JP2003069179A - Electronic component mounting board composite and method for assembling and mounting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mount electronic components in a high density on both side surfaces of an electronic component mounting board and to surface-mount an electronic component mounting board composite on the board to be mounted. SOLUTION: The electronic component mounting board composite comprises the electronic component mounting board 1 having a plurality of terminal electrodes 46 at predetermined positions and mounting a plurality of electronic components 18, a board connecting supporting implement 28 having a plurality of externally connecting terminals 32 on one side surface and having a plurality of internally connecting terminals 30, 31 connected to the terminals 32 on other side surface to support the electronic component mounting board 1, and an intermediate connector 37 having a plurality of through hole conducting electrodes 48 and provided between the board 1 and the implement 28. The connector 37 electrically connects a plurality of externally conductive terminals 27 of the board 1 to a plurality of internally connecting terminals 30, 31 of the implement 28 via the electrodes 48.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board composite suitable for application to a system-in-package in which semiconductor chips, IC packages, transistors, diode packages, passive components, etc. are mounted at high density, and a composite thereof. Assembling and mounting method.

More specifically, electronic component mounting boards and adapters
An intermediate connecting body is provided between the board connecting support tool such as a socket, and the electronic connecting board is electrically connected to the board connecting support tool by the intermediate connecting body, so that both sides of a predetermined board are electronically connected. In addition to being able to mount components, it is also possible to perform surface mounting on a mounted substrate.

[0003]

2. Description of the Related Art In recent years, with the development of multimedia, a multifunctional and high-performance mobile phone, a mobile terminal device, an information processing device, and the like are often used. In particular, since the mobile terminal device is required to be smaller and lighter,
Many electronic components must be mounted in a limited space.

These electronic components include not only semiconductor integrated circuit chips, but also passive components such as capacitors and resistors, and are used as electronic component packages such as system-in-packages and multi-chip modules for circuits in mobile terminal devices. It is designed to be mounted on a board. Electronic component single-sided mounting substrates are used as a method for mounting semiconductor integrated circuit chips at high density.

On this type of electronic component single-sided mounting substrate, a bare chip of a semiconductor integrated circuit is die-bonded to a desired substrate, the terminal electrodes and external connection terminals are connected by a wire bond method, and then a resin is used. There is a sealing type.

In addition to this type, there is an electronic component single-sided mounting substrate in which a stud bump is formed in advance on a bare chip of a semiconductor integrated circuit, and then an anisotropic conductive film is used to conduct conductive coupling to a desired substrate. . In this electronic component single-sided mounting substrate, an anisotropic conductive film is sandwiched between a stud bump and a substrate electrode, and this is thermocompression-bonded and cured to establish conduction. The substrate electrode is electrically connected to the pattern lead on the lower surface of the substrate through the conductive through hole in the substrate. An electronic component single-sided mounting substrate using a conductive adhesive instead of the anisotropic conductive film is also used.

In addition to these types, a single-sided mounting board for electronic components using a flip chip bonding method is also used. In the electronic component single-sided mounting board, solder bumps are formed on a semiconductor chip in advance, and after mounting the semiconductor chip on an electrode on a desired board, the solder bumps are heated and melted by a reflow method or the like to be conductively coupled. Then, the gap between the semiconductor chip and the substrate is bonded and cured. The electrodes on the substrate are previously electrically connected to the pattern leads on the lower surface of the substrate through the conductive through holes in the substrate.

According to the electronic component single-sided mounting board which is bare chip-mounted on only one side of the board, it is directly soldered and mounted on the board to be mounted (hereinafter also referred to as a mother board) by a reflow method or the like. In any of the electronic component mounting boards, electronic components can be mounted on only one side, which is an obstacle to high density. Therefore, the connector shown in FIG.
Electronic component double-sided mounting boards using sockets are manufactured.

According to the example of assembling the electronic component mounting board shown in FIG. 14, it is assumed that the male connector 118 is mounted on the electronic component double-sided mounting board 102 and the female socket 122 is mounted on the mother board 128. Both sides of the electronic component are mounted on the substrate 106.

That is, first, in the wiring pattern on the lower surface of the substrate 106, solder is applied to the conductive pads 117 for mounting passive components such as resistors and capacitors and the conductive pads 121 for connector mounting by the screen printing method. The passive component 114 and the connector 118 are mounted at predetermined positions, the solder is melted and solidified by using a reflow furnace or the like, the passive component 114 and the conductive pad 117 are conductively coupled, and the connector 118 and the conductive pad 121 are conductively coupled. .

After that, the semiconductor package 103, the semiconductor chip 108, and the passive component 123 are mounted on the upper surface of the substrate 106. A chip scale package or a chip size package (hereinafter referred to as CSP 103) is often used as the semiconductor package 103.

This CSP 103 has a chip size
A semiconductor integrated circuit chip is incorporated by a package assembling process and has external electrode terminals 104 such as solder balls. First, the CSP 103 and the passive component 123 are mounted on the upper surface of the substrate 106. In this mounting example, solder is applied to the conductive pad 105 for mounting the CSP external electrode terminal and the conductive pad 125 for mounting the passive component on the wiring pattern on the upper surface of the substrate 106 by the screen method.

After that, the CSP 103 and the passive component 12
3 is mounted at a predetermined position, the solder is melted and solidified by using a reflow method or the like, the external electrode terminal 104 of the CSP 103 and the conductive pad 105 are conductively coupled, and the terminal 124 of the passive component 123 and the conductive pad 125 are conductively coupled. Let

Next, the semiconductor chip 108 is mounted on the upper surface of the substrate 106 by the flip chip method. After the solder bumps 109 previously formed on the semiconductor chip 108 are aligned with the wiring pattern 110 on the upper surface of the substrate 106 for conductive coupling, mounting is performed, and the solder bumps are heated and melted by a reflow method or the like to be conductively coupled. Thereafter, the epoxy resin 111 is used to form the semiconductor chip 108 and the substrate 1.
The gap of 06 is sealed with resin.

After that, in order to enhance the heat dissipation of the semiconductor chip 108, the semiconductor chip 1 flip-chip mounted
The chip back surface of 08 and the heat spreader 113 are bonded to each other using an epoxy-based or silicone-based resin 112.

The CSP 103 thus double-sided mounted,
In the semiconductor chip 108, the passive components 114, 123, etc., the conductive terminals 104, 109, 115, 124, etc. are respectively the conductive pads 105, 110, 11 of the substrate 106.
7, 125 and the like are electrically conductively coupled to the conductive pads 121, etc., which are connected to unillustrated inner terminals of the connector 118 on the lower surface of the substrate 106 through inner layer patterns (not shown) of the substrate 106, inner layer conduction holes, through conduction holes, etc. There is continuity.

