JPH0575292A - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPH0575292A JPH0575292A JP3232700A JP23270091A JPH0575292A JP H0575292 A JPH0575292 A JP H0575292A JP 3232700 A JP3232700 A JP 3232700A JP 23270091 A JP23270091 A JP 23270091A JP H0575292 A JPH0575292 A JP H0575292A
- Authority
- JP
- Japan
- Prior art keywords
- suction nozzle
- electronic component
- suction
- cleaning
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を吸着ノズル
で吸着して、移動し、プリント基板上の所定位置に、こ
の電子部品を装着する電子部品装着装置に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for sucking and moving an electronic component by a suction nozzle and mounting the electronic component at a predetermined position on a printed circuit board.
【０００２】[0002]
【従来の技術】従来の電子部品装着装置の一例を、図６
に基づいて説明する。2. Description of the Related Art An example of a conventional electronic component mounting apparatus is shown in FIG.
It will be explained based on.
【０００３】図６において、間歇回転する回転テーブル
５１の周縁に、昇降可能な複数のロッド５２が、間歇回
転ピッチに合わせて等間隔に配置され、ロッド５２の先
端に、電子部品を吸着する吸着ノズル５３が設けられて
いる。回転テーブル５１上には、各吸着ノズル５３毎
に、吸着ノズル５３に対する真空回路のオン・オフ切替
えを行うメカニカルバルブ５４が配設されている。回転
テーブル５１の横に部品供給部５６が設けられ、この部
品供給部５６上に、複数の部品供給手段５５が移動可能
に取り付けられ、この部品供給手段５５は指定順に移動
して、吸着ノズル５３が電子部品を吸着する部品吸着位
置に、電子部品を供給する。一方、電子部品を装着され
るべき回路基板５７は、Ｘ−Ｙテーブル５８上に固定さ
れ、このＸ−Ｙテーブル５８は、回路基板５７をＸ−Ｙ
方向に移動させて、部品装着位置にある吸着ノズル５３
の下に、回路基板の所定位置をセットする。In FIG. 6, a plurality of rods 52 that can be raised and lowered are arranged at equal intervals on the periphery of a rotary table 51 that intermittently rotates, and the tip of the rod 52 sucks an electronic component by suction. A nozzle 53 is provided. On the rotary table 51, for each suction nozzle 53, a mechanical valve 54 for switching on / off of a vacuum circuit for the suction nozzle 53 is arranged. A component supply unit 56 is provided beside the rotary table 51, and a plurality of component supply units 55 are movably mounted on the component supply unit 56. The component supply units 55 move in a designated order to pick up the suction nozzles 53. Supplies the electronic component to the component suction position where the electronic component is sucked. On the other hand, the circuit board 57 to which electronic parts are to be mounted is fixed on the XY table 58, and the XY table 58 holds the circuit board 57 in the XY direction.
The suction nozzle 53 in the component mounting position
Underneath, set the predetermined position of the circuit board.
【０００４】[0004]
【発明が解決しようとする課題】近年、電子部品装着装
置が装着する電子部品の微小化が進み、それに伴って、
吸着ノズル５３の開口部も小さくなった。その結果、吸
着ノズル５３の開口部に埃、クリーム半田、接着剤等が
詰まり易くなり、装着動作を中断して、吸着ノズル５３
を取り外して、アルコール等の洗浄液と針状の道具とを
用いて、吸着ノズル５３の開口部に詰まっている物質を
取り除く作業の頻度が高くなり、電子部品装着装置の稼
働率が低下するという問題点を有していた。In recent years, electronic components mounted by the electronic component mounting apparatus have been miniaturized, and accordingly,
The opening of the suction nozzle 53 also became smaller. As a result, the opening of the suction nozzle 53 is easily clogged with dust, cream solder, adhesive, etc., so that the mounting operation is interrupted and the suction nozzle 53 is stopped.
Problem that the work of removing the substance clogged in the opening of the suction nozzle 53 by using the cleaning liquid such as alcohol and the needle-shaped tool is removed, and the operation rate of the electronic component mounting apparatus is reduced. Had a point.
