JPH0572164U - Flat IC mounting structure - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] Flat ICs are pre-fixed to the printed circuit board with few adhesive points or simply with double-sided adhesive tape to eliminate problems during dip soldering. An IC mounting structure is provided. [Structure] An adhesive hole or a gas vent hole 6 is provided at the center of the flat board IC3 mounting position of the printed circuit board 1, and an adhesive material is applied to the adhesive hole to pre-fix the flat IC3 or printed with the flat IC3. The substrate 1 is adhered with a double-sided adhesive tape 5.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a flat IC mounting structure, and more particularly to a flat IC mounting structure suitable for improving the work of applying an adhesive material for fixing the flat IC to a printed board.

[0002]

[Prior art]

 As a conventional flat IC mounting structure, for example, a method has been provided in which an adhesive is applied to the four corners of the flat IC as shown in FIGS.

In the figure, 1 is a printed circuit board, 3 is a flat IC, and 4 is an adhesive material.

To fix the flat IC 3 to the printed circuit board 1, as shown in FIGS. 5 and 6, adhesives 4 are applied to the corners of the four corners of the flat IC 3 to bond the flat IC 3 and the printed circuit board 1. After that, I did dip soldering.

[0005]

[Problems to be solved by the device]

 However, in the conventional flat IC mounting structure, as shown in FIGS. 5 and 6, the adhesive 4 is applied to the corners of the four corners of the flat IC 3 to bond the printed circuit board 1 and the flat IC 3 together. Therefore, a rubber-based adhesive or the like which is usually used as an adhesive has a drawback that it causes stringing of the adhesive and the stringing tends to occur during soldering.

Further, when the ultraviolet curable material is used as the adhesive material, the location where the adhesive material is applied is limited to the corner of the flat IC 3 and there is a drawback that the workability is poor.

Further, since the flat IC 3 is moved when the adhesive material 4 is cured, the pattern and the terminals of the flat IC 3 are likely to be misaligned and it takes a long time to cure.

The present invention has been made in view of the above points, and an object thereof is to solve the drawbacks of the conventional example and to fix the flat IC and the printed circuit board easily and at low cost. It is in the area of providing a mounting structure.

[0009]

[Means for Solving the Problems]

 The flat IC mounting structure of the present invention is a flat IC mounting structure in which a flat IC is fixed to a pattern surface of a printed circuit board with an adhesive and is soldered to a pattern of the printed circuit board. A hole is formed through the board, and an adhesive is applied to the hole from the component surface side of the printed board to fix the flat IC.

In addition, in a flat IC mounting structure in which a flat IC is fixed to a pattern surface of the printed board with an adhesive and soldered to the pattern of the printed board, the flat IC mounting portion of the printed board penetrates the printed board. A double-sided adhesive tape for adhering the flat IC to the printed board is provided so that the gas generated between the flat IC and the printed board is released when the flat IC is dip-soldered.

[0011]

[Action]

 According to this invention, in a flat IC mounting structure in which a flat IC is fixed to the pattern surface of the printed board with an adhesive and soldered to the pattern of the printed board, the flat IC mounting part of the printed board is penetrated through the printed board. Since the holes are provided and the flat IC is fixed by applying an adhesive from the component side of the printed circuit board to the hole, the printed circuit board and the flat IC are also bonded with double-sided adhesive tape. Therefore, the workability of applying the adhesive is improved and the stringing due to the adhesive can be eliminated.

Further, it becomes possible to easily release the gas generated between the flat IC and the printed circuit board during the dip soldering of the printed circuit board.

[0013]

【Example】

 An embodiment of a flat IC mounting structure according to the present invention will be described with reference to FIGS.

FIG. 1 is a perspective view showing a mounting state of a flat IC seen from the component side of a printed circuit board according to a first embodiment, FIG. 2 is a sectional view of the first embodiment, and FIG. FIG. 4 is an exploded perspective view showing the mounting of the flat IC as seen from the pattern surface side of the printed circuit board of the embodiment, and FIG. 4 is a sectional view of the second embodiment.

In the figure, 1 is a printed circuit board, 1a is a printed circuit board component surface, 1b is a printed circuit board pattern surface, 2 is a bonding hole, 3 is a flat IC, 4 is an adhesive material, 5 is a double-sided adhesive tape, Reference numeral 6 is a gas vent hole.

