JP2007258548A - Radiator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the pressure force of a thermal conductive member from working on a component to be cooled as much as possible. <P>SOLUTION: A thermal conductive leaf spring 9 made of a leaf spring normally allows the thermal conductive sheet 12 of a heat receiving piece 9c to be separated from a CPU 7 as the component to be cooled with the use of its own snapping force. When the temperature of the CPU 7 becomes the one which requires cooling, a shape-memory leaf spring 10 generates the snapping force for deformation into the stored shape. Then, the heat receiving piece 9c of the thermal conductive leaf spring 9 is pushed up so as to pressurize the thermal conductive sheet 12 against the CPU 7. Consequently, the heat of the CPU 7 is transmitted to a lower case 3 via the thermal conductive sheet 12 and the thermal conductive leaf spring 9. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat dissipation device configured to transmit heat of an electronic component or an electrical component to a heat conducting member to cool the electronic component or the electrical component.

In recent years, in electronic devices, the data capacity has increased dramatically, and the semiconductor devices used have become smaller and more sophisticated. For this reason, the amount of heat generated per unit area of the semiconductor device tends to increase, and various devices for cooling the semiconductor device have been considered.
As a cooling device for a semiconductor device, there is a configuration in which heat of the semiconductor device is transmitted to a heat conducting member and released to the outside. For example, the cooling device described in Patent Document 1 is of a notebook personal computer, but the heat of the CPU is transmitted to the keyboard and the case by a heat conducting member to radiate the heat from the keyboard and the case, or the CPU and the cooling fan. Are arranged side by side, combined with a heat conducting member, and the heat conducting member is cooled by blowing air from a cooling fan.

In addition, there is a type in which the semiconductor device is cooled by passing air through a housing containing the semiconductor device. For example, Patent Document 2 discloses that a vent hole is formed in a housing of an electronic device, and an opening / closing plate of the vent hole is formed as a shape memory spring (when the shape memory spring has an outside temperature that requires ventilation in the electronic device. , Deformed to a memorized shape).
JP 2000-105635 A Japanese Utility Model Publication No. 7-36483

  Some semiconductor devices are of surface mount type. For example, in a BGA (Ball Grid Array) package type semiconductor device, a large number of solder balls (connection terminals) are provided in a lattice shape on the bottom surface, and the solder balls are directly connected to a wiring pattern on a printed wiring board. . In the BGA package type semiconductor device, when the above-described heat conduction method is adopted as the cooling method, the heat conduction member is pressed against the surface of the semiconductor device. For this reason, the pressing force of the heat conducting member always acts on the solder ball.

  By the way, it is known that the connection by the solder ball of the BGA package is weak against external stress and repeated stress. For this reason, if a BGA package type semiconductor device is used in an environment in which the pressing force of the heat conducting member of the cooling device is constantly acting, cracks are likely to occur in the solder balls or creep failure is likely to occur. In particular, in the case of an electronic device mounted on a vehicle, vibrations caused by traveling of the vehicle, thermal stress generated by the vehicle left under the sun being cooled by an air conditioner, etc., act on the solder ball portion. Further reducing the durability of the solder balls.

  As a means for pressing the heat conducting member against the semiconductor device, tightening with a screw is generally used, but in order to prevent damage to the solder ball due to pressing of the heat conducting member as much as possible, the heat conducting member is made by the elastic force of the spring. A method of pressing the semiconductor device is conceivable. Although the pressing by the spring has an effect of relieving the stress acting on the semiconductor device during vibration, it is not an effective solution since the semiconductor device always receives a pressing force.

  The present invention has been made in view of the above circumstances, and an object thereof is to prevent the cooling target component from receiving the pressing force from the heat conductive member as much as possible in the heat dissipation device in which the heat conductive member is brought into contact with the cooling target component. It is in the place of providing the thermal radiation apparatus which can do.

  According to the first aspect of the present invention, when the shape memory spring means reaches a predetermined temperature, the shape memory spring means is deformed into the memorized shape. Specifically, as in the second aspect of the invention, when the shape memory spring means reaches a predetermined temperature or more, the shape memory spring means is deformed into a memorized shape, thereby generating an elastic force, which has been separated from the component to be cooled until then. The member is brought into contact with the part to be cooled. In the invention of claim 3, when the shape memory spring means becomes a predetermined temperature or less, the shape memory spring means is deformed into a memorized shape to generate an elastic force, and the heat that has been pressed against the component to be cooled by the urging force of the urging means until then. Separate the conductive member from the part to be cooled.