【０００５】本発明は、上記の課題を解決し、吸着ノズ
ルの詰まりによる不良品発生を減少し、吸着ノズルの詰
まりによる稼働率の低下を防止し、省力化できる電子部
品装着装置を提供することをその課題としている。The present invention provides an electronic component mounting apparatus which solves the above problems, reduces the occurrence of defective products due to clogging of suction nozzles, prevents a decrease in operating rate due to clogging of suction nozzles, and saves labor. Is the task.
【０００６】[0006]
【課題を解決するための手段】本発明の電子部品装着装
置は、上記の課題を解決するために、部品を供給する複
数の部品供給手段を保持すると共に、この複数の部品供
給手段を指定順に、電子部品吸着位置に移動させる可動
台を有する部品供給部と、この電子部品吸着位置に移動
してきた前記部品供給手段から部品を吸着し、電子部品
装着位置に移動して、吸着した部品を、回路基板の所定
位置に装着する吸着ノズルを備えた複数の装着ヘッドと
を具備した電子部品装着装置において、前記部品供給部
の前記可動台上に、超音波洗浄槽を備えた超音波洗浄装
置を設け、この超音波洗浄槽を、吸着ノズル洗浄時に、
前記電子部品吸着位置に移動し、吸着ノズルを洗浄する
ようにしたことを特徴とする。In order to solve the above-mentioned problems, an electronic component mounting apparatus of the present invention holds a plurality of component supply means for supplying a component, and the plurality of component supply means in a designated order. , A component supply unit having a movable base for moving to the electronic component suction position, and sucks the component from the component supply means that has moved to the electronic component suction position, moves to the electronic component mounting position, and sucks the sucked component, An electronic component mounting apparatus including a plurality of mounting heads having suction nozzles mounted at predetermined positions on a circuit board, wherein an ultrasonic cleaning apparatus including an ultrasonic cleaning tank is provided on the movable table of the component supply unit. This ultrasonic cleaning tank, when cleaning the suction nozzle,
It is characterized in that the suction nozzle is moved to the electronic component suction position to wash the suction nozzle.
【０００７】又、吸着ノズルの吸着不良発生データか
ら、吸着ノズルの汚染又は詰まり等に対する吸着ノズル
洗浄の要否を判断し、吸着ノズルの洗浄が必要と判断し
た場合に、又は、定期的或いは一定吸着回数毎に、電子
部品の装着動作を中断し、洗浄が必要な吸着ノズルを洗
浄し、洗浄後、装着動作を再開するようにした制御部を
設けることが好適である。Further, it is judged from the data of occurrence of suction failure of the suction nozzle whether or not the suction nozzle needs to be cleaned due to contamination or clogging of the suction nozzle, and when it is determined that the suction nozzle needs to be cleaned, or periodically or regularly. It is preferable to provide a control unit that interrupts the mounting operation of the electronic component, cleans the suction nozzle that needs to be cleaned, and restarts the mounting operation after cleaning each time the suction operation is performed.
【０００８】[0008]
【作用】本発明の電子部品装着装置は、洗浄槽を、部品
供給部に移動可能に配設しているので、洗浄のためのス
テーションを別に設ける必要がなく、容易に導入でき
る。又、適切な時期に自動的に吸着ノズルの洗浄を行う
ので、省力化が可能で、且つ、稼働率の向上を計れる。In the electronic component mounting apparatus of the present invention, since the cleaning tank is movably arranged in the component supply section, it is not necessary to separately provide a cleaning station, and the electronic component mounting apparatus can be easily introduced. Further, since the suction nozzle is automatically cleaned at an appropriate time, labor can be saved and the operation rate can be improved.
【０００９】[0009]
【実施例】本発明の一実施例を、図１から図５に基づい
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to FIGS.
