JPH0570773B2 - - Google Patents
Info
- Publication number
- JPH0570773B2 JPH0570773B2 JP60111733A JP11173385A JPH0570773B2 JP H0570773 B2 JPH0570773 B2 JP H0570773B2 JP 60111733 A JP60111733 A JP 60111733A JP 11173385 A JP11173385 A JP 11173385A JP H0570773 B2 JPH0570773 B2 JP H0570773B2
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- metal substrate
- diaphragm
- peripheral fixing
- fixing part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 21
- 238000005530 etching Methods 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
- Measuring Fluid Pressure (AREA)
Description
【発明の詳細な説明】
＜産業上の利用分野＞
本発明は、ダイヤフラム、特に周辺固定部とこ
れに支持された受圧板とからなり、圧力センサ等
に用いられる小形なダイヤフラムに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a diaphragm, and particularly to a small diaphragm that is composed of a peripheral fixing part and a pressure receiving plate supported by the peripheral fixing part and is used in a pressure sensor or the like.
＜従来の技術と問題点＞
従来、この種の小形ダイヤフラムとしては、第
３図のａに示すように、シリコンウエハーをエツ
チングして受圧板１と周辺固定部２とを一体に形
成したシリコンチツプ製のダイヤフラムや、第３
図のｂに示すような、受圧板１にTiクラツド材
を用いるとともに、周辺固定部２にFe−Ni合金
を用いてエツチングによりこれを形成した金属製
のダイヤフラムが知られている。しかしながら、
上記のシリコンチツプ製のものはシリコンウエハ
ーのものが高価であり、金属に比べて強度が低く
破損しやすいという問題がある。また金属製のも
のは破損はしにくいがクラツド材が高価であり、
周辺固定部２となるFe−Ni合金の耐食性が低く、
用途が限定されるという問題がある。<Prior art and problems> Conventionally, this type of small diaphragm has been made using a silicon chip in which a pressure receiving plate 1 and a peripheral fixing part 2 are integrally formed by etching a silicon wafer, as shown in FIG. 3a. diaphragm made of
A metal diaphragm is known in which the pressure receiving plate 1 is made of Ti clad material and the peripheral fixing part 2 is made of Fe--Ni alloy by etching, as shown in FIG. however,
The above-mentioned silicon chips made of silicon wafers are expensive, and have the problem of being lower in strength than metal and easily damaged. Also, metal ones are less likely to break, but clad materials are expensive.
The corrosion resistance of the Fe-Ni alloy that forms the peripheral fixing part 2 is low;
There is a problem that the usage is limited.
これらの問題点に鑑み、本出願人は先にダイヤ
フラムの受圧板及び周辺固定部をすべて耐食性合
金のめつきによつて形成することを提案した（昭
和60年５月９日提出の特許願(2)）。しかし、この
提案の場合、受圧板となるめつき層の上に更に部
分的に周辺固定部となる厚いめつきを施すもので
あり、めつき層から基板を分離する時にめつき層
が変形して受圧板に凹凸が生じたり、めつきの不
均一性のために厚いめつき層の部分に凹凸が生じ
たりすることがあるため、精度のよいダイヤフラ
ムを得ることが困難であつて改良の余地があつ
た。 In view of these problems, the present applicant previously proposed forming the pressure receiving plate and peripheral fixing portion of the diaphragm by plating with a corrosion-resistant alloy (patent application filed on May 9, 1985). 2)). However, in the case of this proposal, thick plating is further applied partially on the plating layer that will become the pressure receiving plate, which will serve as the peripheral fixing part, and the plating layer will be deformed when the board is separated from the plating layer. Because of this, it is difficult to obtain a diaphragm with good precision, and there is still room for improvement. It was hot.
本発明はこのような点に着目し、耐食性や強度
が大きく安価であり、しかも小形でも精度よく製
造することの可能なダイヤフラムを得ることを課
題としてなされたものである。 The present invention has focused on these points, and has been made with the object of providing a diaphragm that has high corrosion resistance and strength, is inexpensive, and can be manufactured with high precision even in a small size.
