JPH0590429A - Semiconductor device - Google Patents

Abstract

PURPOSE:To dissolve disuniformity of resin, poor foaming by making the sealing surface of a case or a substrate and a cap to have a proper tilt angle - shape. CONSTITUTION:An adhesive surface of a ceramic cap 12 has a raised triangular form while an adhesive surface on the side of a ceramic case 11 has a recessed triangular form. Here, the raised surface is required to have an acuter angle than that of the recessed surface, and thereby resin inside the adhesive surface flows in a fixed direction at the time of adhesion followed by dissolution of disuniformity of resin and poor foaming. Further, the damage to resin can be reduced by making the adhesion surface a curved surface. In this case, application uniformity of resin is improved by making the side of the cap 22 a recessed surface in order to apply adhesive resin 13 to the side of the cap 22. Further, resin is intentionally made to flow by making the raised surface to have a smaller curvature than that of the recessed surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device which uses a resin when sealing a cap.

[0002]

2. Description of the Related Art In a conventional semiconductor device, as shown in FIG. 3, elements are sealed by a ceramic case 31 having a cylindrical wall and a flat ceramic cap 32, or as shown in FIG. It is known that the element is sealed with 41 and a ceramics cap 42 having a cylindrical wall.

In any of the above cases, the sealing surface of both the case and the cap is flat, and the mutual sealing is performed by resin.

A method for adhering resin is disclosed in JP-A-63-
As disclosed in Japanese Patent No. 190345, as a pre-bonding treatment, a method has been proposed in which low-pressure treatment and high-pressure treatment are alternately performed to prevent generation of air bubbles and variation in thickness of the adhesive resin.

[0005]

However, in the conventional sealing technique, since the bonding surfaces are mutually flat, there is no escape route for air bubbles in the resin, and even if low-pressure degassing is performed before sealing, after sealing. There was a problem that air bubbles remained on the adhesive surface.

The present invention has been made in view of the above conventional circumstances, and therefore, an object of the present invention is to provide a novel semiconductor device capable of solving the above problems inherent in the conventional art. It is in.

[0007]

In order to achieve the above object, a semiconductor device according to the present invention is configured such that the sealing / sealing surfaces of a case or a substrate and a cap are provided with appropriate inclination angles and shapes. .

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be specifically described with reference to the drawings for each of its preferred embodiments.

FIG. 1 is a sectional view showing a first embodiment according to the present invention.

Referring to FIG. 1, reference numeral 11 is a ceramic case, 12 is a ceramic cap, 13 is a sealing resin, 14 is a semiconductor element, and 15 is a bonding wire.

In the first embodiment, the bonding surface of the ceramic cap 12 is a convex triangle, and the bonding surface on the ceramic case 11 side is a concave triangle. What is required here is that the convex surface has a sharper angle than the concave surface, so that the resin in the bonding surface flows in a certain direction at the time of bonding, and accordingly nonuniformity of the resin and bubble defects are eliminated.

FIG. 2 is a sectional view showing a second embodiment according to the present invention.

In the figure, the same reference numerals are given to the same elements as those in FIG. In the second embodiment, the shape of the adhesive surface is a curved surface, which reduces damage to the resin, and in this case, the adhesive resin 13
In order to apply the resin to the cap 22 side, by making the cap side concave, there is an effect that the resin application uniformity is improved.
Also in this embodiment, the resin is intentionally allowed to flow outward by making the convex surface smaller than the curvature of the concave surface, as in the first embodiment.

[0014]

As described above, according to the present invention,
By having an appropriate inclination angle and shape on the sealing / sealing surface of the case or the substrate and the cap, the resin in the bonding surface flows in a certain direction when a resin having a particularly high viscosity is used as an adhesive. As a result, non-uniformity of the resin and bubble defects can be eliminated.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment according to the present invention.

FIG. 2 is a sectional view showing a second embodiment according to the present invention.

FIG. 3 is a sectional view showing a first example of the prior art.

FIG. 4 is a sectional view showing a second example of the prior art.

[Explanation of symbols]

 11, 21, 31, 41 ... Ceramic case 12, 22, 32 ... Ceramic cap 13 ... Sealing resin 14 ... Semiconductor element 15 ... Bonding wire

Claims (3)

[Claims] 1. A semiconductor device, in particular, a semiconductor device using a resin for sealing a cap, wherein a sealing or sealing surface of a case or a substrate and a cap has a predetermined inclined shape. 2. The inclined shape of the sealing / sealing surface is concave.
The semiconductor device according to claim 1, further comprising a convex triangular shape. 3. The inclined shape of the sealing / sealing surface is concave.
The semiconductor device according to claim 1, further comprising a convex curved surface.