrow 97 in FIG. 6A, the tip of the horn body 11 vibrates laterally in the X direction, and the tip of the capillary 41 vibrates in the X direction. Further, the bonding control unit 62 drives the ultrasonic vibrator 16 to vibrate the tip of the capillary 41 in the Y direction as shown by an arrow 95 in FIG. 5C. Then, with the tip of the capillary 41 vibrating in the XY direction, the bonding control unit 62 drives the Z-direction motor 27 and presses the tip of the capillary 41 against the electrode of the substrate 52 as shown by the arrow 94 in FIG. 5C to press the substrate 52. The wire 45 is bonded to the electrode of 52.
　以上説明したワイヤボンディング装置１００では、ワイヤクランパ３０の弾性ヒンジ３７からクランプアーム３１の先端までの長さＬｃと、超音波ホーン１０のフランジ１４からホーン本体１１のＹ方向プラス側端までの長さＬｈと略同様の長さなっている。このため、クランプアーム３１のＸ方向の共振周波数ｆ１と超音波ホーン１０のＸ方向の共振周波数ｆ２とが同様の振動数となっている。この構成により、クランプアーム３１のＸ方向の共振振動により超音波ホーン１０をＸ方向に共振振動させてキャピラリ４１の先端をＸ方向に振動させることができる。また、超音波振動子１６によって超音波ホーン１０のホーン本体１１をＹ方向に共振させてキャピラリ４１の先端をＹ方向に振動させることができる。このため、キャピラリ４１の先端をＸＹ方向に振動させた状態でワイヤ４５を半導体素子５３の電極或いは基板５２の電極にボンディングすることができる。これにより、ワイヤ４５の接合部分に形状がＹ方向に延びた変形形状となって接合不良となることを抑制でき、ボンディング品質を向上させることができる。また、ワイヤ４５と半導体素子５３の電極或いは基板５２の電極との接合強度を高くすることができる。 In the wire bonding apparatus 100 described above, the length Lc from the elastic hinge 37 of the wire clamper 30 to the tip of the clamp arm 31 and the length from the flange 14 of the ultrasonic horn 10 to the positive end in the Y direction of the horn body 11 It has almost the same length as Lh. Therefore, the resonance frequency f1 in the X direction of the clamp arm 31 and the resonance frequency f2 in the X direction of the ultrasonic horn 10 have the same frequency. With this configuration, the ultrasonic horn 10 can be resonated and vibrated in the X direction by the resonance vibration of the clamp arm 31 in the X direction, and the tip of the capillary 41 can be vibrated in the X direction. Further, the ultrasonic vibrator 16 can resonate the horn body 11 of the ultrasonic horn 10 in the Y direction to vibrate the tip of the capillary 41 in the Y direction. Therefore, the wire 45 can be bonded to the electrode of the semiconductor element 53 or the electrode of the substrate 52 while the tip of the capillary 41 is vibrated in the XY direction. As a result, it is possible to prevent the joint portion of the wire 45 from becoming a deformed shape extending in the Y direction and causing poor joining, and it is possible to improve the bonding quality. Further, the bonding strength between the wire 45 and the electrode of the semiconductor element 53 or the electrode of the substrate 52 can be increased.
　なお、クランプアーム３１のＸ方向の共振振動により超音波ホーン１０をＸ方向に共振振動させてキャピラリ４１の先端をＸ方向に振動させることができれば、長さＬｃと長さＬｈが略同様の長さではなく、例えば、長さＬｃを長さＬｈの８０％～１２０％の範囲としてもよい。 If the ultrasonic horn 10 can be resonated and vibrated in the X direction by the resonance vibration of the clamp arm 31 in the X direction and the tip of the capillary 41 can be vibrated in the X direction, the length Lc and the length Lh are substantially the same length. Instead, for example, the length Lc may be in the range of 80% to 120% of the length Lh.
　また、クランプアーム３１のＸ方向の共振周波数ｆ１、超音波ホーン１０のＸ方向の共振周波数ｆ２は、例えば、２ｋＨｚ近傍の高い周波数であることから、キャピラリ４１先端を高周波でＸ方向に振動させることができ、短時間でボンディングを行う場合でもボンディング中のキャピラリ４１の先端のＸ方向の振動回数を多くすることができる。これにより、ボンディングの品質を向上させることができる。 Further, since the resonance frequency f1 in the X direction of the clamp arm 31 and the resonance frequency f2 in the X direction of the ultrasonic horn 10 are high frequencies in the vicinity of 2 kHz, for example, the tip of the capillary 41 is vibrated in the X direction at a high frequency. It is possible to increase the number of vibrations of the tip of the capillary 41 in the X direction during bonding even when bonding is performed in a short time. Thereby, the quality of bonding can be improved.
