JPH04343234A - Wire clamper of wire bonder - Google Patents
Wire clamper of wire bonderInfo
- Publication number
- JPH04343234A JPH04343234A JP3115123A JP11512391A JPH04343234A JP H04343234 A JPH04343234 A JP H04343234A JP 3115123 A JP3115123 A JP 3115123A JP 11512391 A JP11512391 A JP 11512391A JP H04343234 A JPH04343234 A JP H04343234A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- movable
- fixed
- movable part
- clamp seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000005452 bending Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、半導体装置を製造する
ワイヤボンダに装備され、ワイヤボンディング工程中に
おいて、ワイヤを挟み付けたり、自由にしたりするワイ
ヤボンダのワイヤクランプ装置（以下、「クランプ装置
」と称する）に関する。[Industrial Field of Application] The present invention relates to a wire clamp device (hereinafter referred to as a "clamp device") for a wire bonder that is installed in a wire bonder for manufacturing semiconductor devices and that clamps or frees wires during the wire bonding process. related to).
【０００２】0002
【従来の技術】図２は従来のクランプ装置を示す側面図
であり、同図において、１はワイヤボンダのヘッド（図
示せず）に取り付けられた固定部、２は固定部１に対向
して設けられた可動部、３は可動部２を回動可能に固定
部１に支持する支持ピン、４は固定部１の、可動部２と
対向する側に設けられた固定側クランプ座、５は固定側
クランプ座４と対向して可動部２に設けられた可動側ク
ランプ座、６は固定側および可動側クランプ座４，５を
互いに近付ける向きに固定部１と可動部２との間を付勢
するばね、７，８は上記とは逆に固定側および可動側ク
ランプ座４，５を互いに遠ざける向きに固定部１と可動
部２との間を付勢するソレノイドとプランジャであり、
ソレノイド７は固定部１に、プランジャ８は可動部２に
それぞれ取り付けられており、ソレノイド７に通電する
ことにより、プランジャ８に吸引力が働き、ばね力に抗
して可動部２を矢符Ｂの向きに回動させるようになって
いる。なお、９はワイヤボンディングのためのワイヤで
ある。2 is a side view showing a conventional clamping device. In the figure, 1 is a fixed part attached to the head (not shown) of a wire bonder, and 2 is a fixed part installed opposite to the fixed part 1. 3 is a support pin that rotatably supports the movable part 2 on the fixed part 1, 4 is a fixed side clamp seat provided on the side of the fixed part 1 facing the movable part 2, and 5 is a fixed part. A movable clamp seat 6 provided on the movable part 2 opposite to the side clamp seat 4 biases between the fixed part 1 and the movable part 2 in a direction that brings the fixed and movable clamp seats 4 and 5 closer to each other. Contrary to the above, the springs 7 and 8 are a solenoid and a plunger that bias between the fixed part 1 and the movable part 2 in a direction that moves the fixed side and movable side clamp seats 4 and 5 away from each other.
The solenoid 7 is attached to the fixed part 1, and the plunger 8 is attached to the movable part 2. By energizing the solenoid 7, a suction force is applied to the plunger 8, and the movable part 2 is moved to the arrow B against the spring force. It is designed to rotate in the direction of. Note that 9 is a wire for wire bonding.
【０００３】次に動作を説明する。先ず、固定側クラン
プ座４と可動側クランプ座５との間にワイヤ９を挿入す
る。可動部２には、ばね６によって矢符Ａの向きに力が
加わっており、ワイヤ９を固定側クランプ座４と可動側
クランプ座５との間で挟み付ける。そこで、ソレノイド
７に通電すると、吸引力が働き、可動部２を矢符Ｂの向
きに回動させてワイヤ９を自由にする。次に、ソレノイ
ド７の通電を断つと吸引力が解消し、ばね力によって可
動部２を矢符Ａの向きに回動させてワイヤ９を挟み付け
る。このようにしてワイヤボンダの動作に応じて適宜、
ワイヤ９を挟み付けたり、自由にしたりする。Next, the operation will be explained. First, the wire 9 is inserted between the fixed clamp seat 4 and the movable clamp seat 5. A force is applied to the movable part 2 in the direction of arrow A by a spring 6, and the wire 9 is sandwiched between the fixed side clamp seat 4 and the movable side clamp seat 5. Therefore, when the solenoid 7 is energized, a suction force is activated, causing the movable part 2 to rotate in the direction of the arrow B, thereby freeing the wire 9. Next, when the solenoid 7 is de-energized, the suction force is released, and the spring force causes the movable part 2 to rotate in the direction of arrow A, thereby pinching the wire 9. In this way, depending on the operation of the wire bonder,
The wire 9 is pinched or released.
