JP2006286704A - Apparatus for wire bonding and method of cutting wire therein - Google Patents

Apparatus for wire bonding and method of cutting wire therein Download PDF

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JP2006286704A
JP2006286704A JP2005101068A JP2005101068A JP2006286704A JP 2006286704 A JP2006286704 A JP 2006286704A JP 2005101068 A JP2005101068 A JP 2005101068A JP 2005101068 A JP2005101068 A JP 2005101068A JP 2006286704 A JP2006286704 A JP 2006286704A
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wire
clamper
cutting
bonding
gold
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Makoto Takei
真 竹井
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Sharp Takaya Electronic Industry Co Ltd
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  • Engineering & Computer Science (AREA)
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Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity by shortening the time required for one cycle of wire bonding. <P>SOLUTION: The method of wire cutting in the wire bonding apparatus is to cut a tail of a gold wire 5 connected to a portion to be bonded as if tearing it off, with the gold wire 5 put under restraint by a wire clamper 9. While gradually increasing the binding force of the wire clamper 9 with respect to the gold wire 5, the gold wire 5 is cut as if it were torn off. The wire clamper 9 is so structured as to pinch the gold wire 5 by a pair of pinching claws 9a and 9a. By gradually narrowing the distance between the pinching claws, the binding force is gradually increased with respect to the gold wire 5. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、半導体チップ上や基板上の電極等に金属ワイヤを結線するワイヤボンディング装置におけるワイヤ切断方法に関するものである。   The present invention relates to a wire cutting method in a wire bonding apparatus for connecting a metal wire to an electrode or the like on a semiconductor chip or a substrate.

ワイヤボンディング装置におけるワイヤ切断方法としては、ボンディング対象部位に接続された金属ワイヤをワイヤクランパにより拘束し引きちぎるようにしてテイルを切断する方法がある。このとき、ワイヤクランパの移動速度が速すぎると、金属ワイヤが伸びるとともに切断時に過度の引張応力が働いて、金属ワイヤ変形が生じることがあるという課題がある。しかし、移動速度を遅くすると、ワイヤボンディング１サイクルの時間が長くなるという課題がある。   As a wire cutting method in a wire bonding apparatus, there is a method of cutting a tail by constraining and tearing a metal wire connected to a bonding target site by a wire clamper. At this time, if the moving speed of the wire clamper is too fast, there is a problem that the metal wire is stretched and an excessive tensile stress is applied during cutting to cause deformation of the metal wire. However, if the moving speed is slowed, there is a problem that the time for one cycle of wire bonding becomes long.

これらの課題を解決しようとする従来のワイヤ切断方法として、特許文献１に記載されたワイヤボンディング方法を例示する。このワイヤボンディング方法は、下記（１）〜（６）からなる単位動作を繰り返す方法に関するものである。そして、（５）のテイル切断時に、ワイヤクランパ５０によりワイヤ５１を挟持したまま、キャピラリ５２を上昇させてテイルを切断するに際して、テイル切断までの上昇速度を遅くし、以後キャピラリ上死点までの上昇速度を早くするようにしている。
（１）第１ボンディング
（２）ループ形成
（３）第２ボンディング（図３（ａ）及び図４（動作ポイントａ）参照）
（４）テール形成（図３（ｂ）及び図４（動作ポイントｂ）と、図３（ｃ）及び図４（動作ポイントｃ）とを参照）
（５）テイル切断（図３（ｄ）及び図４（動作ポイントｄ）参照）
（６）次の第１ボンディング点へ移動（図３（ｅ）及び図４（動作ポイントｅ）参照） As a conventional wire cutting method for solving these problems, a wire bonding method described in Patent Document 1 is exemplified. This wire bonding method relates to a method of repeating a unit operation consisting of the following (1) to (6). Then, when the tail is cut by raising the capillary 52 while holding the wire 51 by the wire clamper 50 at the time of tail cutting of (5), the rising speed until the tail cutting is slowed, and thereafter the top dead center of the capillary is reached. I try to speed up the climb.
(1) First bonding (2) Loop formation (3) Second bonding (see FIGS. 3A and 4 (operation point a))
(4) Tail formation (see FIGS. 3B and 4 (operation point b) and FIGS. 3C and 4 (operation point c))
(5) Tail cutting (see FIG. 3 (d) and FIG. 4 (operation point d))
(6) Move to the next first bonding point (see FIG. 3 (e) and FIG. 4 (operation point e))

