JPH06101579B2 - Photo coupler manufacturing method - Google Patents
Photo coupler manufacturing methodInfo
- Publication number
- JPH06101579B2 JPH06101579B2 JP19791486A JP19791486A JPH06101579B2 JP H06101579 B2 JPH06101579 B2 JP H06101579B2 JP 19791486 A JP19791486 A JP 19791486A JP 19791486 A JP19791486 A JP 19791486A JP H06101579 B2 JPH06101579 B2 JP H06101579B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- light receiving
- receiving element
- emitting element
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims description 42
- 229920005989 resin Polymers 0.000 claims description 42
- 238000007789 sealing Methods 0.000 claims description 19
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Description
【発明の詳細な説明】 （技術分野） この発明は発光素子４と受光素子５とを対向せしめ封止
樹脂３で一体化するフオトカプラの製法に関する。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a photocoupler in which a light emitting element 4 and a light receiving element 5 are opposed to each other and integrated with a sealing resin 3.
（背景技術） 第４図及び第５図に示すのはこの種の従来のものであ
る。(Background Art) FIGS. 4 and 5 show a conventional device of this type.
６はリード端子１の先端に拡大部２を形成せるリードフ
レームであり、拡大部２に発光素子４を登載したものと
拡大部２に受光素子５を登載したものを、該発光素子４
と受光素子５とが対向するように配置されている。Reference numeral 6 denotes a lead frame in which the enlarged portion 2 is formed at the tip of the lead terminal 1. The lead frame 6 has the light emitting element 4 mounted on the enlarged portion 2 and the light receiving element 5 mounted on the enlarged portion 2.
And the light receiving element 5 are arranged so as to face each other.
７は透光性の樹脂で、発光素子４と受光素子５との間に
充填されている。透光性の樹脂７としては、例えば、ポ
リエステル樹脂、ポリイミド樹脂等が使用されている。
この透光性の樹脂７は発光素子４と受光素子５間に滴下
され、表面張力により両者間に保持され固化する。A transparent resin 7 is filled between the light emitting element 4 and the light receiving element 5. As the translucent resin 7, for example, polyester resin, polyimide resin or the like is used.
The translucent resin 7 is dripped between the light emitting element 4 and the light receiving element 5, and is held and solidified between them due to surface tension.
３は封止樹脂で、発光素子４と受光素子５との間に透光
性の樹脂７を充填した状態でリードフレーム６の拡大部
２の外周を被覆するように成形されている。封止樹脂３
としては、顔料をいれる等して非透光性としたポリエス
テル樹脂、フエノール樹脂等が使用されている。Reference numeral 3 denotes a sealing resin, which is molded so as to cover the outer periphery of the enlarged portion 2 of the lead frame 6 in a state in which the translucent resin 7 is filled between the light emitting element 4 and the light receiving element 5. Sealing resin 3
As the resin, a polyester resin, a phenol resin, or the like, which is made non-translucent by adding a pigment, is used.
而して、透光性の樹脂７は発光素子４と受光素子５間に
滴下され、表面張力により両者間に保持され固化せしめ
られるので、滴下時に拡大部２よりリード端子１のほう
に流やすく、このため、透光性の樹脂７と封止樹脂３と
の境界面が封止樹脂３の外面に近いリード端子１の部分
に生じやすい。しかるに、このような状態が生ずること
は、透光性の樹脂７と封止樹脂３とは硬度や熱膨張率が
ことなるために熱衝撃等のストレスを受けやすいことに
起因して両者の境界面において劣化を生じ、封止樹脂３
の外面との封止を不完全なものとし、フオトカプラの信
頼性に影響を与える。これは発光素子４と受光素子５間
に滴下される透光性の樹脂７が拡大部２よりリード端子
１に流れやすいために生じているのである。Thus, the translucent resin 7 is dripped between the light emitting element 4 and the light receiving element 5, and is held between them by the surface tension to be solidified. Therefore, the boundary surface between the translucent resin 7 and the sealing resin 3 is likely to occur in the portion of the lead terminal 1 near the outer surface of the sealing resin 3. However, such a state occurs because the translucent resin 7 and the sealing resin 3 are different in hardness and coefficient of thermal expansion, and thus are easily subjected to stress such as thermal shock, and thus the boundary between the two. Deterioration occurs on the surface, and the sealing resin 3
Incomplete sealing with the outer surface of the photo coupler affects the reliability of the photo coupler. This is because the translucent resin 7 dropped between the light emitting element 4 and the light receiving element 5 easily flows from the enlarged portion 2 to the lead terminal 1.