【０００４】図３は、例えば、特開昭５７−１１１０３
９号公報に示された別の従来のクランプ装置の側面図で
あり、同図（Ａ）はワイヤ９を自由にした状態、同図（
Ｂ）はワイヤ９を挟み付けた状態を示し、図２に対応す
る部分には、同一の参照符を付す。１０は自由な状態で
は、「へ」の字形に曲がったばね板であり、固定部１の
、可動部２に対向する側に設けられて、可動側クランプ
座５に対向する先端部１１が固定部１と離隔するように
固定部１に取り付けられている。４はばね板１０の先端
部１１に、可動側クランプ座５と対向して設けられた固
定側クランプ座、１２は一端がソレノイド７に挿入され
るとともに、他端が可動部２に固定された押し棒であり
、ソレノイド７とともに、付勢部を構成し、ソレノイド
７に通電することにより、図において、下向きの力が加
わって可動部５を矢符Ｂ方向に回動させるようになって
いる。FIG. 3 shows, for example, Japanese Patent Application Laid-Open No. 57-11103.
9 is a side view of another conventional clamping device shown in Publication No. 9; FIG.
B) shows a state in which the wire 9 is sandwiched, and parts corresponding to those in FIG. 2 are given the same reference numerals. Reference numeral 10 denotes a spring plate bent in the shape of a "h" in the free state, and is provided on the side of the fixed part 1 facing the movable part 2, and the tip part 11 facing the movable side clamp seat 5 is the fixed part. It is attached to the fixing part 1 so as to be spaced apart from the fixing part 1. Reference numeral 4 denotes a fixed side clamp seat provided on the tip end 11 of the spring plate 10, facing the movable side clamp seat 5; and 12, one end is inserted into the solenoid 7, and the other end is fixed to the movable part 2. It is a push rod, and together with the solenoid 7, constitutes an urging section, and by energizing the solenoid 7, a downward force is applied to the movable section 5 in the direction of arrow B in the figure. .
【０００５】図４は図３に示すクランプ装置の動作図で
あり、図４（Ａ）は図３（Ａ）に、図４（Ｃ）は図３（
Ｂ）にそれぞれ対応する。ソレノイド７に通電している
ときは、図４（Ａ）のようにワイヤ９は自由になってい
る。ソレノイド７の通電を断つと、可動部２は矢符Ａ方
向に回動して図４（Ｂ）の状態になる。このとき、先ず
、固定側クランプ座４と可動側クランプ座５の先端部同
士が当接してワイヤ９には衝撃が加わらない。更に、可
動部２が矢符Ａ方向に回動してばね板１０がたわみ、図
４（Ｃ）のようになって固定側クランプ座４と可動側ク
ランプ座５でワイヤ９を挟み付けるが、ばね板１０によ
りワイヤ９への衝撃は緩和される。FIG. 4 is an operational diagram of the clamping device shown in FIG. 3, where FIG. 4(A) is similar to FIG.
B) respectively. When the solenoid 7 is energized, the wire 9 is free as shown in FIG. 4(A). When the solenoid 7 is de-energized, the movable portion 2 rotates in the direction of the arrow A and enters the state shown in FIG. 4(B). At this time, first, the tips of the fixed clamp seat 4 and the movable clamp seat 5 come into contact with each other, so that no impact is applied to the wire 9. Furthermore, the movable part 2 rotates in the direction of arrow A, and the spring plate 10 is bent, and the wire 9 is sandwiched between the fixed side clamp seat 4 and the movable side clamp seat 5 as shown in FIG. 4(C). The impact on the wire 9 is alleviated by the spring plate 10.
【０００６】[0006]
【発明が解決しようとする課題】このような従来例のク
ランプ装置では、支持ピンを用いて回動させているので
、支持ピンの周囲には遊びが存在し、高速での繰り返し
回動により支持ピン周囲での焼き付けや、摩耗による遊
びの増加が発生し、そのため、高速、高精度、長寿命化
の障害となっていた。[Problems to be Solved by the Invention] In such a conventional clamp device, since the rotation is performed using a support pin, there is play around the support pin, and the support pin is rotated repeatedly at high speed. Seizing around the pins and increased play due to wear occurred, which hindered high speed, high precision, and long life.
