JPH0582667A - Wiring board having lead - Google Patents

Abstract

PURPOSE:To provide a wiring board having a lead which has a minute lead superior in connection reliability and which can be miniaturized. CONSTITUTION:An insulating layer 12 and a conductive layer 13 are successively laminated on a metallic base substrate 11 to form a wiring layer 17, and also from a region 16 to be obtained by etching the metallic base substrate 11 and removing the periphery, a signal-leading lead 15 is led.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board with leads having fine leads.

[0002]

2. Description of the Related Art FIGS. 5 and 6 are schematic views of a conventional clip-on lead system and a lead frame system for a wiring board with leads, which are shown in, for example, the Semiconductor Handbook (Ohm Co., Ltd.) (published in the second edition, 5th edition of 1985). It is a figure which each shows a structure. In each figure, 1 is a base substrate made of an insulator, 2 is a multilayer wiring layer formed on the base substrate 1,
Reference numeral 3 is a lead for signal extraction. The conventional wiring board with leads having the above-described structure is prepared by first using the base substrate 1
After the multi-layered wiring layer 2 is formed thereon, the signal lead-out lead 3 is connected to a pad (not shown) arranged in the peripheral portion of the substrate by soldering or the like.

[0003]

The conventional wiring board with leads is constructed as described above, and is formed on the board for connecting the signal lead-out leads 3 by using solder after forming the wiring board. From the viewpoints of the alignment between the pads and the signal lead-out leads 3, the short-circuiting between the pads, the reliability of the connecting work, etc., the connection portion between the wiring board and the signal lead-out leads 3 is miniaturized, namely There was a problem that miniaturization was difficult.

The present invention has been made in order to solve the above problems, and by forming a wiring layer on a metal substrate to be a lead by a partial etching process, it is fine and has excellent connection reliability. It is an object of the present invention to provide a leaded wiring board having leads and capable of being miniaturized.

[0005]

[Means for Solving the Problems] Claim 1 according to the present invention
The wiring board with leads, a metal base substrate, an insulating layer having a via hole formed in a predetermined pattern on the surface of the metal base substrate, a conductor layer formed in a predetermined pattern on the insulating layer, A signal lead-out lead formed by pulling out from a region obtained by removing the periphery of the metal base substrate by etching from the back side, and the wiring board with leads according to claim 2. In the first aspect, an insulating layer and a conductor layer are sequentially formed on the back surface side of the metal base substrate, and the wiring board with leads of the third aspect has the periphery thereof removed by etching the metal base substrate in the first aspect. Power the other parts except the area obtained by
The lead for pulling out the ground layer.

[0006]

The signal lead-out lead of the wiring board with leads according to the present invention is formed by pulling out from the region obtained by removing the periphery of the metal base substrate by etching from the back surface side, and pulling out the power supply and ground layers. The lead for use is formed by drawing from the other portion except the region obtained by removing the periphery of the metal base substrate by etching.

[0007]

EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view showing the structure of a wiring board with leads according to Embodiment 1 of the present invention, and FIG. 2 is a diagram showing a manufacturing process of the wiring board in FIG. In the figure, 11
Is a metal base substrate made of metal, 12 is this metal base substrate
11 insulating layer having a via hole formed in a predetermined pattern on the surface, 13 is a conductor layer formed on this insulating layer 12,
Reference numeral 15 is a signal lead-out lead drawn out from a region 16 obtained by partially etching and removing the metal base substrate 11 from the back surface side, and 17 is a wiring layer composed of an insulating layer 12 and a conductor layer 13.

Next, a manufacturing process of the conventional wiring board with leads constructed as described above will be described with reference to FIG.
First, as shown in FIG. 2 (B), an insulating material such as polyimide is applied on a metal base substrate 11 made of a metal that can be used as a lead material as shown in FIG. 2 (A) to form a predetermined pattern. The insulating layer 12 is formed. Next, as shown in FIG. 2C, a conductor material such as copper is fixed on the insulating layer 12 by plating or sputtering to form a conductor layer 13. If necessary, as shown in FIG. 2D, a plurality of insulating layers 12 and conductor layers 13 are sequentially formed. The wiring layer 17 is formed at this stage.

Finally, the metal base substrate 11 is partially removed from the back surface side by etching, and the signal lead 15 is formed in a part of the region 16 (shown in FIG. 1) obtained by the removal. In the leaded wiring board in the above-mentioned one example manufactured in this manner,
No special pad is required on the wiring board for connection with the signal lead 15 and the wiring board and the signal lead 15 are connected through a fine via hole. It becomes possible to miniaturize. Further, since the wiring layer 17 is formed directly on the metal base substrate 11 by plating, sputtering, etc., the connection reliability between the signal lead-out lead 15 and the via hole of the wiring layer 17 is high.

