JPH0590087A - Chip type solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To provide a chip-type solid electrolytic capacitor which can have profile excellent in dimensional accuracy and can be automatically mounted by an automatic mounting device. CONSTITUTION:A groove 15, wherein an anode lead wire 12 is contained while, being bent, is provided on the side of the anode lead wire 12 of armor resin 16, which covers a capacitor element 11 so that an anode lead wire 12 may be led out to one side, and the opposite side of the armor resin 16 to the anode lead wire 12 is cut or polished, whereby the cathode part in the capacitor element is exposed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip solid electrolytic capacitor.

[0002]

2. Description of the Related Art A conventional chip-shaped solid electrolytic capacitor is
As shown in FIGS. 3 and 4, the surface of the porous anode body to which the anode lead wire 1 is connected is a dielectric oxide film, an electrolyte layer,
A cathode layer 2 composed of a carbon layer and a silver paint layer is sequentially laminated to form a capacitor element 3, and the outside of the capacitor element 3 is externally packaged so that the anode lead wire 1 and the cathode layer 2 project at both ends. The surface of the anode lead wire 1 and the cathode layer 2 which are covered with the resin 4 and then protrude from the exterior resin 4
The anode metal layer 6 and the cathode metal layer 7 are formed on the exposed surface 2a of the above and the anode lead-out surface 5 of the exterior resin 4, and further immersed in a molten solder bath to remove the anode side solder metal layer 8 and the cathode side solder metal layer 9. Had formed.

[0003]

However, in such a conventional chip-shaped solid electrolytic capacitor, since the anode lead-out wire 1 projects outward from the end surface of the exterior resin 4, the concave shape provided in the carrier tape. When the chip-shaped solid electrolytic capacitor housed in the housing is taken out by an automatic mounting device and attached to a printed circuit board, the anode lead wire 1 is caught on the inner surface of the recessed housing, and the chip-shaped solid electrolytic capacitor is housed in the recess. There was a problem that I could not get it out of the department.

Moreover, since the capacitor element 3 is directly affected by the dimensional variation, the external dimension accuracy as a product is not good.

The present invention solves the above-mentioned problems of the prior art, and provides a chip-shaped solid electrolytic capacitor which can have an outer shape with good dimensional accuracy and can be surely automatically mounted by an automatic mounting apparatus. The purpose is that.

[0006]

In order to achieve the above object, a chip solid electrolytic capacitor of the present invention comprises an anode lead wire and a dielectric oxide film on the surface of an anode body made of a valve metal. A capacitor element formed by sequentially laminating an electrolyte layer and a cathode layer, and an exterior resin that covers the capacitor element so that the anode lead wire is drawn out to one side, are provided on the anode lead wire side of the exterior resin. A groove for accommodating the anode lead-out wire is provided, and the side of the exterior resin opposite to the anode lead-out wire is cut or ground to expose the cathode portion of the capacitor element. An anode-side terminal portion connected to the anode lead-out wire in the groove portion, and a cathode-side terminal portion connected to the cathode portion on the opposite side of the exterior resin from the anode lead-out wire. Those were.

[0007]

According to the above construction, since the anode lead-out wire is bent and housed in the groove portion provided on the side of the anode lead-out wire of the exterior resin, the anode lead-out wire is projected outward from the end face of the exterior resin. Since the outer side of the exterior resin opposite to the anode lead wire is cut or ground to expose the cathode part of the capacitor element, the dimensional accuracy is good without being affected by the dimensional variation of the capacitor element. The external shape can be obtained, and as a result, the automatic mounting of the chip solid electrolytic capacitor by the automatic mounting apparatus can be surely performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing the external appearance of a chip solid electrolytic capacitor according to an embodiment of the present invention, and FIG. 2 is a sectional view showing the chip solid electrolytic capacitor. Is a capacitor element, and this capacitor element 11 has a dielectric oxide film formed on the surface of a porous anode body made of tantalum provided with an anode lead wire 12 by a general anodic oxidation method. Cathode layer 13 composed of carbon layer and silver paint layer
Are sequentially laminated. Then, in the cathode layer 13 provided around the capacitor element 11, a cathode conductor layer 14 made of a conductive material is formed thickly on the surface facing the lead-out surface of the anode lead-out wire 1, and then the anode of the capacitor element 11 is formed. A concave groove portion 15 in which the anode lead-out wire 12 can be bent and housed is formed on the surface from which the lead-out wire 12 is drawn out.
And covering the capacitor element 11 and the cathode conductor layer 14 with the exterior resin 16 so that the anode lead-out wire 12 is drawn out to one side, and thereafter cutting the opposite side of the exterior resin 16 from the anode lead-out wire 12. Alternatively, the exposed surface 14a of the cathode conductor layer 14 is formed by grinding.
Next, the anode metal layer 19 made of plating is formed on the anode lead-out surface 17 of the exterior resin 16 including the anode lead-out wire 12 bent and housed in the concave groove portion 15, and the exposed surface 14a of the cathode conductor layer 14 and A cathode metal layer 20 made of plating was formed on the cathode lead-out surface 18. After that, this is immersed in a molten solder bath to form an anode-side solder metal layer 21 and a cathode-side solder metal layer 22 on the surfaces of the anode metal layer 19 and the cathode metal layer 20 to manufacture a chip solid electrolytic capacitor. did.

