JPH06102128A - Semiconductor composite function sensor - Google Patents
Semiconductor composite function sensorInfo
- Publication number
- JPH06102128A JPH06102128A JP24955692A JP24955692A JPH06102128A JP H06102128 A JPH06102128 A JP H06102128A JP 24955692 A JP24955692 A JP 24955692A JP 24955692 A JP24955692 A JP 24955692A JP H06102128 A JPH06102128 A JP H06102128A
- Authority
- JP
- Japan
- Prior art keywords
- static pressure
- pressure
- thin
- sensor
- differential pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は半導体複合機能センサに
係り、特に静圧を精度良く検出するに好適な構造の半導
体複合機能センサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor multi-function sensor, and more particularly to a semiconductor multi-function sensor having a structure suitable for accurately detecting static pressure.
【0002】[0002]
【従来の技術】流量計測に使用される差圧伝送器では差
圧を電気信号に変換する差圧センサとして半導体基板に
ゲージ抵抗を拡散形成し、裏面を凹形加工した感圧シリ
コンダイアフラムとし、両側に加わる圧力差を検出する
構造の半導体差圧センサがある。2. Description of the Related Art In a differential pressure transmitter used for flow rate measurement, a gauge resistance is diffused and formed on a semiconductor substrate as a differential pressure sensor for converting a differential pressure into an electric signal, and a pressure sensitive silicon diaphragm having a concave back surface is formed. There is a semiconductor differential pressure sensor having a structure that detects a pressure difference applied to both sides.
【0003】また差圧伝送器は差圧出力信号が温度変化
や差圧センサの両側に加わる高い圧力(静圧)による影
響を補正するため温度や静圧を測定し、外部回路により
補正する方法がとられる。具体的には特開昭60−61637
号にあるように差圧検出シリコンダイアフラムの薄肉部
上に差圧に感応する半導体ゲージ群が、固定部には温度
に感応する半導体ゲージ群と静圧検出シリコンダイアフ
ラムの薄肉部上に静圧に感応する半導体ひずみゲージ群
が形成されている。各々の検出部は使用最高レンジで最
適な特性を得る検出部設計となっており、差圧,温度,
静圧に比例した電気信号に変換し、外部回路によって差
圧検出信号の温度,静圧による誤差の補正を行う。Further, the differential pressure transmitter measures the temperature and the static pressure in order to correct the influence of the temperature change and the high pressure (static pressure) applied to both sides of the differential pressure sensor in the differential pressure output signal, and corrects them by an external circuit. Is taken. Specifically, JP-A-60-61637
As shown in No. 6, the semiconductor gauge group that is sensitive to the differential pressure is located on the thin portion of the differential pressure detection silicon diaphragm, and the fixed portion has a static pressure on the thin portion of the static pressure detection silicon diaphragm and the semiconductor gauge group that is sensitive to the temperature. A group of sensitive semiconductor strain gauges is formed. Each detector is designed to obtain the optimum characteristics in the maximum range of use, and the differential pressure, temperature,
Converted to an electrical signal proportional to static pressure, and an external circuit corrects the error in the differential pressure detection signal due to temperature and static pressure.
【0004】[0004]
【発明が解決しようとする課題】しかし、静圧は使用す
るプロセス条件によって数kgf/cm2 から数百kgf
/cm2 と広い範囲で使用され、この圧力範囲を単一の検
出部で使用する場合、最高圧力で最適性能としているた
め低圧側で出力が小さく、大きな誤差が発生する。又、
低圧レンジで最適性能とした場合、高圧での使用が困難
になってしまい、差圧検出や温度検出に比べて静圧検出
の精度が悪いという問題が、高精度化への障害となって
いた。However, the static pressure varies from several kgf / cm 2 to several hundred kgf depending on the process conditions used.
Used in a wide range of / cm 2, and when this pressure range is used with a single detector, the output is small on the low pressure side because of optimum performance at the maximum pressure, and a large error occurs. or,
When the optimum performance is used in the low pressure range, it becomes difficult to use at high pressure, and the problem that the accuracy of static pressure detection is poorer than that of differential pressure detection or temperature detection has been an obstacle to higher accuracy. .