The conductive pad 121 and the like and the connector 118
Since the conductive terminal of the electronic component is conductively coupled with solder, the external conductive terminal of the electronic component double-sided mounting substrate 102 is the connector 118.
Are all conducting. The electronic component double-sided mounting board 102 is mounted on the mother board 128 by inserting the connector 118 into the socket 122 on the opposite side of the connector mounted on the mother board 128 and making it conductive.

[0018]

The electronic component double-sided mounting board 102 according to the conventional example has the following problems. Electronic components are mounted on both surfaces of the substrate 106 by soldering by a reflow method or the like. Therefore, as for the semiconductor integrated circuit chip mounted and mounted on the substrate, there are many packaged products. Incidentally, if packaged products are to be mounted on both sides, the CSP 103 is exposed to a high temperature by a plurality of reflow processes, which causes quality deterioration.
Therefore, there is no choice but to arrange the CSP 103 on one side and only passive components on the other side.

Regarding the electrode joining of the CSP 103,
Ball-shaped external terminals (BGA type) are often used. Therefore, suppose that the CPS 1 is provided on both sides of the substrate 106.
No. 03 can be mounted, but due to the arrangement of the CSPs 103 on both sides, the thermal process after mounting may cause stress of mutual expansion and contraction of the silicon of the electronic component double-sided mounting substrate 102 and the semiconductor integrated circuit chip. . Therefore, the external electrode terminal 104 and the like may be broken,
Its layout design is difficult.

According to the method of mounting the electronic component double-sided mounting substrate 102 on the mother board 128, a method of mounting on the mother board 128 by using the connector 118, the socket 122 and the like as shown in FIG. In this method, the connector 118 and the socket 122 are expensive.

Furthermore, the weight, capacity, and
Due to its large size, the connector 118 and socket 1
Therefore, it is difficult to maintain the reliability of the connector 118, the socket 122, and the like due to distortion or the like. Incidentally, a method of designing the connector 118, the socket 122, and the like to be large can be considered, but as a result, the terminal pitch becomes large.

Therefore, the present invention solves such a conventional problem, and enables electronic components to be mounted on both surfaces of an electronic component mounting board at a high density and is surface-mounted on a mounted substrate. It is an object of the present invention to provide an electronic component mounting board composite and an assembling mounting method thereof.

[0023]

An object of the present invention is an electronic component assembly in which one or more electronic component mounting boards are stacked to form a composite, which has a plurality of terminal electrodes at predetermined positions and a plurality of terminal electrodes. An electronic component mounting board on which electronic components are mounted and a plurality of external connection terminals on one surface, and a plurality of internal connection terminals connected to the external connection terminals on the other surface to mount electronic components Between the electronic component mounting substrate and the other electronic component mounting substrate having a plurality of wiring members for conduction, and / or between the electronic component mounting substrate and the substrate connecting support An intermediate connection body provided between the plurality of terminal electrodes of the electronic component mounting board and a plurality of internal connection terminals of the board connection support is electrically connected by a wiring member. Electronic component mounting characterized by It is solved by the plate complex.

According to the electronic component mounting board composite of the present invention, when one or more electronic component mounting boards are stacked to form an electronic component assembly, a plurality of electronic component mounting boards are formed by the wiring members of the intermediate connector. Is electrically connected to the plurality of internal connection terminals of the substrate connection support.

Therefore, the electronic component mounting board can be mounted on both sides of the electronic component, and the board connection support member can be surface mounted on the mounting surface. This allows
It is possible to provide an electronic component assembly such as a system-in-package in which electronic components are mounted at high density.

The method for assembling and mounting an electronic component mounting board composite body according to the present invention is a method for mounting an electronic component mounting board composite body on a mounted substrate, and a plurality of terminal electrodes and electronic components are mounted at predetermined positions. An electronic component mounting board, a board connection support having a plurality of external connection terminals on one surface and a plurality of internal connection terminals connected to the external connection terminals on the other surface, and a plurality of conductive members. A step of preliminarily forming an intermediate connecting body having a common wiring member, a step of attaching a board connecting support tool to the mounted substrate, and a step of thereafter attaching the intermediate connecting body and the electronic component mounting board to the board connecting support tool. It is characterized by including.

According to the method of assembling and mounting an electronic component mounting board composite body according to the present invention, the intermediate connecting body and the electronic component mounting board are not attached at the time of surface mounting the board connection support on the mounting board. The solder connection temperature and the like can be set to a relatively high temperature, and lead-free solder or the like can be used to bond the mounted substrate and the substrate connection support tool.
Moreover, when mounting the electronic component mounting board on the board connection support, since no heating step is required, there is no deterioration in terms of quality and direct soldering or the like is not required even after mounting. It is possible to prevent deterioration of the connection portion due to thermal stress stress or the like.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of an electronic component mounting board composite body and an assembling and mounting method thereof according to the present invention will be described with reference to the drawings. (1) Embodiment FIG. 1 is a sectional view showing a configuration example of an electronic component mounting board composite body 100 as an embodiment according to the present invention. In this embodiment, when one or more electronic component mounting boards are stacked to form an electronic component assembly, between the electronic component mounting board and another electronic component mounting board and / or the electronic component mounting board is connected to the board. An intermediate connecting body is provided between the electronic component mounting board and the support, and the electronic component mounting board and the board connecting support are electrically connected by the intermediate connecting body so that electronic components can be mounted on both surfaces of the electronic component mounting board. At the same time, it can be surface-mounted on the board to be mounted.

Electronic component mounting board composite 100 shown in FIG.
Is an electronic component assembly obtained by stacking one or more electronic component mounting substrates 1 to form a composite, which can be surface-mounted on the mounting substrate 43. The composite 100 has a board connection support 28, and is configured by mounting the conductive members 36 and 38, the intermediate connection body 37, and the electronic component mounting board 1 inside the board connection support 28. is there.

The electronic component mounting board 1 has a plurality of terminal electrodes 9, 15, 46, etc. at predetermined positions and a plurality of electronic components 2, 10, 18, etc. mounted thereon. In the composite 100, in particular, the electronic component 18 is mounted on one surface of the electronic component mounting board 1 and the electronic components 2, 10 and the like are mounted on the other surface. The electronic component mounting board composite body 100 shown in FIG. 1 is an example in which one electronic component double-sided mounting board is attached. In the case of stacking two electronic component double-sided mounting boards, the height of the board connection support 28 is increased as shown by the chain double-dashed line.

In the case where the electronic component 18 is mounted on both sides of the composite body 100, the first processing temperature is set on one surface to electrically connect the terminal electrode 46 and the like to the electronic component 18, On the other surface, a second processing temperature lower than the first processing temperature is set and the terminal electrodes 9, 15 and the like are electrically connected to other electronic components 2, 10 and the like. This is to prevent the first joined portion from being melted by heat.

For example, in the double-sided electronic component mounting board 1, the IC package (CS
P), the transistor, the diode package, the passive component 22 and the like are mounted by leadless solder bonding, and the board 1
Only the bare chip of the semiconductor integrated circuit is formed by wire bonding mounting on the back surface (lower surface) of 7.

