JPH056673Y2 - - Google Patents
Info
- Publication number
- JPH056673Y2 JPH056673Y2 JP1984199103U JP19910384U JPH056673Y2 JP H056673 Y2 JPH056673 Y2 JP H056673Y2 JP 1984199103 U JP1984199103 U JP 1984199103U JP 19910384 U JP19910384 U JP 19910384U JP H056673 Y2 JPH056673 Y2 JP H056673Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- resin case
- receiving element
- receiving
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は、可視光カツトフイルタの如きフイル
タを備えた半導体受光装置に関する。[Detailed Description of the Invention] (a) Field of Industrial Application The present invention relates to a semiconductor light receiving device equipped with a filter such as a visible light cut filter.
(ロ) 従来の技術
近年、発行素子と受光素子との組合せにより、
スイツチング回路を動作させる光半導体装置が多
く用いられている。(b) Conventional technology In recent years, by combining a light emitting element and a light receiving element,
Optical semiconductor devices that operate switching circuits are often used.
そして、この種の半導体受光装置においては、
受光特性を改善するために、各種フイルタを受光
面に装着している（例えば、電子材料1973年11月
号第64頁乃至第68頁に詳しい）。 In this type of semiconductor photodetector,
In order to improve the light-receiving characteristics, various filters are attached to the light-receiving surface (see, for example, Denshi Materials, November 1973 issue, pages 64 to 68).
従来、例えば、赤外発光素子と受光素子の組合
せに於ける受光装置に装着されている可視光カツ
トフイルタは、受光素子を内蔵するユニツトケー
スの受光窓に、接着剤等を用いて装着していた。 Conventionally, for example, a visible light cut filter attached to a light receiving device in a combination of an infrared light emitting element and a light receiving element was attached to the light receiving window of the unit case containing the light receiving element using adhesive or the like. .
(ハ) 考案が解決しようとする問題点
ユニツトケースにフイルタを接着剤等を用いて
接着すると、その位置決めが煩瑣であり、またそ
の組立工数が多くなり、工程が複雑になるなどの
難点があつた。(c) Problems to be solved by the invention When a filter is attached to a unit case using an adhesive, etc., there are problems such as positioning it is cumbersome, the number of assembly steps increases, and the process becomes complicated. Ta.
(ニ) 問題点を解決するための手段
本考案は、受光窓と挿入口が互いに垂直な面に
設けられた樹脂ケースと、該樹脂ケースに挿入さ
れ、その受光面が前記受光窓と対峙する半導体受
光素子と、前記樹脂ケースに挿入されると共に前
記半導体受光素子の受光面前面に配され、当該半
導体受光素子と前記樹脂ケースで挟持されたフイ
ルタと、前記樹脂ケースの挿入口を封止する封止
用樹脂と、を備えることを特徴とする。(d) Means for Solving the Problems The present invention includes a resin case in which a light receiving window and an insertion opening are provided on mutually perpendicular surfaces, and a resin case that is inserted into the resin case so that its light receiving surface faces the light receiving window. A semiconductor light-receiving element, a filter inserted into the resin case and arranged in front of the light-receiving surface of the semiconductor light-receiving element and sandwiched between the semiconductor light-receiving element and the resin case, and an insertion opening of the resin case are sealed. It is characterized by comprising a sealing resin.
(ホ) 作用
本考案によれば、接着剤等を必要とせずに、フ
イルタを受光面の前面に装着することができる。(E) Effect According to the present invention, the filter can be attached to the front surface of the light-receiving surface without the need for adhesive or the like.
(ヘ) 実施例
以下、本考案の一実施例を図面に従い説明す
る。第１図は正面図、第２図は第１図のＡ−
A′線断面図、第３図は樹脂ケースを示す斜視図
である。(F) Embodiment An embodiment of the present invention will be described below with reference to the drawings. Figure 1 is a front view, Figure 2 is A- of Figure 1.
A sectional view taken along line A' and FIG. 3 are perspective views showing the resin case.
これらの図において、１はPN接合を具えたシ
リコン単結晶からなる半導体基板、２はこの半導
体基板１の一主面に酸化処理により形成された酸
化シリコンの反射防止膜、３はこの反射防止膜２
を貫通して半導体基板１の一導電型領域と結合し
たアルミニウム等の表面電極、５は上記半導体基
板１の他の一主面の逆導電型領域とオーミツク接
触した金等の裏面電極で、かかる半導体基板１な
いし裏面電極５にて、いわゆるフオトダイオード
の受光素子６が形成される。７，８はリードフレ
ームからなる第１、第２のリード体で、前記両電
極３，５に各々接続される。 In these figures, 1 is a semiconductor substrate made of silicon single crystal with a PN junction, 2 is an antireflection film of silicon oxide formed on one main surface of this semiconductor substrate 1 by oxidation treatment, and 3 is this antireflection film. 2
5 is a surface electrode made of aluminum or the like that penetrates through and is coupled to one conductivity type region of the semiconductor substrate 1, and 5 is a back surface electrode made of gold or the like that is in ohmic contact with the opposite conductivity type region of the other principal surface of the semiconductor substrate 1. A so-called photodiode light-receiving element 6 is formed on the semiconductor substrate 1 or the back electrode 5. Reference numerals 7 and 8 denote first and second lead bodies made of lead frames, which are connected to both the electrodes 3 and 5, respectively.