　更に、ベース電圧ＶＢを開放電圧Ｖ０の８０％～１００％の電圧とし、電圧幅ΔＶを開放電圧Ｖ０の８％～３０％の電圧とすることにより、確実にワイヤクランパ３０を開放状態に保ったまま、クランプアーム３１をＸ方向に振動させることができる。これにより、振動中にクランプアーム３１がワイヤ４５に触れてＸ方向の振動が乱れることを抑制でき、ボンディング品質を向上させることができる。 Further, by setting the base voltage VB to a voltage of 80% to 100% of the open circuit voltage V0 and the voltage width ΔV to a voltage of 8% to 30% of the open circuit voltage V0, the wire clamper 30 was reliably kept in the open state. The clamp arm 31 can be vibrated in the X direction as it is. As a result, it is possible to prevent the clamp arm 31 from touching the wire 45 and disturb the vibration in the X direction during vibration, and it is possible to improve the bonding quality.
　また、以上説明した実施形態のワイヤボンディング装置１００では、キャピラリ４１の先端をＸＹ方向に振動させてボンディングを行うこととして説明したが、これに限らず、超音波振動子１６を駆動せず、クランプアーム３１のみをＸ方向に振動させることによりキャピラリ４１の先端をＸ方向にのみ振動させてボンディングを行うようにしてもよい。この場合でも、実施形態のワイヤボンディング装置１００では、高い周波数でキャピラリ４１の先端をＸ方向に振動させることができるので、短時間でボンディングを行う際にもキャピラリ４１の振動の回数を多くすることができ、ボンディング品質を維持することができる。 Further, in the wire bonding apparatus 100 of the embodiment described above, the bonding is performed by vibrating the tip of the capillary 41 in the XY direction, but the present invention is not limited to this, and the ultrasonic vibrator 16 is not driven and the clamp is used. By vibrating only the arm 31 in the X direction, the tip of the capillary 41 may be vibrated only in the X direction for bonding. Even in this case, in the wire bonding apparatus 100 of the embodiment, since the tip of the capillary 41 can be vibrated in the X direction at a high frequency, the number of vibrations of the capillary 41 should be increased even when bonding is performed in a short time. And the bonding quality can be maintained.
　また、ワイヤ４５の太さやボンディング条件によっては、半導体素子５３の電極にフリーエアボール５０をボンディングする際にはクランプアーム３１をＸ方向に振動させずに超音波振動子１６のみを駆動してキャピラリ４１の先端をＹ方向に超音波振動させ、基板５２の電極にワイヤ４５をボンディングする際には、超音波振動子１６を駆動せずにクランプアーム３１のみをＸ方向に振動させてキャピラリ４１の先端をＸ方向に振動させてもよい。これにより、ボンディングの際の圧着ボールの潰れを抑制してボンディング品質を向上させることができる。 Further, depending on the thickness of the wire 45 and the bonding conditions, when the free air ball 50 is bonded to the electrode of the semiconductor element 53, only the ultrasonic vibrator 16 is driven without vibrating the clamp arm 31 in the X direction to carry the capillary. When the tip of 41 is ultrasonically vibrated in the Y direction and the wire 45 is bonded to the electrode of the substrate 52, only the clamp arm 31 is vibrated in the X direction without driving the ultrasonic vibrator 16 to cause the capillary 41. The tip may be vibrated in the X direction. As a result, it is possible to suppress the crushing of the crimping ball during bonding and improve the bonding quality.
　また、以上説明したワイヤボンディング装置１００では、超音波ホーン１０は、ホーン本体１１の根元側のフランジ１４がボンディングアーム２０の先端に取付けられることとして説明したが、これに限らず、ホーン本体１１の根元以外の部分をボンディングアーム２０の中央部或いは、先端近傍に取付けられるように構成してもよい。 Further, in the wire bonding apparatus 100 described above, the ultrasonic horn 10 has been described as having the flange 14 on the root side of the horn body 11 attached to the tip of the bonding arm 20, but the present invention is not limited to this. A portion other than the root may be configured to be attached to the central portion of the bonding arm 20 or near the tip end.