The board connection support 28 is provided with a box-shaped support body 5 having an opening 5A in the upper part for accommodating the electronic component mounting board 1 and the intermediate connection body 37. The board connection support 28 has a plurality of external connection terminals 32 on one surface, and also has a plurality of internal connection terminals 30 and 31 connected to the external connection terminals 32 on the other surface. The intermediate connector 37 and the electronic component mounting board 1 that are housed are supported.

The substrate connecting support 28 includes a support body 5
A lid 41 for closing the opening 5A is provided. The lid 41 is locked to the support body 5 by a locking member 42, and the electronic component mounting board 1 is pressed against the bottom of the support body 5 through the intermediate connector 37.

The intermediate connector 37 has a plurality of wiring members 48 for conduction, and is provided between the electronic component mounting board 1 and the board connection support 28. Two or more electronic component mounting boards 1
In the case of stacking, the intermediate connector 37 is also provided between the electronic component mounting board 1 and another electronic component mounting board 1.

The intermediate connecting body 37 is composed of an insulating frame body having a rectangular ring shape, and a wiring member 48 is formed on the frame body so as to connect the upper and lower surfaces thereof. Wiring member 48
Are arranged at the same positions as the terminal electrodes 46 of the electronic component mounting board 1 in the frame. Through the wiring member 48, the plurality of terminal electrodes 46 of the electronic component mounting board 1 and the plurality of internal connection terminals 30, 31 of the board connection support 28 are electrically connected.

The terminal electrode 46 of the electronic component mounting board 1 described above.
An anisotropic conductive member 38 is attached between the wiring member 48 of the intermediate connecting body 37 and the wiring member 48 of the intermediate connecting body 37, and the wiring member 48 of the intermediate connecting body 37 and the internal connection terminals 30 of the board connection support 28.
An anisotropic conductive member 36 is attached between 31 and the like. This is because electrical continuity is established regardless of thermal bonding. An anisotropic conductive rubber or an anisotropic conductive sheet is used for the conductive members 36 and 38.

Next, a substrate connecting method as an embodiment according to the present invention will be described. In this embodiment, the support body 5 without mounting the electronic component mounting board 1 on the board connection support 28 described above is first soldered to the mounting substrate 43, and then the electronic component is mounted on the board connection support 28. It is assumed that the board 1 is mounted to form the electronic component mounting board composite body 100.

Under these assembling conditions, the electronic component mounting board 1 in which the electronic components 18 are mounted on the substrate 17 having a plurality of terminal electrodes 46 at predetermined positions and the plurality of external connection terminals 32 on one surface are provided. And the external connection terminal 3 on the other surface
A board connection support 28 having a plurality of internal connection terminals 30 and 31 connected to 2 and an intermediate connector 37 having a plurality of wiring members 48 for conduction are prepared in advance.

After that, the board connection support 28 is attached to the mounting board 43. A plurality of connection pads 65 are provided in advance on the mounting substrate 43, and a plurality of internal connection terminals 30, 31, etc. are soldered to the connection pads 65 with conductive balls 64. At this point, since the intermediate connector 37 and the electronic component mounting board 1 are not mounted in the board connection support 28, the solder connection temperature and the like can be set to a relatively high temperature, and leadless solder or the like is used. Thus, the mounted substrate 43 and the substrate connection support tool 28 can be joined.

Thereafter, the intermediate connector 37 and the electronic component mounting board 1 are attached to the board connection support 28. At this time,
An anisotropic conductive member 36 is provided between the wiring member 48 of the intermediate connector 37 and the internal connection terminals 30, 31, etc. of the board connection support 28.
Then, the anisotropic conductive member 38 is sandwiched between the wiring member 48 of the intermediate connector 37 and the plurality of external conductive terminals (which communicate with the terminal electrodes 46) 27 of the electronic component mounting board 1. As a result, the electronic component mounting board composite body 100 is completed.

As described above, according to the electronic component mounting board composite body 100 and the assembling and mounting method thereof according to the embodiment of the present invention, when one or more electronic component mounting boards 1 are stacked to form an electronic component assembly. First, a board connection support tool 28 as shown in FIG. 1 is prepared, in which a plurality of terminal electrodes 46 of the electronic component mounting board 1 and a plurality of board connection support tools 28 of the intermediate connection body 37 are provided. The internal connection terminals 30 and 31 are electrically connected.

Therefore, it is possible to mount the electronic component 18 on both sides of the electronic component mounting board 1, and the board connecting support 2
In No. 8, surface mounting can be performed on the mounted surface. Moreover, when the electronic component mounting board 1 is mounted on the board connection support 28, no heating step is required, so there is no deterioration in quality and direct soldering or the like is not required even after mounting. Therefore, it is possible to prevent deterioration of the connection portion due to thermal stress stress or the like.

This makes it possible to provide an electronic component assembly such as a system-in-package in which the electronic components 18 are mounted at high density. When a failure or the like occurs in the electronic component mounting board 1, the replacement can be easily performed.
Moreover, the cost of the electronic component mounting board composite 100 can be reduced.

(2) Embodiment FIG. 2 is a perspective view showing a structural example of an electronic component double-sided mounting board composite body 101 as an embodiment according to the present invention. In this embodiment, when an electronic component assembly incorporating one electronic component double-sided mounting substrate is configured, electronic components can be mounted on both sides of a predetermined substrate, and the electronic component double-sided mounting substrate and the substrate are mounted. An intermediate connection body is provided between the connection support tool and
The intermediate connection body electrically connects the electronic component double-sided mounting substrate and the substrate connection support member to enable surface mounting on the mounting substrate.

Electronic component double-sided mounting substrate composite 1 shown in FIG.
Reference numeral 01 is surface mountable on a mother board 43 which is an example of a mounted substrate. This composite body 101 has an adapter socket 28 which is an example of a board connection support, and inside the adapter socket 28, conductive members 36 and 38, an intermediate connection body 37, an electronic component double-sided mounting board 11, and the like. Is implemented and configured.

The adapter socket 28 is a support portion main body 55.
And a frame 33, and four notches 34 for positioning are provided on four pieces of the frame 33. This frame 33
The anisotropic conductive members 36, 38, the intermediate connector 37,
The electronic component double-sided mounting substrate 11, the insulating spacer frame 39, and the insulating suppressing frame 40 can be received.

This electronic component double-sided mounting substrate 11 has a plurality of terminal electrodes 46 at predetermined positions and a plurality of electronic components 18 mounted on both sides. In this example, the adapter socket 28 alone is surface-mounted on the mother board 43 by soldering.

A conductive member 36 such as a rectangular frame-shaped anisotropic conductive rubber or anisotropic conductive sheet is inserted into the bottom of the adapter socket 28. Further, the intermediate connector 37 is inserted. After the conductive member 38 is further inserted thereon, the electronic component double-sided mounting board 11 is dropped into the socket 28. After that, the insulating spacer frame 39 and the holding frame 40 are sequentially inserted. The holding frame 40 has elasticity.

