JPH05827B2 - - Google Patents
Info
- Publication number
- JPH05827B2 JPH05827B2 JP63167057A JP16705788A JPH05827B2 JP H05827 B2 JPH05827 B2 JP H05827B2 JP 63167057 A JP63167057 A JP 63167057A JP 16705788 A JP16705788 A JP 16705788A JP H05827 B2 JPH05827 B2 JP H05827B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- container
- connecting body
- thermal expansion
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012212 insulator Substances 0.000 claims description 29
- 238000005219 brazing Methods 0.000 claims description 13
- 229910000833 kovar Inorganic materials 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000035882 stress Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000005336 cracking Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705788A JPH0218879A (ja) | 1988-07-05 | 1988-07-05 | ハーメチック端子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16705788A JPH0218879A (ja) | 1988-07-05 | 1988-07-05 | ハーメチック端子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0218879A JPH0218879A (ja) | 1990-01-23 |
| JPH05827B2 true JPH05827B2 (el) | 1993-01-06 |
Family
ID=15842602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16705788A Granted JPH0218879A (ja) | 1988-07-05 | 1988-07-05 | ハーメチック端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0218879A (el) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2596301Y2 (ja) * | 1991-06-28 | 1999-06-14 | サンデン株式会社 | 流体圧縮機 |
| US5447415A (en) * | 1992-06-29 | 1995-09-05 | Sanden Corporation | Motor driven fluid compressor within hermetic housing |
| CN102959657B (zh) * | 2010-06-28 | 2016-05-18 | 康姆艾德公司 | 真空电容器 |
| JP6383213B2 (ja) * | 2014-08-05 | 2018-08-29 | ショット日本株式会社 | 弾性緩衝機能を有する気密端子 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56119270U (el) * | 1980-02-13 | 1981-09-11 | ||
| JPS5984771U (ja) * | 1983-04-18 | 1984-06-08 | 株式会社 フジ電科 | コ−ルドウエルドタイプフラツトパツケ−ジの端子構造 |
-
1988
- 1988-07-05 JP JP16705788A patent/JPH0218879A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0218879A (ja) | 1990-01-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |