JPH056675Y2 - - Google Patents
Info
- Publication number
- JPH056675Y2 JPH056675Y2 JP1985045053U JP4505385U JPH056675Y2 JP H056675 Y2 JPH056675 Y2 JP H056675Y2 JP 1985045053 U JP1985045053 U JP 1985045053U JP 4505385 U JP4505385 U JP 4505385U JP H056675 Y2 JPH056675 Y2 JP H056675Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- printed circuit
- perforation
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は、ワイヤレスリモートコントロール送
信器に用いられる発光ダイオードの取付装置に関
するものである。[Detailed Description of the Invention] (Field of Industrial Application) The present invention relates to a mounting device for a light emitting diode used in a wireless remote control transmitter.
（従来の技術）
近年、ワイヤレスリモートコントロール送信器
は、テレビ、ビデオ、エアコン等数多くの分野で
使用されているが、その信号光源として用いられ
るものの大半は発光ダイオードである。その発光
ダイオードの取付装置としては、従来、第４図、
第５図に示したように、プリント基板１に設けた
孔に発光ダイオード２のリード端子を取付けた
後、操作方向に発光ダイオード２の発光面が向く
ようにリード端子を曲げるものである。(Prior Art) In recent years, wireless remote control transmitters have been used in many fields such as televisions, videos, and air conditioners, but most of the transmitters used as signal light sources are light emitting diodes. Conventionally, the mounting device for the light emitting diode is as shown in Fig. 4.
As shown in FIG. 5, after the lead terminal of the light emitting diode 2 is attached to the hole provided in the printed circuit board 1, the lead terminal is bent so that the light emitting surface of the light emitting diode 2 faces in the operating direction.
（考案が解決しようとする問題点）
しかしながら、上記装置では、一般に発光ダイ
オード２の上下方向の寸法が他の電気部品に比べ
大きいため、ケース本体３とプリント基板１との
間にある一定のスキマを有する必要が生じ、ワイ
ヤレスリモート送信器本体のデザインの多様化に
対し、対応ができなかつた。(Problem to be solved by the invention) However, in the above device, since the vertical dimension of the light emitting diode 2 is generally larger than other electrical components, there is a certain gap between the case body 3 and the printed circuit board 1. Therefore, it was not possible to respond to the diversification of designs of wireless remote transmitter bodies.
これに対し、第６図に示したように、発光ダイ
オード２を他の電気部品とは基板の反対側に取付
けるようにした例も見られる。しかし、このよう
にすると半田デイツプが不可能となり、別工程の
手半田が必要となつて工数が増加するといつた問
題点があつた。 On the other hand, as shown in FIG. 6, there is also an example in which the light emitting diode 2 is mounted on the opposite side of the board from other electrical components. However, this method had the problem of making it impossible to dip the solder, necessitating manual soldering in a separate process, and increasing the number of man-hours.
そこで本考案は、発光ダイオードの上下方向の
位置決めを自由に選択でき、デザインの多様化に
対応できるようにし、しかも半田デイツプが可能
な発光ダイオードの取付装置を提供するものであ
る。 Therefore, the present invention provides a light emitting diode mounting device that allows the vertical positioning of the light emitting diode to be freely selected, allows for a variety of designs, and allows solder dipping.
（問題点を解決するための手段）
この問題を解決するために、本考案は、ミシン
目によりつながつた２枚のプリント基板の一方に
発光ダイオードを取り付け、またミシン目をまた
いで複数の半田メツキ線の端部を両基板に接合す
る。そしてミシン目を割るとともに半田メツキ線
を折り曲げ、発光ダイオードの発光面を操作方向
に向ける。プリント基板に取付けられた発光ダイ
オードの上下方向の位置決めは、プリント基板の
発光ダイオード取付孔の位置により任意に選択で
きるようにする。(Means for solving the problem) In order to solve this problem, the present invention attaches a light emitting diode to one side of two printed circuit boards connected by a perforation, and also attaches a plurality of solder plates across the perforation. Bond the ends of the wire to both substrates. Then, break the perforation and bend the solder plating wire to direct the light emitting surface of the light emitting diode in the direction of operation. The vertical positioning of the light emitting diode attached to the printed circuit board can be arbitrarily selected by the position of the light emitting diode mounting hole of the printed circuit board.