After that, a pressing plate 41, which is an example of a lid,
The adapter socket 28 is pressed and fastened with a screw 42 which is an example of a locking member. As a result, the conductive electrodes can be electrically connected to each other and the mother board 43 can be electrically connected to each other.

Next, the electronic component double-sided mounting board composite body 101
The electronic component double-sided mounting substrate 11, the adapter socket 28, and the intermediate connector 37 will be separately described. [Electronic Component Double-sided Mounting Board] FIG. 3 is a sectional view showing a configuration example of the electronic component double-sided mounting board 11. 4A is a top view showing a configuration example of the back surface thereof, and FIG. 4B is a rear view showing a configuration example of the front surface thereof. In this electronic component double-sided mounting substrate 11, the terminal electrode 46 and the electronic component 18 are electrically connected by setting the first processing temperature on one surface, and the first processing temperature lower than the first processing temperature on the other surface. The processing temperature of 2 is set and the terminal electrodes 9 and 15 are electrically connected to the other electronic components 2 and 10. That is, CSP or the like is first solder-connected by the reflow method, and then bare chip mounting is performed. This is to prevent the first joined portion from being melted by heat.

The electronic component double-sided mounting board (system-in-package: hereinafter referred to as SIP) 11 shown in FIG. 3 has a predetermined board 17, and one surface of the board 17 is one example of electronic parts. A semiconductor integrated circuit chip size package (hereinafter referred to as CSP) 18 is mounted,
Semiconductor integrated circuit chips (hereinafter referred to as IC chips) 2, 10 and the like are mounted on the other surface.

As the substrate 17, either an organic insulating substrate such as glass / epoxy or an inorganic insulating substrate such as ceramic is used. Further, the SIP 11 may be an individual piece or a plurality of aggregate boards.

In this SIP board 17, as shown in FIG.
The IC package, the transistor, the diode package, the passive component 22 and the like are soldered to one mounting surface (hereinafter, also referred to as a surface or an upper surface) of the substrate 17 shown in FIG. In this example, a semiconductor integrated circuit package, a chip scale package, or a chip size package (hereinafter referred to as CSP) 18 is used as the electronic component.

Wiring connection pads 20 and 24 as shown in FIG. 3 are provided on the surface of the substrate, and external conductive terminals 19 of the CSP 18, external conductive terminals (not shown) such as transistors and diodes, and passive components 22 are provided. The external conductive terminal 23 and the like are connected. The wiring connection pads 20 and 24 are formed by printing and applying solders 21 and 25 by a screen printing method or the like. Lead-less solder is used for the solders 21 and 25, and the reflow temperature thereof is set to, for example, 230 ° C. to 260 ° C. (first processing temperature).

The wiring connection pads 20 and 24 are the substrate 1
The wiring pattern on 7 leads to the terminal electrode 46, and this terminal electrode 46 passes through the through hole 2 in the substrate 17.
6. Arranged and exposed as external conductive terminals 27 on the lower surface of the substrate 17 through the interlayer conduction holes (not shown).

On the side of the substrate 17 on which the IC chip 2 is bare-chip mounted (hereinafter also referred to as the back surface or the bottom surface), guard rings 7 and 16 as shown in FIG. (Also known as dam) is provided at a predetermined position by a printing method or the like using an epoxy-based or silicon-based resin. The board 17 shown in FIG. 3 has a plurality of wiring connection pads 8, 14, 20, 24 and external conductive terminals 9, 1.
5, 27, the terminal electrode 46 and the like are formed in advance. In this example, the wiring connection pad 24 is connected to the terminal electrode 46, and the terminal electrode 46 is electrically connected to the external conductive terminal 27 through the through conduction hole (through hole plating) 26.

An IC chip 2 having an electrode pad 3 is bonded (mounted) to a predetermined portion (on the right side in FIG. 3) of the substrate 17 using a die bonding agent 4. The electrode pads 3 of the IC chip 2 are connected to the plurality of wiring connection pads 8 plated with gold or the like on the substrate 17 with gold wires 5 or the like by using the wire bonding method. The temperature at the time of this wire bonding joining is, for example, 130 ° C. to 21 °
It is set to about 0 ° C. (second processing temperature).

A resin is sealed on the IC chip 2 and the gold wire 5 by a printing method or a dispensing method using an epoxy resin 6 or the like. This wiring connection pad 8 is the substrate 1
The wiring patterns on 7 are arranged and exposed as external conductive terminals 9 on the lower surface of the substrate 17.

Further, at a predetermined position on the left side of the board 17, I
The C chip 10 is joined. The IC chip 10 has
The stud bumps 12 are previously formed on the IC chip electrode pads 10A using gold or the like. This stud bump 1
The reference numeral 2 is to be pressure-bonded to a predetermined portion of the wiring connection pad portion 14 with the anisotropic conductive film 13 interposed.

The anisotropic conductive film 13 is provided for conductively coupling the stud bump 12 and the wiring connection pad portion 14. The wiring connection pad portion 14 is plated with gold or the like to improve conductivity. The wiring connection pads 14 are aligned and exposed as the external conductive terminals 15 on the lower surface of the substrate 17 by routing the wiring pattern on the substrate 17.

As described above, according to the SIP 11, the CSP 18, transistor, and
The diode and the passive component 22 are mounted by soldering, and the IC chips 2 and 10 are mounted only on the bare chip on the other surface. In this SIP 11, the external conductive terminal 27
Are arranged and exposed on the IC chip mounting surface side.

Therefore, the surface of the board 17 to be mounted by soldering makes the accuracy of the wiring pattern rough, and the surface of the board on which only the bare chip of the semiconductor integrated circuit is mounted makes the accuracy of the wiring pattern fine. Can be used properly. As a result, the price of the board 17 can be reduced.

According to the method of forming the SIP 11, the IC chip electrode pad 10 is formed on one surface of the substrate 17.
Stud bump 12 and wiring connection pad 1 formed on A
4 and 4 are aligned. Then, the IC chip 10 is mounted, and the IC chip 1 is mounted via the anisotropic conductive film 13.
0 and the substrate 17 are thermocompression-bonded, hardened, and conductively coupled.

On the other surface of the substrate 17, the external conductive terminal 19 and the external conductive terminal 23 of the passive component 22 are aligned with the wiring connection pads 20 and 24, the CSP 18 is mounted, and solder connection is performed by a reflow method or the like. To be done.

After that, the IC chips 2 and 10 are mounted on one surface of the substrate 17 only by bare chip mounting. This mounting method is a wire bonding method, an anisotropic conductive film method, or a conductive adhesive method. The semiconductor integrated circuit may be mounted on a bare chip, or may be formed by a plurality of methods.

