JPH059396B2 - - Google Patents
Info
- Publication number
- JPH059396B2 JPH059396B2 JP2205187A JP2205187A JPH059396B2 JP H059396 B2 JPH059396 B2 JP H059396B2 JP 2205187 A JP2205187 A JP 2205187A JP 2205187 A JP2205187 A JP 2205187A JP H059396 B2 JPH059396 B2 JP H059396B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- deposited
- ceramic
- ceramics
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 87
- 239000002184 metal Substances 0.000 claims description 87
- 239000000919 ceramic Substances 0.000 claims description 60
- 238000000034 method Methods 0.000 claims description 44
- 230000008018 melting Effects 0.000 claims description 23
- 238000002844 melting Methods 0.000 claims description 23
- 150000002739 metals Chemical class 0.000 claims description 21
- 238000007733 ion plating Methods 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 7
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 150000001768 cations Chemical class 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000001465 metallisation Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910052719 titanium Inorganic materials 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017770 Cu—Ag Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2205187A JPS63190788A (ja) | 1987-02-02 | 1987-02-02 | セラミツクスの金属化法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2205187A JPS63190788A (ja) | 1987-02-02 | 1987-02-02 | セラミツクスの金属化法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63190788A JPS63190788A (ja) | 1988-08-08 |
JPH059396B2 true JPH059396B2 (de) | 1993-02-04 |
Family
ID=12072120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2205187A Granted JPS63190788A (ja) | 1987-02-02 | 1987-02-02 | セラミツクスの金属化法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63190788A (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3495052B2 (ja) * | 1992-07-15 | 2004-02-09 | 株式会社東芝 | メタライズ体およびその製造方法 |
JP4246972B2 (ja) * | 2002-07-22 | 2009-04-02 | 日本碍子株式会社 | 複合材料及びその製造方法 |
KR102496717B1 (ko) * | 2015-10-27 | 2023-02-07 | 주식회사 아모센스 | 세라믹 기판 제조 방법 및 이 제조방법으로 제조된 세라믹 기판 |
-
1987
- 1987-02-02 JP JP2205187A patent/JPS63190788A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63190788A (ja) | 1988-08-08 |
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