【0005】また、差圧出力の補正以外の目的でプラン
ト圧力を測定しようとする時、上記理由から差圧伝送器
以外に圧力伝送器も用いて2種類の伝送器で計測してお
り、単独計器での複数計測が望まれていた。Further, when the plant pressure is to be measured for purposes other than the correction of the differential pressure output, pressure transmitters are used in addition to the differential pressure transmitters for the above-mentioned reasons, and two types of transmitters are used for measurement. Multiple measurements with instruments were desired.
【0006】本発明は上記障害を解決するもので、広い
静圧範囲を精度良く測定可能にし、差圧信号の補正のみ
ならず、プラント圧力の測定にも圧伝送器なしで高精度
測定を可能とする複合機能センサを提供することにあ
る。The present invention solves the above-mentioned obstacles and enables a wide static pressure range to be measured with high accuracy, and not only the correction of the differential pressure signal but also the plant pressure can be measured with high accuracy without a pressure transmitter. To provide a multi-function sensor.
【0007】[0007]
【課題を解決するための手段】本発明は1チップの半導
体基板上にシリコンダイアフラム部を有する半導体ひず
みゲージ抵抗群よりなる差圧検出部,周辺固定部に半導
体ゲージ抵抗よりなる温度検出部と寸法形状の異なるシ
リコンダイアフラム部を有する半導体ひずみゲージ抵抗
群よりなる複数の静圧検出部より成るもので、異なる静
圧感度を持つ静圧検出部によって広い静圧範囲を高精度
に計測可能な構造とした点にある。According to the present invention, there is provided a differential pressure detecting section comprising a semiconductor strain gauge resistance group having a silicon diaphragm section on a one-chip semiconductor substrate, a temperature detecting section comprising a semiconductor gauge resistance in a peripheral fixing section, and dimensions. It consists of a plurality of static pressure detectors consisting of semiconductor strain gauge resistors with silicon diaphragms of different shapes, and a structure that can measure a wide static pressure range with high accuracy by a static pressure detector with different static pressure sensitivity. There is a point.
【0008】[0008]
【作用】一つの半導体基板上に裏面を薄肉加工し、反対
面に半導体ひずみゲージ群を拡散形成して、両面に加わ
る圧力差に対応したゲージ抵抗値の変化をブリッジ回路
結線によって出力信号に変換する構造の差圧検出部,周
辺固定部上に拡散形成し、温度変化に対応してゲージ抵
抗値が変化する温度検出部,周辺固定部の裏面に寸法の
異なる複数の薄肉加工穴を形成し、反対面に各々半導体
ひずみゲージ群を拡散形成し、各々ブリッジ回路結線に
より異なる静圧感度を持ち、低圧力,高圧力など静圧圧
力の種類によって、最適な静圧特性を選択可能とした複
数の静圧検出部より構成される。[Function] The back surface is thinly processed on one semiconductor substrate, the semiconductor strain gauge group is diffused on the opposite surface, and the change in gauge resistance value corresponding to the pressure difference applied to both surfaces is converted into an output signal by the bridge circuit connection. The differential pressure detection part and the peripheral fixed part of the structure are diffused, and the gauge resistance value changes in response to temperature changes. , Each of which has a semiconductor strain gauge group diffused on the opposite surface, has different static pressure sensitivity depending on the bridge circuit connection, and can select the optimum static pressure characteristics depending on the type of static pressure such as low pressure and high pressure. It is composed of the static pressure detection unit.
【0009】複数の静圧検出部は感圧ダイアフラムの寸
法形状が異なり、高圧で最高適正感度を得るもの、中圧
で最高適正感度を得るもの、低圧で最高適正感度を得る
ものがあり、使用静圧圧力に対応してこれらの中から最
適な静圧検出部を選択することにより精度の高い圧力測
定が可能となる。The plurality of static pressure detecting parts differ in the size and shape of the pressure-sensitive diaphragm, and there are one that obtains the highest appropriate sensitivity at high pressure, the one that obtains the most appropriate sensitivity at medium pressure, and the one that obtains the most appropriate sensitivity at low pressure. Highly accurate pressure measurement can be performed by selecting an optimum static pressure detection unit from these in accordance with the static pressure.
【0010】[0010]
【実施例】以下、本発明を図1,図2に示した実施例に
より説明する。EXAMPLES The present invention will be described below with reference to the examples shown in FIGS.