Therefore, since packages having ball terminals such as chip size packages on both sides are not mounted, it is not necessary to make difficult consideration in the layout design of the IC package in consideration of ball terminal destruction due to stress after mounting. . For example, the wiring pattern can be roughly formed on one surface of the SIP 11, and the wiring pattern can be formed at a high density on the other surface.

[Adapter / Socket] FIG.
6 is a perspective view showing a configuration example of the socket 28, FIG. 6 is a top view showing a configuration example of its front surface, FIG. 7 is a rear view showing a configuration example of its back surface, FIG. 8 is a sectional view showing its assembly configuration example, and FIG. 9
[Fig. 4] is a front view showing an example of the joining.

In this embodiment, an adapter for SIP in which the adapter substrate 29 and the frame 33 shown in FIG. 5 are integrated.
The socket 28 is formed, and the socket 28 is a conductive connection pad 30, 30 ′, 31 which is an example of an internal connection terminal arranged on the surface (upper surface) of the adapter substrate 29 at the same position as the conduction electrode of the intermediate connection body 37. , 31 '...

Further, the socket 28 is the adapter substrate 2
9 has a conductive electrode terminal 32, which is an example of an external connection terminal, freely arranged on the back surface (lower surface) of the adapter substrate 29 via the inner layer portion of 9, and the SIP 11, the intermediate connection body 37, and the conductive members 36 and 38. , The spacer frame 39, and the holding frame 40 are included in the positioning protrusion 34.

By using this adapter socket 28, the quality of the SIP 11 is not damaged when the motherboard is mounted, and the surface mounting can be efficiently performed.

The SIP adapter socket 28 shown in FIG. 5 is a surface-mountable substrate connection support, and the SIP 11, the intermediate connector 37, and the anisotropic conductive members 36, 38 described in FIG. A box-shaped support portion main body 55 having an opening 55 </ b> A in the upper part for accommodating the spacer frame 39 and the holding frame 40 is provided.

That is, the support body 55 shown in FIG. 6 has a frame 33 having positioning protrusions (hereinafter also referred to as notches) 34 capable of receiving these component parts, and conductive connection pads 30, 30, 31, 31. 'And the like are converted into external conductive terminals 32 and are integrally formed with an adapter substrate 29. As the adapter substrate 29, a glass epoxy substrate, an organic substrate such as a polyimide substrate or an aramid substrate, or an inorganic insulating substrate such as a ceramic is used, and any material can be used as long as it can withstand the temperature of the reflow method.

A plurality of positioning notches 34 are provided on the inner side surface of the frame 33.
0, 30 ', 31, 31' and the through electrodes of the intermediate connector 37 can be aligned in a self-aligned manner.

Further, the adapter board 29 shown in FIG.
A plurality of external conductive terminals 32 are freely arranged on the surface. In this example, 8 × 8 = 64 external conductive terminals 32 are arranged in a matrix in the vertical and horizontal directions. The shape of the external conductive terminal 32 is either a ball terminal (BGA) or a land terminal (LGA).

At the same time, on the other surface of the adapter substrate 29, a plurality of conductive connection pads 30, 30 ', 31, for connecting to the external conductive terminals 32 as shown in FIG.
31 'is provided. The support portion main body 55 is configured to support the SIP 11, the intermediate connector 37, etc., which are accommodated therein, as shown in FIG.

The conductive connection pads 30, 30 ', 31, 31' on the upper surface of the adapter substrate 29 shown in FIG.
The external conductive terminals 27 and 9 are provided at the same position and in the same arrangement. The conductive connection pads 30, 30 ', 31, 31', etc. are the outer layer patterns 59, 5 of the adapter substrate 29 shown in FIG.
An external conductive terminal pad 32A constituting the external conductive terminal 32 on the surface of the adapter substrate 29 by 9 ', the inner layer pattern 57, the interlayer conductive holes 56, 58, through conductive holes not shown, and the like.
.., 32F ..., Which are freely arranged and arranged.

The adapter board 29 can be formed of a double-sided copper foil board or the like when expanding and converting the terminal space. However, when one double-sided board is not enough, it is formed of a multi-layer board. It Adapter board 29 shown in FIG.
Then, for example, it is composed of an upper substrate 29A, an intermediate substrate 29B and a lower substrate 29C, and a double-sided and / or single-sided copper foil substrate is used for each substrate.

The conductive connection pads 30, 3 on the upper surface described above
0 ', 31, 31' and the like and the external conductive terminals 32 on the lower surface are electrically connected by through-hole plating or the like formed on the intermediate substrate 29B. For example, in the intermediate substrate 29B, the inner layer pattern 57 is extended in the lateral direction by being connected to the conductive connection pad 31 on the upper surface and receiving the interlayer conductive hole (through hole) 56 penetrating the upper substrate 29A. Then, it is connected to an interlayer conductive hole (through hole) 58 penetrating the lower substrate 29C to reach the external conductive terminal 32E. As a result, the adapter substrate 29 can enlarge and convert the terminal interval.

The frame 33 is integrated with the adapter substrate 29, and an organic insulating material such as epoxy is used in a state where the positioning hole in the adapter substrate 29 ensures the outer shape and the inner position accurately. Are integrally molded with the adapter substrate 29 by a transfer molding method or the like.

In the case of adopting the method of joining the frame 33 and the adapter substrate 29 in this example, as shown in FIG. 8A, the frame 33 having the positioning pins 54 in advance is made of an organic insulating material such as epoxy. By injection molding or compression molding. Also, the adapter board 29 shown in FIG. 8B
A positioning hole 53 is provided in advance to secure the positions such as the outer shape and the inner diameter with high accuracy.

Then, the positioning hole 5 of the adapter substrate 29
3, the positioning pin 54 may be press-fitted or fixed to it, or an adhesive may be used to bond the positioning pin 54 to be integrated. The adapter socket 28 may be manufactured as an individual piece, or may be separated into individual pieces after completed with a plurality of aggregates. By this joining, the supporting portion main body 55 as shown in FIG. 9 can be formed.

To the external conductive terminal pads 32A to 32F, conductive balls 64 made of solder or the like as described with reference to FIG. The shape of the external conductive terminal 32 is a ball electrode, so-called BGA (Ball Grid Array).
However, the land electrode, so-called LGA (Land Grid Arra)
Any of y) is acceptable.

Further, a screw hole 35 for fastening is provided in the upper portion of the frame 33. This is the adapter socket 28
In order to attach the holding plate 41 for closing the opening 55A of the support portion main body 55 (see FIG. 2). The holding plate 41 is locked to the support portion main body 55 by the screw 42, and the SIP 11 is pressed against the bottom portion of the support portion main body 55 through the intermediate connector 37.

As a result, the conductive electrode pads 30, 30 ′, 3 arranged at the same positions as the conductive electrodes of the intermediate connector 37.
1, 31 'and the like on the front surface (upper surface) of the adapter board 29, and the external conductive terminals 32 freely arranged on the back surface (lower surface) of the board via the inner layer portion of the adapter board 29,
In addition, the SIP 11, the intermediate connector 37, the anisotropic conductive members 36 and 38, the insulating spacer frame 39, and the frame 33 having the positioning notch 34 that can receive the holding frame 40 are integrated for surface mounting. An adapter socket 28 can be provided.

