JPH0582688A - Semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To flexibly respond to request for modification of a heat radiating fin in a semiconductor integrated circuit device. CONSTITUTION:A heat radiating fin 15 placed on a heat diffusing plate 2 of a semiconductor integrated circuit device is pressed toward the heat diffusing plate 2 with a tensile force a spring 16 provided between the lower surface of an overhang part 15a of the heat radiating fin 15 and a wiring board 13 for the purpose of removable loading thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit device technique, and more particularly to a technique effective when applied to a semiconductor integrated circuit device requiring a radiation fin.

[0002]

2. Description of the Related Art Recently, in semiconductor integrated circuit devices,
High integration of elements, upsizing of semiconductor chips, and speeding up of circuit operation are being promoted.

Since the amount of heat generated by the semiconductor chip during circuit operation tends to increase accordingly, how to efficiently dissipate the heat generated in the semiconductor chip to the outside is becoming an increasingly important technique.

As a heat dissipation structure of a conventional semiconductor integrated circuit device, a structure using a heat dissipation fin is most often used. The reason is that the structure is simple and the cost is low.

The conventional radiation fin is made of a metal having a high thermal conductivity such as aluminum (Al), and is usually joined to the upper surface of the package body by caulking or an adhesive.

Regarding the conventional heat dissipation technology for semiconductor integrated circuit devices, for example, Press Journal Co., Ltd., issued on July 20, 1990, "Monthly Semiconductor World, August 1990" P11.
1 to P113, a low thermal resistance technology of a semiconductor integrated circuit device having a radiation fin and its trend are explained.

[0007]

However, the inventor of the present invention has found that the above-mentioned conventional technique for joining the radiation fin on the package body has the following problems.

First, there is a problem regarding a request for changing the radiation fin. The product is usually provided with heat radiation fins bonded on the package body. The provided product is mounted on a wiring board and incorporated into a device such as a large computer.

At this time, conventionally, the size of the wiring board housing portion, the direction of the cooling air, etc. are different depending on the type of the device incorporating the wiring board. Sometimes it was necessary to do so.

In the past, however, the heat radiation fin was joined to the package body by caulking, adhesive or the like and could not be removed, so that there was a problem that such a change request could not be flexibly dealt with.

The second problem is the heating temperature when the package body is mounted on the wiring board by soldering.

Conventionally, when the package body to which the heat radiation fins are joined and the package body to which the heat radiation fins are not joined are solder-mounted on the wiring board, they are usually soldered at the same time.

The package bodies can be mounted separately, but if this is done, the heating process and the inspection process will be duplicated, the manufacturing time will increase, and the yield and reliability of the products will decrease.

However, conventionally, the package body to which the radiation fins are joined has a large heat capacity, and the heating temperature at the time of solder mounting has to be increased, whereas the package body to which the radiation fins are not joined is not so much. Since it is not necessary to raise the heating temperature, there is a problem that it is difficult to set the heating temperature when these package bodies are simultaneously solder-mounted.

For example, if the heating temperature is set high in accordance with the side having the heat radiation fin during the solder mounting, the heat at that time destroys the semiconductor integrated circuit without the heat radiation fin, and the yield and reliability of the product are increased. It becomes difficult to secure the sex. On the other hand, if the heating temperature at the time of solder mounting is set low according to the one without the heat radiation fin, the heating time must be lengthened, and it takes time to manufacture the product, which causes a problem.

Third, there is a problem relating to the mounting density of the package body mounted on the wiring board.

There is a type in which some of the heat radiation fins project from the side of the package body. This is because the area of the radiating fins is increased and the heat radiating characteristics are improved by providing the protruding portions on a part of the radiating fins.

However, conventionally, when the heat radiation fin having the projecting portion is used, the mounting area of the package body is increased by the amount corresponding to the projecting portion, and there is a problem that the mounting density of electronic components that can be mounted on the wiring board is reduced. It was

The reason is that other electronic parts cannot be mounted below the projecting portion of the radiation fin. This is due to the following reasons, for example.

