JP2003069187A - Board connection supporting tool for electronic component mount board and method for connecting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable surface mounting while maintaining the quality of an electronic component mount board without exposing the mount board to a heat process, and also fabrication of an electronic component package or the like having a high reliability. SOLUTION: A board connection supporting tool is an adaptor socket 101 which supports a system-in-package 12 and is electrically connected to a mother board 27. The supporting tool comprises a supporting section main body 11 having a predetermined shape to support the system-in-package 12, a plurality of top face terminals 19 which are provided on one surface of the supporting section main body 11 and are connected to terminal electrodes 13 of the system- in-package 12, and a plurality of bottom face terminals 20 which are provided on the other surface of the supporting section main body 11 and are connected to the top face terminals 19. After the bottom face terminals 20 of the supporting section main body 11 are thermally bonded to the mother board 27, the system-in-package 12 is connected to the top face terminals 19 by non- thermocompression bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a board connection support for electronic component mounting boards and a board connection method suitable for application to electronic component packages such as packages and multi-chip modules.

More specifically, a plurality of internal connection terminals are provided on one surface of a support body having a predetermined shape, and a plurality of external connection terminals connected to the internal connection terminals are provided on the other surface. , After thermally bonding the external connection terminals of the support body to the mounting board, the electronic component mounting board is non-heat-pressed and connected to the internal connection terminals, so that the electronic component mounting board can be exposed without being exposed to a heat process. It is possible to perform surface mounting while maintaining quality, and to manufacture a highly reliable electronic component package or the like.

[0003]

2. Description of the Related Art In recent years, with the development of multimedia, a multifunctional and high-performance mobile phone, a mobile terminal device, an information processing device, and the like are often used. In particular, since the mobile terminal device is required to be smaller and lighter,
Many electronic components must be mounted in a limited space.

These electronic components include not only semiconductor integrated circuit chips, but also passive components such as capacitors and resistors, and are used as electronic component packages such as system-in-packages and multi-chip modules for circuits in mobile terminal devices. It is designed to be mounted on a board.

FIG. 15 is a sectional view showing a structural example of a multi-chip module 50 according to the first conventional example. Figure 1
6 is a sectional view showing the mounting example. The multi-chip module 50 shown in FIG. 15 has a module substrate 1. A wiring pattern 2 is provided on the module substrate 1, and a plurality of semiconductor integrated circuit chips 5 and the like are attached as electronic components. The semiconductor integrated circuit chip 5 is wire-bonded (conductively connected) to the wiring pattern 2 by a gold wire 6. In addition to the semiconductor integrated circuit chip 5, passive components 7 such as capacitors and resistors may be attached to the module substrate 1 by soldering or conductive paste.

A plurality of external leads 3 are joined to predetermined positions of the wiring pattern 2. A resin member 4 for a package is formed into a predetermined shape so as to cover all of the module board 1 and electronic components and a part of the external leads 3. An epoxy resin or the like is usually used for the resin member 4.

This type of multi-chip module 50
According to the mounting method of (1), soldering is usually performed on the mounted substrate (hereinafter referred to as a mother board) 8 shown in FIG. The mother board 8 is provided with a plurality of circuit patterns 9 such as connection pads, and
The external leads 3 of the chip module 50 are soldered and their conductive connection is made.

FIG. 17 is a sectional view showing a structural example of a system-in-package 80 according to the second conventional example. Figure 1
8 is a cross-sectional view showing the mounting example. The system-in-package 80 shown in FIG. 17 has a package substrate (multilayer substrate) 81 made of an organic substrate (glass epoxy substrate or the like) or a ceramic substrate. A wiring pattern (not shown) is provided on the package substrate 81, and a plurality of semiconductor integrated circuit chip scale packages (hereinafter referred to as CSP) 82 and the like are attached as electronic components.
The CSP 82 is mounted on the wiring pattern by the flip chip method with the solder 84 and is electrically connected.

In addition to the CSP 82, passive components 83 such as capacitors and resistors are mounted on the package substrate 81 by soldering. On each CSP 82, one heat spreader (radiating plate) 87 is commonly used as the epoxy adhesive 8
Bonded by 5. A connector socket 88 is attached to the lower surface of the package board 81. The connector socket (for example, male type) 88 is electrically connected to the wiring pattern at a predetermined position on the upper surface of the package substrate 81, for example, by through-hole plating.

This kind of system-in-package 80
According to the mounting method of, the connector socket (female type) 89 is usually used for the motherboard 8 shown in FIG. Connector socket 89 on the motherboard 8
Is provided, and the socket 89 is connected to a circuit pattern (not shown) of the motherboard 8. The connector socket 88 of the package board 81 is inserted into the connector socket 89 of the mother board 8 and electrically connected.

[0011]

The mounting method of the electronic component mounting board according to the conventional example has the following problems. In the case of the multi-chip module 50, the method of mounting and mounting the external leads 3 by soldering them directly to the motherboard 8 shown in FIG. 16 is employed. This method is a multi-chip module 50
Is performed when the temperature load during solder reflow cannot be withstood. In the case where it can withstand a temperature load sufficiently, a wire bonding method using a gold wire or the like is used for connecting the semiconductor integrated circuit chip 5 inside the IC package and the external lead 3, and even when exposed to a heat process at the time of reflow. This is a case where the joint portion does not melt by heat.

However, in the multi-chip module 50, passive components 7 such as capacitors and resistors are provided inside the package in addition to the semiconductor integrated circuit chip 5, and these are electrically connected by soldering. Therefore, the temperature load during reflow cannot be endured.

Therefore, a method of mounting and mounting the external leads 3 by directly soldering them manually is adopted. However, when the semiconductor integrated circuit is further miniaturized and highly functionalized, the number of terminals of the external leads 3 increases, Since the terminal pitch is narrowed, a solder bridge or the like is likely to occur in the method of directly soldering by hand, and it becomes more difficult to join the solder. Also, the mounting area is increased.

As described above, in the first conventional example, the solder reflow process is made difficult, and it is unavoidable to rely on the mounting method using the connector sockets 88 and 89 as shown in FIG.

