JPH0568433B2 - - Google Patents
Info
- Publication number
- JPH0568433B2 JPH0568433B2 JP60172720A JP17272085A JPH0568433B2 JP H0568433 B2 JPH0568433 B2 JP H0568433B2 JP 60172720 A JP60172720 A JP 60172720A JP 17272085 A JP17272085 A JP 17272085A JP H0568433 B2 JPH0568433 B2 JP H0568433B2
- Authority
- JP
- Japan
- Prior art keywords
- sic
- silicon
- metallic silicon
- particle size
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010703 silicon Substances 0.000 claims description 81
- 229910052710 silicon Inorganic materials 0.000 claims description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 80
- 239000002245 particle Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000003779 heat-resistant material Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 59
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 57
- 239000011148 porous material Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 230000035939 shock Effects 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 239000011819 refractory material Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 229910003902 SiCl 4 Inorganic materials 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000001953 recrystallisation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229920000609 methyl cellulose Polymers 0.000 description 2
- 239000001923 methylcellulose Substances 0.000 description 2
- 235000010981 methylcellulose Nutrition 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- -1 silicon halide Chemical class 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910008556 Li2O—Al2O3—SiO2 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009750 centrifugal casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60172720A JPS6236087A (ja) | 1985-08-06 | 1985-08-06 | 粒状ＳｉＣを分散配置させた金属シリコン耐熱材料 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60172720A JPS6236087A (ja) | 1985-08-06 | 1985-08-06 | 粒状ＳｉＣを分散配置させた金属シリコン耐熱材料 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6236087A JPS6236087A (ja) | 1987-02-17 |
| JPH0568433B2 true JPH0568433B2 (zh) | 1993-09-28 |
Family
ID=15947077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60172720A Granted JPS6236087A (ja) | 1985-08-06 | 1985-08-06 | 粒状ＳｉＣを分散配置させた金属シリコン耐熱材料 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236087A (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2668119B2 (ja) * | 1988-03-15 | 1997-10-27 | 東海高熱工業株式会社 | 炭化けい素−金属けい素材料の製造方法 |
| JPH0813706B2 (ja) * | 1991-07-02 | 1996-02-14 | 工業技術院長 | 炭化珪素／金属珪素複合体及びその製造方法 |
| JP2535480B2 (ja) * | 1992-06-25 | 1996-09-18 | 日本碍子株式会社 | 耐クリ―プ性Ｓｉ−ＳｉＣ質焼結体 |
| JP4327190B2 (ja) | 2006-10-11 | 2009-09-09 | 日本碍子株式会社 | Ｓｉ−ＳｉＣ質焼結体及びその製造方法 |
| JP2009179509A (ja) * | 2008-01-30 | 2009-08-13 | Ngk Insulators Ltd | 炭化珪素質多孔体及びそれを用いた断熱材 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131339A (ja) * | 1983-06-08 | 1986-02-13 | ステンカー・コーポレーシヨン | 複合耐火フオ−ム |
-
1985
- 1985-08-06 JP JP60172720A patent/JPS6236087A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6131339A (ja) * | 1983-06-08 | 1986-02-13 | ステンカー・コーポレーシヨン | 複合耐火フオ−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6236087A (ja) | 1987-02-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |