JPH0319390A - Reflow soldring device - Google Patents

Abstract

PURPOSE:To make zones stable in distribution of heating temperature by a method wherein the interference of an air flow occurring between adjacent zones is canceled, where the zones consist of a pre-heating zone, a reflow zone, and a cooling zone. CONSTITUTION:A transfer mechanism 12 of a board 11 mounted with electronic components is provided, which is composed of a pre-heating g zone 13 where heaters 16 and 17 are provided, a reflow zone 14, and a cooling zone 15 provided with a cooling fan, and these zones range from the transfer shaft end of the board 11 to the transfer terminal end. The pre-heating zone 13 and the reflow zone 14 are formed into a cavity structure connected to an exhaust duct 19, and at least, partitioning members 20 and 21 of hollow structure are provided to boundaries between the pre- heating zone 13 and the reflow zone 14 and the reflow zone 14 and the cooling zone 15 respectively, intake vents 22 and 23 are formed on the undersides of the partitioning members 20 and 21 respectively, and suction exhaust vents 26 and 27 are formed on the lower part of inner side walls 24 and 25. Guide plates 30 and 31 are interposed between the suction exhaust vents 26 and 27 and outer side wall 28 and 29 respectively to prevent air flows flow the intake vents 22 and 23 and the exhaust vents 26 and 27 from interfering with each other and to make them smoothly join together.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention eliminates air flow interference occurring between adjacent zones between a preheating zone and a reflow zone, and between a reflow zone and a cooling zone. The reflow soldering equipment is designed to achieve stable heating temperature distribution in each zone. [Prior Art] A general reflow soldering device, as shown in Fig. 3,
It is equipped with a transport mechanism 2 for a board l on which electronic components are mounted, and constitutes a preheating zone 3, a reflow zone 4, and a cooling zone 5 for the board l from the transport start end to the transport end of the board 1, and between each of the zones. A partition member 6 that does not obstruct the passage of the transport mechanism 2 is provided at the top. (For example, JP-A-64-18
No. 572! (Refer to 1) [Problem B to be solved by the invention] In the above-mentioned partition reflow soldering H system, the partition member disposed between each zone simply separates adjacent zones, and Although these systems are designed to prevent airflow from interfering with each other, as shown in the figure, when a board intervenes on the bottom surface of the partition member, the airflow that comes into contact with this board surface is reflected, changing the flow, and spreading to other zones. In particular, since the ljIC flow is fast between the reflow zone and the cooling zone, there is a problem that a large temperature drop occurs in the reflow zone and affects reflow. As shown, there are problems such as temperature variations observed in the preheating temperature characteristic a and the reflow temperature characteristic. [! ! Means for Solving the Problem] The configuration of the present invention that solves the problems of the prior art includes a transport mechanism for a board on which electronic components are mounted, and a preheating zone for the board from the start end of the board to the end end of the transport. , a reflow soldering apparatus comprising a reflow zone and a cooling zone, and each zone is separated by a partition member that does not impede passage of the transport mechanism, at least between the preheating zone and the reflow zone, and , the partition member between the reflow zone and the cooling zone is a partition member with an air groove structure connected to an exhaust duct, and an intake port is formed on the lower surface of each partition member, and an air inlet is formed inside each zone at the bottom of the side wall of the partition member. It is characterized by the provision of a communicating suction and exhaust port. [Function] When the substrate is inside each zone, the substrate is preheated, ref a+, and cooled depending on the temperature conditions of each zone. When the substrate intervenes on the lower surface of the partition member, the soot flows that are about to interfere with each other are sucked toward the exhaust duct through the air inlet provided on the lower surface of the partition member with the air groove structure due to the chimney effect.
In addition, the air within the zone is sucked by the airflow due to this chimney effect, and there is no interference between the airflow between zones, resulting in a stable heating temperature distribution in each zone. [Example] Next, details of an example of the present invention will be explained with reference to the drawings. Figure 1 is a sectional view of the main parts of the reflow soldering equipment, and Figure 2 is a temperature distribution characteristic diagram of the preheating zone and reflow zone. A is a reflow soldering machine H, and this reflow soldering machine A is a transport mechanism l for a board 11 on which electronic components are mounted.
2, and is composed of a preheating zone 13, a reflow zone, and a cooling zone 15 for the substrate 11 from the transport start end to the transport end of the substrate 1l, and the preheating zone +
3. Heaters I8 and +7 are provided in the reflow zone l4, respectively, and a cooling fan l8 is provided in the cooling zone l5.
is provided. The above preheating zone 13 and reflow zone l
4 has an air groove structure communicating with the exhaust duct l9, and at least the boundary between the preheating zone l3 and the reflow zone l4 and the boundary between the reflow zone 14 and the cooling zone 15 have an air groove structure. Partition member 20.
21, and intake ports 22, 23 are formed on the lower surfaces of both partition members 20, 21, respectively. In addition, @ walls 24 and 25 on the inside side of each zone that constitute the partition member 20.21
At the bottom, there are suction and exhaust ports 26, 2? are formed respectively,
This suction exhaust port 26. 27 and outer side wall 28.29
Between the intake ports 22, 23 and the suction/exhaust ports 26,
, 27 from interfering with each other, and to ensure smooth merging of air flows from both ports 22, 23 and 26, 27. 31 is interposed. 32 is
With a heat insulating layer surrounding the pre-ripening zone +3 and reflow zone 14,
A baffle 33 having a downward U-shaped cross section is provided at the lower side of the heat insulation N32 provided between the reflow zone l4 and the cooling zone l5. The reason for this is that the "yc flow between the reflow zone 14 and the cooling zone 15 is fast, so the baffle 33 applies static pressure to the airflow from the cooling zone 15 toward the reblow zone 14, creating a turbulent gas flow in that area. The turbulent airflow is generated to slow down the speed of the airflow, and this turbulent airflow is sucked in from the intake port 23 without wasting it, so that the cooling air does not affect the reflow zone 14. In the figure, 34 is the exhaust duct l9. Suction fan installed inside
35 is a contact field provided in the above-mentioned interruption layer 32 and which communicates the air groove structure of the preheating zone l3 and the reflow zone 14 with the above-mentioned exhaust a duct}+9; 36 is a contact field provided in the communication field 35; This is a damper for adjusting the amount. Although not particularly shown in the drawings, fans are provided at the upper portions of the preheating zone 13 and the reflow zone 14 to blow hot air toward the substrate 1. [Effects of the Invention] As described above, according to the configuration of the present invention, the following effects can be obtained. When the board is inside each zone, the board is preheated, reflowed, and cooled depending on the temperature conditions of each zone, but when the board is inserted under the partition member, preheating, reflow, and cooling are not performed. The air currents hit the substrate and try to interfere with each other near the partition plate, but these air currents are sucked toward the exhaust duct by the chimney effect from the suction slot provided on the bottom surface of the partition member with an air groove structure, and the chimney The hot air in the zone is sucked by the air flow caused by the effect, and there is no interference of air flow between the zones. Therefore, in the preheating zone and the reflow zone, it is clear from the preheating temperature characteristic C and the reflow temperature characteristic d in Fig. 2. As such, a stable heating temperature distribution can be obtained at all times, improving reflow soldering efficiency, and it is economical with less loss of thermal energy compared to conventional technology.