（発明の目的） この発明は上記欠点を除去せんとするものである。この
発明の目的は、透光性の樹脂７が発光素子４と受光素子
５間にのみ充填され、リード端子１を伝って封止樹脂３
の外周部に流れることがなく、この結果信頼性の高いフ
オトカプラの製法を提供することである。(Object of the Invention) The present invention is intended to eliminate the above drawbacks. An object of the present invention is to fill the space between the light emitting element 4 and the light receiving element 5 with the light-transmissive resin 7 and to pass through the lead terminal 1 to form the sealing resin 3
The present invention is to provide a highly reliable method for manufacturing a photocoupler, which does not flow to the outer peripheral portion of the.
（発明の開示） この発明の要旨とするところは、リード端子１の先端に
拡大部２を形成すると共に、拡大部２のリード端子１と
の接続部に開口部８を設けて対に備えるようにリードフ
レーム６を形成し、一方の拡大部２に発光素子４を搭載
し、他方の拡大部に受光素子５を搭載し、発光素子４と
受光素子５とが対向するように配置し、リード端子１の
開口８より先端部間において発光素子４と受光素子５と
の間に透光性の樹脂７を充填し、個化させ、この状態で
透光性の樹脂７の外周を封止樹脂３で封止することを特
徴とするフオトカプラの製法である。DISCLOSURE OF THE INVENTION The gist of the present invention is to form an enlarged portion 2 at the tip of a lead terminal 1 and provide an opening 8 at a connecting portion of the enlarged portion 2 with the lead terminal 1 so as to be provided in a pair. A lead frame 6 is formed on one side, a light emitting element 4 is mounted on one enlarged portion 2, a light receiving element 5 is mounted on the other enlarged portion, and the light emitting element 4 and the light receiving element 5 are arranged so as to face each other. A transparent resin 7 is filled between the light emitting element 4 and the light receiving element 5 from the opening 8 of the terminal 1 between the light emitting element 4 and the light receiving element 5, and in this state, the outer periphery of the transparent resin 7 is sealed with a sealing resin. It is a method of manufacturing a photocoupler characterized by sealing with 3.
以下、この発明を図示せる実施例にもとずいて説明す
る。The present invention will be described below based on illustrated embodiments.
第１図乃至第３図に示すのはこの発明の一実施例であ
る。1 to 3 show one embodiment of the present invention.
この発明の方法は、フオトカプラの製造に際して用いる
リードフレーム６に特徴があり、その他の部分は上記従
来のものと変わりがないので、リードフレーム６を中心
に説明する。The method of the present invention is characterized by the lead frame 6 used in manufacturing the photocoupler, and the other parts are the same as the conventional ones. Therefore, the lead frame 6 will be mainly described.
６はリード端子１の先端に拡大部２を形成せるリードフ
レームであり、拡大部２のリード端子１との接続部に開
口部８を形成し、該開口部８より先端部において拡大部
２に発光素子４を登載したものと拡大部２に受光素子５
を登載したものを、該発光素子４と受光素子５とを対向
するように配置する。Reference numeral 6 denotes a lead frame in which the enlarged portion 2 can be formed at the tip of the lead terminal 1. An opening 8 is formed in the connecting portion of the enlarged portion 2 with the lead terminal 1, and the enlarged portion 2 is formed from the opening 8 at the tip. The light emitting element 4 is mounted and the light receiving element 5 is provided in the enlarged portion 2.
The light emitting element 4 and the light receiving element 5 are arranged so as to face each other.
受光側若しくは発行側の発光素子４若しくは受光素子５
は一個とは限らず、例えば第３図のごとく、受光素子５
を二個直列接続して使用するときは、リードフレーム6
a、6b、6cを三個平面的に配列し、その内の二個にフオ
トダイオードを受光素子５として登載し、受光素子５を
登載していないリードフレーム6aをプラス端子とし、該
リードフレーム6aをワイヤボンデイングによりリードフ
レーム6bの受光素子５と接続し、かつ該リードフレーム
6bをワイヤボンデイングによりリードフレーム6cの受光
素子５と接続して使用する。Light-receiving element or light-emitting element 4 or light-receiving element 5
The number is not limited to one, and as shown in FIG.