特開２００１−１１８８７８号公報JP 2001-118878 A

ところが、従来のワイヤボンディング方法では、テイル形成からテイル切断までのワイヤクランパ５０の上昇速度を遅くしている（図４における動作ポイントｃ〜ｄの間）ので、その分ワイヤボンディング１サイクルの時間が長くなるという課題がある。近年における半導体素子の集積度の向上等に伴って配線箇所数も増大しており、ワイヤボンディング１サイクルの時間のわずかな遅延でもそれが集積することにより生産性が大幅に低下してしまう。   However, in the conventional wire bonding method, the ascending speed of the wire clamper 50 from the tail formation to the tail cutting is slowed (between the operation points cd in FIG. 4). There is a problem of becoming longer. As the degree of integration of semiconductor elements in recent years has increased, the number of wiring locations has also increased, and even a slight delay in the time of one cycle of wire bonding results in a significant reduction in productivity.

上記課題を解決するために、本発明のワイヤボンディング装置におけるワイヤ切断方法は、
ボンディング対象部位に接続された金属ワイヤをワイヤクランパにより拘束し引きちぎるようにしてテイルを切断するワイヤ切断方法であって、
前記ワイヤクランパにより前記金属ワイヤをスライド可能にほぼ拘束していない状態から拘束力を徐々に増大させながら引きちぎるようにしたことを特徴としている。 In order to solve the above-mentioned problem, a wire cutting method in the wire bonding apparatus of the present invention,
A wire cutting method for cutting a tail by constraining and tearing a metal wire connected to a bonding target site by a wire clamper,
The wire clamper is characterized in that the metal wire is torn off while being gradually increased from a state in which the metal wire is not slidably restrained.

この方法によれば、テイル切断時にワイヤクランパの移動速度を減速するのと同様の効果が得られる。すなわち、前記金属ワイヤのテイル切断時に該金属ワイヤにかかる力を徐々に増大させる（金属ワイヤへ適度な引っ張り応力が加わるようにする）ことができ、テイル切断時の衝撃を抑え、テイルの変形を防止することができる（直進性を保った金属ワイヤ切断が可能となる）。このため、テイル切断時にワイヤクランパの移動速度を減速せずに（又は従来例よりも減速量を少なくして）、従来例と同様の効果が得られるので、ワイヤボンディング１サイクルの時間を短縮でき、生産性を向上させることができる。また、テイル切断時のワイヤクランパの移動速度を従来例と同様に減速すれば、従来例よりも確実にテイルの変形を防止することができる。   According to this method, the same effect as reducing the moving speed of the wire clamper at the time of tail cutting can be obtained. That is, the force applied to the metal wire at the time of tail cutting of the metal wire can be gradually increased (appropriate tensile stress is applied to the metal wire), the impact at the time of cutting the tail can be suppressed, and the deformation of the tail can be reduced. (A metal wire can be cut while maintaining straightness). For this reason, the same effect as the conventional example can be obtained without reducing the moving speed of the wire clamper at the time of tail cutting (or by reducing the deceleration amount as compared with the conventional example), so the time of one cycle of wire bonding can be shortened. , Productivity can be improved. Further, if the moving speed of the wire clamper at the time of tail cutting is reduced as in the conventional example, the deformation of the tail can be prevented more reliably than in the conventional example.

