JPH0577104A - Drilling method of glass backing fluororesin substrate - Google Patents

Drilling method of glass backing fluororesin substrate

Info

Publication number
JPH0577104A
JPH0577104A JP23965591A JP23965591A JPH0577104A JP H0577104 A JPH0577104 A JP H0577104A JP 23965591 A JP23965591 A JP 23965591A JP 23965591 A JP23965591 A JP 23965591A JP H0577104 A JPH0577104 A JP H0577104A
Authority
JP
Japan
Prior art keywords
drill bit
glass
drill
fluororesin substrate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23965591A
Other languages
Japanese (ja)
Inventor
Tsutomu Ichiki
勉 一木
Hideo Funo
秀雄 布野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23965591A priority Critical patent/JPH0577104A/en
Publication of JPH0577104A publication Critical patent/JPH0577104A/en
Pending legal-status Critical Current

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  • Drilling Tools (AREA)
  • Drilling And Boring (AREA)

Abstract

PURPOSE:To obtain a backing fluororesin substrate wherein the wall surface of a drilled hole possesses properties excellent in the performance of future plating without damaging a drill bit by using a drill of straight type wherein the shape of the drill bit is formed of a point angle 130-150 degrees and a twist angle 35-40 degrees. CONSTITUTION:A glass backing fluororesin substrate 1 having an internal layer circuit 6 is drilled with a drill whose diameter is 0.1-3.0mm. In this case, a drill of straight type whose drill bit is formed of a point angle 130-150 degrees, and a twist angle 35-40 degrees is used. Because of this, the glass backing fluororesin substrate 1 having such properties of the wall surface of the drilled hole as excellent in plating performance can be obtained without damaging the drill bit.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子部品、電気部分の
実装に用いられるガラス基材フッ素樹脂基板の穿孔法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a perforation method for a glass-based fluororesin substrate used for mounting electronic parts and electric parts.

【0002】[0002]

【従来の技術】誘電正接、誘電率の高周波特性や耐熱性
に優れた有機絶縁材料であるガラス基材フッ素樹脂基板
は、近年通信衛星分野、コンピューター分野などに広く
使用されてきている。
2. Description of the Related Art Glass-based fluororesin substrates, which are organic insulating materials having excellent dielectric loss tangent and dielectric constant high frequency characteristics and heat resistance, have been widely used in recent years in the fields of communication satellites and computers.

【0003】従来、エポキシ樹脂やポリイミド樹脂など
の樹脂基板の穿孔に用いられるドリルビットの形状はド
リル直径 0.1〜3.0 mmにおいては、先端角度110〜1
30°、捩角度25〜35°のアンダーカットタイプの
ものであった。その理由は、一般にドリルで穿孔する際
に、先端角度が大きくなるとドリル性能の中で切り粉形
状は剪断形になり、排出性、バリ、切削熱には良い効果
をもたらす反面、直進性には悪い影響を与える。捩角度
が大きくなると排出性、バリ、切削熱、耐摩耗性には良
い効果をもたらす反面、直進性、食い付き性には悪い影
響を与えることが知られており、先端角度及び捩角度を
極端に大きくすると直進性が損なわれたり、ドリルの破
損が生じたりするからである。また、ストレートタイプ
の形状のドリルビットを用いると多層プリント配線板の
スミアの問題が発生するからである。
Conventionally, the shape of a drill bit used for drilling a resin substrate such as epoxy resin or polyimide resin has a tip angle of 110 to 1 at a drill diameter of 0.1 to 3.0 mm.
It was an undercut type of 30 ° and a twist angle of 25 to 35 °. The reason is that generally when drilling with a drill, if the tip angle becomes large, the shape of the cutting chips becomes a shear shape in the drill performance, which is good for dischargeability, burr, and cutting heat, but it is not straightforward. Have a bad influence. It is known that when the twisting angle becomes large, it has a good effect on the discharging property, burr, cutting heat, and wear resistance, but it has a bad influence on the straight running property and the biting property. If it is too large, straightness will be impaired and the drill will be damaged. In addition, the use of a straight type drill bit causes a smear problem of the multilayer printed wiring board.