【0011】図1は本発明の複合機能差圧センサの原理
構成を示す一実施例の上図面であり、図2は図1の縦断
面図を示してある。FIG. 1 is a top view of an embodiment showing the principle configuration of a multi-function differential pressure sensor of the present invention, and FIG. 2 is a vertical sectional view of FIG.
【0012】図1,図2において1はシリコン単結晶セ
ンサ基板で、固定厚肉部12は固定台2に気密固定して
ある。In FIGS. 1 and 2, reference numeral 1 denotes a silicon single crystal sensor substrate, and a fixed thick portion 12 is airtightly fixed to a fixed base 2.
【0013】センサ基板1の中央部は薄肉に形成してあ
り、両側の圧力差すなわち差圧△Pに応じて変形するよ
うにしてあり、薄肉部11上にはその変形を電気信号に
変換する差圧検出用半導体ひずみゲージ群111を拡散
法により形成してある。またセンサ基板1の外周固定厚
肉部12の一部分に温度変化を電気信号に変換する温度
検出用半導体ゲージ121が前記差圧検出用半導体ひず
みゲージ群と同様の拡散法により形成してある。センサ
基板1の外部固定厚肉部12の3個所に各々異なる肉厚
の薄肉部13a,13b,13cを形成してあり、前記
薄肉部13a,13b,13cの上面に静圧検出用半導
体ゲージ抵抗群131a,131b,131cを差圧,
温度検出のゲージと同様の拡散法により形成してある。The central portion of the sensor substrate 1 is formed thin so that it is deformed according to the pressure difference between both sides, that is, the differential pressure ΔP, and the deformation is converted into an electric signal on the thin portion 11. The differential pressure detecting semiconductor strain gauge group 111 is formed by a diffusion method. Further, a temperature detecting semiconductor gauge 121 for converting a temperature change into an electric signal is formed on a part of the outer peripheral fixed thick portion 12 of the sensor substrate 1 by the same diffusion method as the differential pressure detecting semiconductor strain gauge group. Thin-walled portions 13a, 13b, 13c having different thicknesses are formed at three locations on the externally fixed thick-walled portion 12 of the sensor substrate 1, and static pressure detection semiconductor gauge resistors are formed on the upper surfaces of the thin-walled portions 13a, 13b, 13c. Differential pressure across the groups 131a, 131b, 131c,
It is formed by the diffusion method similar to the temperature detection gauge.
【0014】前記静圧検出部13aは高圧測定に最適な
性能を得る薄肉寸法形状に形成しており、静圧検出部1
3bは前記静圧検出部13aより薄い薄肉寸法形状と
し、中圧測定に最適な寸法形状としている。静圧検出部
13cは前記静圧検出部13bよりさらに薄い薄肉寸法
形状とし、低圧測定に最適な性能を得るように構成して
いる。The static pressure detecting section 13a is formed in a thin-walled shape to obtain optimum performance for high pressure measurement.
Reference numeral 3b has a thin-walled dimension and shape thinner than the static pressure detection portion 13a, and has an optimal dimension and shape for medium pressure measurement. The static pressure detecting portion 13c is thinner and thinner than the static pressure detecting portion 13b, and is configured to obtain optimum performance for low pressure measurement.
【0015】上記した本発明の実施例によれば静圧検出
部を選択することが可能となり、精度の高い静圧出力信
号を得ることができる。差圧,温度,静圧特性共高精度
な複合機能センサが得られる。According to the above-described embodiment of the present invention, the static pressure detecting section can be selected, and a highly accurate static pressure output signal can be obtained. Highly accurate multi-function sensor with differential pressure, temperature and static pressure characteristics can be obtained.
【0016】[0016]
【発明の効果】本発明によれば、最適な静圧センサを選
択することにより、広い静圧範囲に渡って高精度の静圧
信号が得られるため、差圧検出信号の静圧補正精度が向
上し、広い静圧範囲で高精度の差圧センサが実現でき
る。According to the present invention, by selecting an optimum static pressure sensor, a highly accurate static pressure signal can be obtained over a wide static pressure range, so that the static pressure correction accuracy of the differential pressure detection signal can be improved. It is possible to improve and realize a highly accurate differential pressure sensor in a wide static pressure range.