【００１０】図１から図３において、回転テーブル１
は、インデックスユニット２によって間歇回転する。回
転テーブル１の周縁には、間歇回転ピッチに等しい間隔
で、等間隔に複数の装着ヘッド３が配設されている。装
着ヘッド３の下端部には電子部品を吸着する吸着ノズル
４が設けられている。各装着ヘッド３は、昇降ガイド５
にて昇降自在に支持され、且つ、カムフォロワ７を介し
て円筒カム６に係合し、回転テーブル１の各間歇回転位
置に応じて、その上下位置が規制されている。円筒カム
６の電子部品吸着位置Ａ及び電子部品装着位置Ｂに対応
する部分は、昇降自在なスライダ８にて構成されてい
る。このスライダ８の上端部は、昇降用カム・レバー機
構９に係合し、このスライダ８は装着ヘッド３と共に、
電子部品の吸着時及び装着時に昇降する。1 to 3, the rotary table 1
Are intermittently rotated by the index unit 2. A plurality of mounting heads 3 are arranged on the peripheral edge of the rotary table 1 at equal intervals with an intermittent rotation pitch. A suction nozzle 4 for sucking an electronic component is provided at the lower end of the mounting head 3. Each mounting head 3 has a lifting guide 5
Is supported so as to be able to move up and down, is engaged with the cylindrical cam 6 via the cam follower 7, and its vertical position is regulated according to each intermittent rotation position of the rotary table 1. A portion of the cylindrical cam 6 corresponding to the electronic component suction position A and the electronic component mounting position B is composed of a slider 8 which can be raised and lowered. The upper end of the slider 8 engages with the lifting cam / lever mechanism 9, and the slider 8 together with the mounting head 3
It moves up and down when picking up and mounting electronic parts.
【００１１】回転テーブル１の間歇回転による装着ヘッ
ド３の停止位置の或る一つの位置側に、部品供給部１０
が配設されている。この停止位置が、電子部品吸着位置
Ａである。又、装着ヘッド３の停止位置の他の一つの側
に、Ｘ−Ｙテーブル１２が配設されている。このＸ−Ｙ
テーブル１２は、電子部品を装着されるべき回路基板１
１を保持して、この回路基板１１の指定の装着位置を、
前記装着ヘッド３の停止位置の他の一つの位置に位置す
るように位置決めする。この停止位置が電子部品装着位
置Ｂである。The component supply unit 10 is provided at one position side of the stop position of the mounting head 3 due to the intermittent rotation of the rotary table 1.
Are arranged. This stop position is the electronic component suction position A. Further, an XY table 12 is arranged on the other side of the stop position of the mounting head 3. This XY
The table 12 is a circuit board 1 on which electronic components are to be mounted.
1 is held and the designated mounting position of the circuit board 11 is
The mounting head 3 is positioned so as to be positioned at another position other than the stop position. This stop position is the electronic component mounting position B.
【００１２】部品供給部１０は、ガイドレール１３に沿
って移動し任意の位置に位置決め可能な可動台１４上に
設けられ、この部品供給部１０には、多数の部品供給手
段１５が、前記可動台１４の移動方向に並列して設置さ
れ、任意の部品供給手段１５が電子部品吸着位置Ａに指
定順に移動し位置決めされるように構成されている。The component supply unit 10 is provided on a movable base 14 which can move along the guide rails 13 and can be positioned at an arbitrary position. In the component supply unit 10, a large number of component supply means 15 are movable. It is arranged in parallel in the moving direction of the table 14, and is configured so that an arbitrary component supply means 15 is moved and positioned at the electronic component suction position A in a designated order.
【００１３】そして、この移動台１４の一側部に、超音
波洗浄槽２１を備えた超音波洗浄装置１６が設置されて
いる。又、洗浄後の吸着ノズル４を乾燥させるための乾
燥装置１７を吸着ノズル４の他の停止位置の真下に設置
する。An ultrasonic cleaning device 16 having an ultrasonic cleaning tank 21 is installed on one side of the moving table 14. Further, a drying device 17 for drying the suction nozzle 4 after cleaning is installed directly below another stop position of the suction nozzle 4.
【００１４】次に、装着動作を説明する。Next, the mounting operation will be described.
【００１５】回転テーブル１が回転・停止して、装着ヘ
ッド３が電子部品吸着位置Ａで停止すると、昇降用カム
・レバー機構９によって、スライダ８を介して、装着ヘ
ッド３が下降し、吸着ノズル４が電子部品を吸着し、装
着ヘッド３が上昇する。この上昇後、回転テーブル１が
回転する。When the rotary table 1 rotates and stops, and the mounting head 3 stops at the electronic component suction position A, the mounting cam 3 is lowered by the elevating cam / lever mechanism 9 via the slider 8 and the suction nozzle. 4 picks up electronic components, and the mounting head 3 rises. After this ascent, the turntable 1 rotates.
