JPH0582966A - Flex rigid printed wiring board - Google Patents
Flex rigid printed wiring boardInfo
- Publication number
- JPH0582966A JPH0582966A JP24131191A JP24131191A JPH0582966A JP H0582966 A JPH0582966 A JP H0582966A JP 24131191 A JP24131191 A JP 24131191A JP 24131191 A JP24131191 A JP 24131191A JP H0582966 A JPH0582966 A JP H0582966A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- rigid printed
- flex
- flex rigid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気的接続信頼性に優
れるフレクスリジットプリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flex-rigid printed wiring board having excellent electrical connection reliability.
【０００２】[0002]
【従来の技術】通常、配線板は、エポキシ樹脂やフェノ
ール樹脂をガラスクロスや紙に含浸させ硬化したものを
絶縁基材として用いている。また、ポリイミドフィルム
やポリエステルフィルムなどを絶縁基材として用いるこ
ともある。前者をリジット配線板、後者をフレキシブル
配線板と呼ぶが、このような２種配線板を組み合わせて
フレクスリジットプリント配線板として用いることもあ
り、その組合せ方はさまざまな方法が提案されている。2. Description of the Related Art In general, a wiring board uses an epoxy resin or phenol resin impregnated in glass cloth or paper and cured as an insulating base material. In addition, a polyimide film or a polyester film may be used as an insulating base material. The former is referred to as a rigid wiring board and the latter is referred to as a flexible wiring board. Such two kinds of wiring boards may be combined and used as a flex-rigid printed wiring board, and various combinations have been proposed.
【０００３】[0003]
【発明が解決しようとする課題】ところで、このような
フレクスリジットプリント配線板を積層一体化する組合
せ方に使用される層間接着シートは、高温時における弾
性率が低く、線膨張計数が大きいため、フレクスリジッ
トプリント配線板は熱に対する電気的接続信頼性に不安
があった。本発明は、このような点に鑑みてなされたも
ので、熱に対する電気的接続信頼性に優れたフレクスリ
ジットプリント配線板を提供するものである。By the way, the interlayer adhesive sheet used in such a combination method of laminating and integrating such flex-rigid printed wiring boards has a low elastic modulus at high temperature and a large linear expansion coefficient. , Flex-rigid printed wiring board was concerned about the reliability of electrical connection to heat. The present invention has been made in view of the above circumstances, and provides a flex-rigid printed wiring board having excellent electrical connection reliability against heat.
【０００４】[0004]
【課題を解決するための手段】本発明のフレクスリジッ
トプリント配線板は、フレキシブルプリント配線板の両
側に層間接着シートを介し、硬質プリント配線板を熱圧
着し、一体化した積層板にスルーホールを穿設し、この
スルーホールに銅めっきを施すことにより前記両基材を
電気的に接続したフレクスリジットプリント配線板にお
いて、前記層間接着シートとして１２５℃時の弾性率が
５０〜１００MPa 、線膨張計数が１０〜１５×１０-5℃
-1の材料特性を有する接着剤を用いることを特徴とす
る。The flex-rigid printed wiring board of the present invention has a rigid printed wiring board thermo-compressed on both sides of a flexible printed wiring board through inter-layer adhesive sheets to form a through hole in an integrated laminated board. In the flex-rigid printed wiring board in which both the base materials are electrically connected to each other by forming a through hole and copper plating in the through hole, the interlayer adhesive sheet has an elastic modulus at 125 ° C. of 50 to 100 MPa and a wire. Expansion coefficient is 10-15 × 10 -5 ℃
An adhesive having a material property of -1 is used.
【０００５】[0005]
【作用】本発明によれば、フレクスリジットプリント配
線板の熱に対する電気的接続信頼性の向上に作用する。According to the present invention, the flex-rigid printed wiring board serves to improve the reliability of electrical connection to heat.
【０００６】[0006]
【実施例】本発明を実施例および比較例により具体的に
説明する。EXAMPLES The present invention will be specifically described with reference to Examples and Comparative Examples.