According to the adapter socket 28,
Since the heat capacity is small even when mixedly mounted with other IC packages, parts, etc., and collectively soldered, the condition range can be set wide. Furthermore, since it is lightweight only with the adapter socket 28, the self-alignment effect becomes large,
Eliminates the need for high mount accuracy.

Furthermore, the external conductive terminals 9 and 27 of the SIP 11 are provided.
The arrangement and arrangement can be changed by the adapter / socket 28 even if the arrangement is arbitrarily arranged or the arrangement space is narrowed, so that the external conductive terminal 32 of the adapter / socket 28 can be rearranged easily. You can

[Intermediate Connector] FIG. 10 is a perspective view showing an example of the configuration of the intermediate connector 37. Intermediate connector 3 shown in FIG.
7 is housed in the adapter socket 28 together with the SIP 11, and has a plurality of through conduction electrodes 48 which are an example of a wiring member. The intermediate connector 37 is the SI
It is provided between P11 and the adapter socket 28.
External conductive terminals 9 and 27 of SIP 11 and adapter substrate 29
This is for mediating the conduction with the conductive connection pads 30, 30 ', 31, 31' on the upper surface of the.

The intermediate connecting body 37 is composed of an insulating frame body 37 'having a quadrangular ring shape, and through conductive electrodes 48 are formed on the frame body 37' so as to connect the upper and lower surfaces thereof. The bare chip mounting portions of the SIP chips 2 and 10 of the SIP 11 are accommodated in the annular portion 37A of the frame body 37 '. The through conduction electrode 48 is connected to the SI in the frame 37 '.
It is arranged at the same position as the terminal electrodes 9 and 27 of P11.
Through the through conduction electrodes 48, the plurality of terminal electrodes 9 and 27 of the SIP 11 and the plurality of conduction connection pads 30 and 31 of the adapter socket 28 are electrically connected.

In this example, the upper surface of the intermediate connector 37 has SI
Conductive connection pads 47 and 50 are provided at the same positions and in the same arrangement as the external conductive terminals 9 and 27 of P11, and are electrically connected to the conductive connection pads 49 and 52 on the lower surface by through conduction electrodes (through hole plating) 48 and 51, respectively. There is.

The material of the frame 37 'may be either an organic insulating material or an inorganic insulating material. Regarding the production of the frame body 37 ', it may be separated into individual pieces or a plurality of aggregates at the time of completion. The intermediate connecting body 37 has a spacer function of keeping a space with respect to the height dimension of the shape of the upper surface of the SIP 11. When stacking two or more SIPs 11, the intermediate connector 37 is provided between the SIP 11 and another SIP 11.

In this example, the adapter socket 2 for mounting
8, the intermediate connector 37 is inserted, and the conductive connection pads 30, 31 and S on the surface (upper surface) of the adapter substrate 29 are connected.
The terminal electrodes 9, 15, 27, etc. of the IP11 are insulating and have anisotropic conductive members 36, 38, conductive connection pads 49, 52, through conductive electrodes 48, 51, conductive connection pads 47, 50, etc. The frame 37 'is electrically connected.

Next, a substrate connecting method as an embodiment according to the present invention will be described. 11 to 13 show assembling examples (parts 1 to 3) of the electronic component double-sided mounting board composite body 101.
FIG.

In this embodiment, the support body 5 without mounting the SIP 11 on the adapter socket 28 described above.
5 is singly joined to the motherboard 43 by a reflow method or the like, and then the SIP 11 is placed in the adapter socket 28.
It is premised that the electronic component double-sided mounting board composite body 101 is configured by mounting.

Of course, the plurality of terminal electrodes 9, 15, 27, the IC chips 2, 10 and the CSP 18 are provided at predetermined positions.
And the like, and a plurality of external conductive terminals 32 on one surface, and the external conductive terminal 3 on the other surface.
Adapter socket 28 having a plurality of conductive connection pads 30 and 31 connected to 2 and a plurality of through conductive electrodes 4
An intermediate connector 37 having 8, 51 and the like is prepared in advance.

Thereafter, in the adapter socket 28, the anisotropic conductive member 36, the intermediate connector 37, the anisotropic conductive member 38, the SIP 11, the insulating spacer frame 39, and the holding frame 4 are provided.
0 in order, and then the pressing plate 41 and the socket 2
It is assumed that 8 and 8 are pressed and fastened with a screw 42 to realize surface mounting on the motherboard 43.

With this as an assembling condition, first, FIG.
The adapter socket 28 is attached to the motherboard 43 shown in A (surface mounting). On this motherboard 43, a circuit wiring pattern group (not shown), conductive electrode pads 44 and 65 arranged at the same positions as the external conductive terminals 32 and 64 of the adapter socket 28, and other ICs to be mounted.
Conductive electrode pads (not shown) for electronic components such as chips are formed.

At this point, since the intermediate connector 37 and the SIP 11 are not mounted in the adapter socket 28, the solder connection temperature and the like can be set to a relatively high temperature, and leadless solder or the like can be used. The motherboard 43 and the adapter socket 28 can be joined together.

For example, solder is printed on the conductive electrode pads 44, 65, etc., which are to be solder-joined, by the screen method or the like.
Apply. After that, the conductive electrode pads 44, 65 and the external conductive terminals 32, 64 are aligned with each other, the adapter socket 28 is mounted, and the solder is heated and melted by a reflow method or the like to make solder connection. At this time, mixed mounting with other electronic components,
These mounts are done. This allows the adapter
The socket 28 is conductively mounted at a predetermined position on the motherboard 43.

Then, in the adapter socket 28 shown in FIG. 11B, the anisotropic conductive member 36 and the intermediate connector 37 are sequentially housed with the positioning notch 34 as a guide.
On the upper surface of the intermediate connector 37, the conductive connection pads 47, 50 are arranged at the same positions and in the same positions as the external conductive terminals 9, 27 of the SIP 11.
Are provided, and conductive connection pads 4 on the lower surface are formed by through conductive electrodes (through-hole plating) 48 and 51, respectively.
An insulative frame 37 ', which is electrically connected to 9, 52, is used.

An anisotropic conductive rubber or an anisotropic conductive sheet is used for the conductive member 36. At this time, the conductive connection pads 30, 3 on the surface (upper surface) of the adapter substrate 29
An anisotropic conductive member 36 is sandwiched between 0 ', 31, 31' and the conductive connection pads 49, 52 of the intermediate connector 37.

Then, in the adapter socket 28 shown in FIG. 12, the anisotropic conductive member 38 and the SIP 11 are sequentially inserted using the positioning notch 34 as a guide. An anisotropic conductive rubber or an anisotropic conductive sheet is used for the conductive member 38. At this time, the conductive connection pad 4 of the intermediate connection body 37
An anisotropic conductive member 38 is sandwiched between 7, 50 and the like and the terminal electrodes 9, 15, 27 and the like of the SIP 11.