In the above-described embodiment of the present invention, the anode lead wire 12 is provided in the concave groove portion 15 provided in the exterior resin 16.
Since the anode lead-out wire 12 does not project outward from the end surface of the exterior resin 16, the cathode lead-out surface of the exterior resin 16 is cut or cut in order to expose the cathode conductor layer 14. Since the grinding is performed, the outer shape can be formed with high dimensional accuracy without being affected by the dimensional variation of the capacitor element 11. As a result, even when the chip-shaped solid electrolytic capacitor in one embodiment of the present invention housed in the recessed housing portion provided in the carrier tape is taken out by the automatic mounting device and attached to the printed board, the chip-shaped solid electrolytic capacitor is formed as in the conventional case. The solid electrolytic capacitor is not caught on the inner side surface inside the concave accommodating portion provided on the carrier tape, and thus the automatic mounting by the automatic mounting device can be surely performed.

In the above embodiment of the present invention,
The cathode conductor layer 14 is provided separately from the cathode layer 13 of the capacitor element 11, and the cathode conductor surface of the exterior resin 16 is cut or ground to expose the cathode conductor layer 14. Is the cathode layer 1
It is also possible to form a part of 3 to make the cathode layer 13 exposed.

[0011]

As described above, according to the chip solid electrolytic capacitor of the present invention, the anode lead wire is bent and accommodated in the groove portion provided on the anode lead wire side of the exterior resin.
The anode lead wire no longer projects outward from the end surface of the exterior resin, and the opposite side of the exterior resin anode lead wire is cut or ground to expose the cathode part of the capacitor element. It is possible to form the outer shape with good dimensional accuracy without being affected by the dimensional variation of the element, and as a result, the automatic mounting of the chip solid electrolytic capacitor by the automatic mounting apparatus can be surely performed.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a chip solid electrolytic capacitor according to an embodiment of the present invention.

FIG. 2 is a perspective view of the chip-shaped solid electrolytic capacitor.

FIG. 3 is a perspective view of a conventional chip solid electrolytic capacitor.

FIG. 4 is a sectional view of the same solid electrolytic capacitor chip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Capacitor element 12 Anode lead wire 13 Cathode layer 15 Groove 16 Exterior resin 17 Anode lead surface 18 Cathode lead surface 19 Anode metal layer 20 Cathode metal layer 21 Anode side solder metal layer 22 Cathode side solder metal layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sumio Nishiyama 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] Claim: What is claimed is: 1. A capacitor element comprising an anode lead wire and comprising a dielectric oxide film, an electrolyte layer and a cathode layer which are sequentially laminated on the surface of an anode body made of a valve metal, and a capacitor element comprising the capacitor element and the capacitor element. The anode lead wire is provided with an exterior resin that is coated so as to be drawn out to one side, and a groove portion in which the anode lead wire is bent and housed is provided on the anode lead wire side of the exterior resin, and the anode lead wire of the exterior resin is provided. Exposes the cathode portion of the capacitor element by cutting or grinding the opposite side, and further provides an anode side terminal portion connected to the anode lead wire in the groove portion on the anode lead wire side of the exterior resin, and the exterior A chip solid electrolytic capacitor having a cathode side terminal portion connected to the cathode portion on the side opposite to the anode lead wire of the resin.