JPH0582951A - Mounting method of semiconductor component - Google Patents

Abstract

PURPOSE:To mount a semiconductor component accurately to a printed circuit board, in which a wide wiring pattern such as a power line and a narrow wiring pattern such as a signal line are mixed. CONSTITUTION:When bumps 2a, 2b formed to the electrodes of a semiconductor chip 1 are abutted against corresponding wiring patterns 3a, 3b composed of conductive ink printed on a printed circuit board 4 and the semiconductor chip 1 is connected electrically to the printed circuit board 4, the wiring pattern 3a having board line width in the wiring patterns 3a, 3b on the printed circuit board 4 side is formed by printing narrow wiring patterns 3a1, 3a2 consisting of conductive ink in parallel at an interval A2 of a limiting minimum interval or less capable of separating lines by printing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component mounting method for mounting a semiconductor component such as a semiconductor chip on a printed circuit board by a flip chip bonding technique.

[0002]

2. Description of the Related Art FIG. 2 is a diagram showing each step of a conventional semiconductor component mounting method.

In this mounting method, the bump 1 formed on each electrode of the semiconductor chip 11 as shown in the plan view of FIG.
This is a method of mounting the semiconductor chip 11 on the printed circuit board 14 shown in FIG. 2B by a general flip-chip bonding method via 2a and 12b.

The bumps 12a, 1 on the semiconductor chip 11 side
Corresponding to these, 2b are arranged opposite to the conductive ink wiring patterns 13a and 13b drawn on the printed circuit board 14 by the screen printing method, as shown in FIG. And is heated and melted, as shown in FIG.
As shown in (C), the bumps 12a of the semiconductor chip 11,
12b is the wiring patterns 13a and 13b of the printed circuit board 4.
Connected to.

[0005]

By the way, in the above-described conventional method for mounting a semiconductor component, since it is necessary to suppress the wiring resistance of the power supply line or the like to a low level, the power supply line of the wiring patterns 13a and 13b on the printed circuit board 14 is to be suppressed. The line width of the wiring pattern 13a corresponding to, for example, is set wider than that of other wiring patterns 13b such as signal lines.

By the way, as a characteristic when screen-printing a fine circuit such as the printed circuit board 14, a conductive ink wiring pattern 13 on the printed circuit board 14 is used.
The line width and the film thickness of a and 13b are in a proportional relationship, and the wiring pattern 13a having a wide line width is thicker than the wiring pattern 13b having a narrow line width. That is, the printed circuit board 14
In, the wiring pattern 13a has a line width of 50 μm, the wiring pattern 13b has a line width of 130 μm,
When the line spacing between a and 13b is 130 μm, the wiring pattern 13a has a film thickness of 3 μm and the wiring pattern 13b has a film thickness of 9 μm.

As a result, as shown in FIG. 2C, the wiring pattern 13a having a wide line width is displaced or the ink is crushed during bonding, and the adjacent wiring pattern 13 is formed.
There is a problem that it is short-circuited with b.

Therefore, an object of the present invention is to provide a semiconductor component capable of accurately mounting a semiconductor component on a printed circuit board in which a wide wiring pattern such as a power supply line and a narrow wiring pattern such as a signal line coexist. It is to provide the implementation method of.

[0009]

SUMMARY OF THE INVENTION According to the present invention, bumps formed on electrodes of a semiconductor component are butted against a corresponding wiring pattern made of conductive ink printed on a printed circuit board, and the semiconductor is mounted on the printed circuit board. In a mounting method for electrically connecting components, a wiring pattern having a wide line width of the wiring pattern on the printed circuit board side is separated by a distance equal to or smaller than a limit minimum distance that can separate the lines by printing, and a narrow width and a narrow space are provided. It is a method of mounting a semiconductor component, which is formed by printing wiring patterns of two conductive inks in parallel.

[0010]

According to the present invention, a wiring pattern formed by printing two narrow line width / narrow-spaced wiring patterns of conductive ink in parallel on the printed circuit board side has two narrow lines over time. The width / narrow-spaced wiring patterns are connected by the spread of the viscosity of the printing ink to form one wiring pattern. At this time, the line width of each wiring pattern is set narrow, so
The single wiring pattern has a thin film thickness despite its wide line width.

As a result, on the printed circuit board side, although the wiring patterns have different line widths, the film thicknesses are substantially uniform, and the semiconductor components are not crushed or misaligned during bonding. Can be accurately mounted on a printed circuit board.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a process chart showing a semiconductor component mounting method according to an embodiment of the present invention.