  Thus, when the temperature of the component to be cooled does not require cooling, the heat conducting member is separated from the component to be cooled. When the temperature that requires cooling is reached, the heat conduction member is pressed against the component to be cooled, whereby the heat of the component to be cooled is transmitted to the heat conduction member, and as a result, the component to be cooled is cooled. Therefore, the time when the heat conducting member is pressed against the component to be cooled is limited to the time when cooling is required, so that the component to be cooled can be prevented from receiving the pressing force from the heat conducting member as much as possible.

  The inventions of claims 4 and 5 are configured such that the heat conducting member is formed of a spring material. According to this, since the heat conducting member is separated from the component to be cooled by its own elasticity or is in contact with the component to be cooled, it is not necessary to separately provide a biasing means.

  In the invention of claim 6, the component to be cooled is a surface-mount type semiconductor device such as a BGA package type semiconductor device. By applying the present invention, the durability of connection terminals such as semiconductor balls can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 5 as applied to a navigation apparatus mounted on a vehicle. FIG. 3 shows a case 2 that houses a control device (electronic device) 1 of the navigation device. The case 2 is composed of a lower case 3 and an upper case 4. Both the cases 3 and 4 are made of metal, for example, aluminum die-cast, and at the four corners in the lower case 3, as shown in FIGS. 4 and 5, the receiving portions 3 a are formed by recessing the four corners inward. As shown in FIG. 4, presser portions 4 a having columnar shapes are formed at the four corners of the upper case 4. Then, the upper and lower cases 3, 4 are joined by tightening the receiving portion 3 a and the presser portion 4 a with the screw 5.

  A printed wiring board 6 is disposed in the case 2. The printed wiring board 6 is fixed by sandwiching the four corners between the receiving part 3a and the pressing part 4a when the cases 3 and 4 are coupled. On the printed circuit board 6, various electronic components and electrical components constituting the control device 1 are mounted. In the figure, among these electronic components and electrical components, for example, the CPU 7 is shown. The CPU 7 is formed by wrapping an IC chip in a BGA type package, and a large number of solder balls 7a as connection terminals are provided in a lattice shape on the bottom surface. This CPU 7 is a surface-mount type semiconductor device, and solder balls 7 a are directly connected to a wiring pattern (not shown) of the printed wiring board 6.

  The CPU 7 is equivalent to a component to be cooled, and in the case 2, a heat radiating device 8 for transferring heat from the CPU 7 to the lower case 3 as a heat radiating portion and radiating heat from the lower case 3 to the outside. Is provided. FIG. 1 shows details of the heat radiating device 8. In FIG. 1, a heat conductive leaf spring 9 as a heat conducting member and a shape memory leaf spring as a shape memory spring means are provided at the bottom of the lower case 3. 10 is fixed by a screw 11 with a vertical positional relationship. The heat conductive leaf spring 9 functions as a bias spring with respect to the shape memory leaf spring 10.

  The heat conduction leaf spring 9 is fixed so as to face the surface of the CPU 7 from the fixing portion 9a fixed to the lower case 3 by screws 11, a rising portion 9b extending from the fixing portion 9a toward the CPU 7, and the tip of the rising portion 9b. The heat receiving piece portion 9c is provided. Among them, the heat conductive sheet 12 is affixed to the heat receiving piece 9c. The heat conductive leaf spring 9 is formed of a material excellent in both heat conductivity and spring property, for example, a spring material such as phosphor bronze, and the heat receiving piece portion 9c and the heat conduction sheet 12 are separated in a direction away from the surface of the CPU 7. Have power.

  On the other hand, the shape memory leaf spring 10 has a fixing portion 10 a fixed to the lower case 3 by a screw 11 and a pressing portion 10 b extending from the fixing portion 10 a so as to contact the heat conducting leaf spring 9. The shape memory leaf spring 10 is formed of a shape memory material such as a shape memory alloy or a shape memory plastic, and when it reaches a predetermined temperature, it generates an elastic force in an attempt to be deformed into a memorized shape. The memorized shape of the shape memory leaf spring 10 is maintained even when the temperature exceeds a predetermined temperature. Note that the memory shape of the shape memory leaf spring 10 is the shape indicated by the two-dot chain line in FIG. 1. If the printed wiring board 6 is not provided, the rising angle of the pressing portion 10 b is increased so that the tip portion passes through the CPU 7. Become.

  The shape memory leaf spring 10 loses its elastic force when it is below a predetermined temperature, and is easily plastically deformed with a slight external force. Therefore, when the ambient temperature is low and the shape memory leaf spring 10 is below the predetermined temperature, the heat conducting leaf spring 9 plastically deforms the shape memory leaf spring 10 as shown in FIG. The heat receiving piece 9c (heat conducting sheet 12) is in a state separated from the CPU 7.

