JPH0570757U - Solder reflow equipment - Google Patents

Abstract

(57) [Abstract] [Purpose] Solder reflow that reduces damage to electronic components on the board, reduces the defective rate of the board, saves the time and effort of cleaning the reflow equipment, and does not cause air pollution due to flux decomposition gas. Provide a device. A cooling unit 3 is provided adjacent to the reflow unit 2, and a cooler 7 and a liquefied flux receiver 8 for receiving a flux liquefied by the cooler 7 are provided in the cooling unit 3.
An ambient gas circulation fan 9 is provided. Board 1
0 is reflowed in the reflow section 2 and then passed through the cooling section 3. In the cooling unit 3, the cooler 7
The substrate 10 is cooled by the atmospheric gas cooled by, and the decomposition gas of the flux contained in the atmospheric gas is
When cooled by the cooler 7, it is liquefied and collected in the liquefied flux receiver 8.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a solder reflow device for soldering electronic parts and the like to a printed circuit board.

In this specification, the front and the rear are based on the moving direction of the printed circuit board to be processed, and the front in the moving direction, that is, the left side in FIG. 1 is the front and the opposite side is the rear. Also, left and right refer to the front.

[0003]

[Prior Art]

 Conventionally, a reflow device that uses nitrogen gas as an atmospheric gas is not provided with a cooling unit, and a substrate reflowed in the reflow unit uses a nitrogen gas for oxidation prevention that is installed immediately in front of the reflow unit. When passing through the filled purge section, it was naturally cooled.

[0004]

[Problems to be solved by the device]

 In the above conventional solder reflow equipment, the soldered printed circuit board is naturally cooled, so the cooling speed is slow and the board is held at high temperature for a long time. There was a problem of large heat damage. Also, when the board is cooled, part of the decomposition gas of the soldering flux is liquefied and adheres to the board, causing product defects, or adheres in the reflow equipment, which requires time and cost for cleaning. There was a problem of taking it. Furthermore, there is a problem that the decomposed gas of the flux is contained in the exhausted atmospheric gas, which causes air pollution.

The purpose of the present invention is to shorten the high temperature holding time of the substrate to reduce the damage to electronic parts, reduce the defective rate of the reflowed substrate, save the labor of cleaning the reflow apparatus, and decompose the flux. An object of the present invention is to provide a solder reflow device in which gas is not released into the atmosphere and causes air pollution.

[0006]

[Means for Solving the Problems]

 The solder reflow device according to the present invention is provided with a cooling part in front of the reflow part, and in the cooling part, a cooler, a liquefied flux receiver for receiving the flux liquefied by the cooler, and an atmospheric gas circulation fan. And are provided.

[0007]

[Action]

 The solder reflow device according to the present invention is provided with a cooling part in front of the reflow part, and in the cooling part, a cooler, a liquefied flux receiver for receiving the flux liquefied by the cooler, and an atmospheric gas circulation fan. Therefore, the substrate reflowed in the reflow section is immediately cooled in the cooling section, and the flux decomposition gas contained in the atmospheric gas is liquefied by the cooler to receive the liquefied flux receiver. Will be collected.

[0008]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIGS. 1 and 2, the solder reflow apparatus has a box-shaped furnace (1), and a preheating section (not shown), a reflow section (2), and a reflow section (2) are provided inside the furnace (1). The cooling unit (3) is provided from the rear in this order, and a pair of left and right substrate transfer rails (4) are provided in the upper and lower intermediate portions of the furnace (1).

An infrared heater (5) for heating the substrate is provided above the transfer rail (4) of the reflow section (2), and a recirculation section atmosphere gas circulation fan is provided at the center of the floor surface of the reflow section (2). (6) is provided.

A water-cooled finned cooler (7) is provided above the cooling unit (3), and a liquefied flux that receives the liquefied flux in the cooler (7) is provided below the cooler (7). A catchment (8) is provided. The liquefied flux receiver (8) has a rectangular parallelepiped box shape, and a plurality of liquefied flux receivers (8) are arranged in a row in the front-rear direction corresponding to the places where the liquefied flux of the cooler (7) easily adheres.

A pair of left and right cooling part atmosphere gas circulation fans (9) are provided in the middle of the floor surface of the cooling part (3).

In the solder reflow apparatus, the substrate (10) is transported along the transport rail (4), preheated in the preheating unit, reflowed in the reflow unit (2), and then the cooling unit (3). ) Is passed.

In the cooling unit (3), the atmospheric gas in the cooling unit (3) is raised along the left and right side walls by the cooling unit atmospheric gas circulation fan (9) and cooled by the cooler (7). After that, it is lowered to cool the substrate (10). Further, the decomposed gas of the flux contained in the atmospheric gas is liquefied when cooled by the cooler (7) and is collected in the liquefied flux receiver (8).

Although a plurality of liquefied flux receivers (8) are arranged in the above embodiment, the liquefied flux receivers (8) may be provided so as to cover the entire lower surface of the cooler (7). Further, the positions where the cooler (7) and the fan (9) are provided can be changed as appropriate.

[0016]

[Effect of the device]

 According to the solder reflow apparatus of the present invention, the board reflowed in the reflow section is immediately cooled in the cooling section, so that the high temperature holding time of the board is shortened and the damage to electronic components is reduced.

Further, since the flux decomposition gas contained in the atmospheric gas is liquefied by the cooler and collected in the liquefied flux receiver, the liquefied flux adheres to the substrate and causes a defect, or adheres to the inside of the reflow apparatus. Therefore, it does not require time and cost for cleaning, and the decomposed gas of the flux is not released into the atmosphere to cause air pollution.

[Brief description of drawings]

1 is a schematic vertical sectional view of a solder reflow apparatus according to the present invention.

FIG. 2 is a sectional view taken along line II-II in FIG.

[Explanation of symbols]

 (1) Furnace (2) Reflow part (3) Cooling part (7) Cooler (8) Flux receiver (9) Atmosphere gas circulation fan

Claims (1)

[Scope of utility model registration request] 1. A cooling unit is provided in front of the reflow unit, and a cooler, a liquefied flux receiver for receiving a flux liquefied by the cooler, and an atmospheric gas circulation fan are provided in the cooling unit. Solder reflow equipment.