System-in-Package 80 In the system-in-package 80, a method of mounting on the motherboard 8 by using connector sockets 88 and 89 as shown in FIG. 18 is adopted. In this method, the connector sockets 88 and 89 are expensive.

Further, the weight, capacity, and
Due to its large size, connector sockets 88, 8
Therefore, it is difficult to maintain the reliability of the connector sockets 88 and 89 due to distortion or the like. Incidentally, a method of designing the connector sockets 88 and 89 to be large can be considered, but as a result, the terminal pitch becomes large.

Therefore, the present invention is to solve the above-mentioned conventional problems, and is not exposed to a thermal process.
To provide a board connection support and a board connection method for an electronic component mounting board, which enables surface mounting while maintaining the quality of the electronic component mounting board and can manufacture a highly reliable electronic component package and the like. With the goal.

[0018]

SUMMARY OF THE INVENTION The above-mentioned problem is a board connection support for electrically connecting and supporting an electronic component mounting board having a plurality of terminal electrodes to a mounting target board. A supporting portion main body having a predetermined shape for supporting, a plurality of internal connection terminals provided on one surface of the supporting portion main body and connected to the terminal electrodes of the electronic component mounting board, and the supporting portion main body. The plurality of external connection terminals provided on the other surface and connected to the internal connection terminals are provided, and after the external connection terminals of the support body are thermally bonded to the mounting board, the electronic component mounting board is connected to the internal connection terminals. It is solved by a board connection support for electronic component mounting boards, which is characterized in that it is connected by non-heat compression bonding.

According to the board connection support for an electronic component mounting board of the present invention, when the electronic component mounting board having a plurality of terminal electrodes is electrically connected to the mounting target board, the outside of the supporting portion main body is used. After the connection terminal is thermally bonded to the mounting board, the electronic component mounting board is connected to the internal connection terminal by non-heat compression bonding.

Therefore, it is possible to carry out the surface mounting through the board connecting support while maintaining the quality of the electronic component mounting board without being exposed to the heat process. This allows
System-in-package, which is difficult to surface mount by reflow method, and electronic parts package such as multi-chip module, can be easily surface-mounted while maintaining high quality by using the board connection support tool. Become.

The board connection method according to the present invention is a method for supporting an electronic component mounting board having a plurality of terminal electrodes and electrically connecting the electronic component mounting board to the mounted board, and connecting the electronic component mounted board to the mounted board. To form a board connection support for pre-supporting, a step of joining the board connection support to the mounted board by applying heat, and an electronic component to the board connection support that is thermally bonded to the mounted board. And a step of connecting the mounting substrate by non-heat bonding.

According to the board connecting method of the present invention, when the electronic component mounting board having a plurality of terminal electrodes is electrically connected to the mounting board, the external connection terminals of the support body are mounted on the mounting board. After thermal bonding, the electronic component mounting board is non-heat-pressed and connected to the internal connection terminals.

Therefore, it is possible to carry out the surface mounting through the board connecting support while maintaining the quality of the electronic component mounting board without being exposed to the heat process. This allows
System-in-package, which is difficult to surface mount by reflow method, and electronic parts package such as multi-chip module, can be easily surface-mounted while maintaining high quality by using the board connection support tool. Become.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of a board connecting support for electronic component mounting boards and a board connecting method according to the present invention will be described with reference to the drawings. (1) Embodiment FIG. 1 is a partially crushed sectional view showing a configuration example of a board connection support tool 100 for an electronic component mounting board as an embodiment according to the present invention. In this embodiment, one surface of the support body having a predetermined shape is provided with a plurality of internal connection terminals, and the other surface is provided with a plurality of external connection terminals connected to the internal connection terminals. After thermally bonding the external connection terminals of the support body to the board to be mounted, the electronic component mounting board is non-heat-bonded and connected to its internal connection terminals, maintaining the quality of the electronic component mounting board without applying any heat. In addition to being able to be surface-mounted as it is, a highly reliable electronic component package or the like can be manufactured.

The board connecting support 100 for an electronic component mounting board shown in FIG. 1 supports an electronic component mounting board 12 having a plurality of terminal electrodes 13 and electrically connects it to a mounted board 27. The board connection support device 100 has a box-shaped support portion main body 11 and supports the electronic component mounting board 12. The support body 11 has an opening 11A at the top.
The electronic component mounting board 12 is housed so as to be dropped. The opening 11A has a size such that the electronic component mounting board 12 can be attached and detached. The support portion main body 11 is configured to include, for example, a frame body 21 and a bottom plate portion 18. A double-sided board or a multilayer board is used for the bottom plate portion 18.

In this example, a lid 26 for closing the opening 11A of the support portion main body 11 is provided, and the lid body 26 is locked to the support portion main body 11 by a locking member 33, and electronic parts are mounted. The substrate 12 is pressed against the bottom of the support body 11. Of course, through holes 26 </ b> A through which the locking members 33 are inserted are provided at the four corners of the lid body 26. The holding member 25 may be sandwiched between the lid 26 and the top plate portion of the electronic component mounting board 12. Electronic component mounting board 1
Regarding 2, the target is one in which a plurality of terminal electrodes 13 and electronic components 15 are mounted at predetermined positions. The electronic component mounting board 12 has an electronic component 15 mounted on one surface.

A plurality of internal connection terminals 19 are provided on one surface of the support body 11, that is, the bottom of the box-shaped support body 11.
Are provided and connected to the terminal electrodes 13 of the electronic component mounting board 12. A plurality of protrusions 22 for positioning are provided on the inner surface of the support body 11, and the internal connection terminals 19 are provided.
And the terminal electrode 13 can be aligned in a self-aligned manner. The other surface of the support portion main body 11, that is,
A plurality of external connection terminals 20 are provided on the back surface of the substrate connection support tool 100, and are connected to the internal connection terminals 19 described above. The external connection terminal 20 and the internal connection terminal 19 are electrically connected to each other by through-hole plating or the like on the double-sided board or the multi-layer board that constitutes the bottom plate portion 18.

