JPH0585856B2 - - Google Patents
Info
- Publication number
- JPH0585856B2 JPH0585856B2 JP60295813A JP29581385A JPH0585856B2 JP H0585856 B2 JPH0585856 B2 JP H0585856B2 JP 60295813 A JP60295813 A JP 60295813A JP 29581385 A JP29581385 A JP 29581385A JP H0585856 B2 JPH0585856 B2 JP H0585856B2
- Authority
- JP
- Japan
- Prior art keywords
- diamond
- metal
- single crystal
- semiconductor
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Measuring Fluid Pressure (AREA)
- Die Bonding (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60295813A JPS62151732A (ja) | 1985-12-26 | 1985-12-26 | ダイヤモンド体と金属体の接合構造 |
US06/946,478 US4768011A (en) | 1985-12-24 | 1986-12-24 | Joint structure for diamond body and metallic body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60295813A JPS62151732A (ja) | 1985-12-26 | 1985-12-26 | ダイヤモンド体と金属体の接合構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62151732A JPS62151732A (ja) | 1987-07-06 |
JPH0585856B2 true JPH0585856B2 (enrdf_load_stackoverflow) | 1993-12-09 |
Family
ID=17825494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60295813A Granted JPS62151732A (ja) | 1985-12-24 | 1985-12-26 | ダイヤモンド体と金属体の接合構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62151732A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07121525B2 (ja) * | 1990-03-12 | 1995-12-25 | 富士通株式会社 | グリーンシートの成形方法 |
WO2010150302A1 (ja) * | 2009-06-22 | 2010-12-29 | トヨタ自動車株式会社 | 圧力センサおよびその製造方法 |
-
1985
- 1985-12-26 JP JP60295813A patent/JPS62151732A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62151732A (ja) | 1987-07-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7642115B2 (en) | Method for making a transducer | |
US3800264A (en) | High temperature transducers and housing including fabrication methods | |
US5867886A (en) | Method of making a thick film pressure sensor | |
JP5570811B2 (ja) | 耐熱式ソリッド・ステート圧力センサ | |
US5659127A (en) | Substrate structure of monolithic gas sensor | |
EP0336437A2 (en) | Pressure sensing transducer employing piezoresistive elements on sapphire | |
US5174926A (en) | Compositions for piezoresistive and superconductive application | |
JPS5817421B2 (ja) | 半導体圧力センサ | |
US3930823A (en) | High temperature transducers and housing including fabrication methods | |
US4768011A (en) | Joint structure for diamond body and metallic body | |
US6022756A (en) | Metal diaphragm sensor with polysilicon sensing elements and methods therefor | |
JPS58731A (ja) | 静電容量式圧力センサ | |
US4459855A (en) | Semiconductor pressure sensor | |
JPH05299705A (ja) | ダイヤモンド薄膜電子デバイス及びその製造方法 | |
JPH0585856B2 (enrdf_load_stackoverflow) | ||
JPS594868B2 (ja) | 半導体装置 | |
CN113433191B (zh) | 环热式气体传感器及其制备方法 | |
JPH0513451B2 (enrdf_load_stackoverflow) | ||
JPS62148830A (ja) | 圧力検出器 | |
JPS5936835B2 (ja) | 半導体圧力・差圧伝送器 | |
JPH02236431A (ja) | 圧電型圧力センサ | |
JPS62291534A (ja) | 圧力検出器 | |
JPH0368829A (ja) | 圧力検出器およびその製造方法 | |
JPS633234A (ja) | 圧力検出器 | |
JPS5940252B2 (ja) | 半導体圧力センサ− |