＜問題点を解決するための手段＞
上記課題を達成するため、本発明のダイヤフラ
ムは、平滑な表面を有する金属基板上に厚さが20
〜50μmのめつき層を形成し、金属基板の不要部
分をエツチングにより溶解除去することにより、
残された金属基板の部分からなる周辺固定部と、
この周辺固定部に支持されためつき層からなる受
圧板とを形成している。<Means for Solving the Problems> In order to achieve the above-mentioned problems, the diaphragm of the present invention has a thickness of 20 mm on a metal substrate having a smooth surface.
By forming a ~50μm plating layer and dissolving and removing unnecessary parts of the metal substrate by etching,
A peripheral fixing part consisting of the remaining metal board part,
A pressure-receiving plate made of a stacked layer is supported by this peripheral fixing part.
＜作用＞
本発明によれば、受圧板のみがめつきで形成さ
れて周辺固定部は金属基板のエツチングによつて
形成されるため、受圧板となるめつき層に凹凸が
生じたり周辺固定部の厚みが不均一になつたりす
ることがなく、まためつき層と金属基板の材質を
適切に選定することで所望の耐食性と強度を得る
ことが可能となる。<Function> According to the present invention, only the pressure receiving plate is formed by plating and the peripheral fixing part is formed by etching the metal substrate, so that unevenness may occur in the plating layer that becomes the pressure receiving plate and the peripheral fixing part may be formed by etching. The thickness will not become uneven, and by appropriately selecting the materials of the glazing layer and the metal substrate, it is possible to obtain the desired corrosion resistance and strength.
＜実施例＞ 以下、図示の実施例について説明する。<Example> The illustrated embodiment will be described below.
第１図は本発明によるダイヤフラムを示すもの
で、ダイヤフラム１０は平板状の受圧板１１と周
辺固定部１２とで構成される。受圧板１１はめつ
き層からなる厚さ20〜50μm程度、直径は３〜10
mm程度の微小なものであり、周辺固定部１２は厚
さ0.2〜0.5mm程度の金属基板からなるもので外形
は四角形、内面は円形の枠状となつている。 FIG. 1 shows a diaphragm according to the present invention, and the diaphragm 10 is composed of a flat pressure receiving plate 11 and a peripheral fixing portion 12. As shown in FIG. The pressure receiving plate 11 is made of a plating layer with a thickness of about 20 to 50 μm and a diameter of 3 to 10 μm.
The peripheral fixing part 12 is made of a metal substrate with a thickness of about 0.2 to 0.5 mm, and has a rectangular outer shape and a circular inner frame shape.
上述のようなダイヤフラム１０は例えば第２図
に示す方法で製作される。 The diaphragm 10 as described above is manufactured, for example, by the method shown in FIG.
まず、第２図のａに示すように、ステンレスや
Fe−Ni合金やNiなどの平滑な表面を有する金属
基板１６に十分な表面処理を行ない、一方の面を
マスキングテープなどで被覆した後、他方の面に
例えば40μmの厚さのめつき層１５を形成する。
このめつき層１５は、例えば無電気めつき処理に
より形成されたNi−Ｐめつき層あるいは電気め
つき処理により形成されたNi−Ｐめつき層やNi
−Snめつき層であり、いずれの場合も耐薬品性
を有し、後述のエツチング液に不溶あるいは難溶
のめつき層である。 First, as shown in Figure 2 a, stainless steel
After performing sufficient surface treatment on a metal substrate 16 having a smooth surface such as Fe-Ni alloy or Ni, and coating one side with masking tape, the other side is covered with a plating layer 15 with a thickness of, for example, 40 μm. form.
This plating layer 15 is, for example, a Ni-P plating layer formed by electroless plating, a Ni-P plating layer formed by electroplating, or a Ni-P plating layer formed by electroless plating.
- It is a Sn plating layer, and in either case, it is a plating layer that has chemical resistance and is insoluble or hardly soluble in the etching solution described below.
