JPH0568877B2 - - Google Patents

Info

Publication number
JPH0568877B2
JPH0568877B2 JP59239471A JP23947184A JPH0568877B2 JP H0568877 B2 JPH0568877 B2 JP H0568877B2 JP 59239471 A JP59239471 A JP 59239471A JP 23947184 A JP23947184 A JP 23947184A JP H0568877 B2 JPH0568877 B2 JP H0568877B2
Authority
JP
Japan
Prior art keywords
aln
glass
substrate
layer
oxide layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59239471A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61119094A (ja
Inventor
Nobuo Iwase
Kazuyoshi Saito
Yoshasu Godai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP23947184A priority Critical patent/JPS61119094A/ja
Priority to DE85102159T priority patent/DE3587481T2/de
Priority to EP85102159A priority patent/EP0153737B1/en
Priority to US06/706,280 priority patent/US4659611A/en
Publication of JPS61119094A publication Critical patent/JPS61119094A/ja
Publication of JPH0568877B2 publication Critical patent/JPH0568877B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
JP23947184A 1984-02-27 1984-11-15 高熱伝導性回路基板の製造方法 Granted JPS61119094A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP23947184A JPS61119094A (ja) 1984-11-15 1984-11-15 高熱伝導性回路基板の製造方法
DE85102159T DE3587481T2 (de) 1984-02-27 1985-02-27 Schaltungssubstrat mit hoher Wärmeleitfähigkeit.
EP85102159A EP0153737B1 (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
US06/706,280 US4659611A (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23947184A JPS61119094A (ja) 1984-11-15 1984-11-15 高熱伝導性回路基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP28243294A Division JP2506270B2 (ja) 1994-10-24 1994-10-24 高熱伝導性回路基板及び高熱伝導性外囲器

Publications (2)

Publication Number Publication Date
JPS61119094A JPS61119094A (ja) 1986-06-06
JPH0568877B2 true JPH0568877B2 (enrdf_load_html_response) 1993-09-29

Family

ID=17045260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23947184A Granted JPS61119094A (ja) 1984-02-27 1984-11-15 高熱伝導性回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS61119094A (enrdf_load_html_response)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0725617B2 (ja) * 1985-08-22 1995-03-22 住友電気工業株式会社 窒化アルミニウム基板およびその製造方法
US5352482A (en) * 1987-01-22 1994-10-04 Ngk Spark Plug Co., Ltd. Process for making a high heat-conductive, thick film multi-layered circuit board
US5070393A (en) * 1988-12-23 1991-12-03 Kabushiki Kaisha Toshiba Aluminum nitride substrate for formation of thin-film conductor layer and semiconductor device using the substrate
JPH02174184A (ja) * 1988-12-26 1990-07-05 Toshiba Corp 厚膜回路基板
EP0381242B1 (en) * 1989-02-03 1992-05-27 Mitsubishi Materials Corporation Substrate used for fabrication of thick film circuit
JPH02207554A (ja) * 1989-02-07 1990-08-17 Mitsubishi Metal Corp 放熱性のすぐれた半導体装置用基板
JP2615970B2 (ja) * 1989-02-10 1997-06-04 三菱マテリアル株式会社 内部に導体、抵抗体を配線したＡ▲ｌ▼Ｎ多層基板の製造方法
EP0688047A1 (en) 1994-06-13 1995-12-20 Mitsubishi Materials Corporation Aluminium nitride substrate and method of producing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5075208A (enrdf_load_html_response) * 1973-11-07 1975-06-20
JPS578176A (en) * 1980-06-20 1982-01-16 Seiko Epson Corp High speed thermal printer head
JPS59121175A (ja) * 1982-12-28 1984-07-13 株式会社東芝 放熱体の製造方法

Also Published As

Publication number Publication date
JPS61119094A (ja) 1986-06-06

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Legal Events

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