【０００７】実施例 エポキシ樹脂１００部にＮＢＲを４０部配合することに
より、１２５℃時の弾性率が１００MPa 、２５〜１２５
℃の線膨張計数が１３×１０-5℃-1のエポキシ系接着剤
を得た。この接着剤を塗工することにより厚さ１００μ
ｍの層間接着シートを得た。この層間接着シートを両面
フレキシブルプリント配線板の両側に配し、両面硬質プ
リント配線板を熱圧着して６層フレクスリジットプリン
ト配線板を得る。EXAMPLE By mixing 40 parts of NBR with 100 parts of epoxy resin, the elastic modulus at 125 ° C. is 100 MPa, 25 to 125.
An epoxy type adhesive having a linear expansion coefficient of 13 × 10 −5 ° C. −1 was obtained. By applying this adhesive, the thickness of 100μ
m of the interlayer adhesive sheet was obtained. This interlayer adhesive sheet is arranged on both sides of the double-sided flexible printed wiring board, and the double-sided hard printed wiring board is thermocompression bonded to obtain a 6-layer flex-rigid printed wiring board.
【０００８】次に、このフレクスリジットプリント配線
板を−６５℃で３０分間冷却し、１２５℃で３０分間加
熱する処理を１サイクルとした熱衝撃試験を行い、抵抗
上昇率が１０％以下を保持する最大の処理サイクルを求
めた。Next, this flex-rigid printed wiring board was cooled at −65 ° C. for 30 minutes and heated at 125 ° C. for 30 minutes to perform a thermal shock test, and the resistance increase rate was 10% or less. The maximum processing cycle to hold was determined.
【０００９】この結果を表１に実施例として示す。ま
た、比較のため従来の層間接着シートを使用して得られ
たフレクスリジットプリント配線板について同じ試験を
行った結果を比較例として、あわせて表１に示す。The results are shown in Table 1 as an example. For comparison, the results of the same test performed on a flex-rigid printed wiring board obtained by using a conventional interlayer adhesive sheet are also shown in Table 1 as a comparative example.
【００１０】[0010]
【表１】 表１に示されるように、本実施例で得られたフレクスリ
ジットプリント配線板は熱衝撃に強いことがわかる。[Table 1] As shown in Table 1, the flex-rigid printed wiring board obtained in this example is resistant to thermal shock.
【００１１】[0011]
【発明の効果】本発明は、フレクスリジットプリント配
線板の熱に対する電気的接続信頼性を向上する効果があ
る。The present invention has the effect of improving the reliability of electrical connection of the flex-rigid printed wiring board to heat.
Claims (1)
間接着シートを介し、硬質プリント配線板を熱圧着し、
一体化した積層板にスルーホールを穿設し、このスルー
ホールに銅めっきを施すことにより前記両基材を電気的
に接続したフレクスリジットプリント配線板において、
前記層間接着シートとして１２５℃時の弾性率が５０〜
１００MPa 、線膨張計数が１０〜１５×１０-5℃-1の材
料特性を有する接着剤を用いることを特徴とするフレク
スリジットプリント配線板。1. A rigid printed wiring board is thermocompression-bonded to both sides of a flexible printed wiring board with an interlayer adhesive sheet interposed therebetween,
In a flex-rigid printed wiring board in which a through hole is formed in the integrated laminated plate and copper is plated in the through hole to electrically connect the two base materials,
As the interlayer adhesive sheet, the elastic modulus at 125 ° C. is 50 to
A flex-rigid printed wiring board characterized by using an adhesive having a material characteristic of 100 MPa and a coefficient of linear expansion of 10 to 15 × 10 -5 ° C -1 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24131191A JPH0582966A (en) | 1991-09-20 | 1991-09-20 | Flex rigid printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24131191A JPH0582966A (en) | 1991-09-20 | 1991-09-20 | Flex rigid printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582966A true JPH0582966A (en) | 1993-04-02 |
Family
ID=17072406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24131191A Pending JPH0582966A (en) | 1991-09-20 | 1991-09-20 | Flex rigid printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582966A (en) |
-
1991
- 1991-09-20 JP JP24131191A patent/JPH0582966A/en active Pending
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