【００１６】電子部品を吸着した装着ヘッド３が、電子
部品装着位置Ｂに来たときに、回転テーブル１が停止す
る。電子部品装着位置Ｂに停止した装着ヘッド３は、ス
ライダ８を介して、昇降用カム・レバー機構９によっ
て、下降し、吸着ノズル４に吸着されている電子部品
を、Ｘ−Ｙテーブル１２によって位置決めされている回
路基板１１の所定位置に装着する。装着後、装着ヘッド
３が上昇し、回転テーブル１が回転する。When the mounting head 3 sucking the electronic component reaches the electronic component mounting position B, the rotary table 1 stops. The mounting head 3 stopped at the electronic component mounting position B is lowered by the elevating cam / lever mechanism 9 via the slider 8 and the electronic component sucked by the suction nozzle 4 is positioned by the XY table 12. The circuit board 11 is mounted at a predetermined position. After mounting, the mounting head 3 rises and the turntable 1 rotates.
【００１７】以上の電子部品装着動作を繰り返すことに
よって、回路基板１１上に電子部品を順次装着する。By repeating the above electronic component mounting operation, electronic components are sequentially mounted on the circuit board 11.
【００１８】上記のような、電子部品装着装置の装着過
程において、図３に示す電子部品装着装置の制御部２８
が管理する各吸着ノズル４の吸着不良発生データから、
その制御部２８が、吸着ノズル４の汚染又は詰まり等に
対するノズル洗浄の要否を判断し、その吸着ノズル４の
洗浄が必要と判断した場合、例えば、吸着不良回数が一
定数を越えたり、特定の吸着ノズル４に不良が集中して
発生するような場合に、制御部２８が、その吸着ノズル
４に詰まりが発生したと判断して、部品装着動作を中断
し、吸着ノズル洗浄動作に切り替える。In the mounting process of the electronic component mounting apparatus as described above, the control unit 28 of the electronic component mounting apparatus shown in FIG.
From the suction failure occurrence data of each suction nozzle 4 managed by
When the control unit 28 determines whether or not the suction nozzle 4 needs to be cleaned for contamination or clogging of the suction nozzle 4 and determines that the suction nozzle 4 needs to be cleaned, for example, the number of suction defects exceeds a certain number or is specified. When defects are concentrated on the suction nozzle 4, the control unit 28 determines that the suction nozzle 4 is clogged, interrupts the component mounting operation, and switches to the suction nozzle cleaning operation.
【００１９】吸着ノズル洗浄動作に切り替わると、部品
供給部１０において、可動台１４を移動させて、超音波
洗浄装置１６の超音波洗浄槽２１を電子部品吸着位置Ａ
に位置させる。そして、電子部品吸着動作と同様に、装
着ヘッド３を降下させることによって、吸着ノズル４
を、超音波洗浄装置１６の超音波洗浄槽２１に浸漬し、
超音波洗浄し、更に、乾燥装置１７によって乾燥する。When the operation is switched to the suction nozzle cleaning operation, in the component supply unit 10, the movable base 14 is moved to move the ultrasonic cleaning tank 21 of the ultrasonic cleaning device 16 to the electronic component suction position A.
Located in. Then, like the electronic component suction operation, the suction head 4 is lowered by lowering the mounting head 3.
Is immersed in the ultrasonic cleaning tank 21 of the ultrasonic cleaning device 16,
Ultrasonic cleaning is performed, and further drying is performed by the drying device 17.
【００２０】次に、吸着ノズル４の洗浄工程を、図４と
図５のフローチャートに基づいて説明する。Next, the cleaning process of the suction nozzle 4 will be described with reference to the flow charts of FIGS.