[Brief explanation of drawings]

Figure 1 is a sectional view of the main parts of the reflow soldering apparatus of the present invention, Figure 2 is a temperature distribution characteristic diagram of the preheating zone and reflow zone,
Figure 3 is a cross-sectional view of the conventional device, and Figure 4 is a temperature distribution characteristic diagram of the preheating zone and reflow zone in the same device. l1... Board, 12... Transport mechanism, +3... Preheating zone, 14... Reflow zone, 15... Cooling zone, 16.17... Heater, +8... Cooling fan, 19 ...Exhaust duct, 20.21...
Partition member, 22.23...Exhaust port, 24.25.
...Side wall, 26, 27...Suction and discharge slot, 28.29
...Side wall, 30.31...Guidance plate. Patent Application Applicant Hiroki Co., Ltd. Agent Yoshio Sano Figure 2 Temperature (0C) Figure 4

Claims (1)

[Scope of Claims] A transport mechanism for a board on which electronic components are mounted is provided, which includes a board preheating zone, a board preheating zone,
A reflow soldering apparatus comprising a reflow zone and a cooling zone, and each zone is separated by a partition member that does not impede passage of the transport mechanism, at least between the preheating zone and the reflow zone, and The partition member between the reflow zone and the cooling zone is a partition member with an air groove structure connected to an exhaust duct, and an intake port is formed on the bottom surface of each partition member, and the inside of each zone is communicated with the bottom of the side wall of the partition member. A reflow soldering device characterized by being provided with a suction/exhaust port.