JP2518548Y2 - Exhaust device for solder device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of an exhaust device of a solder device having an exhaust means for exhausting pollutant gas containing flux mist generated during soldering to the outside.

[0002]

2. Description of the Related Art As a soldering device for mounting electronic parts on a printed wiring board of electronic equipment, there is, for example, a reflow soldering device.

As a method widely used for the reflow soldering apparatus, there is an infrared heating type reflow soldering apparatus as shown in FIG.

In FIG. 2, a partition 2 divides a preheating section 3, a reflow section 5 and a cooling section 6.

The furnace body 1 is provided with a conveyer 7 running in the arrow direction in the middle.

The preheating section 3 of the furnace body 1 is for preventing the heat resistant weak parts such as aluminum electrolytic capacitors from being damaged by rapid heating and deteriorating the characteristics of the electronic parts, and for activating the flux. In this example, the panel heater 12 is divided into three sections so that heat can be controlled.

In the preheating section 3, the printed wiring boards 10 placed on the traveling conveyor 7 are sequentially heated, so that the panel heater 1 is sandwiched across the conveyor 7.
2 is arranged as a heat source, fans 13a and 13b for convection the heated air are arranged, and the printed circuit board 10 is heated from room temperature to 160 ° C. for about 2 to 3 minutes.

The printed wiring board 1 placed on the conveyor 7
0 is, for example, one in which cream solder was supplied to the printed circuit board in the previous step and electronic components were mounted.

The reflow section 5 melts the cream solder to bond the electronic component to the printed circuit board. In this case, far-infrared lamps 16 are placed opposite to each other with the conveyor 7 in between, fans 17a and 17b for convection of heated air are provided, and when the solder melting temperature is 183 ° C, heating is performed at about 220 ° C for 10 to 30 seconds.

Further, the cooling unit 6 is provided with fans 18a and 18b opposite to each other with the conveyor 7 sandwiched therebetween, to rapidly cool the printed wiring board 10 after the process in the reflow unit is completed.

Reference numeral 8 denotes an exhaust device including an exhaust duct 81 for exhausting polluted gas containing flux mist composed of flux smoke and solder gas in the furnace by forced exhaust (not shown) to the outside of the furnace. is there.

[0012]

In the conventional reflow soldering apparatus described above, the flux mist consisting of flux smoke and solder gas in the furnace is abruptly exhausted at the inlet of the duct 81 when it goes out of the furnace in the process of being forcibly discharged. Since it is deprived of heat, it solidifies and adheres to the inner wall of the duct 81.

This deteriorates the flow of air in the duct 81, which causes the temperature inside the furnace to rise and causes insufficient control of the temperature inside the furnace.

Further, it was necessary to stop the operation of the furnace for cleaning the duct 81.

In view of the above-mentioned conventional problems, the present invention provides an exhaust device for a soldering device, which enables good temperature control in the furnace and easy duct cleaning.

[0016]

In order to solve the above-mentioned problems, in the present invention, the exhaust of a solder apparatus having an exhaust means for exhausting pollutant gas containing flux mist generated during soldering to the outside is proposed. In the apparatus, the exhaust means is a first exhaust part derived from a soldering device and having heating means, a second exhaust part connected to the first exhaust part and having cooling means, the first exhaust part and the second exhaust part. And a flux mist recovery part provided at the boundary part of the.

[0017]

[Function] Contaminant gases such as flux smoke and flux mist made of solder gas in the furnace are rapidly deprived of heat at the boundary between the first exhaust portion and the second exhaust portion of the duct during the process of forced exhaust. Although it solidifies, in the present invention, since the recovery part is provided between the first exhaust part and the second exhaust part, it does not stick to the inner wall of the duct, the air flow is not disturbed, and the temperature inside the furnace can be controlled well, and Easy to clean.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an example of an exhaust device for a soldering apparatus according to the present invention, which is applied to a reflow soldering apparatus, will be described in detail with reference to FIG.

FIG. 1 shows an example of the present invention. The same components as those in FIG. 2 are designated by the same reference numerals, and detailed description thereof will be omitted.

In the figure, the structure of the furnace body 1 is almost the same as that of the conventional apparatus shown in FIG. 2, and therefore its detailed description is omitted.

In the present invention, in particular, an exhaust device including an exhaust duct for discharging pollutant gas containing flux mist composed of flux smoke and solder gas in the furnace to the outside of the furnace is different from the conventional device.

That is, in the exhaust duct 91 of the exhaust device 9, a first exhaust part 9 is provided with a heating means (not shown) such as a heater provided in a portion of the solder device which is led out of the furnace body 1.
Two regions and a second exhaust part 93 region that is connected to the first exhaust part 92 and has a cooling means (not shown) such as water cooling are provided, and the boundary between the first exhaust part 92 and the second exhaust part 93 is provided. A drain pan 94 that serves as a recovery unit for the flux mist and the like is provided in the portion. The drain pan 94 is the exhaust duct 9
It is removable with respect to 1.

With the above configuration, when the pollutant gas containing the flux mist composed of the flux smoke and the solder gas in the furnace is exhausted to the outside of the furnace, it is heated in the first exhaust portion 92, so that the flux mist is included. Since the polluted gas does not liquefy or solidify in this region, it does not stick to the inner wall of the exhaust duct 91.

Further, the first exhaust part 92 and the second exhaust part 9
At the boundary of 3, the contaminated gas containing the flux mist is rapidly cooled and liquefied or solidified. Since the drain pan 94 is provided here as a collecting part for the flux mist and the like, this drain is used. Collected in bread 94.

The inside of the exhaust duct 91 is kept clean by removing the drain pan 94 from the exhaust duct 91 and periodically cleaning it.

Therefore, the temperature inside the furnace can be controlled well, and the duct can be easily cleaned.

The present invention is not limited to the reflow soldering device described above, but can be applied to, for example, a dip soldering device.

[0028]

As described above, according to the present invention,
A first exhaust portion 92 region provided with a heating means such as a heater in a portion of the solder device which is led out from the furnace body 1,
The second which is connected to the exhaust part 92 and has a cooling means such as water cooling
And an area of the exhaust portion 93, and the first exhaust portion 9
By providing the drain pan 94, which serves as a recovery unit for flux mist and the like, at the boundary between the second exhaust unit 93 and the second exhaust unit 93, the temperature inside the furnace can be controlled well and the duct can be easily cleaned.

[Brief description of drawings]

FIG. 1 is a view showing an example of an exhaust device for a solder device according to the present invention.

FIG. 2 is a view showing an exhaust device of a conventional solder device.

[Explanation of reference numerals] 1 furnace body 2 partition wall 3 preheating part 5 reflow part 6 cooling part 7 conveyor 8, 9 exhaust device 10 printed wiring board 12 panel heater 13a, 13b, 17a, 17b, 18a, 18b fan 16 far infrared lamp 81, 91 Exhaust duct 92 First exhaust part 93 Second exhaust part 93 94 Drain pan

Claims (1)

(57) [Scope of utility model registration request] 1. An exhaust device for a solder device having an exhaust means for exhausting pollutant gas containing flux mist generated when soldering to the outside, wherein the exhaust means is derived from the solder device and has a heating means. An exhaust unit, a second exhaust unit connected to the first exhaust unit and having a cooling unit, and a flux mist recovery unit provided at a boundary portion between the first exhaust unit and the second exhaust unit. Exhaust device for soldering equipment.