次に、ｂに示すように、めつき層１５とは反対
の面にフオトレジスト１７を塗布してパターン化
した後、エツチング液、例えば塩化第二鉄溶液で
エツチング処理を行なう。この処理によつて、フ
オトレジスト１７の塗布されていない部分の金属
基板１６は溶解して除去され、ｃに示すようにめ
つき層１５とフオトレジスト１７が塗布された部
分の金属基板１６Ａとが残る。そこでフオトレジ
スト１７を溶解除去することにより、ｄに示すよ
うに金属基板１６ａにめつき層１５が支持された
状態のものが得られ、このめつき層１５が受圧板
１１となり、金属基板１６ａが周辺固定部１２と
なつて第１図ダイヤフラム１０が形成される。 Next, as shown in b, a photoresist 17 is applied to the surface opposite to the plating layer 15 and patterned, and then etched with an etching solution, for example, a ferric chloride solution. Through this process, the portion of the metal substrate 16 to which the photoresist 17 is not applied is dissolved and removed, and the plating layer 15 and the portion of the metal substrate 16A to which the photoresist 17 is applied are separated, as shown in c. remain. Then, by dissolving and removing the photoresist 17, a state in which the plating layer 15 is supported on the metal substrate 16a is obtained as shown in d, and this plating layer 15 becomes the pressure receiving plate 11, and the metal substrate 16a is A diaphragm 10 in FIG. 1 is formed as a peripheral fixing portion 12.
こうして製作されたダイヤフラム１０は、受圧
板１１が金属基板１６の平滑な表面上に形成され
ためつき層１５からなるものであるため均一な厚
さになるとともに、金属基板１６の不要部分の除
去がエツチングによつて行なわれるため、受圧板
１１に無理な力が加わつてふくれやへこみなどの
凹凸が生ずるようなことはなく、また周辺固定部
１２は金属基板１６の一部がそのまま残つたもの
であるため、周辺固定部１２の厚さは均一で凹凸
を生ずるようなこともなく、寸法精度のよい微小
なダイヤフラム１０が容易に得られるのである。 The diaphragm 10 manufactured in this way has a uniform thickness because the pressure receiving plate 11 is made of the tamping layer 15 formed on the smooth surface of the metal substrate 16, and unnecessary portions of the metal substrate 16 can be removed easily. Since this is done by etching, there is no possibility that excessive force will be applied to the pressure receiving plate 11 and unevenness such as bulges or dents will occur, and the peripheral fixing part 12 is a part of the metal substrate 16 that remains as it is. Therefore, the thickness of the peripheral fixing part 12 is uniform and there is no unevenness, and a small diaphragm 10 with good dimensional accuracy can be easily obtained.
こうして得られたダイヤフラム１０は、厚肉の
周辺固定部１２と薄肉の受圧板１１とを有する構
造であつて、圧力センサのほか流量センサなどに
も利用でき、従来のシリコンチツプ製や金属製の
ダイヤフラムよりも感度が高く、抵抗温度係数や
感度温度係数の低い良好な性能を示した。 The thus obtained diaphragm 10 has a structure having a thick peripheral fixing part 12 and a thin pressure receiving plate 11, and can be used not only as a pressure sensor but also as a flow rate sensor, etc. It exhibited good performance with higher sensitivity than diaphragms and a lower temperature coefficient of resistance and temperature coefficient of sensitivity.
＜発明の効果＞
以上の実施例の説明から明らかなように、本発
明はダイヤフラムの受圧板をめつきで形成し、周
辺固定部を金属基板のエツチングで形成したもの
であつて、強度が高く精度のよいダイヤフラムを
低コストで製作でき、また受圧板となるめつき層
に凹凸が生じたり、周辺固定部の厚さが不均一と
なることもなく、めつき層と金属基板に耐食性の
高い材質を用いることにより耐食性の高いダイヤ
フラムが得られる等の利点がある。<Effects of the Invention> As is clear from the above description of the embodiments, the present invention has a pressure receiving plate of a diaphragm formed by plating, and a peripheral fixing part formed by etching a metal substrate, which has high strength. High-precision diaphragms can be manufactured at low cost, and there is no unevenness in the plating layer that serves as the pressure receiving plate, or uneven thickness of the peripheral fixing part, and the plating layer and metal substrate have high corrosion resistance. By using this material, there are advantages such as being able to obtain a diaphragm with high corrosion resistance.