First, below the protruding portion of the radiation fin,
This is because when the solder is mounted, it becomes a shadow of the overhanging portion and a sufficient amount of heat cannot be secured, so that good solder mounting cannot be performed.

Below the projecting portion of the radiation fin,
This is because the overhang portion interferes with the inspection after solder mounting, and the inspection is difficult.

Further, when a failure occurs in the package body or the like mounted below the projecting portion of the heat radiation fin, the package body is joined to the heat radiation fin because the heat radiation fin and the package body are joined when the defective product is removed. Also has to be removed, which makes the replacement work complicated and
This is because the product yield and reliability are reduced.

Fourth, there is a problem relating to the adhesive strength of the adhesive layer when the heat dissipating fin and the package body are adhered by an adhesive.

The heat radiation fin and the package body usually have different coefficients of thermal expansion due to the difference in their constituent materials. Therefore, the heat generated during the circuit operation applies a stress due to the difference in thermal expansion to the adhesive layer that bonds the heat radiation fin and the package body.

However, heretofore, sufficient consideration has not been given to the stress caused by the difference in thermal expansion, and the adhesive layer is deteriorated by the stress applied to the adhesive layer for bonding the radiation fin and the package body, and the bonding There was a problem of reduced strength.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a technique capable of flexibly responding to a request for changing a radiation fin.

Another object of the present invention is to provide a technique capable of facilitating a process for simultaneously mounting a package body requiring a radiation fin and a package body not requiring a radiation fin on a wiring board. To provide.

Another object of the present invention is to provide a technique capable of mounting another electronic component below the protruding portion of the heat radiation fin.

Another object of the present invention is to provide a technique capable of absorbing the stress caused by the difference in thermal expansion between the radiation fin and the package body.

The above and other objects and novel features of the present invention will be apparent from the description of the specification and the accompanying drawings.

[0031]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, the invention according to claim 1 provides a semiconductor integrated circuit device structure in which a heat radiation fin is detachably mounted by an elastic member on the upper surface of the package body for sealing the semiconductor chip.

According to a second aspect of the present invention, the elastic member has a semiconductor integrated circuit device structure made of a shape memory alloy.

According to a third aspect of the present invention, there is provided a semiconductor integrated circuit device structure in which a heat conductive material is interposed between surfaces of the package body and the heat radiation fin which face each other.

[0035]

According to the invention described in claim 1, since the radiation fin can be attached and detached, it is possible to change the radiation fin at any time according to the demand.

When the package body is mounted on the wiring board, the heat capacity can be reduced by heating with the radiation fins removed, so that the heating temperature during mounting can be lowered. ..

When the package body requiring the heat radiation fins and other electronic components not requiring the heat radiation fins are simultaneously mounted on the wiring board, the heat radiation temperature can be increased by heating with the heat radiation fins removed. It becomes possible to easily set.

Even when the heat radiation fin has a projecting portion, when the package body is mounted on the wiring board, heating is performed with the heat radiation fin removed, so that a shadow is formed at a portion below the projecting portion during mounting. Since it does not occur, it is possible to satisfactorily mount other electronic components below the projecting portion.

Even when the heat radiation fin has a projecting portion, when inspecting the package body after the mounting process,
By removing the heat radiation fins, it becomes possible to easily inspect other electronic components mounted below the protruding portion of the heat radiation fins, and also to inspect the package body. It will be possible.

When another electronic component mounted below the protruding portion of the radiation fin fails, the defective electronic component is replaced after the radiation fin is removed.
It becomes possible to easily replace the defective electronic component.

Further, since the heat radiation fin and the package body are not fixed but only pressed by the elastic member, it is possible to absorb the stress caused by the thermal expansion difference between the heat radiation fin and the package body. Become.

According to the second aspect of the present invention, the shape is stored in the elastic member so that the heat radiation fin and the package body are in good contact with each other due to the heat generated during the operation of the semiconductor integrated circuit device. By keeping
It is possible to improve heat dissipation characteristics.