　１０　超音波ホーン、１１　ホーン本体、１２　ベース部、１３，３３　開口、１４　フランジ、１５，１８，２５，３５　ボルト、１６　超音波振動子、１７　圧電素子、２０　ボンディングアーム、２１　先端（Ｙ方向プラス側端）、２４　座、２６　回転中心、２７　Ｚ方向モータ、２８　ベース、２９　ＸＹ駆動機構、３０　ワイヤクランパ、３１　クランプアーム、３２　基体部、３４　アクチュエータ、３６　アーム取付け部、３７　弾性ヒンジ、３８　凹部、４１　キャピラリ、４５　ワイヤ、５０　フリーエアボール、５１　ボンディングステージ、５２　基板、５３　半導体素子、６０　制御部、６１　クランパ制御部、６２　ボンディング制御部、１００　ワイヤボンディング装置。 10 ultrasonic horn, 11 horn body, 12 base, 13, 33 opening, 14 flange, 15, 18, 25, 35 bolt, 16 ultrasonic transducer, 17 piezoelectric element, 20 bonding arm, 21 tip (plus in Y direction) Side end), 24 seat, 26 rotation center, 27 Z direction motor, 28 base, 29 XY drive mechanism, 30 wire clamper, 31 clamp arm, 32 base part, 34 actuator, 36 arm mounting part, 37 elastic hinge, 38 recess , 41 capillary, 45 wire, 50 free air ball, 51 bonding stage, 52 substrate, 53 semiconductor element, 60 control unit, 61 clamper control unit, 62 bonding control unit, 100 wire bonding device.

Claims (9)

  1. 　ワイヤが挿通するボンディングツールが先端に取付けられる超音波ホーンと、
    　前記超音波ホーンが取付けられるボンディングアームと、を備え、
    　前記ボンディングツールをボンディング対象に接離させて前記ワイヤを前記ボンディング対象にボンディングするワイヤボンディング装置であって、
    　前記ボンディングアームから長手方向に突出して前記ワイヤを把持するクランプアームと、前記ボンディングアームの上側に取付けられて前記クランプアームを開閉動作させるアクチュエータを収容する基体部と、を有するワイヤクランパと、
    　前記ワイヤクランパの前記アクチュエータの開閉動作を調整する制御部と、を含み、
    　前記制御部は、
    　ボンディングの際に前記ワイヤクランパの前記アクチュエータによって前記クランプアームを開放状態で開閉方向に振動させること、
    　を特徴とするワイヤボンディング装置。     An ultrasonic horn to which a bonding tool through which a wire is inserted is attached to the tip,
    A bonding arm to which the ultrasonic horn is attached is provided.
    A wire bonding apparatus that attaches and detaches the bonding tool to a bonding target and bonds the wire to the bonding target.
    A wire clamper having a clamp arm that protrudes in the longitudinal direction from the bonding arm and grips the wire, and a base portion that is attached to the upper side of the bonding arm and houses an actuator that opens and closes the clamp arm.
    A control unit for adjusting the opening / closing operation of the actuator of the wire clamper is included.
    The control unit
    At the time of bonding, the actuator of the wire clamper causes the clamp arm to vibrate in the opening / closing direction in an open state.
    A wire bonding device characterized by.
  2. 　請求項１に記載のワイヤボンディング装置であって、
    　前記制御部は、
    　ボンディングの際に前記ワイヤクランパの前記アクチュエータによって前記クランプアームを前記クランプアームの共振周波数の８０％～１２０％の周波数で開閉方向に駆動すること、
    　を特徴とするワイヤボンディング装置。     The wire bonding apparatus according to claim 1.
    The control unit
    At the time of bonding, the actuator of the wire clamper drives the clamp arm in the opening / closing direction at a frequency of 80% to 120% of the resonance frequency of the clamp arm.
    A wire bonding device characterized by.
  3. 　請求項１に記載のワイヤボンディング装置であって、
    　前記ワイヤクランパの前記クランプアームの長さは前記超音波ホーンの長さの８０％～１２０％の長さであること、
    　を特徴とするワイヤボンディング装置。     The wire bonding apparatus according to claim 1.
    The length of the clamp arm of the wire clamper shall be 80% to 120% of the length of the ultrasonic horn.
    A wire bonding device characterized by.
  4. 　請求項２に記載のワイヤボンディング装置であって、
    　前記ワイヤクランパの前記クランプアームの長さは前記超音波ホーンの長さの８０％～１２０％の長さであること、
    　を特徴とするワイヤボンディング装置。     The wire bonding apparatus according to claim 2.
    The length of the clamp arm of the wire clamper shall be 80% to 120% of the length of the ultrasonic horn.
    A wire bonding device characterized by.