In this embodiment, after the external connection terminals 20 of the supporting portion main body 11 are thermally bonded to the mounting board 27, the electronic component mounting board 12 is not heat-pressed and the internal connection terminals 19 are connected.
Connected to. This is because the electronic component mounting board 12 is surface-mounted with the board connection support tool 100 interposed while maintaining the quality.

The terminal electrodes 13 of the electronic component mounting board 12
An anisotropic conductive member 24 is provided between the internal connection terminal 19 of the support portion main body 11 and the internal connection terminal 19. Conductive member 24
Anisotropic conductive rubber, anisotropic conductive sheet, or the like is used for. The electrically conductive member 24 has a property that electrically conductive particles are mixed in an insulative object, the insulative property is maintained in a non-pressurized state, and a portion to which pressure is applied exhibits electrical conductivity.

By sandwiching the anisotropic conductive member 24, the terminal electrode 1 of the electronic component mounting board 12 can be treated without applying heat.
3 and the internal connection terminal 19 of the support body 11 can be electrically connected. At the time of mounting, even after mounting and assembling, the terminal electrodes 13 of the electronic component mounting board 12 and the internal connection terminals 1 of the support body 11
Since 9 is connected by anisotropic conductive rubber or the like, no stress strain is generated in the connecting portion.

Next, a substrate connecting method as an embodiment according to the present invention will be described. 2 and 3 are process diagrams showing an assembly example (Nos. 1 and 2) of the board connection support tool 100. In this embodiment, the board connection support 100 is prepared in advance, and the electronic component mounting board 1 having a plurality of terminal electrodes 13 is provided.
It is premised that the substrate 2 is supported by the substrate connecting support 100 to be electrically connected to the mounted substrate 27.

Under these assembling conditions, the substrate connecting support 100 as shown in FIG. 2A is formed in advance. The support portion main body 11 is formed in a box shape, and an opening portion 11A having a size capable of accommodating the electronic component mounting board 12 is secured in the upper portion thereof. The support portion main body 11 is configured to include, for example, a frame body 21 defining the opening 11A and a bottom plate portion 18 thereof. A double-sided board or a multilayer board is used for the bottom plate portion 18.

A plurality of internal connection terminals 19 connected to the terminal electrodes 13 of the electronic component mounting board 12 are formed on one surface of the bottom plate portion 18 of the support portion main body 11. The bottom plate 18
A plurality of external connection terminals 20 are formed on the other surface of the. The external connection terminal 20 and the internal connection terminal 19 are electrically connected by through-hole plating or the like. Solder bumps are formed on the external connection terminals 20. As a result, the board connection support tool 100 is completed.

Thereafter, the side on which the solder bumps are formed is aligned so as to face the mounted substrate 27. Figure 2B
The external connection terminal 20 and the mounted substrate 27 are joined by applying heat to the substrate connection support 100 shown in FIG. Then, the electronic component mounting board 12 is connected to the board connection support 100 shown in FIG. At this time, the electronic component mounting board 1
2 of the terminal electrode 13 and the internal connection terminal 19 of the support body 11
An anisotropic conductive member 24 is sandwiched between and.

After that, the lid 26 is attached to the upper portion of the support portion main body 11 shown in FIG. 3B. Opening 1 of support body 11
This is to block 1A. At this time, the holding member 25 may be sandwiched between the lid body 26 and the top plate portion of the electronic component mounting board 12. Then, the lid 26 is locked to the support body 11 by the locking member 33, and the electronic component mounting board 12 is pressed against the bottom of the support body 11. As a result, the mounting of the electronic component mounting board 12 on the board connecting support 100 is completed without applying any heat.

As described above, according to the board connecting support 100 and the board connecting method for an electronic part mounting board according to the embodiment of the present invention, the electronic part mounting board 12 having a plurality of terminal electrodes 13 is mounted. In the case of electrically connecting to the board 27, after the external connection terminals 20 of the supporting portion main body 11 are thermally bonded to the mounting board 27, the electronic component mounting board 12 is connected to the internal connection terminals 19 thereof by non-heat compression bonding. It is a thing.

Therefore, the surface mounting can be performed with the board connecting support 100 interposed while maintaining the quality of the electronic component mounting board 12 without applying any heat. As a result, the system that is difficult to surface mount by the reflow method
By using the board connecting support 100, an electronic package such as an in-package or a multi-chip module can be easily surface-mounted while maintaining high quality. Therefore, a highly reliable electronic component package can be provided. In addition, the electronic component mounting board 12 can be provided at a low cost as compared with the case where the electronic component mounting board 12 is mounted via the conventional connector / socket.

(2) First Embodiment FIG. 4 is a perspective view showing a configuration example of an adapter socket 101 for mounting an electronic component package as a first embodiment according to the present invention. FIG. 5 is a top view showing a configuration example of the support portion main body 11. In this embodiment, an adapter socket 101 for mounting an electronic component package, which is an example of a board connection support, is formed, has conductive electrode terminals on the upper and lower surfaces of the adapter substrate, and is an example of an electronic component mounting board. It has a support portion main body 11 capable of receiving the system-in-package 12 which becomes, and further, a notch 22 which is an example of a positioning projection portion is formed integrally with the frame body 21.

The adapter socket 101 shown in FIG. 4 is suitable for application to surface solder mounting, and has a plurality of terminal electrodes 13.
The system-in-package 12 having the above is supported and electrically connected to a mother board 27 which is an example of a mounted substrate. The adapter socket 101 has a box-shaped support body 11, and is adapted to support the system-in-package 12. The support portion main body 11 has an opening 11A at the top, and is accommodated so that the entire system-in-package 12 is dropped.

The opening 11A has such a size that the system-in-package 12 can be attached and detached. The support portion main body 11 is configured to include, for example, a frame body 21 and an adapter substrate 18 that is an example of a bottom plate portion.
The frame body 21 has a size capable of receiving the system-in-package 12. A double-sided board or a multilayer board is used as the adapter board 18.