According to the invention described in claim 3, the contact thermal resistance between the package body and the radiation fin can be reduced, and the variation of the radiation characteristic due to the attachment and detachment of the radiation fin can be suppressed. ..

[0044]

Embodiment 1 FIG. 1 is a cross-sectional view of a semiconductor integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a semiconductor device mounted on a wiring board.
5 is a side view of the semiconductor integrated circuit device of FIG. 1 and other electronic components that do not require a radiation fin, FIGS. 3 and 4 are side views of the semiconductor integrated circuit device of FIG. 1 and other electronic components during the mounting process, and FIGS. 7 is a side view of the semiconductor integrated circuit device of FIG. 1 and other electronic components during the process of replacing the defective electronic component.

The semiconductor integrated circuit device of the first embodiment shown in FIG. 1 is, for example, a PGA (Pin Grid Array) 1.

The heat diffusion plate 2 constituting the PGA 1 is made of, for example, copper (Cu), and its surface is subjected to an oxidation treatment.

A convex portion 2a protruding downward in FIG. 1 is formed at the center of the lower surface of the heat diffusion plate 2, and the semiconductor chip 3 has its main surface downward in FIG. 1 on the lower surface of the convex portion 2a. It is joined in the state of facing.

The semiconductor chip 3 is made of, for example, silicon (S
i) A semiconductor integrated circuit such as a CMOS gate array which operates at high speed is formed on the main surface side of the single crystal.

On the other hand, the convex portion 2a is formed on the lower surface of the heat diffusion plate 2.
A package substrate 4 is installed on the outer periphery of the so as to surround the semiconductor chip 3. An opening 4a is opened in the center of the package substrate 4, and the opening 4a is fitted in the convex portion 2a.

The package substrate 4 is made of, for example, glass epoxy resin or bismaleimide triazine (BT) resin, and its upper surface is bonded to the heat diffusion plate 2 by an adhesive layer 5 made of, for example, silicone rubber.

An adhesive layer 6a is formed on the lower surface of the package substrate 4.
The frame body 7 is adhered by.

A cap 8 is adhered to the lower surface of the frame body 7 by an adhesive layer 6b. The semiconductor chip 3 is thus hermetically sealed.

On the lower surface of the package substrate 4, wiring 9 made of, for example, Cu is formed in a pattern. In addition, inner layer wiring (not shown) is also provided inside the package substrate 4.
Are patterned.

One end of the wiring 9 has a bonding wire 10
Is electrically connected to the semiconductor integrated circuit of the semiconductor chip 3 through. The other end of the wiring 9 and the inner layer wiring are
It is electrically connected to the lead pin 11.

The lead pin 11 is made of, for example, Kovar, is inserted into each of a plurality of through holes 12 penetrating the upper and lower surfaces of the package substrate 4, and is joined to the package substrate 4. The exposed surface of the lead pin 11 is coated with, for example, solder made of lead (Pb) / tin (Sn).

Further, the lead pin 11 is inserted into the through hole 14 of the wiring board 13, so that the PG
A1 is mounted on the wiring board 13.

The wiring board 13 is made of, for example, glass epoxy resin or BT resin, and although not shown, wiring is patterned on its upper and lower surfaces and inside.

The heat diffusion plate 2, the package substrate 4, the frame 7, the cap 8 and the lead pins 11 constitute a package body of the PGA 1 of the first embodiment.

By the way, in the first embodiment, the heat radiation fins 15 and the springs (elastic members) 16 are provided on the upper surface of the heat diffusion plate 2.
It is removably attached by. Therefore, the PGA 1 according to the first embodiment can flexibly meet a request for changing the heat radiation fin 15.

The radiating fin 15 is made of, for example, aluminum (Al), and an overhanging portion 15a is formed in a part thereof.

The spring 16 is arranged between the lower surface of the projecting portion 15 a of the heat radiation fin 15 and the upper surface of the wiring board 13. The adhesion between the heat radiation fin 15 and the heat diffusion plate 2 is ensured by the tension of the spring 16. The spring 16
Is made of ordinary metal.