ここで、「前記ワイヤクランパによる前記金属ワイヤに対する拘束力を徐々に増大させ」とは、特に限定されないが、次の態様を例示する。
（１）前記ワイヤクランパは少なくとも一対の挟持爪で前記金属ワイヤを挟持するように構成されており、前記金属ワイヤを該両挟持爪が解放している状態から該両挟持爪の間隔を徐々に狭めることによる態様。
（２）前記ワイヤクランパは前記金属ワイヤを少なくとも一対の挟持爪で挟持するように構成されており、前記金属ワイヤを該両挟持爪で弱く挟持した状態から該両挟持爪による挟持力（荷重）を徐々に強めることによる態様。 Here, “gradually increasing the restraining force on the metal wire by the wire clamper” is not particularly limited, but the following mode is exemplified.
(1) The wire clamper is configured to clamp the metal wire with at least a pair of clamping claws, and gradually increases the distance between the clamping claws from the state where the both clamping claws release the metal wire. Aspect by narrowing.
(2) The wire clamper is configured to hold the metal wire with at least a pair of holding claws, and a holding force (load) by the holding claws from a state in which the metal wire is weakly held between the holding claws. A mode by gradually strengthening.

これらの方法によれば、既存のワイヤボンディング装置の機械的構成をほとんど変更せずに、主にワイヤクランパの制御処理内容を修正することにより対応でき、低コストで実現できる。   According to these methods, the mechanical configuration of the existing wire bonding apparatus can be changed by changing mainly the control processing content of the wire clamper, and can be realized at low cost.

本発明に係るワイヤボンディング装置におけるワイヤ切断方法によれば、金属ワイヤのテイル切断時における衝撃を抑え、テイルの変形を防止することができるようにすることができるという優れた効果を奏する。   According to the wire cutting method in the wire bonding apparatus according to the present invention, there is an excellent effect that the impact at the time of tail cutting of the metal wire can be suppressed and the deformation of the tail can be prevented.

図１〜図３は本発明を具体化した一実施形態のワイヤボンディング装置におけるワイヤ切断方法を示している。本例で使用するワイヤボンディング装置は、中心に金ワイヤ５を通すための貫通穴が形成され、該貫通穴から先方に突出する金ワイヤ５を先端部でボンディング点に押し付けるキャピラリ６と、該キャピラリ６の上方で金ワイヤ５をクランプしたり開放したりするワイヤクランパ９と、キャピラリ６及びワイヤクランパ９を水平及び昇降移動させる駆動機構（図示略）とを備えている。ワイヤクランパ９は一対の挟持爪９ａ，９ａで金ワイヤ５を挟持するように構成されており、両挟持爪９ａ，９ａの間隔を制御可能に構成されている。本例では、両挟持爪９ａが開いた状態における該両挟持爪９ａの間隔は、０．０７〜０．０８ｍｍとなっている。なお、本例のワイヤクランパ９では、両挟持爪９ａ，９ａの閉じ時間Ｔｃを指定すると、その時間をかけて両挟持爪９ａ，９ａの間隔をリニアに狭めるように構成されている。   1 to 3 show a wire cutting method in a wire bonding apparatus according to an embodiment of the present invention. The wire bonding apparatus used in this example has a through-hole for passing a gold wire 5 in the center, a capillary 6 for pressing the gold wire 5 protruding forward from the through-hole to a bonding point at the tip, and the capillary A wire clamper 9 that clamps or releases the gold wire 5 above 6 and a drive mechanism (not shown) that moves the capillary 6 and the wire clamper 9 up and down horizontally are provided. The wire clamper 9 is configured to clamp the gold wire 5 with a pair of clamping claws 9a, 9a, and is configured to be able to control the interval between the both clamping claws 9a, 9a. In this example, the distance between the two clamping claws 9a in a state where both the clamping claws 9a are open is 0.07 to 0.08 mm. Note that the wire clamper 9 of this example is configured to linearly narrow the interval between the two clamping claws 9a and 9a when the closing time Tc of the both clamping claws 9a and 9a is designated.