In this example, a holding plate 26, which is an example of a lid, is provided to close the opening 11A of the support body 11.
The restraining plate 26 is locked to the supporting portion main body 11 with a screw 33 which is an example of a locking member, and presses the system-in-package 12 against the bottom portion of the supporting portion main body 11. Of course, through-holes 26A for passing the screws 33 are provided at the four corners of the pressing plate 26. It is advisable to sandwich a holding sheet 25, which is an example of a holding member, between the holding plate 26 and the top plate portion of the system-in-package 12.

A plurality of upper surface terminals 19 as an example of the internal connection terminals 19 are provided on one surface of the support portion main body 11, that is, the upper surface of the adapter substrate 18, and the terminal electrodes 13 of the system-in-package 12 are provided. Connected to. The terminal electrodes 13 are external terminals of the system-in-package 12, and although not shown in this example, 9 × 9 = 81 terminal electrodes 13 are arranged in a matrix in the vertical and horizontal directions. The shape of the terminal electrode 13 is a ball terminal (BGA)
Or a land terminal (LGA). In order to receive the matrix-shaped terminal electrodes 13, 9 × 9 = 81 upper surface terminals 19 are also arranged in matrix in the vertical and horizontal directions as shown in FIG.

A plurality of positioning notches 22 are provided on the inner side surface of the frame body 21 of the support portion main body 11 so that the upper surface terminals 19 and the terminal electrodes 13 can be aligned in a self-aligned manner. . The notches 22 are provided at one place for each inner piece of the frame body 21 in total, and each notch 22 is integrally shaped with the frame body 21. Further, screw holes 23 for fastening are provided at the upper four corners of the frame body 21. The frame 21 is integrally molded with the adapter board 18 by a transfer molding method or the like in a state where the positions such as the outer shape and the inner method are accurately secured by the positioning holes provided in the adapter board 18 in advance. It

As for the system-in-package 12, as shown in FIG. 6, a plurality of terminal electrodes 13 are provided at predetermined positions.
And an integrated circuit chip scale as an example of an electronic component
A package (hereinafter referred to as CSP15) mounted is a target. The CSP 15 is soldered to the circuit board of the system-in-package 12. The electronic components include passive components 16 such as capacitors and resistors in addition to the CSP 15.

These passive components 16 are also conductively connected to the wiring pattern of the circuit board of the system-in-package 12. A double-sided board or a multilayer board is used as this circuit board, and an organic board such as a glass epoxy board or a ceramic board is usually used. The system-in-package 12 includes a CSP 15 and a passive component 16 mounted on one side.

In the system-in-package 12, the exterior molding resin 14 is covered on the electronic component mounting surface side to protect the CSP 15 and the passive components 16. Regarding the method of forming this protective member, there are cases where it is integrally molded by a transfer molding method, a printing molding method, or the like, and it is sometimes covered with a protective member as a cover case.

On the other surface of the supporting portion main body 11 shown in FIG. 6, that is, on the back surface of the adapter substrate 18, a lower surface terminal 20 which is an example of an external connection terminal is provided and is connected to the upper surface terminal 19 described above. It Bottom terminal 20 and top terminal 19
Are electrically connected to each other by through-hole plating or the like in a double-sided board or a multi-layer board that constitutes the adapter board 18.

An organic substrate such as a glass epoxy substrate, a polyimide substrate, an aramid substrate or a ceramic substrate is used for the adapter substrate 18, and any material can be used as long as it can withstand the temperature of the reflow method. The upper surface terminals 19 and the lower surface terminals 20 have the same terminal arrangement as the terminal electrodes 13 of the system-in-package 12 and the same spacing and spacing.

In this example, the lower surface terminals 20 are arranged in a matrix on the rear surface of the adapter substrate 18. Since the array of the lower surface terminals 20 can be arranged in a matrix on the back surface of the adapter socket 101, the mounting area can be further reduced.

In this embodiment, the supporting portion main body 1 shown in FIG.
After the lower surface terminal 20 of No. 1 is thermally bonded to the mother board 27, the system-in-package 12 is non-heat-pressed and connected to the upper surface terminal 19. This is because surface mounting is performed with the adapter socket 101 interposed while maintaining the quality of the system-in-package 12.

An anisotropic conductive member 24 as shown in FIG. 6 is sandwiched between the terminal electrode 13 of the system-in-package 12 and the upper surface terminal 19 of the supporting portion main body 11. An anisotropic conductive rubber, an anisotropic conductive sheet, or the like is used for the conductive member 24. The electrically conductive member 24 has a property that electrically conductive particles are mixed in an insulative object, the insulative property is maintained in a non-pressurized state, and a portion to which pressure is applied exhibits electrical conductivity.

By sandwiching this anisotropic conductive member 24, the terminal electrode 13 of the system-in-package 12 and the upper surface terminal 19 of the support body 11 can be electrically connected.
System-in-package 12 during mounting and after mounting
Since the terminal electrode 13 and the upper surface terminal 19 of the support portion main body 11 are connected by anisotropic conductive rubber or the like, no stress strain is generated in the connection portion.

The mother board 27 is an example of the mounted substrate. The connection pads 28 are conductively connected to the adapter board 18 of the circuit patterns formed on the motherboard 27. Naturally, the connection pad 28 and the lower surface terminal 20 of the adapter socket 101 have the same arrangement and the same space dimension.

Next, a substrate connecting method as a first embodiment according to the present invention will be described. 7A and 7B are process diagrams showing an example of assembling the adapter socket 101 for an electronic component package. In this embodiment, an adapter socket 101 as shown in FIG. 5 is prepared in advance, and a system-in-package 12 having a plurality of ball-shaped (BGA-shaped) terminal electrodes 13 is supported by this adapter socket 101. It is premised that the motherboard 27 is electrically connected to the motherboard 27.

As shown in FIG. 5, the adapter socket 101 has a support portion main body 11 formed in a box-shaped body, and an opening portion 11A having a size capable of accommodating the system-in-package 12 is secured in the upper portion thereof. It The support portion main body 11 is configured to include, for example, a frame body 21 that defines the opening portion 11A and the adapter substrate 18.

