JPH0573340B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a micro-component positioning device and method, and more particularly to a micro-component positioning device and method for aligning micro-components using a microscope.

[Prior art]

One method for processing a workpiece by placing it on a bonding pad of a substrate is to use a microscope for highly accurate positioning.

This positioning method is illustrated in FIGS. 2 and 3, for example.
As shown in the figure.

2 and 3, 20 is a bonding pad, 21 is a processing tool, 22 is a workpiece (ball), 23 is a microscope, 24 is a reference point, 25 is a reference plane, 26 is an incorrect reference point, 27 is the amount of positional deviation, 28
is the height difference of the substrate 29, and 29 is the substrate.

Further, the processing tool 21 is arranged vertically, and the microscope 23 captures the workpiece 22 from an oblique direction.

In this case, if the substrate 29 is warped or there is a difference in height 28, the operator may misjudge the reference plane 25 when moving the substrate 29 on which the workpiece 22 is placed a certain distance, and the operator may place the bonding part of the substrate 29 at the reference point 24. Even if you intend to place the board 20 and the workpiece 22, if you try to process them in alignment with the incorrect reference point 26 on the optical axis of the microscope 23, they will deviate greatly from the reference point 24.

For this reason, the processing tool 21 and the bonding pad 2
0, or a positional deviation amount 27 occurs between the processing tool 21 and the workpiece 22, resulting in processing defects.

As a specific example of such work, in manual wire bonding, a fine wire ball is positioned as the workpiece 22 on the bonding pad 20 on the substrate 29, and the bonding head of the processing tool 21 is positioned with high precision. In some cases, fine wires are bonded by applying pressure to the ball vertically and then heating it or applying ultrasonic waves.

In addition, in conventional microscopes, when a positioning scale plate is built-in, it is fixed to the eyepiece. Further, some microscopes intended for measuring the length of a length-measuring object move a scale plate provided within the microscope in one direction, and measure the length according to the position of the length-measuring object.

Related devices of this type include, for example, Japanese Patent Application Laid-Open No. 59-225537.

[Problem to be solved by the invention]

In the conventional technology described above, when the processing tool is positioned vertically and the workpiece is captured from an oblique direction using a microscope, if the substrate is warped or there is a difference in height, the operator will have to point out the wrong reference point on the optical axis of the microscope. As a result, there is a problem in that machining is carried out according to the position of the bonding pad, or the bonding pad or the workpiece is misaligned, resulting in frequent machining defects. Ta.

The purpose of the present invention is to improve such problems,
When positioning the workpiece using a microscope from an oblique direction, even if the substrate is warped or has a height difference,
It is an object of the present invention to provide a micro component positioning device and method that can perform positioning with high precision while preventing positional deviation.

[Means to solve the problem]

In order to achieve the above object, the micro component positioning device of the present invention is equipped with a microscope installed at a position where the workpiece is viewed from an oblique direction, and a means for moving a substrate on which the workpiece is installed, and a substrate with a height difference. When a workpiece is placed on a bonding pad and processed using a fixed processing tool, the substrate is moved and the workpiece and bonding pad are positioned using a microscope at a reference point corresponding to the head of the processing tool. In a micro-component positioning device, a scale plate with marks corresponding to the shapes of the processing tool and the workpiece is placed at the focal point between the eyepiece and objective lens of the microscope, and the scale plate is moved finely in the X and Y directions. The feature is that it has a means of adjustment (fine adjustment knob).

Furthermore, in the micro component positioning method of the present invention, when a workpiece is installed on a bonding pad of a board with a difference in height and processed with a fixed processing tool, the workpiece is viewed diagonally using a microscope. Capture,
In a micro component positioning method, the workpiece and bonding pad are positioned at a reference point corresponding to the head of the processing tool by moving the substrate,
A scale plate having marks corresponding to the shape of the processing tool and the workpiece is provided at the focal position between the eyepiece and the objective lens of the microscope, and a means (fine adjustment knob) for finely adjusting the scale plate in the X and Y directions is provided. Check the scale and the position of the processing tool head corresponding to the scale, move the scale plate, align the corresponding mark with the processing tool, move the workpiece based on the scale plate, and It is characterized by matching things to marks.