（作用）
プリント基板の発光ダイオード取付孔の位置を
変えることにより、発光ダイオードの上下方向の
位置決めを自由に選択することが可能であり、し
かも半田デイツプが可能である。(Function) By changing the position of the light emitting diode mounting hole on the printed circuit board, it is possible to freely select the vertical positioning of the light emitting diode, and moreover, soldering is possible.
（実施例） 以下実施例を図面を用いて詳細に説明する。(Example) Examples will be described in detail below with reference to the drawings.
まず、第１図の４，５は孔６及びスリツト７か
らなるミシン目によつてつながつている２枚のプ
リント基板である。このプリント基板４，５に、
ミシン目をまたいで複数の半田メツキ線８を配置
するとともに、プリント基板５上に発光ダイオー
ド９を配置し、半田処理を行なう。次いで、第２
図、第３図に示したように、ミシン目を割り、半
田メツキ線８を折り曲げる。この際プリント基板
４，５の折り曲げ角度は、半田メツキ線８に沿つ
てあけられたスリツト７の長さにより決定され
る。 First, reference numerals 4 and 5 in FIG. 1 are two printed circuit boards connected by a perforation consisting of a hole 6 and a slit 7. On this printed circuit board 4, 5,
A plurality of solder plating lines 8 are arranged across the perforations, and a light emitting diode 9 is arranged on the printed circuit board 5, and soldering is performed. Then the second
As shown in FIG. 3, the perforation is cut and the solder plating line 8 is bent. At this time, the bending angle of the printed circuit boards 4 and 5 is determined by the length of the slit 7 made along the solder plating line 8.
以上のように構成された本実施例では、発光ダ
イオード９のミシン目からの取付距離により、発
光ダイオード９の上下方向の位置は自由に選択す
ることができ、しかも半田デイツプが可能であ
る。 In this embodiment configured as described above, the vertical position of the light emitting diode 9 can be freely selected depending on the mounting distance from the perforation of the light emitting diode 9, and soldering is also possible.
なお、第１図〜第３図に示したものは一実施例
にすぎず、プリント基板４，５やミシン孔６及び
スリツト７はこれに類するその他の形状形体でも
よく、また発光ダイオード９及び半田メツキ線８
の数も実施例以外の数でもよい。 Note that what is shown in FIGS. 1 to 3 is only one example, and the printed circuit boards 4 and 5, the perforation holes 6, and the slits 7 may have other similar shapes, and the light emitting diode 9 and the solder Metsuki line 8
The number may also be a number other than that in the example.
（考案の効果）
以上のように本考案によれば、プリント基板の
発光ダイオード取付孔の位置を変えることによ
り、発光ダイオードの上下方向の位置決めを自由
に選択することができ、ワイヤレスリモートコン
トロール送信器本体のデザインの多様化に対し、
対応が可能となるばかりでなく、半田デイツプが
可能となるので、組込工数の面から考えても実用
的価値の大なるものである。(Effects of the invention) As described above, according to the invention, by changing the position of the light emitting diode mounting hole on the printed circuit board, the vertical positioning of the light emitting diode can be freely selected. In response to the diversification of body designs,
Not only is this possible, but it also allows solder dips, so it has great practical value from the perspective of assembly man-hours.