The spring 16 can be attached and detached from the upper surface side of the radiation fin 15. The surface of the spring 16 is subjected to an oxidation treatment from the viewpoint of preventing a short circuit failure of the lead pin 11 or a lead pin of another electronic component described later.

A heat-conducting grease (heat-conducting material) 17, for example, is interposed between the opposing surfaces of the heat radiation fin 15 and the heat diffusion plate 2. As a result, the contact thermal resistance between the radiation fin 15 and the heat diffusion plate 2 can be reduced, and the variation of the radiation characteristics due to the attachment / detachment of the radiation fin 15 can be suppressed.

Next, FIG. 2 shows a state in which the PGA 1 of the first embodiment and other electronic components that do not require the heat radiation fins 15 are mounted on the wiring board 13.

On the wiring board 13, the PGA 1 and, for example, SOJ (S
mall Outline J-lead Package) 18 and DIP (Dual
In-line Package) 19 is implemented.

The SOJ 18 and the DIP 19 are mounted below the projecting portion 15a of the radiation fin 15. Therefore, it is possible to improve the packaging density.

The lead 18a of the SOJ 18 is formed in a J shape, and is connected to the land (not shown) of the wiring board 13 and the P.
They are joined and electrically connected by a solder made of b / Sn or the like.

The lead pins 19a of the DIP 19 are inserted into through holes (not shown in FIG. 2) of the wiring board 13 and are electrically connected to the wiring on the wiring board 13 or inside.

Next, a method of mounting such PGA1, SOJ18 and DIP19 will be described with reference to FIGS.

First, as shown in FIG.
(See Fig. 1) PGA1 and SOJ18 removed,
The DIP 19 and the DIP 19 are arranged on the wiring board 13.

The PGA 1 and the DIP 19 are wiring boards 1
Lead pin 1 in through hole 3 (not shown in FIG. 3)
1 and 19a are placed on the wiring board 13 in the inserted state.

The SOJ 18 has its lead 18a.
And the land on the wiring board 13 are temporarily fixed by the cream solder applied on the land.

Subsequently, P is applied by, for example, infrared heat treatment.
GA1, SOJ18, DIP19 wiring board 13
Solder on at the same time.

At this time, in the first embodiment, PGA1
Since the radiating fin 15 (see FIG. 1) is not attached to, the heat capacity can be reduced and the heating temperature during solder mounting can be set low. Therefore, it becomes easy to set the heating temperature during solder mounting.

Further, since the radiation fin 15 (see FIG. 1) is not attached to the PGA 1, there is no shadow in the area below the projecting portion 15a of the radiation fin 15 during solder mounting. Therefore, the projecting portion 15 of the radiation fin 15
SOJ18 and D placed at the bottom of a
It is possible to satisfactorily solder the IP19.

After that, PGA1, SOJ18 and DI
Check P19. At this time, in the first embodiment,
Since the radiating fin 15 (see FIG. 1) is not attached to the PGA 1, the SOJ 18 and the DIP 1 mounted on the portion below the protruding portion 15a of the radiating fin 15 are mounted.
Inspection of 9 becomes easy. For the same reason, PG
The inspection of A1 itself becomes easy.

After the inspection, as shown in FIG. 4, the heat diffusion plate 2
Thermally conductive grease 17 is applied on top. Subsequently, after placing the radiation fins 15 on the heat diffusion plate 2, as shown in FIG. 1, the springs 16 are attached to the radiation fins 15 and the radiation fins 15 are detachably attached.

Next, taking the case where the DIP 19 is broken as an example, the replacement work of the failed electronic parts will be described with reference to FIGS. In addition, in FIG. 5 to FIG.
It shows with a mark.

First, as shown in FIG.
After removing the, as shown in FIG.
Remove 9.

