JPH0583632B2 - - Google Patents
Info
- Publication number
- JPH0583632B2 JPH0583632B2 JP59223944A JP22394484A JPH0583632B2 JP H0583632 B2 JPH0583632 B2 JP H0583632B2 JP 59223944 A JP59223944 A JP 59223944A JP 22394484 A JP22394484 A JP 22394484A JP H0583632 B2 JPH0583632 B2 JP H0583632B2
- Authority
- JP
- Japan
- Prior art keywords
- target
- magnetic field
- plasma
- microwave
- generating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/357—Microwaves, e.g. electron cyclotron resonance enhanced sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59223944A JPS61104074A (ja) | 1984-10-26 | 1984-10-26 | スパッタリング方法及びその装置 |
EP85110155A EP0173164B1 (en) | 1984-08-31 | 1985-08-13 | Microwave assisting sputtering |
DE8585110155T DE3566194D1 (en) | 1984-08-31 | 1985-08-13 | Microwave assisting sputtering |
KR1019850006013A KR900006488B1 (ko) | 1984-08-31 | 1985-08-21 | 마이크로파 여기 스퍼터링 방법 및 장치 |
US06/769,505 US4721553A (en) | 1984-08-31 | 1985-08-23 | Method and apparatus for microwave assisting sputtering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59223944A JPS61104074A (ja) | 1984-10-26 | 1984-10-26 | スパッタリング方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61104074A JPS61104074A (ja) | 1986-05-22 |
JPH0583632B2 true JPH0583632B2 (enrdf_load_stackoverflow) | 1993-11-26 |
Family
ID=16806146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59223944A Granted JPS61104074A (ja) | 1984-08-31 | 1984-10-26 | スパッタリング方法及びその装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61104074A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107663629A (zh) * | 2016-07-27 | 2018-02-06 | 丰田自动车株式会社 | 高频波供给构造 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621352B2 (ja) * | 1985-12-25 | 1994-03-23 | 株式会社日立製作所 | スパツタリング装置 |
JPH07107189B2 (ja) * | 1986-03-24 | 1995-11-15 | 日本電信電話株式会社 | 薄膜形成装置 |
JPH0715145B2 (ja) * | 1988-05-10 | 1995-02-22 | 松下電器産業株式会社 | スパッタ装置 |
FR2774251B1 (fr) * | 1998-01-26 | 2000-02-25 | Commissariat Energie Atomique | Source a plasma micro-onde lineaire en aimants permanents |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5875839A (ja) * | 1981-10-30 | 1983-05-07 | Fujitsu Ltd | スパツタ装置 |
JPS58161774A (ja) * | 1982-03-17 | 1983-09-26 | Fujitsu Ltd | スパツタリング処理方法 |
JPS6050167A (ja) * | 1983-08-26 | 1985-03-19 | Nippon Telegr & Teleph Corp <Ntt> | プラズマ付着装置 |
-
1984
- 1984-10-26 JP JP59223944A patent/JPS61104074A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107663629A (zh) * | 2016-07-27 | 2018-02-06 | 丰田自动车株式会社 | 高频波供给构造 |
Also Published As
Publication number | Publication date |
---|---|
JPS61104074A (ja) | 1986-05-22 |
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