以下、ワイヤボンディング装置におけるワイヤ切断方法を、図１及び図２を参照しながら工程順に説明する。本例では、フレーム２の上に装着された半導体チップ１上のボンディングパッド３を第一ボンディング点とし、フレーム２上のボンディング電極４を第二ボンディング点として金ワイヤ５で接続する場合において、第二ボンディング点の接続後に行うワイヤ切断方法を示す。また、前記第二ボンディング点は、ウェッジボンディング法により金ワイヤ５を圧接することにより接続されているものとする（図１（Ａ）及び図２（動作ポイントＡ）参照）。   Hereinafter, a wire cutting method in the wire bonding apparatus will be described in the order of steps with reference to FIGS. 1 and 2. In this example, when the bonding pad 3 on the semiconductor chip 1 mounted on the frame 2 is used as the first bonding point and the bonding electrode 4 on the frame 2 is connected as the second bonding point with the gold wire 5, A wire cutting method performed after connecting two bonding points will be described. The second bonding point is connected by pressing the gold wire 5 by the wedge bonding method (see FIGS. 1A and 2 (operation point A)).

（１）第二ボンディング点において金ワイヤ５を圧接した下死点よりも、キャピラリ６及びワイヤクランパ９をわずかに上昇させた位置からワイヤクランパ９の両挟持爪９ａ，９ａの間隔を狭め始める（図１（Ｂ）及び図２（動作ポイントＢ）参照）。両挟持爪９ａ，９ａの閉じ時間Ｔｃとしては、特に限定されないが、本例では、１．５〜２．５ミリ秒とすることを例示する。この位置では、ワイヤクランパ９は、金ワイヤ５をスライド可能に拘束していない状態となっている。なお、キャピラリ６及びワイヤクランパ９の上昇速度は減速しない。 (1) The gap between the nail claws 9a, 9a of the wire clamper 9 begins to be narrowed from the position where the capillary 6 and the wire clamper 9 are slightly raised from the bottom dead center where the gold wire 5 is pressed at the second bonding point ( FIG. 1B and FIG. 2 (operation point B)). Although it does not specifically limit as closing time Tc of both clamping nail | claws 9a and 9a, In this example, setting it as 1.5-2.5 milliseconds is illustrated. At this position, the wire clamper 9 is in a state where the gold wire 5 is not slidably restrained. The ascending speeds of the capillary 6 and the wire clamper 9 are not decelerated.

（２）キャピラリ６及びワイヤクランパ９の上昇とともに、両挟持爪９ａ，９ａの間隔が金ワイヤ５の直径に略等しいところまで狭まると、両挟持爪９ａ，９ａと金ワイヤ５との摩擦により、金ワイヤ５に対する拘束力が生じ始め、これにより金ワイヤ５が上昇し始める（図１（Ｃ）及び図２（動作ポイントＣ）参照）。この拘束力が弱いときは、ワイヤクランパ９に対して、金ワイヤ５がスライドするので、ワイヤクランパ９の上昇速度よりも金ワイヤ５の上昇速度が遅くなっている。 (2) When the capillary 6 and the wire clamper 9 are raised and the distance between both the holding claws 9a and 9a is reduced to a position substantially equal to the diameter of the gold wire 5, the friction between the both holding claws 9a and 9a and the gold wire 5 A restraining force on the gold wire 5 starts to be generated, and thereby the gold wire 5 starts to rise (see FIG. 1C and FIG. 2 (operation point C)). When this restraining force is weak, the gold wire 5 slides with respect to the wire clamper 9, so that the rising speed of the gold wire 5 is slower than the rising speed of the wire clamper 9.

（３）両挟持爪９ａ，９ａの間隔が狭まるにつれて、金ワイヤ５に対する拘束力が増大して行き、最終的に、ワイヤクランパ９の上昇速度と金ワイヤ５の上昇速度とが等しくなる。前記（２）の工程から本工程までの過程で、前記ウェッジボンディングによって亀裂が生じている部位から金ワイヤ５がテイル切断される（図１（Ｄ）及び図２（動作ポイントＤ）参照）。 (3) As the distance between the nail claws 9a and 9a becomes narrower, the restraining force on the gold wire 5 increases, and finally, the rising speed of the wire clamper 9 and the rising speed of the gold wire 5 become equal. In the process from the step (2) to the present step, the gold wire 5 is tail-cut from the portion where the crack is generated by the wedge bonding (see FIG. 1D and FIG. 2 (operation point D)).