[Effect]

In the present invention, by installing a scale plate having fine adjustment knobs in the XY direction between the eyepiece and objective lens of the microscope, when positioning the workpiece using the microscope from an oblique direction, Even if there is a warpage or a difference in height, the workpiece can be accurately positioned with respect to the processing tool.

That is, when carrying out the mounting work on the board, look through the eyepiece and if there is no warpage or difference in height of the board, carry out the mounting work using the scale plate as a guide.

In addition, if the board is warped or there is a height difference, move the cross mark on the scale plate to align it with the center of the corresponding processing tool, and then move the workpiece using this scale plate as a reference. By aligning the cross mark on the scale plate with the corresponding workpiece, the processing tool can be positioned with high precision with respect to the workpiece.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram showing the inside of an eyepiece holder of a microscope incorporating a scale plate according to an embodiment of the present invention, FIG. 4 is an overview diagram of the scale plate according to an embodiment of the present invention, and FIG. FIG. 3 is an enlarged view of a stamped portion of a scale plate in an embodiment of the invention.

In Figures 1, 4 and 5, 1 is a scale plate, 2 is a center line, 3 is a ball outline line, 4 is a head outline line, 5 is a pad outline line, 6 is an eyepiece, and 7 is an eyepiece. holder, 8
is a fine adjustment knob.

The scale plate 1 shown in FIG. 4 has a scale engraved on a transparent glass plate, and an enlarged view of the engraved portion A in FIG. 4 is shown in FIG.

This ball outline line 3 has a cross mark, and is used as a guide when placing the workpiece ball on the bonding pad after aligning the bonding pad with the pad outline line 5. The head outline line 4 is also used to lower the head to match the image of the head on the processing tool. The pad outline line 5 is used at the beginning of positioning, when setting the position of the bonding pad together with the bonding pad, and when performing alignment (fine adjustment) with the bonding pad.

Further, a configuration in which the scale plate 1 is incorporated into an eyepiece of a microscope is shown in FIG.

In this embodiment, the scale plate 1 is placed at the focus of the eyepiece 6.
A fine adjustment knob 8 in the XY direction is provided so that the This allows fine adjustment in the X and Y directions when aligning the bonding pad with the pad outer line 5.

Note that the cross mark in this embodiment is for accurate positioning regardless of the size of the ball diameter, and is provided for aligning the ball center.

Next, a method for positioning micro parts according to this embodiment will be described.

FIG. 6 is an explanatory diagram showing the procedure of a micro component positioning method in an embodiment of the present invention, and FIG. 7 is a comparison between the amount of positional deviation in the embodiment of the present invention and the amount of positional deviation in a conventional method. It is an explanatory diagram.

In FIG. 6, 2 is the center line, 3 is the ball outline line, 4 is the head outline line, 5 is the pad outline line, 9 is the substrate, 10 is the bonding pad, 11 is the head of the processing tool, and 12 is the ball (cover). processed products).

In this example, the procedure for moving the cross mark or scale provided in the microscope using the fine adjustment knob on the scale plate to align it with the center of the processing tool (center line 2) or the head outline line 4, and 12 to match the corresponding scale, and a procedure for performing predetermined machining on the workpiece 12 using a machining tool, positioning of the micro parts is performed.

That is, first, as in the step, while looking through the eyepiece, the image of the bonding pad 10 and the pad outline line 5 visible within the scope are brought into alignment by moving the substrate 9 in the X and Y directions. In this case, the substrate 9 is rotated as necessary to correct the positional shift in the θ direction.

Next, as shown in the step, head 1 of the processing tool.
Lower 1.

Next, as in the step, adjust the image of the head 11 and the head outline line 4 using the fine adjustment knobs 8 in the X and Y directions.
Match using . Note that if there is any positional deviation in the θ direction, the eyepiece lens is rotated to align the position.

Next, the head 11 is raised like a step.