  5. 　請求項１から４のいずれか１項に記載のワイヤボンディング装置であって、
    　前記ワイヤクランパは、前記アクチュエータに所定の開放電圧が印加されると前記クランプアームが開放状態となり、前記アクチュエータに電圧が印加されない場合には前記クランプアームが閉状態となり、
    　前記制御部は、
    　前記アクチュエータに所定の前記開放電圧と同一又は所定の前記開放電圧より低いベース電圧を中心として所定の電圧幅で変動する変動電圧を印加することにより、前記クランプアームを開放状態で開閉方向に振動させること、
    　を特徴とするワイヤボンディング装置。     The wire bonding apparatus according to any one of claims 1 to 4.
    In the wire clamper, the clamp arm is opened when a predetermined opening voltage is applied to the actuator, and the clamp arm is closed when no voltage is applied to the actuator.
    The control unit
    By applying a fluctuating voltage that fluctuates in a predetermined voltage width centering on a base voltage that is the same as or lower than the predetermined open circuit voltage to the actuator, the clamp arm is vibrated in the open / close direction in the open state. thing,
    A wire bonding device characterized by.
  6. 　請求項５に記載のワイヤボンディング装置であって、
    　前記ベース電圧は、所定の前記開放電圧の８０％～１００％の電圧であり、
    　所定の前記電圧幅は、所定の前記開放電圧の８％～３０％の電圧であること、
    　を特徴とするワイヤボンディング装置。     The wire bonding apparatus according to claim 5.
    The base voltage is a voltage of 80% to 100% of the predetermined open circuit voltage.
    The predetermined voltage width shall be a voltage of 8% to 30% of the predetermined open circuit voltage.
    A wire bonding device characterized by.
  7. 　請求項１から４のいずれか１項に記載のボンディング装置であって、
    　前記超音波ホーンを長手方向に超音波振動させる超音波振動子を含み、
    　前記制御部は、
    　前記超音波振動子の駆動を調整し、
    　ボンディングの際に前記ワイヤクランパの前記アクチュエータによって前記クランプアームを開放状態で開閉方向に振動させると同時に、前記超音波振動子を超音波振動させて前記超音波ホーンを長手方向に超音波振動させること、
    　を特徴とするワイヤボンディング装置。     The bonding apparatus according to any one of claims 1 to 4.
    Including an ultrasonic vibrator that ultrasonically vibrates the ultrasonic horn in the longitudinal direction,
    The control unit
    Adjust the drive of the ultrasonic oscillator to
    At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening / closing direction in an open state, and at the same time, ultrasonically vibrates the ultrasonic vibrator to vibrate the ultrasonic horn in the longitudinal direction. ,
    A wire bonding device characterized by.
  8. 　請求項５に記載のボンディング装置であって、
    　前記超音波ホーンを長手方向に超音波振動させる超音波振動子を含み、
    　前記制御部は、
    　前記超音波振動子の駆動を調整し、
    　ボンディングの際に前記ワイヤクランパの前記アクチュエータによって前記クランプアームを開放状態で開閉方向に振動させると同時に、前記超音波振動子を超音波振動させて前記超音波ホーンを長手方向に超音波振動させること、
    　を特徴とするワイヤボンディング装置。     The bonding apparatus according to claim 5.
    Including an ultrasonic vibrator that ultrasonically vibrates the ultrasonic horn in the longitudinal direction,
    The control unit
    Adjust the drive of the ultrasonic oscillator to
    At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening / closing direction in an open state, and at the same time, ultrasonically vibrates the ultrasonic vibrator to vibrate the ultrasonic horn in the longitudinal direction. ,
    A wire bonding device characterized by.
  9. 　請求項６に記載のボンディング装置であって、
    　前記超音波ホーンを長手方向に超音波振動させる超音波振動子を含み、
    　前記制御部は、
    　前記超音波振動子の駆動を調整し、
    　ボンディングの際に前記ワイヤクランパの前記アクチュエータによって前記クランプアームを開放状態で開閉方向に振動させると同時に、前記超音波振動子を超音波振動させて前記超音波ホーンを長手方向に超音波振動させること、
    　を特徴とするワイヤボンディング装置。
          The bonding apparatus according to claim 6.
    Including an ultrasonic vibrator that ultrasonically vibrates the ultrasonic horn in the longitudinal direction,
    The control unit
    Adjust the drive of the ultrasonic oscillator to
    At the time of bonding, the actuator of the wire clamper vibrates the clamp arm in the opening / closing direction in an open state, and at the same time, ultrasonically vibrates the ultrasonic vibrator to vibrate the ultrasonic horn in the longitudinal direction. ,
    A wire bonding device characterized by.
PCT/JP2020/027307 2019-08-13 2020-07-14 Wire bonding device WO2021029174A1 (en)

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