Subsequently, as shown in FIG. 7, after mounting a new DIP 19 having no failure on the wiring board 13, a thermal conductive grease 17 is applied on the heat diffusion plate 2, and as shown in FIG. After mounting the radiation fin 15 on the heat diffusion plate, the radiation fin 15 is detachably mounted by the spring 16.

Conventionally, when an electronic component below the protruding portion of the radiation fin fails, the package body must be removed when the defective electronic component is removed because the radiation fin and the package body are joined together. There wasn't.

In the case of the PGA 1 of the first embodiment, the radiation fin 15 can be removed, so that it is not necessary to remove the PGA 1 itself. Therefore, the replacement work of the defective electronic component is easy, and the yield and reliability of the products due to the replacement work of the defective electronic component are not deteriorated.

As described above, according to the first embodiment, the following effects can be obtained.

(1). Since the radiation fins 15 are detachably attached to the upper surface of the heat diffusion plate 2 by the springs 16, the radiation fins 15 can be detached, so that the radiation fins 15 can be changed at any time according to a request. That is, the radiation fin 15
It becomes possible to flexibly respond to the change request.

(2). PGA1 requiring the radiation fin 15
And SOJ 18 and D that do not require the radiation fin 15.
When mounting the IP 19 and the wiring board 13 on the wiring board 13 at the same time, the heating temperature can be lowered when the PGA 1 requiring the radiation fins 15 is mounted by heating with the radiation fins 15 removed. It is possible to easily set the heating temperature of.

(3). Due to the above (2), PGA1 that requires the radiation fin 15 and S that does not require the radiation fin 15.
It is possible to prevent a reduction in product yield and reliability, or an increase in manufacturing time due to difficulty in setting a heating temperature when the OJ 18 and the DIP 19 are simultaneously mounted on the wiring board 13.

(4). PGA1 requiring the radiation fin 15
And SOJ 18 and D that do not require the radiation fin 15.
When the IP 19 and the IP board 19 are simultaneously mounted on the wiring board 13, by heating with the radiation fin 15 removed, a shadow does not occur at a portion below the overhang portion 15a of the radiation fin 15 during solder mounting. 15a
SOJ18 and DI placed below
P19 can be satisfactorily mounted by soldering.

(5). With the radiation fin 15 removed,
By performing the inspection after the solder mounting, the SO mounted on the portion below the protruding portion 15a of the heat radiation fin 15 is mounted.
The inspection of J18 and DIP19 can be facilitated, and the inspection of PGA1 itself can also be facilitated.

(6). If the DIP 19 below the overhanging portion 15a of the radiating fin 15 fails, only the radiating fin 15 needs to be removed when the defective item is replaced.
It becomes possible to facilitate the replacement work of the defective product. Further, it becomes possible to prevent the yield and the reliability from being deteriorated due to the defective item replacement work.

(7). From the above (4) to (6), the radiation fin 1
The SOJ 18 and the DIP 1 are also provided below the protruding portion 15a of
9 can be mounted, so that the mounting density of electronic components that can be mounted on the wiring board 13 can be improved.

(8). The radiation fin 15 and the heat diffusion plate 2 are
Since it is only pressed by the spring 16 and is not fixed, it is possible to absorb the stress caused by the difference in thermal expansion between the radiation fin 15 and the heat diffusion plate 2.

(9). Since the heat conductive grease 17 is interposed between the opposing surfaces of the heat radiation fin 15 and the heat diffusion plate 2, the contact heat resistance between the heat radiation fin 15 and the heat diffusion plate 2 is reduced. In addition, it is possible to suppress fluctuations in heat radiation characteristics due to attachment / detachment of heat radiation fins. As a result, it becomes possible to provide highly reliable PGA1.

[0093]

Second Embodiment FIG. 8 is a side view of a semiconductor integrated circuit device which is another embodiment of the present invention.

As shown in FIG. 8, a through hole 20 is formed in the projecting portion 15a of the radiation fin 15. Further, the wiring board 13 is also provided with a through hole 21.

Bolts 22 are inserted into the through holes 20 and 21. A male screw is formed at the tip of the bolt 22 and a nut 23 is attached. That is, the radiation fin 15 is detachable.