  In the above configuration, when the temperature in the case 2 is low, for example, because the car navigation device is not activated, the heat conducting leaf spring 9 plastically deforms the shape memory leaf spring 10 to conduct the heat conduction of the heat receiving piece 9c. The sheet 12 is separated from the CPU 7. When the car navigation device is activated, the temperature in the case 2 gradually increases due to heat generated from the CPU 7 mounted on the printed wiring board 6 and other electronic components and electrical components.

When the temperature in the case 2 rises, and the ambient temperature of the shape memory leaf spring 10 becomes higher than the temperature that requires cooling of the CPU 7 with this, the temperature of the shape memory leaf spring 10 also rises above the predetermined temperature. Become. Then, the shape memory leaf spring 10 generates an elastic force so as to be deformed into the memorized shape, and pushes the heat conduction leaf spring 9 by the pressing portion 10b. Then, the shape memory leaf spring 10 elastically deforms the heat conduction leaf spring 9 against its elastic force and presses the heat conduction sheet 12 of the heat receiving piece 9c against the surface of the CPU 7 as shown in FIG.
When the heat conductive sheet 12 is pressed by the CPU 7, the heat of the CPU 7 is transmitted from the heat conductive sheet 12 to the heat receiving piece portion 9c of the heat conductive leaf spring 9, and further, the rising portion 9b and the fixing portion 9a are transferred from the heat receiving piece portion 9c. In order, it is transmitted to the lower case 3 as a heat radiating part. The heat transferred to the lower case 3 is finally released from the lower case 3 into the atmosphere.

  If the shape memory leaf spring 10 falls below a predetermined temperature due to the atmospheric temperature being lowered, for example, when the operation of the car navigation device is terminated, the shape memory leaf spring 10 loses its elasticity. Then, the heat conduction leaf spring 9 returns to its original state while plastically deforming the shape memory leaf spring 10 by its own restoring elastic force, and releases the heat conduction sheet 12 from the CPU 7.

  Thus, according to the present embodiment, the heat receiving plate portion 9c of the heat conducting plate spring 9 is pressed by the CPU 7 only when the CPU 7 needs to be cooled, and when the CPU 7 does not need to be cooled, the heat conducting plate spring is used. 9 leaves the CPU 7. For this reason, the heat conducting leaf spring 9 does not exert a pressing force on the CPU 7 except when the CPU 7 needs to be cooled, so that the CPU 7 receives the pushing force from the heat conducting leaf spring 9 and accompanies the traveling of the vehicle. Thus, the occurrence of the opportunity of receiving vibrations can be minimized, and the durability of the solder balls 7a can be improved.

6 and 7 show another embodiment of the present invention. Hereinafter, the same parts as those in FIGS. 1 to 5 are denoted by the same reference numerals in FIG. 6 and FIG. Only the part will be described.
This embodiment differs from the above-described embodiment in that a shape memory coil spring 13 is used instead of the shape memory leaf spring 10. The shape memory coil spring 13 is inserted into the holding hole 15 of the holder 14 fixed to the inner bottom surface of the lower case 3, and is held so as to be positioned under the heat receiving piece portion 9 c of the heat conducting plate spring 9.

  The shape memory coil spring 13 loses elasticity at a temperature lower than a predetermined temperature, and is in a state of being compressed by the restoring elastic force of the heat conductive leaf spring 9. In this state, the heat conductive leaf spring 9 separates the heat receiving piece 9c (heat conductive sheet 12) from the CPU 7 as shown by a two-dot chain line in FIG. And if it becomes more than the predetermined temperature which should cool CPU7, the shape memory coil spring 13 will produce a resilient force so that it may become the memorize | stored shape, and will push up the heat receiving piece part 9c of the heat conductive leaf | plate spring 9. FIG. Thereby, as shown by a solid line in FIG. 6, the heat conductive sheet 12 of the heat receiving piece portion 9 c of the heat conductive plate spring 9 is pressed by the CPU 7, and the heat of the CPU 7 is transmitted to the lower case 3 via the heat conductive plate spring 9.