This mounting method is applied to the semiconductor chip 1 (see FIG.
(D) is a method of mounting the semiconductor chip 1 on the printed circuit board 4 by a flip chip bonding method via the bumps 2a and 2b formed on each electrode.
First, using the print pattern 5 shown in FIG.
As shown in (B), wiring patterns 3a and 3b of conductive ink such as copper ink, gold ink, silver ink, and carbon ink are printed on the insulating substrate 4a made of glass, ceramics, polyester film or the like by the screen printing method. The printed circuit board 4 is obtained.

Of the above print patterns 5, pattern 5a
Is a bump 2a formed on the power supply electrode of the semiconductor chip 1.
The wiring pattern 3a corresponding to
The pattern 5b is for printing on the insulating substrate 4a made of a polyester film or the like, and the pattern 5b is for printing the wiring pattern 3b corresponding to the bumps 2b formed on the signal electrodes of the semiconductor chip 1 on the insulating substrate 4a. Pattern.

The line spacing C between the patterns 5a and 5b is 1
30 μm and the line width A of the pattern 5a is 130 μm
In addition, the line width B of the pattern 5b is set to 50 μm. The pattern 5a has a line width A1 (= 50 μm)
The two pattern portions 5a1 and 5a2 of the line pattern A2 (= 3
0 μm) and are arranged in parallel. The line spacing A2 (= 30 μm) in this case is 2 by the screen printing method.
The spacing is equal to or less than the line spacing at which the book wiring can be separately printed. The wiring having a line width of 50 μm is a line width that can be printed by the screen printing method.

Therefore, on the printed circuit board 1 obtained by screen printing using the above-mentioned printed pattern 5, a wiring pattern 3b having a line width of 50 μm corresponding to the pattern 5b and a wiring pattern having a line width of 130 μm corresponding to the pattern 5a. The pattern 3a is printed.

Immediately after printing, the wiring pattern 3a has two wiring patterns 3a1 and 3a2 having a line width of 50 μm, which correspond to the two pattern portions 5a1 and 5a2 of the pattern 5a in the printing pattern 5, and are arranged in parallel at a line interval of 30 μm. Will be things.

However, the wiring patterns 3a1 and 3a
Since the line interval of 30 μm of 2 is less than the line interval that can be separately printed by the screen printing method, the two wiring patterns 3a1 and 3a2 are connected with each other due to the spread due to the viscosity of the printing ink with the passage of time. ) Results in one pattern.

As shown in the conventional example, since the wiring pattern printed with a line width of 50 μm has a film thickness of 3 μm, the above 2
The wiring pattern 3a obtained by unifying the wiring patterns 3a1 and 3a2 has a line width of 130 μm and a film thickness of 3 μm. That is, the film thickness of each wiring pattern 3a, 3b formed by printing on the printed circuit board 1 is made substantially uniform regardless of the difference in line width.

Therefore, each bump 2 on the semiconductor chip 1 side
As shown in FIG. 1 (D), a and 2b are butted against corresponding wiring patterns 3a and 3b on the printed circuit board 4 side, and are temporarily pressure-bonded, and are connected and fixed by heating and melting. As a result, the semiconductor chip 1 is mounted on the printed circuit board 4.
Will be implemented.

[0021]

As described above, according to the semiconductor component mounting method of the present invention, the bumps formed on the electrodes of the semiconductor component are formed into the corresponding wiring patterns made of the conductive ink printed on the printed circuit board. When abutting and electrically connecting a semiconductor component to the printed circuit board, the wiring pattern with the widest line width of the printed circuit board side wiring pattern should be separated by a distance not exceeding the minimum distance that can be separated by printing. Since the wiring patterns of two conductive inks having a narrow width are printed in parallel at a distance from each other, a wiring pattern formed by printing two wiring patterns in parallel is a time-lapse pattern. At the same time, they are connected by spreading due to the viscosity of the printing ink to form a single wiring pattern, and the film thickness is reduced so that semiconductor components can be printed without misalignment or crushing of the printing ink. It can be accurately mounted on a circuit board.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing a step of a semiconductor component mounting method according to an embodiment of the present invention.

FIG. 2 is a diagram schematically showing a step of a conventional semiconductor component mounting method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor chip 2a, 2b bumps 3a, 3b wiring pattern 3a1, 3a2 narrow line width / narrow interval wiring pattern 4 printed circuit board 4a insulating substrate

Claims (1)

[Claims] 1. A semiconductor for bumping bumps formed on electrodes of a semiconductor component to a corresponding wiring pattern made of conductive ink printed on a printed circuit board to electrically connect the semiconductor component to the printed circuit board. In the mounting method of components, a wiring pattern having a wide line width of a wiring pattern on the printed circuit board side is separated by two conductive lines having a narrow width and a narrow space with a space equal to or smaller than a minimum limit space for separating the lines by printing. A method for mounting a semiconductor component, which is formed by printing ink wiring patterns in parallel.