【００２１】図４において、超音波洗浄槽２１は、超音
波洗浄槽昇降装置２２によって支持されて昇降する。洗
浄液タンク２３には、供給ポンプ２４と排出ポンプ２７
とがあり、供給ポンプ２４は洗浄液タンク２３の洗浄液
を超音波洗浄槽２１に供給し、排出ポンプ２７は超音波
洗浄槽２１から洗浄液を洗浄液タンク２３に戻す。液面
センサ２５は超音波洗浄槽２１の洗浄液の液面を検知し
て、その液面を一定レベルに保つようにし、超音波発生
器２６は超音波を発生して吸着ノズル４を超音波洗浄す
る。In FIG. 4, the ultrasonic cleaning tank 21 is supported by an ultrasonic cleaning tank elevating device 22 and moves up and down. The cleaning liquid tank 23 includes a supply pump 24 and a discharge pump 27.
Therefore, the supply pump 24 supplies the cleaning liquid in the cleaning liquid tank 23 to the ultrasonic cleaning tank 21, and the discharge pump 27 returns the cleaning liquid from the ultrasonic cleaning tank 21 to the cleaning liquid tank 23. The liquid level sensor 25 detects the liquid level of the cleaning liquid in the ultrasonic cleaning tank 21 and keeps the liquid level at a constant level, and the ultrasonic generator 26 generates ultrasonic waves to ultrasonically clean the adsorption nozzle 4. To do.
【００２２】図５のステップ＃１において、吸着ノズル
洗浄動作に切り替わると、部品供給部１０上で、その一
側部に超音波洗浄装置１６を配した可動台１４を移動し
て、超音波洗浄槽２１を電子部品吸着位置Ａに位置決め
し、ステップ＃２に進む。In step # 1 of FIG. 5, when the suction nozzle cleaning operation is switched to, the movable table 14 having the ultrasonic cleaning device 16 on one side thereof is moved on the component supply section 10 to perform ultrasonic cleaning. The tank 21 is positioned at the electronic component suction position A, and the process proceeds to step # 2.
【００２３】ステップ＃２において、超音波洗浄槽２１
が、吸着ノズル４が下降したとき、吸着ノズル４の先端
部が超音波洗浄槽２１の洗浄液に浸漬するように、少し
上昇し、ステップ＃３に進む。In step # 2, the ultrasonic cleaning tank 21
However, when the suction nozzle 4 descends, the tip of the suction nozzle 4 slightly rises so as to be immersed in the cleaning liquid in the ultrasonic cleaning tank 21, and the process proceeds to step # 3.
【００２４】ステップ＃３において、吸着ノズル４が下
降し、ステップ＃４に進む。At step # 3, the suction nozzle 4 descends, and the process proceeds to step # 4.
【００２５】ステップ＃４において、詰まっている物質
の除去を促すために、吸着ノズル４からエアの排出を始
め、ステップ＃５に進む。In step # 4, in order to promote the removal of the clogged substance, the discharge of air from the suction nozzle 4 is started, and the process proceeds to step # 5.
【００２６】ステップ＃５において、洗浄液タンク２３
から洗浄液が超音波洗浄槽２１に供給され、ステップ＃
６に進む。In step # 5, the cleaning liquid tank 23
The cleaning liquid is supplied to the ultrasonic cleaning tank 21 from the step #
Proceed to 6.
【００２７】ステップ＃６において、液面センサ２５が
超音波洗浄槽２１内の洗浄液面を検知し、この液面を所
定レベルに制御し、ステップ＃７に進む。In step # 6, the liquid level sensor 25 detects the cleaning liquid level in the ultrasonic cleaning tank 21, controls this liquid level to a predetermined level, and proceeds to step # 7.
【００２８】ステップ＃７において、吸着ノズル４の超
音波洗浄を行い、一定時間の洗浄後、ステップ＃８に進
む。In step # 7, the suction nozzle 4 is ultrasonically cleaned, and after cleaning for a certain period of time, the process proceeds to step # 8.
【００２９】ステップ＃８において、吸着ノズル４から
のエアの排出を停止し、ステップ＃９に進む。In step # 8, the discharge of air from the suction nozzle 4 is stopped, and the process proceeds to step # 9.
【００３０】ステップ＃９において、吸着ノズル４が上
昇し、ステップ＃１０に進む。In step # 9, the suction nozzle 4 moves up and the process proceeds to step # 10.
