JPH0582714A - Bypass capacitor-built in ic - Google Patents
Bypass capacitor-built in icInfo
- Publication number
- JPH0582714A JPH0582714A JP3239403A JP23940391A JPH0582714A JP H0582714 A JPH0582714 A JP H0582714A JP 3239403 A JP3239403 A JP 3239403A JP 23940391 A JP23940391 A JP 23940391A JP H0582714 A JPH0582714 A JP H0582714A
- Authority
- JP
- Japan
- Prior art keywords
- bypass capacitor
- internal
- built
- pattern
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Amplifiers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣの内部構成に係わ
り、特に高周波ノイズ除去用バイパスコンデンサを内蔵
してなるＩＣに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an internal structure of an IC, and more particularly to an IC having a bypass capacitor for removing high frequency noise.
【０００２】[0002]
【従来の技術】従来、ＩＣを基板に実装する場合、直流
電源に含まれている高周波ノイズを除去すべく、ＩＣ各
々に対するバイパスコンデンサは半田付け等によって、
ＩＣとは別個にその近傍の電源ライン上に実装されてい
るのが実情である。2. Description of the Related Art Conventionally, when an IC is mounted on a board, a bypass capacitor for each IC is soldered or the like in order to remove high frequency noise contained in a DC power supply.
In reality, it is mounted separately from the IC on the power supply line in the vicinity thereof.
【０００３】[0003]
【発明が解決しようとする課題】以上のように、これま
でにあっては、ＩＣ各々での誤動作を防止すべく、ＩＣ
近傍にはバイパスコンデンサが実装されているわけであ
るが、基板上に実装されるＩＣの数が多くなる程にバイ
パスコンデンサが多く要され、その実装作業量の増加は
否めないばかりか、バイパスコンデンサの実装数や半田
接点数の増加によって、実装基板全体としての信頼性が
いきおい劣化されるものとなっている。本発明の目的
は、バイパスコンデンサがＩＣとともに基板上に実装さ
れるに際し、バイパスコンデンサ各々の基板への個別実
装が不要とされたバイパスコンデンサ内蔵ＩＣを供する
にある。As described above, as described above, in order to prevent malfunction of each IC,
Although bypass capacitors are mounted in the vicinity, more bypass capacitors are required as the number of ICs mounted on the board increases, and it is unavoidable that the amount of mounting work will increase and that bypass capacitors will not be denied. Due to the increase in the number of mounted boards and the number of solder contacts, the reliability of the mounting board as a whole is deteriorated. An object of the present invention is to provide an IC with a built-in bypass capacitor that does not require individual mounting of each bypass capacitor on the substrate when the bypass capacitor is mounted on the substrate together with the IC.
【０００４】[0004]
【課題を解決するための手段】上記目的は、ＩＣにチッ
プコンデンサをバイパスコンデンサとして内蔵せしめる
ことで達成される。The above object can be achieved by incorporating a chip capacitor in the IC as a bypass capacitor.
【０００５】[0005]
【作用】ＩＣ本体内のＶｃｃ−ＧＮＤ間にチップコンデ
ンサが挿入されるべく、ＩＣ本体内にチップコンデンサ
をバイパスコンデンサとして内蔵せしめる場合は、その
ＩＣの基板への実装は、取りも直さずバイパスコンデン
サの基板への同時実装を意味するところとなるものであ
る。When the chip capacitor is built in the IC body as a bypass capacitor so that the chip capacitor is inserted between Vcc and GND in the IC body, the IC is mounted on the substrate without repairing it. This means simultaneous mounting on the board.
【０００６】[0006]
【実施例】以下、本発明を図１，図２により説明する。
図１は本発明によるそのバイパスコンデンサ内蔵ＩＣの
一例での一部分解斜視状態の概略を、また、図２
（ａ），（ｂ）はそれぞれそのバイパスコンデンサ内蔵
ＩＣの一部平面、正面（各種入出力信号ピンや電源関係
ピンは図示省略）を示したものである。これによる場
合、ＩＣ本体２（２ａ，２ｂ）にはいわゆるＩＣチップ
（図示せず）が適当な態様で内蔵されており、そのＩＣ
チップへの電源は内部Ｖccパタ−ン４および内部GNDパ
タ−ン５を介し供給されるものとなっている。内部Ｖcc
パタ−ン４はＶcc供給ピン（図示せず）に、また、内部
GNDパタ−ン５はGNDピン３に電気的に接続されているわ
けであるが、ＩＣチップとそのＩＣ外部との間では各種
信号が入出力信号ピン６，７を介し授受されるものとな
っている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to FIGS.
FIG. 1 is a partially exploded perspective view of an example of an IC with a bypass capacitor according to the present invention, and FIG.
(A) and (b) respectively show a partial plan view and front view (various input / output signal pins and power supply related pins are omitted) of the bypass capacitor built-in IC. In this case, a so-called IC chip (not shown) is built in the IC body 2 (2a, 2b) in an appropriate manner.