After that, after inserting the insulating spacer frame 39 and the holding frame 40 in order in the adapter socket 28 shown in FIG. 13 using the positioning notches 34 as guides, the holding plate 41 is covered and the four corners are fastened with the screws 42. And fix it. At this time, the screw 42 is screwed into the screw hole 35,
The holding plate 41 is configured to press the SIP 11 through the insulating spacer frame 39 and the holding frame 40.

As a result, the conductive connection pads 30, 30 ', 31, 31' and the like on the surface (upper surface) of the adapter substrate 29 and the conductive connection pads 49, 52 of the intermediate connector 37 are formed by the anisotropic conductive member 36. It is conducted. The conductive connection pads 47, 50, etc. of the intermediate connector 37 and the external conductive terminals 27, 9, 15, etc. of the SIP 11 are electrically connected by the anisotropic conductive member 38.

At this time, the external conductive terminal 27 of the SIP 11
Passes through the anisotropic conductive member 38, conducts to the conductive connection pad 47 on the upper surface of the intermediate connector 37, communicates with the conductive connection pad 49 on the lower surface through the through conductive hole 48, and further connects the anisotropic conductive member 36. Then, the conductive connection pads 30 on the upper surface of the adapter substrate 29 of the adapter socket 28 are electrically connected.

As a result, through the outer layer patterns 59 and 59 'of the adapter substrate 29 of the adapter socket 28, the through conductive hole 60, the external conductive terminal pad 32F and the conductive ball terminal 32 (64), the conductive electrode pad on the mother board 43. It will be electrically connected to 44 and 65.

The external conductive terminal 9 of the SIP 11 is electrically connected to the conductive connection pad 50 on the upper surface of the intermediate connector 37 through the anisotropic conductive member 38, and is connected to the conductive connection pad 52 on the lower surface through the through conductive hole 51. Further, via the anisotropic conductive member 36, the adapter board 29 of the adapter socket 28.
Conducts to the conductive connection pad 31 on the upper surface of the.

As a result, the conductive electrode pad 65 on the mother board 43 is passed through the interlayer conductive hole 56, the inner layer pattern 57 and the interlayer conductive hole 58 of the adapter substrate 29 of the adapter socket 28, the external conductive terminal pad 32E and the conductive ball terminal 64. Will be conducted to. The external conductive terminal 27 and the like of the SIP 11 and the external conductive terminal 32 of the adapter socket 28 are electrically connected to each other through the respective parts to form an assembly. Thus, the electronic component double-sided mounting board composite 1
01 is completed.

As described above, according to the electronic component double-sided mounting board composite body 101 and the method for assembling and mounting the electronic component as the embodiment according to the present invention, when the electronic component assembly containing the SIP 11 is constructed, it is shown in FIG. Adapter socket 28
, In which the conductive connection pad 4 of the intermediate connector 37 is prepared.
9, 52, through conduction electrodes 48, 51, conduction connection pad 4
7, 50, etc., the plurality of terminal electrodes 27 of the SIP 11,
9 and 15 and the like and the plurality of conductive connection pads 30 and 31 of the adapter socket 28 are electrically connected.

Therefore, in SIP11, CSP18
The IC chips 2 and 10 can be mounted on both sides, and the adapter socket 28 can be mounted on the mounting surface. Moreover, when the SIP 11 is mounted on the adapter socket 28, no heating step is required, so that there is no deterioration in quality and no direct soldering or the like is required even after mounting. It is possible to prevent the deterioration of the connection portion due to the above.

As a result, the CSP 18 and the IC chip 2,
It is possible to provide an electronic component assembly such as a system-in-package in which 10 are mounted at high density. SIP1
When a failure or the like occurs in No. 1, the replacement can be easily performed. Therefore, the electronic component double-sided mounting board composite body 101
The price of can be reduced.

According to the example of assembling the electronic component double-sided mounting board composite body 101, not only the SIP 11 can be surface-mounted on the mother board 43, but also by mounting the adapter socket 28 on the test board, SI can be realized.
It can also be used as a measuring socket for P.

[0113]

As described above, according to the electronic component mounting board composite body of the present invention, when a plurality of electronic component mounting boards are stacked to form an electronic component assembly, a plurality of conductive components are used. An intermediate connecting body is provided between the electronic component mounting board and another electronic component mounting board having a wiring member and / or between the electronic component mounting board and the board connection support, and the wiring member of the intermediate connecting body. With this, a plurality of terminal electrodes of the electronic component mounting board and a plurality of internal connection terminals of the board connection support are electrically connected.

With this structure, both sides of the electronic component can be mounted on the electronic component mounting board, and surface mounting can be performed on the mounting surface of the board connecting support. Therefore, it is possible to provide an electronic component assembly such as a system-in-package in which electronic components are mounted at high density.

According to the method for assembling and mounting an electronic component mounting board composite body according to the present invention, an electronic component mounting board having a plurality of terminal electrodes and electronic components mounted at predetermined positions, and a plurality of external connection terminals on one surface. And a substrate connecting support having a plurality of internal connecting terminals connected to the external connecting terminals on the other surface, and an intermediate connecting body having a plurality of wiring members for conduction are formed in advance. After that, after mounting the board connection support tool on the mounting board, the intermediate connector and the electronic component mounting board are mounted on the board connection support tool.

With this configuration, since the intermediate connector and the electronic component mounting board are not attached at the time of surface mounting the board connection support on the mounting board, the solder connection temperature and the like can be set to a relatively high temperature. It is possible to join the mounted substrate and the board connection support tool by using leadless solder or the like.

Moreover, when mounting the electronic component mounting board on the board connecting support, no heating step is required, so that there is no deterioration in quality and direct soldering or the like is required even after mounting. Since it does not, it is possible to prevent deterioration of the connection portion due to thermal stress stress or the like. This invention is a semiconductor chip or IC
It is extremely suitable for application to a system-in-package in which a package, a transistor, a diode package, a passive component, etc. are mounted in high density.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of an electronic component mounting board composite body 100 as an embodiment according to the invention.

FIG. 2 is a perspective view showing a configuration example of an electronic component double-sided mounting board composite body 101 as an embodiment according to the present invention.

FIG. 3 is a cross-sectional view showing a configuration example of an electronic component double-sided mounting substrate 11.

FIG. 4A is a top view showing a configuration example of the front surface of the electronic component double-sided mounting substrate 11, and B is a rear view showing a configuration example of the back surface thereof.

5 is a perspective view showing a configuration example of an adapter socket 28. FIG.

FIG. 6 is a top view showing a configuration example of the surface of an adapter socket 28.

7 is a rear view showing a configuration example of the back surface of the adapter socket 28. FIG.