In the second embodiment, the spring 16 is interposed between the nut 23 and the lower surface of the wiring board 13, so that the heat radiation fin 15 and the heat diffusion plate 2 are firmly attached to each other. Has been done.

Therefore, in the second embodiment, it is possible to obtain the same effect as that of the first embodiment.

[0098]

Third Embodiment FIG. 9 is a side view of a semiconductor integrated circuit device which is another embodiment of the present invention.

As shown in FIG. 9, on the wiring board 13,
QFP (semiconductor integrated circuit device) 24 and a plurality of PGAs
1 is implemented.

Radiating fin 1 of PGA1 and QFP24
All of 5 are in contact with each other through the heat conductive grease 17.

A pressing plate 25 is placed on the radiation fins 15. The holding plate 25 is made of a metal having a good thermal conductivity, such as Al, and holds down the heat radiation fins 15. That is, also in the third embodiment, the radiating fins 15 are only pressed by the holding plate 25 and are not joined and fixed.

Further, the holding plate 25 is detachable by means of bolts 22 and nuts 23. Therefore,
Also in the third embodiment, the radiation fin 15 is detachable.

The force with which the pressing plate 25 presses the radiating fins 15 is set by the springs 16 interposed between the lower surface of the wiring board 13 and the nuts 23, whereby the radiating fins 15 and the package body 26 are separated from each other. Adhesion is secured.

Therefore, also in the third embodiment, the same effect as that of the first embodiment can be obtained.

[0105]

Fourth Embodiment FIG. 10 is a side view of a semiconductor integrated circuit device according to another embodiment of the present invention.

As shown in FIG. 10, in the fourth embodiment, the radiation fin 15 is pressed by the plate-shaped spring 16. Radiating fin 15 and package body 26
The close contact with is secured by the spring 16.

The spring 16 is made of metal having good heat conductivity and is attached to the lower surface of the fixed plate 27. Fixed plate 2
At both ends of 7, stoppers 27a are supported rotatably in the directions shown by the arrows in FIG.

The fixing portion 27 is detachably attached to the wiring board 13 by a stopper 27a. That is, also in the fourth embodiment, the radiation fin 15 is removable.

Therefore, in the fourth embodiment, it is possible to obtain the same effect as that of the first embodiment.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-mentioned Embodiments 1 to 4 and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

For example, in the first embodiment, the case where the radiation fin having the projecting portion is used has been described, but the present invention is not limited to this, and another radiation fin having no projecting portion may be used. ..

Further, in the first and second embodiments, the case where the present invention is applied to the PGA of the plastic package substrate has been described, but the present invention is not limited to this, and the present invention is also applied to the PGA of the ceramic package, for example. it can.

Further, in the above-mentioned first to fourth embodiments, the spring is explained as a normal metal, but the present invention is not limited to this, and the spring may be made of a shape memory alloy, for example. In this case, the heat radiation characteristic can be improved by memorizing the shape so that the contact between the spring and the package body is improved by the heat during the circuit operation, so that the semiconductor integrated circuit device with high reliability can be improved. Can be provided.

At this time, by interposing a heat conductive grease between the heat radiation fin and the package body,
It is also possible to reduce the contact thermal resistance between the members and suppress the fluctuation of the heat radiation characteristics.

[0115]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

(1). That is, according to the invention described in claim 1, since the radiation fin can be attached and detached, the radiation fin can be changed at any time in accordance with the demand. That is, it becomes possible to flexibly respond to a request for changing the radiation fin.

Further, when the package body requiring the radiation fins and the other electronic components not requiring the radiation fins are simultaneously mounted on the wiring board, the radiation fins are heated in a state where the radiation fins are removed, so that the radiation fins are removed. Since the required heating temperature at the time of mounting the package body can be lowered, it becomes possible to easily set the heating temperature at the time of mounting.