１０は可視光を遮断するカツトフイルタで、受
光素子６の受光面すなわち反射防止膜２の前面に
配置される。１１は赤外線を透過しない樹脂ケー
スで、この樹脂ケース１１には受光窓１２が形成
されている。 Reference numeral 10 denotes a cut filter that blocks visible light, and is arranged on the light receiving surface of the light receiving element 6, that is, on the front surface of the antireflection film 2. Reference numeral 11 denotes a resin case that does not transmit infrared rays, and a light receiving window 12 is formed in this resin case 11.
さて、本考案は、受光素子６の反射防止膜２の
前面にフイルタ１０を配設し、この受光素子６と
フイルタ１０とを樹脂ケース１１内に挿入する。
そして、この樹脂ケース１１の挿入口１３を赤外
線非透過形の封止用樹脂１４にて封止する。而し
て、フイルタ１０は、樹脂ケース１１と受光素子
６とで挟持されると共に樹脂１４により固定さ
れ、受光素子６の受光面の前面にフイルタ６が装
着されることになる。 Now, in the present invention, a filter 10 is disposed in front of the antireflection film 2 of the light receiving element 6, and the light receiving element 6 and the filter 10 are inserted into the resin case 11.
Then, the insertion opening 13 of this resin case 11 is sealed with a sealing resin 14 that does not transmit infrared rays. Thus, the filter 10 is sandwiched between the resin case 11 and the light receiving element 6 and fixed by the resin 14, so that the filter 6 is mounted on the front surface of the light receiving surface of the light receiving element 6.
(ト) 考案の効果
以上説明したように、本考案によれば、接着剤
等を必要とせずに、フイルタを受光素子の受光面
の前面に装着することができ、組立工数が減少し
生産性が向上するなどその実用的効果は大きい。(g) Effects of the invention As explained above, according to the invention, the filter can be attached to the front of the light-receiving surface of the light-receiving element without the need for adhesives, reducing assembly man-hours and increasing productivity. The practical effects are significant, such as improved performance.
図面は本考案の一実施例を示し、第１図は正面
図、第２図は第１図のＡ−A′線断面図、第３図
は樹脂ケースを示す斜視図である。
６……受光素子、２……反射防止膜（受光面）、
１１……樹脂ケース、１２……受光窓、１４……
封止用樹脂。
The drawings show one embodiment of the present invention; FIG. 1 is a front view, FIG. 2 is a sectional view taken along line A-A' in FIG. 1, and FIG. 3 is a perspective view showing a resin case. 6... Light-receiving element, 2... Anti-reflection film (light-receiving surface),
11...Resin case, 12...Light receiving window, 14...
Sealing resin.
Claims (1)
樹脂ケースと、該樹脂ケースに挿入され、その受
光面が前記受光窓と対峙する半導体受光素子と、
前記樹脂ケースに挿入されると共に前記半導体受
光素子の受光面前面に配され、当該半導体受光素
子と前記樹脂ケースで挟持されて前記樹脂ケース
の受光窓を覆い挿入口まで達するフイルタと、前
記樹脂ケースの挿入口を封止する封止用樹脂と、
を備えることを特徴とする半導体受光装置。 a resin case in which a light-receiving window and an insertion opening are provided on mutually perpendicular surfaces; a semiconductor light-receiving element inserted into the resin case and having its light-receiving surface facing the light-receiving window;
a filter that is inserted into the resin case and arranged in front of the light-receiving surface of the semiconductor light-receiving element, is sandwiched between the semiconductor light-receiving element and the resin case, covers the light-receiving window of the resin case, and reaches the insertion opening; and the resin case. a sealing resin for sealing the insertion port of the
A semiconductor light receiving device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199103U JPH056673Y2 (en) | 1984-12-27 | 1984-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984199103U JPH056673Y2 (en) | 1984-12-27 | 1984-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61112660U JPS61112660U (en) | 1986-07-16 |
| JPH056673Y2 true JPH056673Y2 (en) | 1993-02-19 |
Family
ID=30758718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984199103U Expired - Lifetime JPH056673Y2 (en) | 1984-12-27 | 1984-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH056673Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833967U (en) * | 1971-08-31 | 1973-04-24 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234457Y2 (en) * | 1981-05-28 | 1987-09-02 |
-
1984
- 1984-12-27 JP JP1984199103U patent/JPH056673Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833967U (en) * | 1971-08-31 | 1973-04-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61112660U (en) | 1986-07-16 |
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