FIG. 8 is a cross-sectional view showing an example of an assembled configuration of the adapter socket 28.

9 is a front view showing an example of joining the adapter socket 28. FIG.

FIG. 10 is a perspective view showing a configuration example of an intermediate connection body 37.

11A and 11B are electronic component double-sided mounting board composite bodies 10;
It is a flowchart showing an example (1) of assembling of 1.

FIG. 12 is a process diagram showing an assembly example (No. 2) of the electronic component double-sided mounting board composite body 101.

FIG. 13 is a process drawing showing an example (3) of assembling the electronic component double-sided mounting board composite body 101.

FIG. 14 is a cross-sectional view showing an example of an assembled configuration of a double-sided electronic component mounting substrate 102 according to a conventional example.

[Explanation of symbols]

1 ... Electronic component mounting board, 9, 15, 19, 23, 2
7, 32 ... External conductive terminals, 11 ... System in package (SIP: Electronic component double-sided mounting board), 1
8 ... Chip scale package (CSP: electronic component), 28 ... Adapter socket (board connecting support), 29 ... Adapter board (bottom plate part), 30, 31
... Internal connection terminals, 32 ... External connection terminals, 33 ...
..Frames, 34 ... Notches (projections), 37 ... Intermediate connectors, 41 ... Suppression plates (lids), 42 ... Screws (locking members), 46 ... Terminals Electrodes, 48 ... Penetration conducting electrodes, 55 ... Support body, 100 ... Electronic component mounting board composite, 101 ... Electronic component double mounting board composite

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H01L 25/14 ZF term (reference) 5E336 AA04 AA14 BB02 BB03 CC31 CC55 CC58 EE03 EE20 GG30 5E344 AA01 AA16 AA19 AA22 BB06 BB08 BB10 CC05 CC24 CD02 CD19 DD02 DD06 EE13 5E346 AA22 AA43 CC04 CC09 CC10 CC16 CC32 DD02 EE04 EE12 FF07 GG14 GG15 GG17 GG19 GG25 GG28 HH22

Claims (16)

[Claims] 1. An electronic component assembly in which one or more electronic component mounting boards are stacked to form a composite, having a plurality of terminal electrodes at predetermined positions and mounting a plurality of electronic components. A substrate and a substrate connection support that has a plurality of external connection terminals on one surface and a plurality of internal connection terminals connected to the external connection terminals on the other surface and supports the electronic component mounting board And a plurality of wiring members for conduction, and is provided between the electronic component mounting board and another electronic component mounting board or / and between the electronic component mounting board and the board connection support tool. An intermediate connecting body is provided, and the intermediate connecting body is configured to electrically connect the plurality of terminal electrodes of the electronic component mounting board and the plurality of internal connection terminals of the board connection support tool by the wiring member. Electronic component mounting characterized by Plate complex. 2. The electronic component mounting board composite body according to claim 1, wherein the electronic component is mounted on both surfaces of the electronic component mounting board. 3. A case where the electronic component is mounted on both surfaces of the electronic component mounting board, wherein a first processing temperature is set on one surface to electrically connect the terminal electrode and the electronic component. A second processing temperature lower than the first processing temperature is set on the other surface, and the terminal electrode and other electronic component are electrically connected to each other. The electronic component mounting board composite described. 4. The insulating frame body having wiring members arranged at the same positions as the terminal electrodes of the electronic component mounting board, and having a predetermined shape to house the wiring members. The electronic component mounting board composite body according to claim 1, wherein the electronic component mounting board composite body comprises: 5. Anisotropy between the terminal electrode of the electronic component mounting board and the wiring member of the intermediate connector, and between the wiring member of the intermediate connector and the internal connection terminal of the board connection support. The electronic component mounting board composite body according to claim 1, wherein the electronic component mounting board composite body is provided. 6. The board connection support has a box-shaped support body, and the support body has an opening at an upper part for accommodating an electronic component mounting board and an intermediate connector. The electronic component mounting board composite body according to claim 1, wherein: 7. A lid body for closing the opening of the support portion main body, wherein the lid body is locked to the support portion main body by a locking member, and the electronic component mounting board is passed through the intermediate connector. The electronic component mounting board composite body according to claim 6, which is pressed against the bottom portion of the support portion main body. 8. A method of mounting an electronic component mounting board composite on a mounting substrate, comprising: an electronic component mounting board having a plurality of terminal electrodes and electronic components mounted at predetermined positions; and a plurality of external surfaces on one surface. A substrate connection support having a connection terminal and a plurality of internal connection terminals connected to the external connection terminal on the other surface, and an intermediate connection body having a plurality of wiring members for conduction in advance. An electronic component comprising: a step of forming, a step of attaching the substrate connection support tool to the mounted substrate, and a step of subsequently attaching the intermediate connection body and the electronic component mounting board to the substrate connection support tool. Assembling and mounting method of mounting board composite. 9. A plurality of terminal electrodes of the electronic component mounting board and a plurality of internal connection terminals of the substrate connecting support when mounting the intermediate connector and the electronic component mounting board on the board connecting support. 9. The method of assembling and mounting an electronic component mounting board composite body according to claim 8, wherein the wiring members of the intermediate connector are electrically connected. 10. Anisotropy between the terminal electrode of the electronic component mounting board and the wiring member of the intermediate connector, and between the wiring member of the intermediate connector and the internal connection terminal of the board connection support. 9. The conductive member according to claim 8 is sandwiched.
A method for assembling and mounting an electronic component mounting board composite according to. 11. The intermediate connector is provided between the electronic component mounting board and another electronic component mounting board or / and between the electronic component mounting board and the board connection support. Item 9. A method for assembling and mounting an electronic component mounting board composite body according to Item 8. 12. The method for assembling and mounting an electronic component mounting board composite according to claim 8, wherein the electronic components are mounted on both sides of the electronic component mounting board. 13. A method for mounting the electronic component on both surfaces of the electronic component mounting board, wherein a first processing temperature is set on one surface to electrically connect the terminal electrode and the electronic component. 9. The electronic device according to claim 8, wherein a second processing temperature lower than the first processing temperature is set on the other surface to electrically connect the terminal electrode to another electronic component. Assembly mounting method of component mounting board composite. 14. A wiring member is arranged at the same position as a terminal electrode of the electronic component mounting board, and the intermediate connection body composed of an insulating frame body in which the wiring member is embedded is formed. The method of assembling and mounting the electronic component mounting board composite body according to claim 8. 15. The board connection support tool having a box-shaped support body having an opening for accommodating the electronic component mounting board and the intermediate connector is formed. Assembling and mounting method of electronic component mounting board composite. 16. A lid body for closing an opening of the support portion main body is formed in advance, the lid body is locked to the support portion main body by a locking member, and the electronic component mounting board is connected to the intermediate connection. The method for assembling and mounting an electronic component mounting board composite body according to claim 15, wherein the supporting portion body is pressed against the bottom through the body.