Even if another electronic component is mounted below the projecting portion of the heat radiating fin, no trouble occurs in the mounting process, inspection and failure replacement work. Therefore, since another electronic component can be mounted below the protruding portion of the heat radiation fin, it is possible to improve the mounting density of the electronic component that can be mounted on the wiring board.

Further, since the heat radiation fin and the package body are only pressed by the spring but not fixed, it is possible to absorb the stress caused by the difference in thermal expansion between the heat radiation fin and the package body. ..

(2) According to the second aspect of the invention, for example, the heat radiation fins and the package body are brought into good contact with each other by the heat generated during the operation of the semiconductor integrated circuit device.
By memorizing the shape of the spring, it is possible to improve the heat dissipation characteristics, so that it is possible to provide a highly reliable semiconductor integrated circuit device.

(3) According to the invention described in claim 3, the contact thermal resistance between the package body and the radiation fin can be reduced, and the fluctuation of the radiation characteristic due to the attachment / detachment of the radiation fin can be suppressed. Therefore, it is possible to provide a highly reliable semiconductor integrated circuit device.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor integrated circuit device that is an embodiment of the present invention.

FIG. 2 is a side view of the semiconductor integrated circuit device of FIG. 1 mounted on a wiring board and another electronic component that does not require a radiation fin.

FIG. 3 is a side view of the semiconductor integrated circuit device and other electronic components of FIG. 1 during a mounting process.

FIG. 4 is a side view of the semiconductor integrated circuit device and other electronic components of FIG. 1 during a mounting process.

5 is a side view of the semiconductor integrated circuit device of FIG. 1 and other electronic components during a process of replacing a defective electronic component.

FIG. 6 is a side view of the semiconductor integrated circuit device of FIG. 1 and other electronic components during the process of replacing the defective electronic component.

FIG. 7 is a side view of the semiconductor integrated circuit device of FIG. 1 and other electronic components during the process of replacing the defective electronic component.

FIG. 8 is a side view of a semiconductor integrated circuit device according to another embodiment of the present invention.

FIG. 9 is a side view of a semiconductor integrated circuit device which is another embodiment of the present invention.

FIG. 10 is a side view of a semiconductor integrated circuit device which is another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 PGA (semiconductor integrated circuit device) 2 thermal diffusion plate 2a convex part 3 semiconductor chip 4 package substrate 4a opening 5 adhesive layer 6a adhesive layer 6b adhesive layer 7 frame 8 cap 9 wiring 10 bonding wire 11 lead pin 12 through hole 13 wiring Substrate 14 Through Hole 15 Radiating Fin 15a Overhanging Part 16 Spring (Elastic Member) 17 Thermal Conductive Grease (Heat Conductive Material) 18 SOJ 18a Lead 19 DIP 19a Lead Pin 20 Through Hole 21 Through Hole 22 Bolt 23 Nut 24 QFP (Semiconductor Integrated) Circuit device) 25 Presser plate 26 Package body 27 Fixing plate 27a Stopper

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Miwa 2326 Imai, Ome-shi, Tokyo Hitachi, Ltd. Device Development Center (72) Inventor Yoshiyuki Shirai 2326 Imai, Ome, Tokyo Hitachi, Ltd. Device development Inside the center (72) Inventor Toshihiro Tsuboi 5-20-1, Josuihoncho, Kodaira-shi, Tokyo Inside Hitsuritsu Cho-LS Engineering Co., Ltd. (72) Inventor Hiroshi Ozaku, 5 Mizumizuhoncho, Kodaira-shi, Tokyo Chome No. 20-1 Hitate Super LSI Engineering Co., Ltd.

Claims (3)

[Claims] 1. A semiconductor integrated circuit device, wherein a heat radiation fin is detachably attached by an elastic member on the upper surface of a package body for sealing a semiconductor chip. 2. The semiconductor integrated circuit device according to claim 1, wherein the elastic member is made of a shape memory alloy. 3. The semiconductor integrated circuit device according to claim 1, wherein a heat conductive material is interposed between the opposing surfaces of the package body and the heat radiation fin.