【０００７】さらに、図３の従来例においては、図２の
従来例と異なり、ソレノイド７および押し棒１２が、支
持ピン３よりもクランプ座４，５側に配置される構成と
なっているために、かかるクランプ装置をワイヤボンダ
に装備し、このクランプ装置が揺動される場合には、図
２のクランプ装置に比べてイナーシャが大きくなり、高
速化が図りにくいという難点がある。Furthermore, in the conventional example shown in FIG. 3, unlike the conventional example shown in FIG. Furthermore, when such a clamping device is installed in a wire bonder and the clamping device is oscillated, there is a problem that the inertia is larger than that of the clamping device shown in FIG. 2, making it difficult to increase the speed.
【０００８】本発明は、上述の点に鑑みて為されたもの
であって、生産性向上の要請に応じ、高速、高精度、長
寿命化を図ることを目的とする。The present invention has been made in view of the above points, and aims to achieve high speed, high precision, and long life in response to the demand for improved productivity.
【０００９】[0009]
【課題を解決するための手段】本発明では、上述の目的
を達成するために、次のように構成している。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention is constructed as follows.
【００１０】すなわち、本発明は、互いに対向する固定
部および可動部を有し、該固定部および可動部の一端側
の各対向面には、ワイヤを挟みつける固定側クランプ座
および可動側クランプ座がそれぞれ設けられ、前記固定
部および可動部の他端側には、駆動信号に応答して前記
固定部および可動部を付勢する付勢手段が設けられ、前
記クランプ座と前記付勢手段との間の位置であって、か
つ、前記固定部および可動部の対向面間には、前記固定
部および可動部を弾性的に結合する結合部が設けられて
いる。That is, the present invention has a fixed part and a movable part that face each other, and each of the opposing surfaces on one end side of the fixed part and the movable part has a fixed clamp seat and a movable clamp seat for sandwiching the wire. are respectively provided, and biasing means for biasing the fixed part and the movable part in response to a drive signal is provided on the other end sides of the fixed part and the movable part, and the clamp seat and the biasing means A connecting portion that elastically connects the fixed portion and the movable portion is provided between the opposing surfaces of the fixed portion and the movable portion.
【００１１】[0011]
【作用】上記構成によれば、固定部と可動部との間に設
けられた結合部が弾性的にたわむことによって両クラン
プ座の間にワイヤを挟んだり、自由にしたりすることが
可能となり、従来のような支持ピンを使用する必要がな
い。[Operation] According to the above structure, the connecting part provided between the fixed part and the movable part elastically bends, thereby making it possible to pinch the wire between the two clamp seats or to release it freely. There is no need to use support pins like in the past.
【００１２】さらに、駆動信号に応答して固定部および
可動部を付勢する付勢手段、例えば、ソレノイドおよび
プランジャを、クランプ座が設けられている端部とは反
対側の端部に設けるので、ワイヤボンダに装備されて揺
動された場合に、イナーシャが小さくなって高速化を図
ることができる。Furthermore, since a biasing means, such as a solenoid and a plunger, for biasing the fixed part and the movable part in response to a drive signal is provided at the end opposite to the end where the clamp seat is provided. , when it is mounted on a wire bonder and swung, the inertia is reduced and high speed can be achieved.
【００１３】[0013]
【実施例】以下、図面によって本発明の実施例について
、詳細に説明する。Embodiments Hereinafter, embodiments of the present invention will be explained in detail with reference to the drawings.
【００１４】図１は、本発明の一実施例の側面図であり
、上述の従来例に対応する部分には、同一の参照符を付
す。FIG. 1 is a side view of one embodiment of the present invention, and parts corresponding to the above-mentioned conventional example are given the same reference numerals.
