JPH0568801B2 - - Google Patents
Info
- Publication number
- JPH0568801B2 JPH0568801B2 JP61016271A JP1627186A JPH0568801B2 JP H0568801 B2 JPH0568801 B2 JP H0568801B2 JP 61016271 A JP61016271 A JP 61016271A JP 1627186 A JP1627186 A JP 1627186A JP H0568801 B2 JPH0568801 B2 JP H0568801B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- conductive adhesive
- silver
- powder
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- NPAAPVNPKGDSFN-UHFFFAOYSA-N acetic acid;2-(2-hydroxyethoxy)ethanol Chemical compound CC(O)=O.OCCOCCO NPAAPVNPKGDSFN-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000007639 printing Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XXXFZKQPYACQLD-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCO XXXFZKQPYACQLD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1627186A JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62176003A JPS62176003A (ja) | 1987-08-01 |
| JPH0568801B2 true JPH0568801B2 (de) | 1993-09-29 |
Family
ID=11911879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1627186A Granted JPS62176003A (ja) | 1986-01-27 | 1986-01-27 | 導電性接着ペ−スト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62176003A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04269403A (ja) * | 1991-02-25 | 1992-09-25 | Nec Kagoshima Ltd | 導電性ペースト |
| JP4726803B2 (ja) * | 2004-12-09 | 2011-07-20 | 株式会社 旭 | 成型金型の補修方法、成型金型及び成型製品 |
| WO2006061907A1 (ja) * | 2004-12-09 | 2006-06-15 | Asahi Co., Ltd | 成型金型の補修方法並びに成型金型及び成型製品 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143203A (en) * | 1981-02-27 | 1982-09-04 | Taiyo Yuden Kk | Conductive paste for forming conductive layer by baking on porcelain |
-
1986
- 1986-01-27 JP JP1627186A patent/JPS62176003A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143203A (en) * | 1981-02-27 | 1982-09-04 | Taiyo Yuden Kk | Conductive paste for forming conductive layer by baking on porcelain |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62176003A (ja) | 1987-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4459166A (en) | Method of bonding an electronic device to a ceramic substrate | |
| US4401767A (en) | Silver-filled glass | |
| US4436785A (en) | Silver-filled glass | |
| US5165986A (en) | Copper conductive composition for use on aluminum nitride substrate | |
| US3440182A (en) | Copper/vanadium oxide compositions,noble metal metalizing compositions containing vanadium oxide additives,and electrical conductor elements made therewith | |
| JPS6254206B2 (de) | ||
| JPH11150135A (ja) | 熱伝導性が良好な導電性ペースト及び電子部品 | |
| EP0217584A2 (de) | Hoch thermisch leitendes Keramiksubstrat | |
| JPH04152642A (ja) | 接着用ペースト | |
| US4592794A (en) | Glass bonding method | |
| JPS5873904A (ja) | 銀充填ガラス | |
| JP5863323B2 (ja) | 半導体装置、及び半導体装置の製造方法 | |
| WO1983000949A1 (en) | Improved glass bonding means and method | |
| WO2016043095A1 (ja) | 放熱構造体及びそれを利用した半導体モジュール | |
| US4997718A (en) | Silver phosphate glass die-attach composition | |
| US4963187A (en) | Metallizing paste for circuit board having low thermal expansion coefficient | |
| JPH0719964B2 (ja) | 銀系配線セラミック基板 | |
| JPH0568801B2 (de) | ||
| JPS61248302A (ja) | 炭化ケイ素焼結体用メタライズペ−スト | |
| US4515898A (en) | Glass bonding means and method | |
| GB2103250A (en) | Silver-filled glass | |
| US4800421A (en) | Glass bonding means and method | |
| JP2560865B2 (ja) | 半導体装置用金合金はんだペースト | |
| JPS6280907A (ja) | 導電ペ−スト | |
| JP2517024B2 (ja) | セラミックパッケ―ジとその製造方法 |