又、金属基板としてめつき層と熱膨張係数の等
しいNi板などを用いれば熱歪の少ないダイヤフ
ラムが得られるという利点がある。更に、本発明
では、上記のように受圧部をめつき層により形成
しているため下記のような効果を奏する。 Further, if a Ni plate or the like having the same coefficient of thermal expansion as the plating layer is used as the metal substrate, there is an advantage that a diaphragm with less thermal distortion can be obtained. Further, in the present invention, since the pressure receiving portion is formed of a plating layer as described above, the following effects are achieved.
まず、受圧部は、圧延材等の金属基板を使用し
た場合と異なり変形に異方性がなく、等方性であ
り、ダイヤフラムに要求される変形の均質性が良
好である。 First, unlike the case where a metal substrate such as a rolled material is used, the pressure receiving part does not have anisotropy in deformation, but is isotropic, and the homogeneity of deformation required for the diaphragm is good.
次に、変形能を制御するために、受圧部を複合
材料化、多層材料化することができる。 Next, in order to control the deformability, the pressure receiving part can be made of a composite material or a multilayer material.
更に、受圧部の厚さは、めつき時間の制御によ
り変更できるため、各種の厚さの受厚部を有する
ダイヤフラムを容易に製作することができる。 Further, since the thickness of the pressure receiving portion can be changed by controlling the plating time, diaphragms having thickened portions of various thicknesses can be easily manufactured.
第１図は本発明の一実施例の断面図、第２図は
同実施例の製造手順を示す図、第３図は従来例の
断面図である。
１０……ダイヤフラム、１１……受圧板、１２
……周辺固定部、１５……めつき層、１６，１６
ａ……金属基板、１７……フオトレジスト。
FIG. 1 is a sectional view of one embodiment of the present invention, FIG. 2 is a diagram showing the manufacturing procedure of the same embodiment, and FIG. 3 is a sectional view of a conventional example. 10...Diaphragm, 11...Pressure plate, 12
... Peripheral fixing part, 15 ... Plating layer, 16, 16
a... Metal substrate, 17... Photoresist.
Claims (1)
50μmのめつき層を形成し、金属基板の不要部分
をエツチングにより溶解除去することにより、残
された金属基板の部分からなる周辺固定部と、こ
の周辺固定部に支持されためつき層からなる受圧
板とを形成したことを特徴とするダイヤフラム。1 Thickness of 20~20 mm on a metal substrate with a smooth surface
By forming a 50 μm plating layer and dissolving and removing unnecessary parts of the metal substrate by etching, a pressure receiving area is created that consists of a peripheral fixing part made of the remaining metal substrate part and a plating layer supported by this peripheral fixing part. A diaphragm characterized by forming a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11173385A JPS61269033A (en) | 1985-05-23 | 1985-05-23 | Diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11173385A JPS61269033A (en) | 1985-05-23 | 1985-05-23 | Diaphragm |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61269033A JPS61269033A (en) | 1986-11-28 |
| JPH0570773B2 true JPH0570773B2 (en) | 1993-10-05 |
Family
ID=14568797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11173385A Granted JPS61269033A (en) | 1985-05-23 | 1985-05-23 | Diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61269033A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19736306C5 (en) * | 1996-08-27 | 2010-02-25 | Robert Bosch Gmbh | Method for producing pressure sensors |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758367A (en) * | 1980-09-24 | 1982-04-08 | Matsushita Electric Ind Co Ltd | Manufacture of pressure sensor |
-
1985
- 1985-05-23 JP JP11173385A patent/JPS61269033A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5758367A (en) * | 1980-09-24 | 1982-04-08 | Matsushita Electric Ind Co Ltd | Manufacture of pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61269033A (en) | 1986-11-28 |
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