When connecting two in series, use the lead frame 6
A, 6b, and 6c are arranged in a plane and two of them have photodiodes mounted as the light receiving elements 5, and the lead frame 6a on which the light receiving elements 5 are not mounted is used as a positive terminal, and the lead frame 6a is provided. Is connected to the light receiving element 5 of the lead frame 6b by wire bonding, and
6b is used by being connected to the light receiving element 5 of the lead frame 6c by wire bonding.
７は透光性の樹脂で、発光素子４と受光素子５との間に
充填する。透光性の樹脂７としては、例えば、ポリエス
テル樹脂、ポリイミド樹脂が使用される。この透光性の
樹脂７は発光素子４と受光素子５間に滴下され、表面張
力により両者間に保持され固化する。而して、この発明
にあっては、発光素子４若しくは受光素子５を登載する
拡大部２のリード端子１との接続部に開口部８を設けて
いるので、滴下する透光性の樹脂７は発光素子４と受光
素子５間を中心に充填され、該透光性の樹脂７はこの開
口部８に遮られてリード端子１のほうに流れるのが防止
されているのである。A transparent resin 7 is filled between the light emitting element 4 and the light receiving element 5. As the translucent resin 7, for example, polyester resin or polyimide resin is used. The translucent resin 7 is dripped between the light emitting element 4 and the light receiving element 5, and is held and solidified between them due to surface tension. Thus, in the present invention, since the opening 8 is provided at the connection portion of the enlarged portion 2 on which the light emitting element 4 or the light receiving element 5 is mounted with the lead terminal 1, the translucent resin 7 to be dropped. Is filled in the space between the light emitting element 4 and the light receiving element 5, and the transparent resin 7 is blocked by the opening 8 and prevented from flowing toward the lead terminal 1.
３は封止樹脂で、発光素子４と受光素子５との間に透光
性の樹脂７を充填し、個化した状態でリードフレーム６
の拡大部２の外周を被覆するように成型し、透光性の樹
脂７の外周を封止している。封止樹脂３としては、顔料
をいれる等して非透光性としたポリエステル樹脂、フエ
ノール樹脂等が使用する。3 is a sealing resin, which is filled with a light-transmissive resin 7 between the light emitting element 4 and the light receiving element 5, and is separated into lead frames 6
Is molded so as to cover the outer circumference of the enlarged portion 2 and the outer circumference of the translucent resin 7 is sealed. As the sealing resin 3, a polyester resin, a phenol resin or the like which is made non-translucent by adding a pigment or the like is used.
（発明の効果） 以上の如くこの発明によるフオトカプラの製法によれ
ば、発光素子４と受光素子５との間に透光性の樹脂７を
充填し、個化させる際に、この透光性の樹脂７は、拡大
部２とリード端子１の接続部において拡大部２に設けら
れた開口部８に遮られリード端子１の方向に流れること
がなく、透光性の樹脂７と封止樹脂３との境界面が封止
樹脂３の外面に近いリード端子１の部分に生じることが
なく、従って封止樹脂３の外面との封止を不完全なもの
とし、フオトカプラの信頼性に悪影響を与えることがな
いのである。(Effects of the Invention) As described above, according to the method of manufacturing the photocoupler of the present invention, when the light-transmissive resin 7 is filled between the light emitting element 4 and the light receiving element 5 and the light transmissive resin 7 is singulated, The resin 7 does not flow in the direction of the lead terminal 1 while being blocked by the opening 8 provided in the enlarged portion 2 at the connecting portion between the enlarged portion 2 and the lead terminal 1, and the translucent resin 7 and the sealing resin 3 are provided. Does not occur in the portion of the lead terminal 1 close to the outer surface of the sealing resin 3, and therefore the sealing with the outer surface of the sealing resin 3 is incomplete, which adversely affects the reliability of the photocoupler. There is nothing.