【0004】ガラス基材フッ素樹脂基板は、熱可塑性で
柔らかく、切削加工に関して切れが悪い性質を有してい
る。図4に従来の前記ドリルビットを使用して穿孔した
ガラス基材フッ素樹脂基板の断面図(左半分はガラス繊
維4を図示せず)を示す。ガラス繊維4からなるガラス
布基材にフッ素樹脂7を含浸、乾燥して得たプリプレグ
を積層成形して得た内層回路6を有する多層のガラス基
材フッ素樹脂基板1に従来の前記ドリルビットを使用し
て孔2を穿孔すると切り粉がドリルビットに巻き付きド
リルビットを破損する問題や孔2の内壁にガラス繊維の
突起物5が発生し、めっき層3が均一に付着しない問題
などを有していた。図5は孔2をさらに拡大してSEM
で観察した時の様子でありフッ素樹脂7中にガラス繊維
4が一部突起物5となっているのが認められた。
The glass-based fluororesin substrate is thermoplastic and soft, and has the property of being difficult to cut in cutting. FIG. 4 shows a cross-sectional view of a glass-based fluororesin substrate perforated using the conventional drill bit (the glass fiber 4 is not shown in the left half). A glass cloth substrate made of glass fibers 4 is impregnated with a fluororesin 7 and dried, and a prepreg obtained by laminating is laminated to form a multilayer glass base fluororesin substrate 1 having an inner layer circuit 6 and the conventional drill bit. When the hole 2 is drilled by using it, there is a problem that the cutting powder is wrapped around the drill bit and the drill bit is damaged, and the glass fiber protrusions 5 are generated on the inner wall of the hole 2 so that the plating layer 3 does not adhere uniformly. Was there. FIG. 5 shows the SEM with the hole 2 enlarged further.
It was observed under the condition of 1. and it was observed that the glass fibers 4 were partially formed as protrusions 5 in the fluororesin 7.

【0005】[0005]

【発明が解決しようとする課題】そこで本発明は、ドリ
ルビットを破損することなく、穿孔された孔の壁面が後
のめっき性に優れた性状を有するガラス基材フッ素樹脂
基板の穿孔法を提供することにある。
SUMMARY OF THE INVENTION Therefore, the present invention provides a method for boring a glass-based fluororesin substrate in which the wall surface of the bored hole has a property excellent in the subsequent plating property without damaging the drill bit. To do.

【0006】[0006]

【課題を解決するための手段】本発明は前記の問題点に
鑑みなされたものであり、その特徴は、ガラス基材フッ
素樹脂基板をドリル直径 0.1〜3.0mmで穿孔する際に、
ドリルビットの形状が先端角度130〜150°、捩角
度35〜40°のストレートタイプを用いることにあ
る。
The present invention has been made in view of the above problems, and its characteristic is that when a glass-based fluororesin substrate is drilled with a drill diameter of 0.1 to 3.0 mm,
The shape of the drill bit is to use a straight type having a tip angle of 130 to 150 ° and a screw angle of 35 to 40 °.

【0007】[0007]

【作用】先端角度を大きくし、ストレートタイプのドリ
ルビットを使用することによって、切り粉の形状が剪断
形になり、切り粉の巻き付きがなくなりドリルビットの
破損がなくなる。先端角度を大きくし、捩角度を大きく
しかつストレートタイプのドリルビットを使用すること
によって、ドリルビットの切削性、切り粉の排出性が向
上し、めっき性に優れた孔壁面が形成できる。
[Operation] By increasing the tip angle and using a straight type drill bit, the shape of the cutting chips becomes a shearing shape, the cutting chips are not wrapped around, and the drill bits are not damaged. By increasing the tip angle, increasing the twist angle, and using a straight type drill bit, the machinability of the drill bit and the discharge of chips are improved, and a hole wall surface with excellent plating properties can be formed.

【0008】このようなドリルビット形状を使用しても
ガラス基材フッ素樹脂基板は柔らかく、270〜350
℃とTgが高いために直進性が確保でき孔位置精度に優
れた穿孔ができ、ドリルビットの破損、ドリルビットの
摩耗、スミアの発生がないなどは従来と変わらない。
Even if such a drill bit shape is used, the glass-based fluororesin substrate is soft and is 270-350.
Since the temperature and Tg are high, straightness can be ensured, drilling with excellent hole position accuracy can be performed, and there is no damage to the drill bit, wear of the drill bit, no smear, etc.

【0009】[0009]

【実施例】以下、本発明のガラス基材フッ素樹脂基板の
穿孔法を実施例に基づいて説明する。なお、本発明はこ
れら実施例に限定されるものではない。
EXAMPLES The method for punching a glass-based fluororesin substrate of the present invention will be described below based on examples. The present invention is not limited to these examples.

【0010】ガラス基材フッ素樹脂基板としては、積層
板用に用いられるフッ素樹脂をそのまま用いることがで
きる。またフッ素樹脂に無機充填剤や有機充填剤さらに
は気泡などをそれぞれ単独、組み合わせ併用で含むこと
もできる。ガラス基材もガラス布、不織布に耐熱性に優
れた芳香族ポリアミドイミド骨格を有する有機繊維を含
むものを用いることができる。
As the glass-based fluororesin substrate, the fluororesin used for the laminated plate can be used as it is. Further, the fluororesin may contain an inorganic filler, an organic filler, bubbles, etc., either alone or in combination. As the glass substrate, a glass cloth or a non-woven cloth containing an organic fiber having an aromatic polyamideimide skeleton having excellent heat resistance can be used.

