JPH058679Y2 - - Google Patents
Info
- Publication number
- JPH058679Y2 JPH058679Y2 JP1988070584U JP7058488U JPH058679Y2 JP H058679 Y2 JPH058679 Y2 JP H058679Y2 JP 1988070584 U JP1988070584 U JP 1988070584U JP 7058488 U JP7058488 U JP 7058488U JP H058679 Y2 JPH058679 Y2 JP H058679Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire
- ultrasonic
- bonding tool
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005284 excitation Effects 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 5
- 230000002950 deficient Effects 0.000 description 5
- 230000010355 oscillation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988070584U JPH058679Y2 (enrdf_load_stackoverflow) | 1988-05-28 | 1988-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988070584U JPH058679Y2 (enrdf_load_stackoverflow) | 1988-05-28 | 1988-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01173939U JPH01173939U (enrdf_load_stackoverflow) | 1989-12-11 |
| JPH058679Y2 true JPH058679Y2 (enrdf_load_stackoverflow) | 1993-03-04 |
Family
ID=31295818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988070584U Expired - Lifetime JPH058679Y2 (enrdf_load_stackoverflow) | 1988-05-28 | 1988-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058679Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-05-28 JP JP1988070584U patent/JPH058679Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01173939U (enrdf_load_stackoverflow) | 1989-12-11 |
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