第１図は、本考案の一実施例のプリント基板上
に部品を配置した状態の平面図、第２図は、プリ
ント基板を折り曲げた後の状態の平面図、第３図
は、第２図の側面図、第４図は、従来例の発光ダ
イオードを他の部品とプリント基板の同一面に配
置した図、第５図は、第４図の側面図、第６図は
発光ダイオードを他の部品とはプリント基板の反
対面に配置した側面図である。
４，５……プリント基板、６……ミシン目の
孔、７……スリツト、８……半田メツキ線、９…
…発光ダイオード。
FIG. 1 is a plan view of an embodiment of the present invention in which parts are arranged on a printed circuit board, FIG. 2 is a plan view of the printed circuit board after it has been bent, and FIG. 4 is a side view of the conventional light emitting diode and other components placed on the same side of the printed circuit board, FIG. 5 is a side view of FIG. 4, and FIG. It is a side view of components arranged on the opposite side of the printed circuit board. 4, 5... Printed circuit board, 6... Perforation hole, 7... Slit, 8... Solder plating wire, 9...
...Light emitting diode.
Claims (1)
の一方の基板に、前記ミシン目から所望の距離に
発光ダイオードを半田付けにより取り付けるとと
もに、前記ミシン目をまたいで複数の半田メツキ
線の両端をそれぞれ前記基板に接合し、前記ミシ
ン目を割りかつ前記半田メツキ線を折り曲げて前
記２枚の基板を所定の角度で保持してなることを
特徴とする発光ダイオードの取付装置。 A light emitting diode is attached to one of two printed circuit boards connected by a perforation at a desired distance from the perforation by soldering, and both ends of a plurality of solder-plated wires are connected across the perforation to each of the boards. A light emitting diode mounting device characterized in that the two substrates are held at a predetermined angle by joining the two substrates together, dividing the perforations, and bending the solder plating wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985045053U JPH056675Y2 (en) | 1985-03-29 | 1985-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985045053U JPH056675Y2 (en) | 1985-03-29 | 1985-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61162071U JPS61162071U (en) | 1986-10-07 |
| JPH056675Y2 true JPH056675Y2 (en) | 1993-02-19 |
Family
ID=30558204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985045053U Expired - Lifetime JPH056675Y2 (en) | 1985-03-29 | 1985-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056675Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201123410A (en) * | 2009-12-25 | 2011-07-01 | Bright Led Electronics Corp | LED light-emitting module and its manufacturing method thereof. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58153471U (en) * | 1982-04-08 | 1983-10-14 | 松下電器産業株式会社 | printed circuit board equipment |
| JPS58187175U (en) * | 1982-06-08 | 1983-12-12 | パイオニア株式会社 | Printed board |
-
1985
- 1985-03-29 JP JP1985045053U patent/JPH056675Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61162071U (en) | 1986-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4775917A (en) | Thermal compensated circuit board interconnect apparatus and method of forming the same | |
| JPH056675Y2 (en) | ||
| JPH0749822Y2 (en) | Surface mount hybrid integrated circuit module | |
| JPS6242548Y2 (en) | ||
| JPS5844602Y2 (en) | printed wiring board | |
| JPS6316478U (en) | ||
| JP2542125Y2 (en) | Split circuit board | |
| JPS5826343Y2 (en) | pointer device | |
| JPS5923437Y2 (en) | Electrical component mounting equipment on printed wiring boards | |
| JPS5833710Y2 (en) | Printed board | |
| JPS5843783Y2 (en) | electronic circuit equipment | |
| JPS6112699Y2 (en) | ||
| JPH08321665A (en) | Printed board | |
| JPH03123096A (en) | Manufacture and structure of hybrid ic | |
| JP3009036U (en) | Experiment circuit board kit for short-time acquisition learning of transistor circuit | |
| JPH07297542A (en) | Method for connecting flexible printed circuit board by soldering | |
| JPS6033576Y2 (en) | Band-shaped jumper wire for printed boards | |
| JPS58182343U (en) | printed circuit board equipment | |
| JPS5895074U (en) | Electronic component mounting equipment | |
| JPH0548239A (en) | Forming method of circuit substrate | |
| JPS60158610A (en) | Manufacture of high-frequency coil | |
| JPS60144268U (en) | Parts mounting structure on printed circuit board | |
| JPH01273384A (en) | Integrated circuit device | |
| JPS60200587A (en) | Method of producing module | |
| JPH056808U (en) | Electronic parts |