The present invention is not limited to the embodiments described above and shown in the drawings, and can be expanded or changed as follows.
The shape memory spring means is not limited to the configuration heated by the atmosphere, and the shape memory spring means may be directly heated by the cooling target component by bringing the shape memory spring means into contact with the cooling target component.
The shape memory spring means may lose its elastic force when a predetermined temperature is exceeded. In this case, the heat conducting leaf spring 9 is formed so as to urge the heat receiving piece portion 9c in a direction in contact with the CPU 7 by its own elastic force, and the shape memory spring means is used as the heat receiving piece of the heat conducting leaf spring 9. For example, it is configured as a coil spring hung between the portion 9 c and the bottom of the lower case 3. And the shape memory spring means which consists of a coil spring is set as the structure which produces the elastic force when it becomes below predetermined temperature, and urges | biases the heat receiving piece part 9c of the heat conductive leaf | plate spring 9 away from CPU7.

The parts to be cooled are not limited to those housed in the case, but may be electronic parts or electronic parts exposed to the atmosphere. In this case, for example, the cooling target component is cooled by contacting an aluminum heat sink, and when the cooling target component reaches a predetermined temperature that requires cooling, the shape memory spring means generates elasticity. The heat sink is configured to be in contact with the part to be cooled or separated from the part to be cooled.
The heat conducting member may be made of a material having no spring property. In this case, the biasing means is constituted by a separate spring.
The component to be cooled is not necessarily limited to the surface mount type electronic component.
The component to be cooled is not limited to the CPU 7 and may be another electronic component. Moreover, the parts to be cooled are not limited to electronic parts, and may be electrical parts such as capacitors and transformers.

Sectional drawing which shows one Embodiment of this invention and shows the state which separated the heat conductive sheet of the heat conductive leaf | plate spring from the components to be cooled. Sectional view showing the heat conductive sheet of the heat conductive leaf spring in contact with the component to be cooled Sectional view of the case containing the parts to be cooled Broken perspective view showing the inside of the case Exploded perspective view Sectional drawing of the principal part which shows other embodiment of this invention. Perspective view of main parts

Explanation of symbols

  In the figure, 2 is a case, 6 is a printed circuit board, 7 is a CPU (component to be cooled), 7a is a solder ball (connection terminal), 8 is a heat dissipation device, 9 is a heat conductive leaf spring (heat conductive member), 10 is A shape memory leaf spring (shape memory spring means), 12 is a heat conductive sheet, 13 is a shape memory coil spring (shape memory spring means), and 14 is a holder.

Claims (6)

In a heat dissipation device configured to transmit heat of the cooling target component to the heat conductive member by bringing the heat conductive member into contact with the cooling target component consisting of an electronic component or an electrical component,
A biasing means that constantly exerts a biasing force in one direction out of a direction in which the heat conduction member is in contact with the component to be cooled and a direction in which the heat conduction member is separated from the component to be cooled, and when a predetermined temperature is reached. A shape memory spring means made of a shape memory material that deforms into the shape memorized and exerts a biasing force in the other direction,
The heat radiating device according to claim 1, wherein the heat conducting member is brought into contact with or separated from the object to be cooled by being deformed into a shape memorized by the shape memory spring means. In a heat dissipation device configured to transmit heat of the cooling target component to the heat conductive member by bringing the heat conductive member into contact with the cooling target component consisting of an electronic component or an electrical component,
An urging means for urging the heat conducting member in a direction away from the component to be cooled;
The urging force of the urging means is provided in contact with the cooling target component or in the vicinity of the cooling target component. And a shape memory spring means made of a shape memory material for bringing the heat conducting member into contact with the part to be cooled against the heat radiation device. In a heat dissipation device configured to transmit heat of the cooling target component to the heat conductive member by bringing the heat conductive member into contact with the cooling target component consisting of an electronic component or an electrical component,
An urging means for urging the heat conducting member in a direction to contact the component to be cooled;
Provided in contact with the cooling target component or in the vicinity of the cooling target component and when the temperature falls below a predetermined temperature, it is deformed into a memorized shape to generate a resilient force against the biasing force of the biasing means. And a shape memory spring means made of a shape memory material for separating the heat conducting member from the component to be cooled.   The heat conducting member is made of a spring material, and is also used as the urging means, and when the shape memory spring means is below the predetermined temperature, it is displaced in a direction away from the cooling target component by its own elastic force. The heat dissipating device according to claim 2.   The heat conducting member is made of a spring material, and is also used as the urging means, and when the shape memory spring means exceeds the predetermined temperature, it is displaced in a direction in contact with the component to be cooled by its own elastic force. The heat dissipating device according to claim 3.   6. The heat dissipation device according to claim 1, wherein the component to be cooled is a surface-mount type semiconductor device in which a large number of connection terminals for connecting to a printed wiring board are arranged on the bottom surface.

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