【００３１】ステップ＃１０において、吸着ノズル４
は、洗浄中よりも強く瞬間的に一回エアブローを行う。
これは、超音波洗浄で除去できなかった埃や吸着ノズル
４を濡らしている洗浄液を吹き飛ばし、吸着ノズル４の
乾燥を助けるためである。そして、ステップ＃１１に進
む。In step # 10, the suction nozzle 4
Blows once more instantaneously than during washing.
This is because the dust that could not be removed by the ultrasonic cleaning and the cleaning liquid that wets the suction nozzle 4 are blown away, and the drying of the suction nozzle 4 is assisted. Then, the process proceeds to step # 11.
【００３２】ステップ＃１１において、超音波洗浄槽２
１が降下し、ステップ＃１２に進む。In step # 11, the ultrasonic cleaning tank 2
1 descends and the process proceeds to step # 12.
【００３３】ステップ＃１２において、洗浄すべき次の
吸着ノズル４の有無を判断する。有れば、ステップ＃１
３に進み、無ければ、ステップ＃１４に進む。In step # 12, it is determined whether or not there is the next suction nozzle 4 to be cleaned. If so, step # 1
If not, go to step # 14.
【００３４】ステップ＃１３において、回転テーブル１
が回転し、ステップ＃２からステップ＃１１を繰り返し
て、洗浄すべき吸着ノズル４が無くなるまで続ける。In step # 13, the rotary table 1
Rotates, and steps # 2 to # 11 are repeated until the suction nozzles 4 to be cleaned run out.
【００３５】ステップ＃１４において、洗浄すべき吸着
ノズル４が無くなると、超音波洗浄槽２１の洗浄液は洗
浄液タンク２３にもどされ、ステップ＃１５に進む。When the adsorption nozzles 4 to be cleaned are exhausted in step # 14, the cleaning liquid in the ultrasonic cleaning tank 21 is returned to the cleaning liquid tank 23, and the process proceeds to step # 15.
【００３６】ステップ＃１５において、洗浄された吸着
ノズル４は順次、乾燥装置１７の位置に位置決めされ、
温風もしくは赤外線で乾燥され、ステップ＃１６に進
む。In step # 15, the cleaned suction nozzles 4 are sequentially positioned at the position of the drying device 17,
After drying with warm air or infrared rays, the process proceeds to step # 16.
【００３７】ステップ＃１６において、可動台１４が電
子部品装着動作状態に復帰し、ノズル洗浄動作が終了す
る。In step # 16, the movable table 14 is returned to the electronic component mounting operation state, and the nozzle cleaning operation is completed.
【００３８】上記の吸着ノズル４の詰まりの検知から洗
浄・乾燥の工程を総て自動化しているので、省力化が可
能であり、又、吸着ノズル４を取り外す必要がないので
洗浄時間が短縮され稼働率が大幅に向上する。Since the steps from the detection of clogging of the suction nozzle 4 to the cleaning / drying are automated, labor can be saved, and since it is not necessary to remove the suction nozzle 4, the cleaning time is shortened. The operating rate is greatly improved.
【００３９】本発明は、上記の実施例に限らず、種々の
態様が可能である。例えば、複数の吸着ノズル４を洗浄
する際に、洗浄液の超音波洗浄槽２１への供給を一回の
みにしているが、特に、詰まりや汚れがひどい場合に
は、吸着ノズル４を一本洗浄する毎に、洗浄液を入れ換
えても良い。又、実施例のように、詰まりを検出する機
構を作らず、一定吸着回数毎、一定時間毎に全吸着ノズ
ル４を洗浄しても良い。The present invention is not limited to the above-mentioned embodiment, but various modes are possible. For example, when cleaning the plurality of suction nozzles 4, the cleaning liquid is supplied to the ultrasonic cleaning tank 21 only once. However, in the case where clogging or dirt is severe, one suction nozzle 4 is cleaned. The cleaning liquid may be replaced each time the cleaning is performed. Further, unlike the embodiment, the mechanism for detecting the clogging may not be provided, and all the suction nozzles 4 may be cleaned at a constant number of suction times and at a constant time.