Embodiment 2. In the first embodiment, the case where the wiring layer 17 has only one side has been described, but the wiring layer 17 can be formed on both sides of the metal base substrate 11 serving as a lead via via holes. That is, in the manufacturing process, as shown in FIG. 3, first, on the other surface of the lead-attached wiring board in Example 1 in which the wiring layer 17 is formed on one surface of the metal base substrate 11, FIG. As shown in (D), the insulating layer 12 and the conductor layer 13 are sequentially repeated to form a wiring layer.
Even if 17 is formed, it goes without saying that the same effect as that of the first embodiment can be obtained, and further downsizing can be achieved by forming the wiring layer 17 on both surfaces of the metal base substrate 11.

Embodiment 3. In each of the above-described embodiments, the metal base substrate 11 is used only as the signal lead-out lead 15. However, as shown in FIG. 4, from the other portion 18 excluding the region 16 used as the signal lead-out lead 15. It is also possible to pull out the leads 19 for pulling out the power supply and the ground layer.

[0012]

As described above, according to the present invention, an insulating layer and a conductor layer are sequentially stacked on a metal base substrate to form a wiring layer, and the periphery of the metal base substrate is removed by etching. Since the signal lead-out lead is drawn out from the region obtained as described above, there is an effect that it is possible to provide a leaded wiring board which has a fine lead and is excellent in connection reliability and which can be miniaturized.

[Brief description of drawings]

FIG. 1 is a perspective view showing a wiring board with leads according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing process of the wiring board with leads in FIG.

FIG. 3 is a diagram showing a manufacturing process of a wiring board with leads according to a second embodiment of the present invention.

FIG. 4 is a perspective view showing a wiring board with leads according to a third embodiment of the present invention.

FIG. 5 is a view showing a conventional wiring board with a clip-on-lead type lead.

FIG. 6 is a view showing a conventional lead frame type wiring board with leads.

[Explanation of symbols]

 11 Metal base substrate 12 Insulation layer 13 Conductor layer 15 Signal lead-out lead 16 Area 17 Wiring layer 18 Area 19 Power supply / ground layer lead-out lead

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[Procedure amendment]

[Submission date] November 30, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 3

[Correction method] Change

[Correction content]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

[0005]

[Means for Solving the Problems] Claim 1 according to the present invention
The wiring board with leads, a metal base substrate, an insulating layer having a via hole formed in a predetermined pattern on the surface of the metal base substrate, a conductor layer formed in a predetermined pattern on the insulating layer, Corresponding to via holes on the surface of the metal base substrate by etching the metal base substrate from the back side
And a signal lead-out lead formed by pulling out from a region obtained by removing the periphery of the portion , and the wiring board with leads according to claim 2 is the back surface of the metal base substrate according to claim 1. An insulating layer and a conductor layer are sequentially formed also on the side, and the leaded wiring board according to claim 3 is the via hole formed on the surface of the metal base board by etching the metal base board according to claim 1.
Other parts except the region obtained by removing the peripheries of the corresponding parts are used as leads for drawing out the power supply and ground layers.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction content]

[0006]

According to the present invention, the signal lead-out lead of the wiring board with leads is formed from the region obtained by removing the periphery of the portion corresponding to the via hole on the front surface of the metal base substrate by etching the metal base substrate from the rear surface side. drawer is formed, also pulled out lead of the power supply and the ground layer, the metal base by etching of the metal base substrate
It is formed by drawing from other parts except the region obtained by removing the periphery of the via hole corresponding part on the substrate surface .

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction content]

Embodiment 3. Each of the above embodiments, although only utilizes a metal base substrate 11 as the signal lead-out leads 15, as shown in FIG. 4, the other portion 18 excluding the region 16 to be used as a signal lead-out lead 15 Power and
It is also possible to draw out the lead 19 for drawing out as a ground layer .

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location H05K 1/11 C 6736-4E 3/44 B 8727-4E 3/46 Z 6921-4E 7352-4M H01L 23/14 R

Claims (3)

[Claims] 1. A metal base substrate, an insulating layer having a via hole formed in a predetermined pattern on the surface of the metal base substrate, a conductor layer formed in a predetermined pattern on the insulating layer, and the metal described above. A wiring board with leads, comprising: a signal drawing lead formed by drawing from a region obtained by removing the periphery of the base substrate from the back side by etching. 2. The wiring board with leads according to claim 1, wherein an insulating layer and a conductor layer are sequentially formed on the back surface side of the metal base substrate. 3. The lead according to claim 1, wherein other portions except a region obtained by removing the periphery of the metal base substrate by etching are used as leads for drawing out the power source and the ground layer. Wiring board.