【0017】さらに、プラント圧力測定信号としても別
の圧力伝送器を使用することなく計測可能なため、経済
的に大きな利点となる。Further, the plant pressure measurement signal can be measured without using another pressure transmitter, which is a great economical advantage.
【0018】さらに、従来の半導体圧力センサと同一の
製造工程で容易に実現でき、応用範囲の拡大が可能であ
る。Further, it can be easily realized by the same manufacturing process as the conventional semiconductor pressure sensor, and the range of application can be expanded.
【図1】本発明の一実施例を示す半導体複合機能センサ
の上面図である。FIG. 1 is a top view of a semiconductor multi-function sensor according to an embodiment of the present invention.
【図2】図1の断面図である。FIG. 2 is a cross-sectional view of FIG.
1…シリコン単結晶センサ基板、2…固定台、11…差
圧検出薄肉部、13a…高圧力静圧検出薄肉部、13b
…中圧力静圧検出薄肉部、13c…低圧力静圧検出薄肉
部、111…差圧検出半導体ひずみゲージ、112…温
度検出半導体ゲージ、113a,113b,113c…
静圧検出半導体ひずみゲージ。DESCRIPTION OF SYMBOLS 1 ... Silicon single crystal sensor substrate, 2 ... Fixing base, 11 ... Differential pressure detection thin part, 13a ... High pressure static pressure detection thin part, 13b
... Medium pressure static pressure detection thin portion, 13c ... Low pressure static pressure detection thin portion, 111 ... Differential pressure detection semiconductor strain gauge, 112 ... Temperature detection semiconductor gauge, 113a, 113b, 113c ...
Static pressure detection semiconductor strain gauge.
Claims (2)
び静圧検出部を有する半導体機能センサにおいて、前記
静圧検出部が異なる圧力感度の複数の静圧検出部を有す
ることを特徴とする半導体複合機能センサ。1. A semiconductor functional sensor having a differential pressure detection unit, a temperature detection unit, and a static pressure detection unit on a semiconductor substrate, wherein the static pressure detection unit has a plurality of static pressure detection units having different pressure sensitivities. Semiconductor multi-function sensor.
ダイアフラム外周の固定部に寸法形状の異なる感圧シン
コンダイアフラムを形成してなることを特徴とする半導
体複合機能センサ。2. The semiconductor multi-function sensor according to claim 1, wherein the static pressure detecting portion is formed by forming a pressure sensitive sincone diaphragm having different dimensions in a fixed portion on the outer periphery of the differential pressure detecting silicon diaphragm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24955692A JPH06102128A (en) | 1992-09-18 | 1992-09-18 | Semiconductor composite function sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24955692A JPH06102128A (en) | 1992-09-18 | 1992-09-18 | Semiconductor composite function sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06102128A true JPH06102128A (en) | 1994-04-15 |
Family
ID=17194757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24955692A Pending JPH06102128A (en) | 1992-09-18 | 1992-09-18 | Semiconductor composite function sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06102128A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008152953A (en) * | 2006-12-14 | 2008-07-03 | Tokai Rika Co Ltd | Membrane switch |
KR101032076B1 (en) * | 2008-10-07 | 2011-05-02 | 가부시키가이샤 야마다케 | Pressure sensor |
US8161820B2 (en) | 2008-10-07 | 2012-04-24 | Yamatake Corporation | Pressure sensor |
KR101222746B1 (en) * | 2010-04-13 | 2013-01-15 | 아즈빌주식회사 | Pressure sensor |
-
1992
- 1992-09-18 JP JP24955692A patent/JPH06102128A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008152953A (en) * | 2006-12-14 | 2008-07-03 | Tokai Rika Co Ltd | Membrane switch |
KR101032076B1 (en) * | 2008-10-07 | 2011-05-02 | 가부시키가이샤 야마다케 | Pressure sensor |
US8042400B2 (en) | 2008-10-07 | 2011-10-25 | Yamatake Corporation | Pressure sensor |
US8161820B2 (en) | 2008-10-07 | 2012-04-24 | Yamatake Corporation | Pressure sensor |
KR101222746B1 (en) * | 2010-04-13 | 2013-01-15 | 아즈빌주식회사 | Pressure sensor |
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