第１図乃至第３図はこの発明の一実施例を示す図で、第
１図は断面図、第２図及び第３図は平面図、第４図及び
第５図はこの発明の従来例を示す図で、第４図は断面
図、第５図は平面図である。 １はリード端子、２は拡大部、３は封止樹脂、４は発光
素子、５は受光素子、６はリードフレーム、７は透光性
の樹脂、８は開口部である。1 to 3 are views showing an embodiment of the present invention. FIG. 1 is a sectional view, FIGS. 2 and 3 are plan views, and FIGS. 4 and 5 are conventional examples of the present invention. FIG. 4 is a sectional view and FIG. 5 is a plan view. Reference numeral 1 is a lead terminal, 2 is an enlarged portion, 3 is a sealing resin, 4 is a light emitting element, 5 is a light receiving element, 6 is a lead frame, 7 is a translucent resin, and 8 is an opening.
Claims (1)
と共に、拡大部２のリード端子１との接続部に開口部８
を設けて対に備えるようにリードフレーム６を形成し、
一方の拡大部２に発光素子４を搭載し、他方の拡大部に
受光素子５を搭載し、発光素子４と受光素子５とが対向
するように配置し、リード端子１の開口８より先端部間
において発光素子４と受光素子５との間に透光性の樹脂
７を充填し、個化させ、この状態で透光性の樹脂７の外
周を封止樹脂３で封止することを特徴とするフオトカプ
ラの製法。1. An enlarged portion 2 is formed at a tip of a lead terminal 1, and an opening 8 is formed at a connecting portion of the enlarged portion 2 with the lead terminal 1.
To form the lead frame 6 so as to prepare for the pair,
The light emitting element 4 is mounted on the one enlarged portion 2, the light receiving element 5 is mounted on the other enlarged portion, and the light emitting element 4 and the light receiving element 5 are arranged so as to face each other. Between the light emitting element 4 and the light receiving element 5, a translucent resin 7 is filled and singulated, and the outer periphery of the translucent resin 7 is sealed with a sealing resin 3 in this state. The manufacturing method of photo coupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19791486A JPH06101579B2 (en) | 1986-08-22 | 1986-08-22 | Photo coupler manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19791486A JPH06101579B2 (en) | 1986-08-22 | 1986-08-22 | Photo coupler manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6353983A JPS6353983A (en) | 1988-03-08 |
| JPH06101579B2 true JPH06101579B2 (en) | 1994-12-12 |
Family
ID=16382371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19791486A Expired - Lifetime JPH06101579B2 (en) | 1986-08-22 | 1986-08-22 | Photo coupler manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06101579B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3907743B2 (en) * | 1995-05-11 | 2007-04-18 | ローム株式会社 | Semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5487197A (en) * | 1977-12-23 | 1979-07-11 | Toshiba Corp | Photo coupling semiconductor device |
-
1986
- 1986-08-22 JP JP19791486A patent/JPH06101579B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6353983A (en) | 1988-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6825551B1 (en) | Method for packaging a semiconductor chip containing sensors and resulting package | |
| KR950024308A (en) | Solid state imaging device and manufacturing method | |
| CN102194771A (en) | Semiconductor device and manufacturing method thereof | |
| JPH06101579B2 (en) | Photo coupler manufacturing method | |
| US6509584B2 (en) | Optical unit incorporating light-emitting or light-receiving element coated by resin protector | |
| JP2002016194A (en) | Semiconductor device | |
| KR20210123551A (en) | Light emitting device, its manufacturing method and multi sensor package module for wearable device | |
| JPS59195882A (en) | Interrupter | |
| JPH0648883Y2 (en) | Optical coupling element | |
| JPH0590549A (en) | Solid-state image sensing element and manufacture thereof | |
| JPH02101776A (en) | Package for photo sensor and its manufacture | |
| JP2958228B2 (en) | Transmission type optical coupling device | |
| JPS5869174A (en) | Solid-state image pickup device | |
| JPS63213373A (en) | Optical semiconductor device | |
| JPH0243746A (en) | Manufacture of photoelectric conversion element molded with transparent resin | |
| JPH0224385B2 (en) | ||
| JPS6353984A (en) | Photocoupler package | |
| JPH0614562B2 (en) | Optical coupling device | |
| US20040046169A1 (en) | Optical semiconductor device with transparent support | |
| JP2602269B2 (en) | Optical coupling device | |
| JPH05182999A (en) | Semiconductor device | |
| JPH1022515A (en) | Photoelectric converter | |
| JPH05152601A (en) | Photocoupler | |
| JPS60241278A (en) | Photo semiconductor device | |
| JPH02186680A (en) | Manufacture of optically coupled semiconductor device |