【００１５】同図において、１はワイヤボンダのヘッド
（図示せず）に取り付けられた固定部、２は固定部１に
対向して設けられた可動部、４は固定部１の一端側の、
可動部２と対向する側に設けられた固定側クランプ座、
５は固定側クランプ座４と対向して可動部２の一端側に
設けられた可動側クランプ座、４，５は固定側および可
動側クランプ座を互いに近付ける向きに固定部１と可動
部２との間を付勢するばね、７，８は通電があったとき
に、固定側および可動側クランプ座４，５を互いに遠ざ
ける向きに固定部１と可動部２との間を付勢する付勢手
段としてのソレノイドとプランジャであり、ソレノイド
７は固定部１の他端側に、プランジャ８は可動部２の他
端側にそれぞれ取り付けられており、ソレノイド７に駆
動信号としての通電があると、プランジャ８に吸引力が
働き、ばね力に抗して可動部２を矢符Ｂの向きに回動さ
せるようになっている。なお、９はワイヤボンディング
のためのワイヤである。In the figure, 1 is a fixed part attached to the head (not shown) of a wire bonder, 2 is a movable part provided opposite to the fixed part 1, and 4 is a fixed part on one end side of the fixed part 1.
a fixed side clamp seat provided on the side facing the movable part 2;
5 is a movable clamp seat provided on one end side of the movable part 2 facing the fixed clamp seat 4, and 4 and 5 are the fixed part 1 and the movable part 2 arranged in such a direction that the fixed and movable clamp seats are brought closer to each other. Springs 7 and 8 bias the fixed part 1 and the movable part 2 in a direction that moves the fixed and movable clamp seats 4 and 5 away from each other when energized. The means are a solenoid and a plunger, and the solenoid 7 is attached to the other end of the fixed part 1, and the plunger 8 is attached to the other end of the movable part 2. When the solenoid 7 is energized as a drive signal, A suction force acts on the plunger 8 to rotate the movable part 2 in the direction of arrow B against the spring force. Note that 9 is a wire for wire bonding.
【００１６】この実施例のクランプ装置では、クランプ
座４，５と付勢手段７，８との間の位置であって、かつ
、固定部１および可動部２の対向面間には、両者を弾性
的に結合する結合部１３が設けられており、この結合部
１３は、クランプ座４，５側および付勢手段７，８側か
らそれぞれ円弧状に削り取られた形状となっており、こ
の結合部１３の薄くなった箇所がたわむことによって、
可動部２が矢符Ａ，Ｂ方向に回動できるようになってい
る。In the clamp device of this embodiment, there is a position between the clamp seats 4, 5 and the urging means 7, 8, and between the opposing surfaces of the fixed part 1 and the movable part 2. A connecting portion 13 that connects elastically is provided, and this connecting portion 13 has a shape cut out in an arc shape from the clamp seat 4, 5 side and the biasing means 7, 8 side, respectively. By bending the thinned part of part 13,
The movable part 2 can rotate in the directions of arrows A and B.
【００１７】上記構成を有するクランプ装置において、
ソレノイド７に通電すると、吸引力が働き、可動部２を
、結合部１３の最も薄い部分を中心にして矢符Ｂの向き
に回動させてワイヤ９を自由にする。次に、ソレノイド
７の通電を断つと吸引力が解消し、ばね力により可動部
２を、結合部１３の最も薄い部分を中心として矢符Ａの
向きに回動させてワイヤ９を挟み付ける。可動部５は、
剛体であり、したがって、ばね６およびプランジャ８か
らの力は、可動部２を通して可動側クランプ座５に確実
、かつ、高速に作用する。[0017] In the clamp device having the above configuration,
When the solenoid 7 is energized, a suction force acts, causing the movable part 2 to rotate in the direction of arrow B around the thinnest part of the joint part 13, thereby freeing the wire 9. Next, when the solenoid 7 is de-energized, the suction force is eliminated, and the spring force causes the movable part 2 to rotate in the direction of arrow A around the thinnest part of the joint part 13, thereby pinching the wire 9. The movable part 5 is
It is a rigid body, and therefore, the force from the spring 6 and plunger 8 acts on the movable clamp seat 5 through the movable part 2 reliably and at high speed.
【００１８】上述の実施例では、結合部１３を円弧状に
削り取った形状としたけれども、本発明は、かかる形状
に限るものではなく、結合部１３を、ゴムや板ばねその
他の弾性部材で構成してもよい。In the above-described embodiment, the joint portion 13 is shaped into an arcuate shape, but the present invention is not limited to such a shape, and the joint portion 13 may be made of rubber, a leaf spring, or other elastic member. You may.
【００１９】また、上述の実施例では、可動部２を回動
させる付勢力として、ばね６およびソレノイド７を用い
たけれども、本発明は、これに限るものではなく、圧電
素子やリニアモータなどを用いてもよい。Further, in the above embodiment, the spring 6 and the solenoid 7 are used as the urging force for rotating the movable part 2, but the present invention is not limited to this, and a piezoelectric element, a linear motor, etc. May be used.