（４）キャピラリ６及びワイヤクランパ９の上昇速度を低下させることなく、上昇させ、上死点に到達させる（図１（Ｅ）及び図２（動作ポイントＥ）参照）。 (4) Raise the capillary 6 and the wire clamper 9 without lowering the speed, and reach the top dead center (see FIGS. 1E and 2 (operation point E)).

以上のように構成された本例のワイヤ切断方法によれば、テイル切断時にワイヤクランパ９の移動速度を減速するのと同様の効果が得られる。すなわち、金ワイヤ５のテイル切断時に該金ワイヤ５にかかる力を徐々に増大させる（金ワイヤ５へ適度な引っ張り応力が加わるようにする）ことができ、テイル切断時の衝撃を抑え、テイルの変形を防止することができる（直進性を保った金ワイヤ５切断が可能となる）。このため、テイル切断時にワイヤクランパ９の移動速度を減速せずに（又は従来例よりも減速量を少なくして）、従来例と同様の効果が得られるので、ワイヤボンディング１サイクルの時間を短縮でき、生産性を向上させることができる。また、テイル切断時のワイヤクランパの移動速度を従来例と同様に減速すれば、従来例よりも確実にテイルの変形を防止することができる。   According to the wire cutting method of the present example configured as described above, the same effect as that of reducing the moving speed of the wire clamper 9 at the time of tail cutting can be obtained. That is, the force applied to the gold wire 5 at the time of tail cutting of the gold wire 5 can be gradually increased (appropriate tensile stress is applied to the gold wire 5), and the impact at the time of cutting the tail can be suppressed. Deformation can be prevented (the gold wire 5 can be cut while maintaining straightness). For this reason, the same effect as the conventional example can be obtained without reducing the moving speed of the wire clamper 9 at the time of tail cutting (or by reducing the amount of deceleration compared to the conventional example), so the time of one cycle of wire bonding is shortened. And productivity can be improved. Further, if the moving speed of the wire clamper at the time of tail cutting is reduced as in the conventional example, the deformation of the tail can be prevented more reliably than in the conventional example.

また、金ワイヤ５を該両挟持爪９ａ，９ａが解放している状態から該両挟持爪の間隔を徐々に狭めることにより、金ワイヤ５に対する拘束力を徐々に増大させるようにしているので、既存のワイヤボンディング装置の機械的構成をほとんど変更せずに、主にワイヤクランパ９の制御処理内容を修正することにより対応でき、低コストで実現できる。   Further, since the gold wire 5 is gradually narrowed from the state where the both clamping claws 9a, 9a are released, the binding force on the gold wire 5 is gradually increased. This can be realized mainly by modifying the control processing content of the wire clamper 9 without changing the mechanical configuration of the existing wire bonding apparatus, and can be realized at low cost.

なお、本発明は前記実施形態に限定されるものではなく、例えば以下のように、発明の趣旨から逸脱しない範囲で適宜変更して具体化することもできる。
（１）金ワイヤ５を該両挟持爪９ａ，９ａで弱く挟持した状態から該両挟持爪９ａ，９ａによる挟持力を徐々に強めることにより、金ワイヤ５に対する拘束力を徐々に増大させるようにすること。
（２）他の部位に接続した金ワイヤ５の切断に本方法を使用すること。
（３）ボールボンディング法等の他の方法で接続した金ワイヤ５の切断に本方法を使用すること。 In addition, this invention is not limited to the said embodiment, For example, it can also be suitably changed and embodied as follows, for example in the range which does not deviate from the meaning of invention.
(1) By gradually increasing the holding force by the holding claws 9a, 9a from the state where the gold wire 5 is held weakly by the both holding claws 9a, 9a, the restraining force on the gold wire 5 is gradually increased. To do.
(2) Use this method for cutting the gold wire 5 connected to another part.
(3) Use this method for cutting gold wires 5 connected by other methods such as ball bonding.