【0011】ドリルビットの材質についても特に限定す
るものではなく、通常積層板に使用されるものをそのま
ま用いることができる。
The material of the drill bit is not particularly limited, and the material normally used for laminated plates can be used as it is.

【0012】実施例1 ガラス基材フッ素樹脂基板として3.2mm厚の10層板
を使用し、この基板の上側に0.4mmの積層板と下側に
1.6mmの積層板を重ね合わせた後、次のドリルビット
で穿孔した。ドリルビットはその形状がドリル直径1.0m
mで先端角度130°、捩角度37°のストレートタイ
プのものを用い、穿孔条件60000r.p.m、50μm/rev、で
600 ヒットまで孔明けを実施した。その結果、孔壁面
にガラス繊維の突起物は認められなかった。この時の孔
の内壁状態をSEM観察したものを図1示す。内層回路
6の上下にガラス繊維4の束がフッ素樹脂7をバインダ
ーとして配列している。 孔詰まりは0/600で無く、切り粉の巻き付き量
はLが2mm、Hが0.5mmであった。なお、各結果の評
価方法は次の通りである。
Example 1 A 10-layer plate having a thickness of 3.2 mm was used as a glass substrate fluororesin substrate, and a 0.4 mm laminated plate was laminated on the upper side of this substrate and a 1.6 mm laminated plate was laminated on the lower side thereof. Then, it was perforated with the next drill bit. The shape of the drill bit is 1.0m in diameter.
Use a straight type with a tip angle of 130 ° and a twist angle of 37 ° at m, and drilling conditions of 60000r.pm and 50μm / rev.
Drilled up to 600 hits. As a result, no glass fiber protrusion was observed on the wall surface of the hole. FIG. 1 shows an SEM observation of the state of the inner wall of the hole at this time. A bundle of glass fibers 4 is arranged above and below the inner layer circuit 6 using the fluororesin 7 as a binder. The hole clogging was not 0/600, and the wrapping amount of cutting chips was 2 mm for L and 0.5 mm for H. The evaluation method for each result is as follows.

【0013】の孔内壁はSEM観察による。孔詰り
は目視観察による。切り粉の巻き付き量は切り粉の長
さLとし幅をHとして測寸した。
The inner wall of the hole is observed by SEM. The clogging of holes is observed visually. The wrapping amount of the cutting chips was measured with the length L of the cutting chips and the width H.

【0014】実施例2 実施例1のドリルビットの形状をドリル直径 1.0mmで先
端角度150°、捩角度40°のストレートタイプの形
状に換えた以外は実施例1と同様に実施した。その結
果、孔壁面にガラス繊維の突起物は認められなかっ
た。孔詰まりは0/600で無く、切り粉の巻き付
き量はLが1mm、Hが0.5mmであった。
Example 2 Example 1 was repeated except that the shape of the drill bit of Example 1 was changed to a straight type shape having a drill diameter of 1.0 mm, a tip angle of 150 ° and a screw angle of 40 °. As a result, no glass fiber protrusion was observed on the wall surface of the hole. The hole clogging was not 0/600, and the wrapping amount of the cutting chips was L 1 mm and H 0.5 mm.

【0015】比較例1 実施例1のドリルビットの形状をドリル直径 1.0mmで先
端角度118°、捩角度30°のストレートタイプの形
状に換えた以外は実施例1と同様に実施した。その結
果、孔壁面にガラス繊維の突起物が認められた。この
時の孔の壁面状態をSEM観察したものを図2示す。内
層回路6の上下にガラス繊維4の束が樹脂7をバインダ
ーとして配列し、ガラス繊維4の一部が所々で突起物5
として著しく起立していた。他のガラス繊維4も大半が
起立傾向にあった。孔詰まりは39/600であり、
切り粉の巻き付き量はLが10mm、Hが5mmであっ
た。
Comparative Example 1 The same procedure as in Example 1 was carried out except that the shape of the drill bit of Example 1 was changed to a straight type having a drill diameter of 1.0 mm, a tip angle of 118 ° and a screw angle of 30 °. As a result, glass fiber protrusions were observed on the wall surfaces of the holes. FIG. 2 shows an SEM observation of the wall surface state of the holes at this time. A bundle of glass fibers 4 is arranged above and below the inner layer circuit 6 using the resin 7 as a binder, and a part of the glass fibers 4 has protrusions 5 at some places.
As it was standing up remarkably. Most of the other glass fibers 4 also tended to stand. The hole clogging is 39/600,
The amount of cutting chips wrapped around was 10 mm for L and 5 mm for H.

