JPH058947U - Solid relay - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a solid state relay with a small installation space by installing a protective fuse in the solid state relay, which allows easy installation. A partition plate 10 for dividing the inside of the main body case 5 is provided, a solid relay section A containing a semiconductor switching element is provided in one of the divided spaces, and a protective fuse F is provided in the other space on the wiring board 1. The heat sink 3 for dissipating the heat generated from the protective fuse F to the outside.
Attach to. [Effect] Since the solid relay section A is not affected by the heat generated by the protective fuse F, both can be built in the main body case 5.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solid-state relay in which a semiconductor switching element such as a thyristor or a triac controls opening and closing of a load.

[0002]

[Prior Art]

 Conventionally, as this type of solid relay, for example, one shown in FIG. 3 is known. In the figure, the input signal circuit 51 is such that a light emitting element, for example, a series circuit of a light emitting diode L and a resistor R1 is connected between input terminals P1 and P2, and a capacitor C3 is connected in parallel with the above light emitting diode L. It is configured. The load circuit 52 is constructed by connecting a series body of a protective fuse F, a load RL and a power source E between output terminals P3 and P4, and connecting a semiconductor switching element, for example, a triac Q to the load RL in series. A capacitor C2 and resistors R4 and R5 are connected between the triac Q and the load RL to form a surge absorption circuit of the triac Q. The trigger circuit 53 is composed of a light receiving element, for example, a photothyristor FS, resistors R2 and R3, a capacitor C1 and rectifying diodes D1 to D4. Has been formed. The circuit shown by these chain lines is resin-molded to form the solid relay section A. The solid relay section A is housed in the main body case together with the terminals and the like to form a solid relay.

In the above structure, when an input signal is applied between the input terminals P1 and P2, the light emitting diode L emits light and the photothyristor FS becomes conductive. The conduction of the photothyristor FS triggers the gate pole of the triac Q, and the triac Q conducts. As a result, the output terminals P3 and P4 are "closed", and the load RL is energized.

[0004]

[Problems to be solved by the device]

 By the way, since the semiconductor switching element Q of the solid state relay generates heat when energized, this heat causes the internal temperature of the element Q to rise, causing thermal destruction. In order to prevent this, the conventional solid state relay described above is provided with a heat dissipation plate that dissipates the heat generated from the element Q to the outside.

On the other hand, in the above-mentioned conventional solid state relay, the protective fuse F, the breaker and the like are provided in the load circuit 2 to prevent the semiconductor switching element Q from being damaged due to a short circuit of the load RL. If these protective fuses F and breakers are built into the main body case of the solid state relay together with the above semiconductor switching elements Q, these protective fuses F and breakers also generate heat when energized, and the temperature around the semiconductor switching elements Q rises. Thermal destruction of Q is likely to occur. Therefore, conventionally, the protective fuse F and the breaker are formed separately from the solid state relay. As a result, when installing the solid state relays, it is necessary to install the protective fuses F and breakers and wire connection work, and it is necessary to provide a space for installing these, which hinders the dense arrangement of electronic devices. Come.

The present invention has been made to solve the above problems, and prevents thermal destruction of a semiconductor switching element due to heat generation of a protective fuse, and by incorporating a protective fuse in a solid-state relay, simple work can be performed. The objective is to provide a solid relay that can be installed and has a small installation space.

[0007]

[Means for Solving the Problems]

 The solid state relay according to the present invention is provided with a partition plate for dividing the inside of the main body case, a semiconductor switching element is arranged in one of the divided spaces, a protective fuse is arranged in the other space, and a protective fuse is generated. A heat radiation plate for radiating the generated heat to the outside is attached to the heat radiation plate for the element.

[0008]

With the above structure, the heat generated from the protective fuse is dissipated to the outside by the radiator plate, and the protective fuse and the semiconductor switching element are shielded by the partition plate, so that the heat generated from the protective fuse is generated by the semiconductor. Since it does not affect the ambient temperature of the switching element, it becomes possible to incorporate the semiconductor switching element and the protective fuse in the body case of the solid state relay. This eliminates the need to install additional protective fuses and breakers when installing the solid state relays, thus reducing the space for installing them. Further, since a part of the heat generated from the semiconductor switching element is conducted from the element heat sink to the protective fuse heat sink and radiated to the outside, the element heat sink can be made small. ..