A plurality of upper surface terminals 19 connected to the terminal electrodes 13 of the system-in-package 12 are formed on one surface of the adapter substrate 18 of the support body 11. A plurality of lower surface terminals 20 are provided on the other surface of the adapter board 18.
To form. The connection between the upper surface terminal 19 and the lower surface terminal 20 of the adapter substrate 18 is made by conducting through-hole plating for both the organic substrate and the ceramic substrate. The electrode structures of the upper surface terminal 19 and the lower surface terminal 20 are preferably convex.

In order to obtain such an electrode structure, leadless solder or conductive paste is used for both the upper surface terminal 19 and the lower surface terminal 20, and the electrodes are formed in a convex shape by a screen printing method.
Alternatively, only the upper surface terminal 19 may be formed by a screen printing method using a conductive paste, and the lower surface terminal 20 may be formed by a leadless solder ball by a mounting method. As a result, the adapter socket 101 is completed.

Assuming that such an adapter socket 101 is prepared, surface mounting is first performed on the motherboard 27 by the reflow method in FIG. 7A. For example, an appropriate amount of solder is applied to the connection pad 28 of the mother board 27 by screen printing, and then the connection pad 28 and the lower surface terminal 20 are aligned by a mounting mount machine.

Further, the adapter socket 101 is mounted on the upper surface of the motherboard 27, and then the motherboard 27 with the adapter socket is put in a reflow furnace to melt and join the solder. At this time, other electronic mechanical components mounted on the mother board 27 can be mixedly mounted. Also,
When using lead-less solder, it is usually necessary to set the reflow temperature higher than when using eutectic solder (6: 4 solder). At this point, electronic parts are mounted on the adapter socket 101. Not working, so you can proceed without worrying about the temperature.

Then, after the adapter socket 101 is surface-mounted on the mother board 27, the system-in-package 12 is connected to the adapter socket 101 shown in FIG. At this time, the system in
An anisotropic conductive member 24 is sandwiched between the terminal electrode 13 of the package 12 and the upper surface terminal 19 of the support body 11. An anisotropic conductive rubber, an anisotropic conductive sheet, or the like is used for the conductive member 24.

At this time, the conductive member 24 is inserted into the frame body 21 and brought into contact with the upper surface terminals 19 of the adapter board 18. After that, the system-in-package 12 is guided to the frame body 2 by using the positioning notch 22 as a guide in a predetermined position direction.
Insert into 1. As a result, the terminal electrode 13 of the system-in-package 12 and the upper surface terminal 1 of the adapter substrate 18 are
9 is positioned automatically by sandwiching the anisotropic conductive member 24.

After that, the restraining sheet 25 having elasticity is inserted into the frame body 21. System in Package 12
This is to protect the top plate part of the. Further, the pressing plate 26 is covered from above, and the pressing plate 26 and the frame 21
The screw holes 23 are fastened and fixed. This is for closing the opening 11A of the support body 11.

As a result, the system-in-package 1
2 is pressed against the bottom of the adapter socket 101. At this time, the total size of the height dimension of the frame body 21 and the anisotropic conductive member 24, the system-in-package 12, the restraining sheet 25 and the elastic reduction amount of the anisotropic conductive member 24 and the restraining sheet 25 are The upper surface terminal 19 of the adapter substrate 18 and the terminal electrode 1 of the system-in-package 12
3 and 3 are set so as to be well conducted through the anisotropic conductive member 24.

As described above, according to the adapter socket 101 and the board connecting method thereof as the first embodiment of the present invention, the system-in-package 12 having the plurality of terminal electrodes 13 is electrically connected to the mother board 27. In this case, the lower surface terminal 20 of the support portion main body 11 is thermally bonded to the mother board 27, and then the system-in-package 12 is non-heat-pressed and connected to the upper surface terminal 19.

Therefore, without applying any heat, the adapter socket 1 is maintained while maintaining the quality of the system-in-package 12 which is difficult to surface mount by the reflow method.
01 can be used for surface mounting. Therefore,
It is possible to provide a highly reliable electronic component package such as a multi-chip module. Moreover, it can be provided at a lower cost than when the system-in-package 12 is mounted via the conventional connector socket.

In this embodiment, regarding the shape of the terminal electrode 13 of the system-in-package 12, a ball shape (B
The case of the GA shape) has been described, but the present invention is not limited to this and may be a land shape (LGA shape).
In the method of the present invention, the system-in-package 1
Since the method of directly mounting and soldering 2 on the motherboard 27 is not adopted, the accuracy of the coplanarity (flatness) of the terminal electrode 13 is also eased. Therefore, in terms of cost, it is preferable that the terminal electrode 13 has a land shape (LGA type), which is also an advantage of the method of the present invention.

(3) Second Embodiment FIG. 8 is a partially crushed sectional view showing an example of the structure of an adapter / socket 102 for an electronic component package according to a second embodiment of the present invention. FIG. 9 is a top view showing a configuration example of the support body 31. In this embodiment, an adapter for mounting an electronic component package, which is another example of the board connection support, is mounted.
The socket 102 is configured to change the arrangement pitch of the upper surface terminals 19 and the lower surface terminals 20 of the adapter board 38. Of course, the socket 102 is the support body 3 that can receive the system-in-package 12.
1, and a notch 22 which is an example of a protrusion for positioning is integrally formed with the frame body 21. It should be noted that those having the same names and the same reference numerals as those in the first embodiment have the same functions, and therefore their explanations are omitted.

The adapter socket 102 shown in FIG. 8 is suitable for application to surface solder mounting, and it has a plurality of terminal electrodes 13.
The system-in-package 12 having the above is supported and electrically connected to a mother board 27 which is an example of a mounted substrate. The adapter socket 102 has a box-shaped support body 31 and is adapted to support the system-in-package 12. The support portion main body 31 has an opening portion 31A in the upper portion and is accommodated so as to drop the entire system-in-package 12.

The opening 31A has such a size that the system-in-package 12 can be attached and detached. The support portion main body 31 is configured to include, for example, the frame body 21 and an adapter substrate 38 that is an example of a bottom plate portion.
The frame body 21 has a size capable of receiving the system-in-package 12. A double-sided board or a multilayer board is used as the adapter board 38.