Next, as in the step, while looking through the eyepiece lens, the substrate 9 is moved to match the image of the bonding pad 10 shifted in the step with the pad outline line 5 visible within the scope.

Next, as in the step, while looking through the eyepiece 6, the ball 12 is placed on the bonding pad 10 using the ball outline line 3 as a guide.

By following these steps, when the microscope is mounted obliquely to the head 11, positional deviations caused by warping of the substrate or differences in height, that is, positional deviations of the bonding pad 10 and ball 12 relative to the head 11, can be avoided. can be easily corrected.

Furthermore, the amount of positional deviation when positioning is performed according to this embodiment is shown in FIG.

That is, even if the board is warped or has a difference in height, it is possible to perform positioning with higher accuracy than when no jig is used or when only a scale is used.

In addition to this embodiment, for example, (1) when mounting high-precision microcomponents on a board from a vertical direction, the shape of the mounted parts is monitored from an oblique direction and automatically recognized, and the parts relative to the monitor's sensor are (2) When measuring from an oblique direction at high magnification, measure by keeping the reference surface constant when measuring the length from a perspective direction at high magnification. Therefore, when reading the dimensions of the object from the scale plate after detecting the deviation caused by the warpage or height difference of the sample and finely moving the scale plate to match the deviation, (3) positioning is necessary. To make it easier, when displaying the machining part from an oblique direction with a fine pointer such as a laser, align the laser pointer in the oblique direction with the processing tool positioned at the machining point, and then use the pointer as a guide to display the workpiece. Similar effects can be obtained by applying this embodiment to the case of positioning an object.

〔Effect of the invention〕

According to the present invention, when positioning a workpiece using a microscope from an oblique direction, the workpiece can be accurately positioned with respect to a processing tool even if the substrate is warped or has a height difference.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram showing the inside of an eyepiece holder of a microscope incorporating a scale plate according to an embodiment of the present invention, FIGS. 2 and 3 are explanatory diagrams showing a conventional method for positioning minute parts, and FIG. FIG. 5 is an enlarged view of the engraved portion of the scale plate in one embodiment of the present invention, and FIG.
The figure is an explanatory diagram showing the procedure of a micro component positioning method according to an embodiment of the present invention, and FIG. be. 1: Scale plate, 2: Center line, 3: Ball outline line, 4: Head outline line, 5: Pad outline line, 6: Eyepiece, 7: Eyepiece holder, 8: Fine adjustment knob, 9, 29: Board, 10,2
0: Bonding pad, 11: Head of processing tool, 12, 22: Ball (workpiece), 21: Processing tool, 23: Microscope, 24: Reference point, 25: Reference plane, 26: Wrong board point, 27 : Positional deviation amount, 28:
Difference in height of the board 29.

Claims (1)

[Claims] 1. A microscope for viewing a workpiece from an oblique direction, and a means for moving a substrate on which the workpiece is installed, and the workpiece is installed on a bonding pad of a substrate with a difference in height. When processing with a fixed processing tool, the micro component positioning device moves the substrate and positions the workpiece and bonding pad using the microscope at a reference point corresponding to the head of the processing tool. A scale plate with marks corresponding to the shape of the processing tool and the workpiece, and the scale plate are installed in the eyepiece lens barrel of the microscope.
A micro component positioning device characterized by being provided with means for fine adjustment in the X and Y directions. 2. When a workpiece is installed on the bonding pad of a substrate with a difference in height and processed using a fixed processing tool, the workpiece is captured from an oblique direction with a microscope, the substrate is moved, and the processing is performed using a fixed processing tool. In a method for positioning a micro-component in which the workpiece and the bonding pad are positioned at a reference point corresponding to the head of the tool, a mark corresponding to the shape of the processing tool and the workpiece is provided in the eyepiece barrel of the microscope. A scale plate and a means for finely adjusting the scale plate in the X and Y directions are provided, and the scale of the microscope and the position of the processing tool head corresponding to the scale are confirmed, and the scale plate is moved to set the corresponding mark. After matching with the processing tool,
A method for positioning a minute component, characterized by moving a workpiece using the scale plate as a reference, and aligning the workpiece with the mark.