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic exploded perspective view showing an example of a fixed relay according to the present invention. In the figure, a solid relay section A having a built-in triac is provided on one side of the main surface 1a of the wiring board 1 in close contact with the main surface 1a with a heat dissipation plate 13 for an element interposed. A protective fuse F is provided on the side. Input terminals P1 and P2 and output terminals P3 and P4 are projected on the main surface 1a, and these parts are connected to each other by a conductive connecting member 2. Further, the wiring board 1 is formed by laminating a heat dissipation plate 3 for protective fuse, which is made of aluminum having a high thermal conductivity, and an insulating sheet 4.

On the upper surface 5a of the main body case 5 mounted on the wiring board 1, the input terminal holes 6 into which the tips of the input terminals P1 and P2 are inserted and the tips of the output terminals P3 and P4 are inserted. Output terminal hole 7 is formed. Further, an exchange hole 8 for fuse exchange is provided, and a lid 9 is detachably attached to the exchange hole 8. A partition plate 10 is provided inside the main body case 5 to divide the space inside the main body case 5. A screw groove 11 into which a mounting screw body (not shown) is inserted is formed on the side surface of the body case 5.

As shown in FIG. 2, the partition plate 10 divides the space 12 in the main body case 5 into a fuse portion 12 a and an element portion 12 b, and the element portion 12 b is filled with resin. ing.

In the above structure, when the gate electrode of the triac built in the solid relay section A is triggered by the input signal as described above, the triac and the protective fuse F are energized, and both of them generate heat. The heat generated from this triac is conducted to and dissipated to the element heat sink 13 via the solid relay section A, and a part thereof is further conducted to the fuse heat sink 3 via the insulating sheet 4 to be dissipated to the outside. It The heat generated from the protective fuse F is conducted to the heat radiating plate 3 for the fuse through the insulating sheet 4 and radiated to the outside. Therefore, the heat generated from the protective fuse F is not conducted to the solid relay section A containing the triac through the wiring board 1. At this time, since the protective fuse F and the solid relay section A are shielded from each other by the partition plate 10, the heat generated from the protective fuse F does not affect the ambient temperature of the solid relay section A by radiation and convection. Absent.

As described above, in the solid state relay of the present invention, the heat generated from the protective fuse F is not conducted to the triac built in the solid state relay portion A, and the thermal destruction thereof can be prevented. The F and the triac can be built in the main body case 5. This eliminates the need to install additional protective fuses and breakers when installing the solid state relays, thus reducing the space for installing them. Further, a part of the heat generated from the triac built in the solid relay section A is conducted from the element heat radiation plate 13 to the fuse heat radiation plate 3 and radiated to the outside. Can be small. In the above-described embodiment, the element heat sink 13 and the fuse heat sink 3 are separately formed, but it goes without saying that both may be integrally formed.

[0014]

[Effect of the device]

 As described above, according to the present invention, the semiconductor switching element is prevented from being destroyed by heat due to the heat generated by the protective fuse, and the protective fuse is built into the solid-state relay. It is possible to provide a small solid state relay.

[Brief description of drawings]

FIG. 1 is a schematic exploded perspective view showing an example of a solid state relay according to the present invention.

FIG. 2 is a schematic sectional view of the solid-state relay.

FIG. 3 is a circuit diagram of a conventional solid state relay.

[Explanation of symbols]

 1 Wiring board 3 Heat sink for fuse 5 Body case 10 Partition plate 13 Heat sink for element A Solid relay F F Protection fuse

Claims (1)

[Claims for utility model registration] [Claim 1] A semiconductor switching element connected to a power source through a load and a protective fuse is built in a main body case, and heat generated from the semiconductor switching element is radiated to the outside. In a solid state relay provided with a plate, a partition plate for dividing the inside of the main body case is provided, the semiconductor switching element is arranged in one of the divided spaces, and the protective fuse is arranged in the other space, and a protective fuse is provided. A solid state relay characterized in that a heat dissipation plate for radiating heat generated from the outside is mounted on the heat dissipation plate for the semiconductor switching element.