In this example, a holding plate 26 is provided to close the opening 31A of the supporting portion main body 31, and the holding plate 26 is locked to the supporting portion main body 31 with a screw 33 and the system
The in-package 12 is pressed against the bottom of the support body 31. This restraint plate 26 and system
Holding sheet 25 between the top plate of the in-package 12
It is good to sandwich.

A plurality of upper surface terminals 19 are provided on one surface of the supporting portion main body 31, that is, the upper surface of the adapter substrate 38, and are connected to the terminal electrodes 13 of the system-in-package 12. The upper surface terminals 19 have the same terminal arrangement as the terminal electrodes 13 of the system-in-package 12 and the same arrangement and spacing.

The terminal electrodes 13 are external terminals of the system-in-package 12, and although not shown in this example, 8 × 8 = 64 terminal electrodes 13 are arranged in a matrix in the vertical and horizontal directions. . The shape of the terminal electrode 13 is either a ball terminal (BGA) or a land terminal (LGA). 8 × 8 = 64 upper surface terminals 19 are arranged in the vertical and horizontal directions so as to receive the matrix-shaped terminal electrodes 13.
Are also arranged in a matrix as shown in FIG.

When the arrangement pitch of the upper surface terminals 19 shown in FIG. 9 is p1 and the arrangement pitch of the lower surface terminals 20 connected to the connection pads 28 of the motherboard 27 as shown in FIG. The main body 31 has an arrangement pitch of p
2> p1. That is, in this embodiment, the arrangement pitch (terminal spacing) p2 of the lower surface terminals 20 is enlarged and converted by the adapter board 38 and arranged.

The reason why the terminal intervals are enlarged and converted by using the adapter substrate 38 is that the terminal electrodes 13 of the system-in-package 12 are arranged at a narrow interval (0.65 mm pitch or less). This is because the circuit pattern of the motherboard 27 requires a finer pattern, which makes the motherboard 27 more expensive and makes mounting the adapter socket 102 on the motherboard 27 more difficult.

The adapter substrate 38 can be formed of a double-sided copper foil substrate or the like when expanding and converting the terminal spacing, but if one double-sided substrate is not enough, it is formed of a multi-layered substrate. An organic substrate such as a glass epoxy substrate, a polyimide substrate, an aramid substrate, or a ceramic substrate is used for the adapter substrate 38, and any material can be used as long as it can withstand the temperature of the reflow method.

The adapter substrate 38 shown in FIG. 11 is, for example,
It is composed of an upper substrate 38A, an intermediate substrate 38B and a lower substrate 38C, and a double-sided and / or single-sided copper foil substrate is used for each substrate. In order to make the arrangement pitch different, the upper surface terminal 19 and the lower surface terminal 20 described above are electrically connected by through hole plating or the like formed on the intermediate substrate 38B.
In the intermediate board 38B, for example, the upper surface terminal 19 is connected,
The wiring pattern is extended laterally by receiving the through hole penetrating the upper substrate 38A. Then, it is connected to a through hole penetrating the lower substrate 38C to reach the lower terminal 20. Thereby, the terminal spacing can be expanded and converted on the adapter substrate 38.

In the support portion main body 31 shown in FIG.
Similar to the embodiment described above, a plurality of positioning notches 22 are provided on the inner side surface of the frame body 21 so that the upper surface terminals 19 and the terminal electrodes 13 can be aligned in a self-aligned manner. A screw hole 23 for fastening is provided in the upper portion of the frame body 21.

In this example, the adapter substrate 38 is provided with the positioning holes 35 in advance, and the positions such as the outer shape and the inner method are accurately secured. Further, the frame body 21 is provided with positioning pins 34. The frame body 21 is prepared by injection-molding epoxy resin or the like in advance. Further, when enhancing the heat dissipation effect, the frame body 21 is prepared by aluminum alloy die casting or the like.

After that, the positioning pins 34 of the frame 21 are inserted into the positioning holes 35 of the adapter board 38. At that time, an adhesive is applied to the surface to be joined and the surface to be joined. The adapter substrate 38 and the frame 21 are integrated by adhesion. At this time, the integration may be performed by inserting and fixing. By this joining, the support portion main body 31 as shown in FIG. 12 can be formed.

Next, a board connecting method as a second embodiment according to the present invention will be described. 13A and 13B are process sectional views showing an example of assembling the adapter socket 102. In this embodiment, an adapter socket 102 as shown in FIG. 12 is prepared in advance, and a plurality of ball shapes (B
It is assumed that the system-in-package 12 having the (GA-shaped) terminal electrode 13 is supported by the adapter socket 102 and electrically connected to the motherboard 27.

Assuming that such an adapter socket 102 is prepared, in FIG. 13A, surface mounting is first performed on the motherboard 27 by the reflow method.
For example, an appropriate amount of solder is applied to the connection pad 28 of the mother board 27 by screen printing, and then the connection pad 28 and the lower surface terminal 20 are aligned by a mounting mount machine.

Further, the adapter socket 102 is mounted on the upper surface of the motherboard 27, and then the motherboard 27 with the adapter socket is put in a reflow furnace and the solder is melted and joined. At this time, other electronic mechanical components mounted on the mother board 27 can be mixedly mounted. Also,
When using lead-less solder, it is usually necessary to set the reflow temperature higher than when using eutectic solder (6: 4 solder). At this point, electronic parts are mounted on the adapter socket 102. Therefore, the work can be proceeded without worrying about the temperature in the same manner as in the first embodiment.

Then, after the adapter socket 102 is surface-mounted on the motherboard 27, the system-in-package 12 is placed in the adapter socket 102 shown in FIG. 13B.
Are connected by non-heat pressure bonding. At this time, the anisotropic conductive member 24 is sandwiched between the terminal electrode 13 of the system-in-package 12 and the upper surface terminal 19 of the support body 31.
An anisotropic conductive rubber, an anisotropic conductive sheet, or the like is used for the conductive member 24.