The power to the chip is supplied via the internal Vcc pattern 4 and the internal GND pattern 5. Internal Vcc
The pattern 4 is connected to the Vcc supply pin (not shown) and internally.
The GND pattern 5 is electrically connected to the GND pin 3, but various signals are exchanged between the IC chip and the outside of the IC via the input / output signal pins 6 and 7. ing.
【０００７】さて、ＩＣチップは内部Ｖccパタ−ン４お
よび内部GNDパタ−ン５を介し供給される電源によって
動作しているが、その電源中に高周波ノイズが混入され
ている場合には、その所期の動作を期待し得なくなり誤
動作することは明らかである。このため、これまでにあ
ってはバイパスコンデンサがそのＩＣ近傍に実装されて
いたものであるが、本発明ではそのバイパスコンデンサ
をＩＣ本体２内に予め内蔵せしめるように構成したもの
である。図１に示すように、内部Ｖccパタ−ン４、内部
GNDパタ−ン５間にはチップコンデンサ１が接続されて
いるが、これを以てバイパスコンデンサとして機能せし
めようというものである。このように、ＩＣにバイパス
コンデンサを予め内蔵せしめておく場合は、ＩＣの基板
上への実装は即バイパスコンデンサの実装もが同時に達
成されるものである。Now, the IC chip is operated by the power source supplied through the internal Vcc pattern 4 and the internal GND pattern 5, but if high frequency noise is mixed in the power source, It is obvious that the desired behavior cannot be expected and malfunctions. Therefore, the bypass capacitor has been mounted in the vicinity of the IC so far, but in the present invention, the bypass capacitor is configured to be built in the IC body 2 in advance. As shown in FIG. 1, internal Vcc pattern 4, internal
The chip capacitor 1 is connected between the GND patterns 5 and is intended to function as a bypass capacitor. In this way, when the IC has a built-in bypass capacitor in advance, mounting of the IC on the substrate can be achieved immediately by mounting the bypass capacitor.
【０００８】[0008]
【発明の効果】以上説明したように、請求項１によれ
ば、バイパスコンデンサがＩＣとともに基板上に実装さ
れるに際し、バイパスコンデンサ各々の基板への個別実
装が不要とされる結果、実装基板全体としての信頼性が
図られることになる。As described above, according to the first aspect, when the bypass capacitor is mounted on the substrate together with the IC, it is not necessary to individually mount each bypass capacitor on the substrate, and as a result, the entire mounting substrate is mounted. Reliability will be achieved.
【図１】図１は、本発明によるそのバイパスコンデンサ
内蔵ＩＣの一例での分解斜視状態を概略として示す図FIG. 1 is a diagram schematically showing an exploded perspective view of an example of an IC with a bypass capacitor according to the present invention.
【図２】図２（ａ），（ｂ）は、それぞれそのバイパス
コンデンサ内蔵ＩＣの一部平面、正面を示す図2 (a) and 2 (b) are views showing a partial plan view and front view of an IC with a bypass capacitor, respectively.
１…チップコンデンサ、２（２ａ，２ｂ）…ＩＣ本体、
３…GNDピン、４…内部Ｖccパタ−ン、５…内部GNDパタ
−ン，６，７…入出力信号ピン1 ... Chip capacitor, 2 (2a, 2b) ... IC body,
3 ... GND pin, 4 ... Internal Vcc pattern, 5 ... Internal GND pattern, 6, 7 ... Input / output signal pin
Claims (1)
として内蔵してなる構成のバイパスコンデンサ内蔵Ｉ
Ｃ。1. A bypass capacitor built-in I having a structure in which a chip capacitor is built in as a bypass capacitor.
C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3239403A JPH0582714A (en) | 1991-09-19 | 1991-09-19 | Bypass capacitor-built in ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3239403A JPH0582714A (en) | 1991-09-19 | 1991-09-19 | Bypass capacitor-built in ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0582714A true JPH0582714A (en) | 1993-04-02 |
Family
ID=17044258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3239403A Pending JPH0582714A (en) | 1991-09-19 | 1991-09-19 | Bypass capacitor-built in ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0582714A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6873035B2 (en) | 2000-12-15 | 2005-03-29 | Renesas Technology Corp. | Semiconductor device having capacitors for reducing power source noise |
-
1991
- 1991-09-19 JP JP3239403A patent/JPH0582714A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6873035B2 (en) | 2000-12-15 | 2005-03-29 | Renesas Technology Corp. | Semiconductor device having capacitors for reducing power source noise |
| US7233065B2 (en) | 2000-12-15 | 2007-06-19 | Renesas Technology Corp. | Semiconductor device having capacitors for reducing power source noise |
| US7319268B2 (en) | 2000-12-15 | 2008-01-15 | Renesas Technology Corp | Semiconductor device having capacitors for reducing power source noise |
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