本発明を具体化した一実施形態に係るワイヤボンディング装置におけるワイヤ切断方法の手順を示す図である。It is a figure which shows the procedure of the wire cutting method in the wire bonding apparatus which concerns on one Embodiment which actualized this invention. 同方法におけるワイヤボンディング装置の動作を示すタイミングチャートである。It is a timing chart which shows operation | movement of the wire bonding apparatus in the method. 従来のワイヤボンディング装置におけるワイヤ切断方法の手順を示す図である。It is a figure which shows the procedure of the wire cutting method in the conventional wire bonding apparatus. 同方法におけるワイヤボンディング装置の動作を示すタイミングチャートである。It is a timing chart which shows operation | movement of the wire bonding apparatus in the method.

符号の説明Explanation of symbols

１ 半導体チップ
２ フレーム
３ ボンディングパッド
４ ボンディング電極
５ 金ワイヤ
６ キャピラリ
９ ワイヤクランパ
９ａ 挟持爪 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Frame 3 Bonding pad 4 Bonding electrode 5 Gold wire 6 Capillary 9 Wire clamper 9a Holding nail

Claims (3)

ボンディング対象部位に接続された金属ワイヤをワイヤクランパにより拘束し引きちぎるようにしてテイルを切断するワイヤ切断方法であって、
前記ワイヤクランパにより前記金属ワイヤをスライド可能にほぼ拘束していない状態から拘束力を徐々に増大させながら引きちぎるようにしたことを特徴とするワイヤボンディング装置におけるワイヤ切断方法。 A wire cutting method for cutting a tail by constraining and tearing a metal wire connected to a bonding target site by a wire clamper,
A wire cutting method in a wire bonding apparatus, wherein the metal wire is torn apart while gradually increasing a restraining force from a state in which the metal wire is not substantially slidably restrained by the wire clamper. 前記ワイヤクランパは少なくとも一対の挟持爪で前記金属ワイヤを挟持するように構成されており、
前記金属ワイヤを該両挟持爪が解放している状態から該両挟持爪の間隔を徐々に狭めることにより、前記金属ワイヤに対する拘束力を徐々に増大させるようにした請求項１記載のワイヤボンディング装置におけるワイヤ切断方法。 The wire clamper is configured to clamp the metal wire with at least a pair of clamping claws,
The wire bonding apparatus according to claim 1, wherein a binding force for the metal wire is gradually increased by gradually reducing a distance between the both nail claws from a state in which the both nail claws are released. Wire cutting method. 前記ワイヤクランパは前記金属ワイヤを少なくとも一対の挟持爪で挟持するように構成されており、
前記金属ワイヤを該両挟持爪で弱く挟持した状態から該両挟持爪による挟持力を徐々に強めることにより、前記金属ワイヤに対する拘束力を徐々に増大させるようにした請求項１記載のワイヤボンディング装置におけるワイヤ切断方法。 The wire clamper is configured to clamp the metal wire with at least a pair of clamping claws,
The wire bonding apparatus according to claim 1, wherein a binding force for the metal wire is gradually increased by gradually increasing a clamping force by the both clamping claws from a state where the metal wire is weakly clamped by the both clamping claws. Wire cutting method.
JP2005101068A 2005-03-31 2005-03-31 Apparatus for wire bonding and method of cutting wire therein Pending JP2006286704A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101138A (en) * 1989-09-13 1991-04-25 Mitsubishi Electric Corp Wire clamping apparatus of wire bonder
JPH06268006A (en) * 1993-03-11 1994-09-22 Matsushita Electric Ind Co Ltd Method of wire bonding
JPH09129664A (en) * 1995-11-02 1997-05-16 Matsushita Electric Ind Co Ltd Wire bonder and wire bonding method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101138A (en) * 1989-09-13 1991-04-25 Mitsubishi Electric Corp Wire clamping apparatus of wire bonder
JPH06268006A (en) * 1993-03-11 1994-09-22 Matsushita Electric Ind Co Ltd Method of wire bonding
JPH09129664A (en) * 1995-11-02 1997-05-16 Matsushita Electric Ind Co Ltd Wire bonder and wire bonding method

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