【００２０】さらに、本発明の他の実施例として、図３
と同様に、ばね板１０を設けてワイヤ９に加わる衝撃を
緩和させるようにしてもよい。Furthermore, as another embodiment of the present invention, FIG.
Similarly, a spring plate 10 may be provided to reduce the impact applied to the wire 9.
【００２１】[0021]
【発明の効果】以上のように本発明によれば、固定部と
可動部の対向面間に両者を弾性的に結合する結合部を設
け、この結合部が弾性的にたわむことによりワイヤを挟
み付けたり、自由にしたりするようにしたので、支持ピ
ンを用いて回動させる従来例のように、支持ピンの周囲
に遊びが生じて高速での繰り返し回動により支持ピン周
囲での焼き付けや、摩耗による遊びの増加が発生すると
いったことが防止され、これによって、高速、高精度、
長寿命化は図ることが可能となる。As described above, according to the present invention, a connecting portion is provided between the opposing surfaces of the fixed portion and the movable portion to elastically connect the two, and this connecting portion elastically bends to sandwich the wire. Since it is made to be able to attach or freely rotate, unlike the conventional example where the support pin is used to rotate, there is play around the support pin, and repeated rotation at high speed can cause burn-in around the support pin. Increased play due to wear is prevented, which results in high speed, high precision,
It is possible to extend the lifespan.
【００２２】さらに、ソレノイドおよびプランジャとい
った付勢手段を、クランプ座が設けられている端部とは
反対側の端部に設けるので、ワイヤボンダに装備されて
揺動された場合に、イナーシャが小さくなって高速化を
図るのが容易となる。Furthermore, since the biasing means such as the solenoid and the plunger are provided at the end opposite to the end where the clamp seat is provided, the inertia is reduced when the wire bonder is equipped and swung. This makes it easy to increase speed.
【図１】本発明の一実施例の側面図である。FIG. 1 is a side view of an embodiment of the invention.
【図２】従来例の側面図である。FIG. 2 is a side view of a conventional example.
【図３】他の従来例の平面図である。FIG. 3 is a plan view of another conventional example.
【図４】図３の動作図である。FIG. 4 is an operational diagram of FIG. 3;
１ 固定部
２ 可動部
４ 固定側クランプ座５
可動側クランプ座７ ソ
レノイド
８ プランジャ
１３ 結合部1 Fixed part 2 Movable part 4 Fixed side clamp seat 5
Movable side clamp seat 7 Solenoid 8 Plunger 13 Connection part
Claims (1)
有し、該固定部および可動部の一端側の各対向面には、
ワイヤを挟みつける固定側クランプ座および可動側クラ
ンプ座がそれぞれ設けられ、前記固定部および可動部の
他端側には、駆動信号に応答して前記固定部および可動
部を付勢する付勢手段が設けられ、前記クランプ座と前
記付勢手段との間の位置であって、かつ、前記固定部お
よび可動部の対向面間には、前記固定部および可動部を
弾性的に結合する結合部が設けられたことを特徴とする
ワイヤボンダのワイヤクランプ装置。[Claim 1] A fixed part and a movable part facing each other, each opposing surface on one end side of the fixed part and the movable part,
A fixed side clamp seat and a movable side clamp seat are respectively provided for pinching the wire, and on the other end sides of the fixed part and the movable part, there is a biasing means for biasing the fixed part and the movable part in response to a drive signal. is provided at a position between the clamp seat and the biasing means and between opposing surfaces of the fixed part and the movable part, a coupling part for elastically coupling the fixed part and the movable part. A wire clamp device for a wire bonder, characterized in that it is provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3115123A JPH04343234A (en) | 1991-05-21 | 1991-05-21 | Wire clamper of wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3115123A JPH04343234A (en) | 1991-05-21 | 1991-05-21 | Wire clamper of wire bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04343234A true JPH04343234A (en) | 1992-11-30 |
Family
ID=14654836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3115123A Pending JPH04343234A (en) | 1991-05-21 | 1991-05-21 | Wire clamper of wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04343234A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110091266A (en) * | 2019-04-12 | 2019-08-06 | 武克学 | A kind of hand vice |
-
1991
- 1991-05-21 JP JP3115123A patent/JPH04343234A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110091266A (en) * | 2019-04-12 | 2019-08-06 | 武克学 | A kind of hand vice |
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