【0016】比較例2 実施例1のドリルビットの形状をドリル直径 1.0mmで先
端角度118°、捩角度35°のアンダーカットタイプ
の形状に換えた以外は実施例1と同様に実施した。その
結果、孔壁面にガラス繊維の突起物が認められた。こ
の時の孔の壁面状態をSEM観察したものを図3示す。
内層回路6の上下にガラス繊維4の束が樹脂7をバイン
ダーとして配列し、ガラス繊維4の一部が所々で突起物
5として比較例1より著しく起立していた。他のガラス
繊維4も大半が起立傾向にあった。孔詰まりは28/
600であり、切り粉の巻き付き量はLが13mm、H
が7mmであった。
Comparative Example 2 The procedure of Example 1 was repeated except that the shape of the drill bit of Example 1 was changed to an undercut type having a drill diameter of 1.0 mm, a tip angle of 118 ° and a screw angle of 35 °. As a result, glass fiber protrusions were observed on the wall surfaces of the holes. FIG. 3 shows an SEM observation of the wall surface state of the holes at this time.
A bundle of glass fibers 4 was arranged above and below the inner layer circuit 6 using the resin 7 as a binder, and a part of the glass fibers 4 was remarkably erected as a protrusion 5 in comparison with Comparative Example 1. Most of the other glass fibers 4 also tended to stand. 28 / hole clogging
600, the amount of shavings wrapped around is 13 mm for L and H
Was 7 mm.

【0017】以上から、実施例は比較例に比べて孔壁面
のガラス繊維の突出が無く、孔詰まりも無く、切り粉の
巻き付き量も少ないことが確認できた。
From the above, it was confirmed that the glass fiber of the example did not protrude from the wall surface of the hole, the hole was not clogged, and the amount of the cutting dust was smaller than that of the comparative example.

【0018】[0018]

【発明の効果】本発明によって、ドリルビットを破損す
ることなく、穿孔された孔の壁面が後のめっき性に優れ
た性状を有するガラス基材フッ素樹脂基板を得ることが
できる。
According to the present invention, it is possible to obtain a glass-based fluororesin substrate in which the wall surface of the drilled hole has a property excellent in the subsequent plating property without damaging the drill bit.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例で穿孔した孔の壁面を示す拡
大図である。
FIG. 1 is an enlarged view showing a wall surface of a hole punched in an embodiment of the present invention.

【図2】一比較例の穿孔した孔の壁面を示す拡大図であ
る。
FIG. 2 is an enlarged view showing a wall surface of a perforated hole of a comparative example.

【図3】他の比較例の穿孔した孔の壁面を示す拡大図で
ある。
FIG. 3 is an enlarged view showing a wall surface of a hole punched in another comparative example.

【図4】従来例で穿孔したガラス基材フッ素樹脂基板を
示す断面図である。
FIG. 4 is a cross-sectional view showing a glass-based fluororesin substrate punched in a conventional example.

【図5】一従来例の穿孔した孔の壁面を示す拡大図であ
る。
FIG. 5 is an enlarged view showing a wall surface of a hole drilled in a conventional example.

【符号の説明】[Explanation of symbols]

1 ガラス基材フッ素樹脂基板 2 孔 3 めっき層 4 ガラス繊維 5 ガラス繊維の突起部 6 内層回路 7 フッ素樹脂 1 Glass Base Fluororesin Substrate 2 Hole 3 Plating Layer 4 Glass Fiber 5 Protrusion of Glass Fiber 6 Inner Layer Circuit 7 Fluororesin

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ガラス基材フッ素樹脂基板をドリル直径
0.1〜3.0mmで穿孔する際に、ドリルビットの形状が先
端角度130〜150°、捩角度35〜40°のストレ
ートタイプを用いることを特徴とするガラス基材フッ素
樹脂基板の穿孔法。
1. A glass-based fluororesin substrate having a drill diameter
A drilling method for a glass-based fluororesin substrate, characterized in that, when drilling with a diameter of 0.1 to 3.0 mm, the drill bit is a straight type having a tip angle of 130 to 150 ° and a screw angle of 35 to 40 °.
JP23965591A 1991-09-19 1991-09-19 Drilling method of glass backing fluororesin substrate Pending JPH0577104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23965591A JPH0577104A (en) 1991-09-19 1991-09-19 Drilling method of glass backing fluororesin substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23965591A JPH0577104A (en) 1991-09-19 1991-09-19 Drilling method of glass backing fluororesin substrate

Publications (1)

Publication Number Publication Date
JPH0577104A true JPH0577104A (en) 1993-03-30

Family

ID=17047937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23965591A Pending JPH0577104A (en) 1991-09-19 1991-09-19 Drilling method of glass backing fluororesin substrate

Country Status (1)

Country Link
JP (1) JPH0577104A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016063133A (en) * 2014-09-19 2016-04-25 日立化成株式会社 Wiring board and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016063133A (en) * 2014-09-19 2016-04-25 日立化成株式会社 Wiring board and method of manufacturing the same

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