【００４０】[0040]
【発明の効果】本発明の電子部品装着装置は、部品供給
部の可動台上に、吸着ノズル洗浄用の超音波洗浄槽を配
しているので、吸着ノズルの洗浄のためのステーション
を別に設置する必要がなく、導入し易いという効果を奏
する。In the electronic component mounting apparatus of the present invention, the ultrasonic cleaning tank for cleaning the suction nozzle is arranged on the movable base of the component supply unit, so that a separate station for cleaning the suction nozzle is installed. There is no need to do so, and it is easy to introduce.
【００４１】又、自動的に、吸着ノズルの詰まりを検出
して洗浄・乾燥を行うので、吸着率の向上と省力化が可
能であるという効果を奏する。Further, since the clogging of the suction nozzle is automatically detected and the cleaning and drying are performed, the suction rate can be improved and labor can be saved.
【００４２】又、一定吸着回数毎、或いは、定期的に、
吸着ノズルを洗浄するので、吸着ノズルの詰まりを未然
に防ぎ、不良率の減少、稼働率の向上が可能であるとい
う効果を奏する。In addition, every fixed number of times of adsorption, or periodically,
Since the suction nozzle is cleaned, it is possible to prevent clogging of the suction nozzle, reduce the defect rate, and improve the operation rate.
【図１】本発明の一実施例の平面図である。FIG. 1 is a plan view of an embodiment of the present invention.
【図２】本発明の一実施例の一部断面側面図である。FIG. 2 is a partial cross-sectional side view of an embodiment of the present invention.
【図３】本発明の一実施例の超音波洗浄装置の側面図で
ある。FIG. 3 is a side view of the ultrasonic cleaning apparatus according to the embodiment of the present invention.
【図４】本発明の他の実施例の斜視図である。FIG. 4 is a perspective view of another embodiment of the present invention.
【図５】本発明の一実施例の洗浄動作のフローチャート
である。FIG. 5 is a flowchart of a cleaning operation according to an embodiment of the present invention.
【図６】従来例の斜視図である。FIG. 6 is a perspective view of a conventional example.
１ 回転テーブル ２ インデックスユニット ３ 装着ヘッド ４ 吸着ノズル ５ 昇降ガイド ６ 円筒カム ７ カムフォロワ ８ スライダ ９ 昇降用カム・レバー機構 １０ 部品供給部 １２ Ｘ−Ｙテーブル １３ ガイドレール １４ 可動台 １５ 部品供給手段 １６ 超音波洗浄装置 １７ 乾燥装置 ２１ 超音波洗浄槽 ２２ 超音波洗浄槽昇降装置 ２３ 洗浄液タンク ２４ 供給ポンプ ２５ 液面センサ ２６ 超音波発生器 ２７ 排出ポンプ ２８ 制御部 Ａ 電子部品吸着位置 Ｂ 電子部品装着装置 1 rotary table 2 index unit 3 mounting head 4 suction nozzle 5 lifting guide 6 cylindrical cam 7 cam follower 8 slider 9 lifting cam / lever mechanism 10 parts supply part 12 XY table 13 guide rail 14 movable base 15 parts supply means 16 super Sonic cleaning device 17 Drying device 21 Ultrasonic cleaning tank 22 Ultrasonic cleaning tank elevating device 23 Cleaning liquid tank 24 Supply pump 25 Liquid level sensor 26 Ultrasonic generator 27 Discharge pump 28 Control unit A Electronic component suction position B Electronic component mounting device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 桜井 邦男 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 米澤 隆弘 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 西 尚美 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kunio Sakurai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Takahiro Yonezawa 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Naomi Nishi, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (2)
持すると共に、この複数の部品供給手段を指定順に、電
子部品吸着位置に移動させる可動台を有する部品供給部
と、この電子部品吸着位置に移動してきた前記部品供給
手段から部品を吸着し、電子部品装着位置に移動して、
吸着した部品を、回路基板の所定位置に装着する吸着ノ
ズルを備えた複数の装着ヘッドとを具備した電子部品装
着装置において、前記部品供給部の前記可動台上に、超
音波洗浄槽を備えた超音波洗浄装置を設け、この超音波
洗浄槽を、吸着ノズル洗浄時に、前記電子部品吸着位置
に移動し、吸着ノズルを洗浄するようにしたことを特徴
とする電子部品装着装置。1. A component supply section which holds a plurality of component supply means for supplying a component and which has a movable base for moving the plurality of component supply means to an electronic component suction position in a designated order, and the electronic component suction position. The component is sucked from the component supply means that has been moved to, and moved to the electronic component mounting position,
An electronic component mounting apparatus comprising a plurality of mounting heads each having a suction nozzle for mounting a suctioned component at a predetermined position on a circuit board, wherein an ultrasonic cleaning tank is provided on the movable table of the component supply unit. An electronic component mounting apparatus comprising an ultrasonic cleaning device, wherein the ultrasonic cleaning tank is moved to the electronic component suction position during cleaning of the suction nozzle to clean the suction nozzle.