To mount the flat IC 3 of the first embodiment on the printed circuit board 1, as shown in FIGS. 1 and 2, a bonding hole 2 is opened in the center of the flat IC 3 mounting position on the printed circuit board 1, and An adhesive material 4 is applied to the bonding hole 2 from the component surface 1a of the printed circuit board 1, and the flat IC 3 is bonded to the pattern surface 1b of the printed circuit board 1.

Therefore, the stringing of the adhesive 4 is eliminated, and the flat IC 3 can be bonded to the printed circuit board 1 without the adhesive 4 sticking to the terminals of the flat IC 3.

In the second embodiment, a plurality of gas vent holes 6 are formed in the center of the printed circuit board 1 where the flat IC 3 is attached, and the double-sided adhesive tape 5 is attached to the pattern surface 1b side of the printed circuit board 1. From the top, the terminals of the flat IC 3 are bonded according to the pattern.

Therefore, when the flat IC 3 is dip-soldered, the gas generated between the printed circuit board 1 and the flat IC 3 escapes from the gas vent hole 6 to the component surface side of the printed circuit board 1 through the double-sided adhesive tape 5. The gas prevents the flat IC 3 from floating above the printed circuit board 1.

Further, by using the double-sided adhesive tape 5, there is no need to worry about the deviation between the terminals of the flat IC 3 and the pattern until the adhesive material is cured like when an adhesive material is used. Things will disappear.

[0021]

[Effect of the device]

 Since the flat IC mounting structure according to the present invention is configured as described above, the following effects can be obtained.

In the first embodiment, there is only one place where the adhesive is applied, there is no variation, there is an effect of improving workability, and the required amount of the adhesive can be reduced.

Further, since the stringing of the adhesive material is eliminated, the tempura at the time of dip soldering is also eliminated, and there is an effect of improving the quality of soldering.

In the second embodiment, since the double-sided adhesive tape is used instead of the adhesive material, the adhesion of the flat IC is easy, the curing time of the adhesive material is not necessary, and the gas generated during the dip soldering can be transmitted. Therefore, it also has the effect of preventing the flat IC from rising.

Moreover, it has an excellent feature that the cost can be reduced by simply making a hole on the printed circuit board side and the implementation is easy.

[Brief description of drawings]

FIG. 1 shows a first embodiment of the present invention and is a perspective view of a mounted state of a flat IC seen from the component side of a printed circuit board.

FIG. 2 is a sectional view of the first embodiment as seen from the side surface.

FIG. 3 is an exploded perspective view showing the mounting of the flat IC as seen from the pattern surface side of the printed circuit board according to the second embodiment of the present invention.

FIG. 4 is a sectional view of the second embodiment as seen from the side surface.

FIG. 5 is a perspective view showing a conventional example, showing a position of applying an adhesive material on a flat IC attached to a pattern surface of a printed circuit board.

FIG. 6 is a cross-sectional view showing a conventional flat IC attachment.

[Explanation of symbols]

 1 Printed circuit board 1a Printed circuit board component side 1b Printed circuit board pattern surface 2 Adhesive hole 3 Flat IC 4 Adhesive 5 Double-sided adhesive tape 6 Gas vent hole

Claims (2)

[Scope of utility model registration request] 1. A flat I on a pattern surface of a printed circuit board.
In a flat IC mounting structure in which C is fixed with an adhesive and soldered to the pattern of the printed circuit board, a hole for penetrating the printed circuit board is provided in the flat IC mounting portion of the printed circuit board, and the component surface of the printed circuit board is provided in the hole. An attachment structure for a flat IC, characterized in that an adhesive is applied from the side to fix the flat IC. 2. The flat I on the pattern surface of the printed circuit board.
In a flat IC mounting structure in which C is fixed using an adhesive material and soldered to a pattern on the printed circuit board, the flat IC and the printed circuit board are bonded to the flat IC mounting hole of the printed circuit board. A flat IC characterized in that a double-sided adhesive tape is provided so that gas generated between the flat IC and the printed circuit board is released when the flat IC is dip-soldered.
Mounting structure.