At this time, the conductive member 24 is inserted into the frame body 21 and brought into contact with the upper surface terminals 19 of the adapter board 38. After that, the system-in-package 12 is guided to the frame body 2 by using the positioning notch 22 as a guide in a predetermined position direction.
Insert into 1. As a result, the terminal electrodes 13 of the system-in-package 12 and the upper surface terminals 1 of the adapter substrate 38 are
9 is positioned automatically by sandwiching the anisotropic conductive member 24. Since the subsequent steps are the same as those in the first embodiment, the description thereof will be omitted.

The system-in-package 12 is pressed against the bottom of the adapter socket 102. At this time, the height of the frame 21 and the anisotropic conductive member 24, the system-in-package 12, the restraining sheet 2
5, the anisotropic conductive member 24 and the restraining sheet 25
The elastic contraction amount is set so that the upper surface terminal 19 of the adapter substrate 38 and the terminal electrode 13 of the system-in-package 12 are well connected to each other through the anisotropic conductive member 24.

As described above, according to the adapter socket 102 and the board connecting method therefor according to the second embodiment of the present invention, the terminal arrangement and spacing of the electronic component package can be enlarged and converted by the adapter board 38 depending on the situation. ,
The degree of freedom in designing the motherboard 27 can be expanded, and the adapter socket 102 can be easily mounted.

Therefore, the system-in-package 12
It is possible to significantly reduce the defective mounting rate on the motherboard 27. Of course, as in the first embodiment, after the lower surface terminal 20 of the supporting portion main body 31 is thermally bonded to the mother board 27, the system-in-package 12 is unheated and pressure-bonded and connected to the upper surface terminal 19. It

As a result, similarly to the first embodiment,
It is possible to perform surface mounting through the adapter socket 102 while maintaining the quality of the system-in-package 12 which is difficult to be surface mounted by the reflow method, without applying any heat.

(4) Third Embodiment FIG. 14 is an assembly diagram showing a configuration example of an adapter socket 103 with a heat radiation function as a third embodiment according to the present invention. In this embodiment, a heat radiating means is attached to the upper part of a pressing plate 26 which is an example of a lid. It should be noted that those having the same names and the same reference numerals as those in the first embodiment have the same functions, and therefore their explanations are omitted.

The adapter socket 103 shown in FIG. 14 is suitable for application to surface solder mounting, and is particularly suitable for mounting the system-in-package 12 that requires heat dissipation. Also in this example, the adapter socket 10
Reference numeral 3 is for supporting the system-in-package 12 having a plurality of terminal electrodes 13 and electrically connecting it to a motherboard 27 (not shown).

The adapter socket 103 has a box-shaped support portion main body 11, and the system-in-package 1
It is designed to support 2. In this example, the support body 1
A fin 46 for heat dissipation (heat sink), which is an example of a heat dissipation means, is attached to an upper portion of the restraining plate 26 that covers 1 to dissipate the heat generated in the system-in-package 12 to the outside. The fins 46 are formed of aluminum or its alloy having good thermal conductivity. The fins 46 are formed in a comb shape to increase the surface area.

When the fins 46 for heat dissipation are used by being stacked on the holding plate 26, the conductive member 24,
After accommodating the system-in-package 12 and the restraining sheet 25 in order, the restraining plate 26 is covered, the heat radiation fins 46 are mounted thereon, and the screws 33 are collectively fastened. By adopting this adapter socket 103, the fins 46 for heat dissipation can be easily attached, and heat can be easily dissipated.

In this embodiment, the case where the fins 46 for heat dissipation are attached to the upper portion of the restraining plate 26 has been described, but the present invention is not limited to this, and it may be attached to the side surface of the support portion main body 11. Also, instead of the restraining plate 26, the fin 4
You may make it attach 6 also as a lid. In that case, the restraining sheet 25 is preferably made of a material having good thermal conductivity.

[0094]

As described above, according to the board connection support for electronic component mounting boards of the present invention, a plurality of internal connection terminals are provided on one surface of the support body having a predetermined shape. It is provided with a plurality of external connection terminals connected to this internal connection terminal on the other surface, and after the external connection terminals of the support body are thermally bonded to the mounting board, the electronic component mounting board It is formed by non-heating crimp connection to the connection terminal.

With this configuration, the electronic component mounting board can be surface-mounted while maintaining its quality with the board connection support interposed, without being exposed to a heating process.
As a result, system-in-package, which is difficult to surface mount by the reflow method, and electronic component packages such as multi-chip modules, can be easily surface-mounted while maintaining high quality by using the board connection support tool. become able to. Therefore, a highly reliable electronic component package can be provided. Moreover, the electronic component mounting board can be provided at a low cost as compared with the case where the electronic component mounting board is mounted via the conventional connector / socket.

According to the board connecting method of the present invention, when the electronic component mounting board having a plurality of terminal electrodes is supported and electrically connected to the mounted board, after the board connecting support is formed in advance. The board connection support is joined to the mounting board by applying heat to the mounting board, and the electronic component mounting board is connected to the board connecting support which is thermally joined to the mounting board by non-heat compression bonding.

With this structure, it is possible to perform surface mounting with the board connecting support interposed while maintaining the quality of the electronic component mounting board without being exposed to the heat process. Therefore, a highly reliable electronic component package can be manufactured. Moreover, the electronic component mounting board can be provided at a low cost as compared with the case where the electronic component mounting board is mounted via the conventional connector / socket. This invention is a system-in-package,
It is extremely suitable for application to electronic component packages such as multi-chip modules.

[Brief description of drawings]

FIG. 1 is a partially crushed cross-sectional view showing a configuration example of a board connection support tool 100 for an electronic component mounting board according to an embodiment of the present invention.

2A and 2B are process drawings showing an example (1) of assembling the substrate connection support tool 100. FIG.

3A and 3B are process diagrams showing an example (No. 2) of assembling the substrate connection support tool 100. FIG.

FIG. 4 is a perspective view showing a configuration example of an adapter socket 101 for mounting an electronic component package as the first embodiment according to the present invention.

FIG. 5 is a top view showing a configuration example of a support portion main body 11.

FIG. 6 is a partially crushed sectional view showing a configuration example of an adapter / socket 101 when an electronic component package is mounted.