吸着ノズルの汚染又は詰まり等に対する吸着ノズル洗浄
の要否を判断し、吸着ノズルの洗浄が必要と判断した場
合に、又は、定期的或いは一定吸着回数毎に、電子部品
の装着動作を中断し、洗浄が必要な吸着ノズルを洗浄
し、洗浄後、装着動作を再開するようにした制御部を設
けた請求項１に記載の電子部品装着装置。2. From the suction failure occurrence data of the suction nozzle,
When it is determined whether or not the suction nozzle needs to be cleaned for contamination or clogging of the suction nozzle, and when it is determined that the suction nozzle needs to be cleaned, or periodically or at regular intervals of suction, the mounting operation of electronic components is interrupted. The electronic component mounting apparatus according to claim 1, further comprising a control unit configured to clean the suction nozzle that requires cleaning and restart the mounting operation after cleaning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232700A JP3043482B2 (en) | 1991-09-12 | 1991-09-12 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3232700A JP3043482B2 (en) | 1991-09-12 | 1991-09-12 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0575292A true JPH0575292A (en) | 1993-03-26 |
| JP3043482B2 JP3043482B2 (en) | 2000-05-22 |
Family
ID=16943406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3232700A Expired - Fee Related JP3043482B2 (en) | 1991-09-12 | 1991-09-12 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3043482B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003092918A1 (en) * | 2002-05-03 | 2003-11-13 | Emag Ag | Device for automatically cleaning vacuum holders or vacuum pipettes that are accommodated in machine cassettes |
| JP2008060463A (en) * | 2006-09-01 | 2008-03-13 | Yamaha Motor Co Ltd | Mounting machine, mounting line, and air blow method of mounting machine |
| WO2018229910A1 (en) * | 2017-06-14 | 2018-12-20 | 株式会社Ｆｕｊｉ | Nozzle cleaning unit automatic exchange system |
| JPWO2019176038A1 (en) * | 2018-03-15 | 2021-01-14 | 株式会社Ｆｕｊｉ | Mounting related equipment and mounting system |
| CN114424688A (en) * | 2019-09-24 | 2022-04-29 | 株式会社富士 | Drying device and drying method |
-
1991
- 1991-09-12 JP JP3232700A patent/JP3043482B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003092918A1 (en) * | 2002-05-03 | 2003-11-13 | Emag Ag | Device for automatically cleaning vacuum holders or vacuum pipettes that are accommodated in machine cassettes |
| JP2008060463A (en) * | 2006-09-01 | 2008-03-13 | Yamaha Motor Co Ltd | Mounting machine, mounting line, and air blow method of mounting machine |
| WO2018229910A1 (en) * | 2017-06-14 | 2018-12-20 | 株式会社Ｆｕｊｉ | Nozzle cleaning unit automatic exchange system |
| JPWO2018229910A1 (en) * | 2017-06-14 | 2020-04-09 | 株式会社Ｆｕｊｉ | Nozzle cleaning unit automatic replacement system |
| JPWO2019176038A1 (en) * | 2018-03-15 | 2021-01-14 | 株式会社Ｆｕｊｉ | Mounting related equipment and mounting system |
| JP2021185637A (en) * | 2018-03-15 | 2021-12-09 | 株式会社Fuji | Mounting related device and mounting system |
| CN114424688A (en) * | 2019-09-24 | 2022-04-29 | 株式会社富士 | Drying device and drying method |
| CN114424688B (en) * | 2019-09-24 | 2023-10-27 | 株式会社富士 | Drying device and drying method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3043482B2 (en) | 2000-05-22 |
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| LAPS | Cancellation because of no payment of annual fees |