7A and 7B are process cross-sectional views showing an example of assembling the adapter socket 101.

FIG. 8 is a partially crushed sectional view showing a configuration example of an adapter / socket 102 for an electronic component package as a second embodiment according to the present invention.

FIG. 9 is a top view showing a configuration example of a support body 31.

FIG. 10 is a rear view showing a configuration example of the lower surface terminal 20 of the adapter socket 102.

11 is a cross-sectional view taken along the arrow X1-X2 showing an example of the assembly configuration of the support portion main body 31 shown in FIG.

FIG. 12 is a front view showing an example of joining the support body 31.

13A and 13B are process cross-sectional views showing an example of assembling the adapter socket 102.

FIG. 14 is an assembly diagram showing a configuration example of an adapter socket 103 with a heat dissipation function as a third embodiment according to the present invention.

FIG. 15 is a cross-sectional view showing a configuration example of a multi-chip module 50 according to a first conventional example.

FIG. 16 is a cross-sectional view showing a mounting example of the multi-chip module 50.

FIG. 17 is a cross-sectional view showing a configuration example of a system-in-package 80 according to a second conventional example.

FIG. 18 is a cross-sectional view showing a mounting example of the system-in-package 80.

[Explanation of symbols]

11, 31, ... Support body, 12 ... System
In-package (electronic component mounting board), 13 ... Terminal electrode, 15 ... Chip system package (C
SP: Electronic component, 17,100 ... Adapter socket (board connection support tool), 18, 38 ... Adapter board (bottom plate part), 19 ... Top terminal (internal connection terminal),
20 ... Lower surface terminal (external connection terminal), 21 ... Frame body, 22 ... Notch (projection portion), 24 ... Conductive member, 26 ... Suppression plate (cover body), 46 ... .Fin for heat dissipation (heat dissipation means), 101, 102, 103 ... Adapter socket

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5E023 AA04 AA16 AA22 BB16 BB18                       BB21 CC26 DD26 FF01 HH23                 5E024 CA18 CA19 CB06                 5E336 AA04 AA09 BB01 CC32 CC43                       CC51 DD13 DD16 EE05 EE08                       EE17 GG01

Claims (17)

[Claims] 1. A board connection support for electrically connecting and supporting an electronic component mounting board having a plurality of terminal electrodes to a mounted substrate, the predetermined shape for supporting the electronic component mounting board. And a plurality of internal connection terminals that are provided on one surface of the support body and that are connected to terminal electrodes of the electronic component mounting board, and that are provided on the other surface of the support body. A plurality of external connection terminals connected to the internal connection terminals, wherein the electronic connection board is not heated to the internal connection terminals after the external connection terminals of the support body are thermally bonded to the mounting board. A board connection support tool for an electronic component mounting board, characterized by being crimped and connected. 2. The electronic component mounting board according to claim 1, further comprising an anisotropic conductive member between the terminal electrode of the electronic component mounting board and the internal connection terminal of the supporting portion main body. Board connection support. 3. The electronic component according to claim 1, wherein the support body has a box shape, and an opening is provided in an upper portion of the support body to accommodate the electronic component mounting board. Board connection support for mounting boards. 4. The board connection support tool for an electronic component mounting board according to claim 3, wherein a positioning projection is provided inside the support body. 5. A lid body for closing an opening of the support portion main body, wherein the lid body is locked to the support portion main body by a locking member, and the electronic component mounting board is attached to the support portion main body. The board connection support for electronic component mounting boards according to claim 4, which is pressed against the bottom. 6. The board connection support device for an electronic component mounting board according to claim 3, further comprising a heat dissipation means provided on a side surface of the support portion main body and / or an upper portion of the lid body. 7. When the arrangement pitch of the internal connection terminals of the support portion main body is p1 and the arrangement pitch of the external connection terminals of the support portion main body is p2, the arrangement pitch of the support portion main body is converted to p2> p1. The board connection support device for an electronic component mounting board according to claim 1. 8. The board connection support for an electronic component mounting board according to claim 1, wherein the external connection terminals are arranged in a matrix on the other surface of the support body. 9. A method of electrically connecting and supporting an electronic component mounting substrate having a plurality of terminal electrodes to a mounting substrate, wherein the electronic component mounting substrate is connected to and supported by the mounting substrate. Of pre-forming the board connection support of, the step of joining the board connection support by applying heat to the mounted substrate, the electronic component mounting board to the board connection support thermally bonded to the mounted board And a step of connecting by non-heat compression bonding. 10. A support body having a predetermined shape for supporting the electronic component mounting board is formed, and one surface of the support body is connected to a terminal electrode of the electronic component mounting board. A plurality of internal connection terminals are formed, a plurality of external connection terminals are formed on the other surface of the support portion main body, and the board connection support is formed by connecting the external connection terminals and the internal connection terminals. The board connection method according to claim 9, wherein: 11. The board connecting method according to claim 9, wherein an anisotropic conductive member is sandwiched between the terminal electrode of the electronic component mounting board and the internal connecting terminal of the supporting portion main body. 12. The board connecting method according to claim 9, wherein a box-shaped support portion main body having an opening in an upper portion is formed to accommodate the electronic component mounting board. 13. The board connecting method according to claim 12, wherein a protrusion for positioning is formed inside the support body. 14. A lid body for closing an opening of the box support body is formed in advance, the lid body is locked to the support body by a locking member, and the electronic component mounting board is attached to the support body. The board connecting method according to claim 12, wherein the board connecting method is performed by pressing the bottom of the board. 15. The heat dissipating means is attached to a side surface of the support portion main body and / or an upper portion of the lid body.
2. The board connecting method described in 2. 16. When the arrangement pitch of the internal connection terminals connected to the terminal electrodes of the electronic component mounting substrate is p1 and the arrangement pitch of the external connection terminals connected to the mounted substrate is p2, the supporting portion is provided. The board connecting method according to claim 9, wherein the arrangement pitch is converted to p2> p1 in the main body. 17. The substrate connecting method according to claim 9, wherein the external connection terminals are arranged in a matrix on the other surface of the support body.